This document specifies three test methods for investigating brazeability. A spreading test shows testing method with measurement of the spread area of the filler metals. A T-joint test describes a scheme to construct a T-shape design by the test pieces and a testing method. A varying gap test describes a test piece and a testing method for assessing the influence of the various parameters which can influence brazing during manufacture as a function of clearances.

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This document specifies the performance requirements for fluxes in solid, liquid and paste forms
intended for use with soft solders.
NOTE 1 ISO 9454-1 specifies the requirements for labelling and packaging as well as the coding system for the
classification of the fluxes.
NOTE 2 Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria
in Tables 1 and 2.
Requirements for these fluxes are agreed between the purchaser and the supplier.

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The principle of the method specified is to distil a prepared flux solution with sodium hydroxide to expel the ammonia present in the flux, to pass the resulting distillate into a standard sulfuric acid solution, to titrate the excess acid with sodium hydroxide solution and to calculate the ammonia content of the flux. Applies to fluxes of class 3.1.1 only, as defined in ISO 9454-1.

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This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper.
The test is applicable to all fluxes of type 1 as defined in ISO 9454-1.

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This document specifies the requirements for chemical composition for soft solder alloys containing
two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.

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This document specifies a distillation method for the determination of the ammonia content of solid, paste or liquid fluxes. The method is applicable to fluxes of class 311 and 321 only, as defined in ISO 9454‑1.

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This document specifies the performance requirements for fluxes in solid, liquid and paste forms intended for use with soft solders. NOTE 1 ISO 9454‑1 specifies the requirements for labelling and packaging as well as the coding system for the classification of the fluxes. NOTE 2 Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria in Tables 1 and 2. Requirements for these fluxes are agreed between the purchaser and the supplier.

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This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.

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This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.

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This document specifies the classification of fluxes used for brazing metals and characterizes these fluxes on the basis of their properties and use, and gives technical delivery conditions and health and safety precautions. This document covers two classes of flux, FH and FL. Class FH is used for the brazing of heavy metals (steels, stainless steels, copper and its alloys, nickel and its alloys, precious metals, molybdenum and tungsten). Class FL is used for the brazing of aluminium and its alloys.

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This document specifies two methods for the determination of the acid value of a flux of types 1 and 2
only, as defined in ISO 9454-1.
Method A is a potentiometric titration method and is to be considered as the reference method.
Method B is an alternative, visual end‑point, titration method.

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This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454-1.

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This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454‑1.
NOTE It is hoped that future developments using improved techniques for obtaining a reproducible range of test surfaces will enable this method for assessing flux efficacy to be quantitative. For this reason, several alternative procedures for preparing the surface of the test piece are included in the present method.

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This document specifies two methods for the determination of the acid value of a flux of types 1 and 2 only, as defined in ISO 9454‑1. Method A is a potentiometric titration method and is to be considered as the reference method. Method B is an alternative, visual end‑point, titration method.

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This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454‑1. NOTE It is hoped that future developments using improved techniques for obtaining a reproducible range of test surfaces will enable this method for assessing flux efficacy to be quantitative. For this reason, several alternative procedures for preparing the surface of the test piece are included in the present method.

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This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
The Standard defines acceptance and rejection criteria for high-reliability manufacture of surface-mount and mixed-technology circuit assemblies intended to withstand normal terrestrial conditions and the vibrational g loads and environment imposed by space flight.
The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work.
The assembly of leaded devices to through-hole terminations and general soldering principles are covered in ECSS-Q-ST-70-08.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70 10, ECSS-Q-ST-70-11 and ECSS-Q-ST-70-12 . The mounting and supporting of devices, terminals and conductors prescribed herein applies to assemblies at PCB level designed to continuously operate over the mission within the temperature limits of -55 C to +85 C.
For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability.
Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 C, power transistors) in order to ensure that solder joints do not exceed 85 C.
Verification of SMD assembly processes is made on test vehicles (surface mount verification samples). Temperature cycling ensures the operational lifetime for spacecraft. However, mechanical testing only indicates SMD reliability as it is unlikely that the test vehicle represents every flight configuration.
This Standard does not cover the qualification and acceptance of the EQM and FM equipment with surface-mount and mixed-technology.
The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03.
This standard may be tailored for the specific characteristics and constraints of a space project, in accordance with ECSS-S-ST-00.

