25.160.50 - Brazing and soldering
ICS 25.160.50 Details
Brazing and soldering
Hartloten Weichloten
Brasage
Trdo in mehko lotanje
General Information
e-Library Subscription
Create subscription and get permanent access to documents within 25.160.50 - Brazing and soldering
Currently subscription includes documents marked with .We are working on making all documents available within the subscription.
- 1 (current)
- 2
- 3
- 4
- 5
This document specifies a coding system for the classification and designation of solid and flux-cored solder wire, and the performance requirements to be met by flux-cored wire and its constituents. Requirements for sampling, labelling and packaging are also specified.
- Draft15 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies two methods for the determination of the flux content of a sample flux-cored solder wire.
- Draft8 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies designations for filler materials for brazing on the basis of their chemical composition. The designation includes their solidus/liquidus temperatures. This document applies to the metallic part of filler materials used in brazing products, for example foils, wires, rods, pastes, flux-coated rods or wires and flux-cored rods or wires.
- Draft6 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies two methods for the determination of the flux content of a sample flux-cored solder wire.
- Standard4 pagesEnglish languagesale 15% off
- Standard4 pagesFrench languagesale 15% off
This document specifies a coding system for the classification and designation of solid and flux-cored solder wire, and the performance requirements to be met by flux-cored wire and its constituents. Requirements for sampling, labelling and packaging are also specified.
- Standard11 pagesEnglish languagesale 15% off
- Standard11 pagesFrench languagesale 15% off
This document specifies the compositional ranges of a series of filler metals used for brazing. The filler metals are divided into seven classes, related to their composition but not necessarily to the major element present.
NOTE 1 For the major element(s) present, see Annex A.
In the case of composite products, such as flux-coated rods, pastes or plastics tapes, this document covers only the filler metal that forms parts of such products. The melting temperatures given in the tables are only approximate, as they necessarily vary within the compositional range of the filler metal. Therefore, they are given only for information. Technical delivery conditions are given for brazing filler metals and products containing brazing filler metals with other constituents such as flux and/or binders.
NOTE 2 For some applications, such as precious metal jewellery, aerospace and dental, filler metals other than those included in this document are often used. These are covered by other International Standards to which reference can be made.
- Draft26 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies designations for filler materials for brazing on the basis of their chemical composition. The designation includes their solidus/liquidus temperatures. This document applies to the metallic part of filler materials used in brazing products, for example foils, wires, rods, pastes, flux-coated rods or wires and flux-cored rods or wires.
- Standard2 pagesEnglish languagesale 15% off
- Standard2 pagesFrench languagesale 15% off
This document specifies the compositional ranges of a series of filler metals used for brazing. The filler metals are divided into seven classes, related to their composition but not necessarily to the major element present. NOTE 1 For the major element(s) present, see Annex A. In the case of composite products, such as flux-coated rods, pastes or plastics tapes, this document covers only the filler metal that forms parts of such products. The melting temperatures given in the tables are only approximate, as they necessarily vary within the compositional range of the filler metal. Therefore, they are given only for information. Technical delivery conditions are given for brazing filler metals and products containing brazing filler metals with other constituents such as flux and/or binders. NOTE 2 For some applications, such as precious metal jewellery, aerospace and dental, filler metals other than those included in this document are often used. These are covered by other International Standards to which reference can be made.
- Standard21 pagesEnglish languagesale 15% off
- Standard23 pagesFrench languagesale 15% off
This document specifies a method of testing for deleterious effects that can arise from flux residues
after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in
ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste
constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as
agreed between user and supplier (see ISO 9453).
This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the
soldering temperatures can be adjusted with agreement between tester and customer.
- Standard29 pagesEnglish languagesale 10% offe-Library read for1 day
This document details a classification of imperfections that can occur in brazing joints. In addition,
guidance is provided on quality levels and suggested limits for imperfections are detailed.
For requirements not covered by this document, reference can be made to other sources, such as
statutory regulations, codes of practice and technical delivery conditions.
No information is given on how imperfections are to be assessed in individual cases because this
depends on the requirements for the particular brazed joint. These imperfections are not always
detectable by the use of non-destructive testing alone.
This document covers only imperfections that can occur in connection with brazing without the effect
of any additional service loads. Only the type, shape and position of such imperfections are covered; no
indication is given of the conditions of occurrence or causes.
For requirements for brazed joints which are relevant and essential to the particular function of
the component, reference can be made to the relevant documentation, for example manufacturing
documents or procedure sheets.
It is important that these requirements be precisely prescribed and that conformity with them be
verifiable. Conformity can be established by testing either the brazed assembly itself or a test piece
produced under comparable conditions.
This document does not specify requirements for acceptance levels for imperfections, since these will
differ very markedly depending on the application, but it does suggest some quality levels which can be
of value in the absence of more detailed information.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).
This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.
- Standard29 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453). This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.
- Standard22 pagesEnglish languagesale 15% off
- Standard22 pagesFrench languagesale 15% off
This document details a classification of imperfections that can occur in brazing joints. In addition, guidance is provided on quality levels and suggested limits for imperfections are detailed.
For requirements not covered by this document, reference can be made to other sources, such as statutory regulations, codes of practice and technical delivery conditions.
No information is given on how imperfections are to be assessed in individual cases because this depends on the requirements for the particular brazed joint. These imperfections are not always detectable by the use of non-destructive testing alone.
This document covers only imperfections that can occur in connection with brazing without the effect of any additional service loads. Only the type, shape and position of such imperfections are covered; no indication is given of the conditions of occurrence or causes.
For requirements for brazed joints which are relevant and essential to the particular function of the component, reference can be made to the relevant documentation, for example manufacturing documents or procedure sheets.
It is important that these requirements be precisely prescribed and that conformity with them be verifiable. Conformity can be established by testing either the brazed assembly itself or a test piece produced under comparable conditions.
This document does not specify requirements for acceptance levels for imperfections, since these will differ very markedly depending on the application, but it does suggest some quality levels which can be of value in the absence of more detailed information.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
This document details a classification of imperfections that can occur in brazing joints. In addition, guidance is provided on quality levels and suggested limits for imperfections are detailed. For requirements not covered by this document, reference can be made to other sources, such as statutory regulations, codes of practice and technical delivery conditions. No information