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This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
The Standard defines acceptance and rejection criteria for high-reliability manufacture of surface-mount and mixed-technology circuit assemblies intended to withstand normal terrestrial conditions and the vibrational g loads and environment imposed by space flight.
The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work.
The assembly of leaded devices to through-hole terminations and general soldering principles are covered in ECSS-Q-ST-70-08.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70 10, ECSS-Q-ST-70-11 and ECSS-Q-ST-70-12 . The mounting and supporting of devices, terminals and conductors prescribed herein applies to assemblies at PCB level designed to continuously operate over the mission within the temperature limits of -55 C to +85 C.
For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability.
Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 C, power transistors) in order to ensure that solder joints do not exceed 85 C.
Verification of SMD assembly processes is made on test vehicles (surface mount verification samples). Temperature cycling ensures the operational lifetime for spacecraft. However, mechanical testing only indicates SMD reliability as it is unlikely that the test vehicle represents every flight configuration.
This Standard does not cover the qualification and acceptance of the EQM and FM equipment with surface-mount and mixed-technology.
The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03.
This standard may be tailored for the specific characteristics and constraints of a space project, in accordance with ECSS-S-ST-00.

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This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Examples of special
solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy
solder powders.

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This document specifies a qualitative method for determination of the corrosive properties of flux
residues on a copper substrate when subjected to controlled environmental conditions. The test is
applicable to type 1 fluxes, as defined in ISO 9454-1.

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This document specifies a qualitative method for the assessment of the tackiness of the residues of a
soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and
flux cored solder wires. The method is particularly appropriate for applications where flux residues are
left in situ on electrical and electronic equipment.

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This document specifies a qualitative method for assessing the solubility of flux residues in a selected
solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 9454-1.
NOTE This test gives no assurance that post-cleaning residues, which may be present in sufficiently small
amounts to pass the test, will not be detrimental to the soldered assembly in the long term.

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This document specifies a method for estimating the tendency of a flux to spatter in use. It is a
qualitative (comparative) method and is only applicable to liquid fluxes, as defined in ISO 9454-1.
The method is not applicable to flux cored solder wire or to solder pastes.

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This part of IEC 62739 describes the selection methodology of an appropriate evaluating test
method for the erosion of the metal materials without or with surface processing intended to
be used for lead-free wave soldering equipment as a solder bath and other components which
are in contact with the molten solder.

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ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

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ISO 9455-13:2017 specifies a method for estimating the tendency of a flux to spatter in use. It is a qualitative (comparative) method and is only applicable to liquid fluxes, as defined in ISO 9454‑1.
The method is not applicable to flux cored solder wire or to solder pastes.

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ISO 9455-11:2017 specifies a qualitative method for assessing the solubility of flux residues in a selected solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 9454‑1.

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ISO 9455-15:2017 specifies a qualitative method for determination of the corrosive properties of flux residues on a copper substrate when subjected to controlled environmental conditions. The test is applicable to type 1 fluxes, as defined in ISO 9454‑1.

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This European Standard defines the requirements for the ordering, manufacture, testing, inspection and delivery of all forms of filler metal for brazing for aerospace applications. It shall be applied when referred to in the EN material standard unless otherwise specified on the drawing, order or inspection schedule.

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ISO 9455-11:2017 specifies a qualitative method for assessing the solubility of flux residues in a selected solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 9454‑1.

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ISO 9455-13:2017 specifies a method for estimating the tendency of a flux to spatter in use. It is a qualitative (comparative) method and is only applicable to liquid fluxes, as defined in ISO 9454‑1. The method is not applicable to flux cored solder wire or to solder pastes.

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ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

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ISO 9455-15:2017 specifies a qualitative method for determination of the corrosive properties of flux residues on a copper substrate when subjected to controlled environmental conditions. The test is applicable to type 1 fluxes, as defined in ISO 9454‑1.

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This European Standard defines the requirements for the ordering, manufacture, testing, inspection and delivery of all forms of filler metal for brazing for aerospace applications. It shall be applied when referred to in the EN material standard unless otherwise specified on the drawing, order or inspection schedule.

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This part of IEC 62739 provides an evaluating test method for the erosion of the metallic
materials with surface processing intended to be used for lead-free wave soldering equipment
as a solder bath and other components which are in contact with the molten solder. It aims at
prevention of an accident or a fire by predicting a setup and life of a suitable maintenance
cycle.

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This International Standard specifies the compositional ranges of a series of filler metals used for
brazing. The filler metals are divided into seven classes, related to their composition, but not necessarily
to the major element present.
NOTE 1 For the major element(s) present, see Annex A.
In the case of composite products, such as flux-coated rods, pastes or plastics tapes, this International
Standard covers only the filler metal that forms parts of such products. The melting temperatures
given in the tables are only approximate, as they necessarily vary within the compositional range of the
filler metal. Therefore, they are given only for information. Technical delivery conditions are given for
brazing filler metals and products containing brazing filler metals with other constituents such as flux
and/or binders.
NOTE 2 For some applications, e.g. precious metal jewellery, aerospace and dental, filler metals other than
those included in this International Standard are often used and these are covered by other International
Standards to which reference can be made.

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This International Standard specifies designations for filler materials for soldering and brazing, on
the basis of their chemical composition. For brazing materials only, the designation includes their
solidus/liquidus temperatures. This International Standard deals with the metallic part of filler
materials used in soldering and brazing products, e.g. foils, wires, rods, pastes, flux coated rods/wires,
flux cored rods/wires, etc.

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ISO 3677:2016 specifies designations for filler materials for soldering and brazing, on the basis of their chemical composition. For brazing materials only, the designation includes their solidus/liquidus temperatures. This International Standard deals with the metallic part of filler materials used in soldering and brazing products, e.g. foils, wires, rods, pastes, flux coated rods/wires, flux cored rods/wires, etc.

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ISO 17672:2016 specifies the compositional ranges of a series of filler metals used for brazing. The filler metals are divided into seven classes, related to their composition, but not necessarily to the major element present.

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ISO 3677:2016 specifies designations for filler materials for soldering and brazing, on the basis of their chemical composition. For brazing materials only, the designation includes their solidus/liquidus temperatures. This International Standard deals with the metallic part of filler materials used in soldering and brazing products, e.g. foils, wires, rods, pastes, flux coated rods/wires, flux cored rods/wires, etc.

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ISO 17672:2016 specifies the compositional ranges of a series of filler metals used for brazing. The filler metals are divided into seven classes, related to their composition, but not necessarily to the major element present.

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This part of ISO 9454-1 specifies a coding system for the classification of fluxes intended for use with
soft solders, according to their active fluxing ingredients, together with requirements for labelling
and packaging.

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ISO 9454-1:2016 specifies a coding system for the classification of fluxes intended for use with soft solders, according to their active fluxing ingredients, together with requirements for labelling and packaging.

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ISO 9454-1:2016 specifies a coding system for the classification of fluxes intended for use with soft solders, according to their active fluxing ingredients, together with requirements for labelling and packaging.

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This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, high-reliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11. Verification of manual soldering assemblies which are not described in this standard are performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard. This standard does not cover the qualification and acceptance of EQM and FM equipment with hand soldered connections. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03. The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of -55 °C to +85 °C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 °C, power transistors) in order to ensure that solder joints do not exceed 85 °C. This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST-00.

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This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, high-reliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11. Verification of manual soldering assemblies which are not described in this standard are performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard. This standard does not cover the qualification and acceptance of EQM and FM equipment with hand soldered connections. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03. The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of -55 °C to +85 °C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 °C, power transistors) in order to ensure that solder joints do not exceed 85 °C. This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST-00.

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This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double‐sided and multilayer boards are also defined.
This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS‐S‐ST‐00.

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This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double‐sided and multilayer boards are also defined.
This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS‐S‐ST‐00.

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EN IEC 61190-1-2 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1.

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This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

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This part of ISO 9455 specifies a method for the determination of the efficacy of a soft soldering flux. The method is known as the solder spread method of filler metal and is applicable to all flux classes defined in ISO 9454-1.

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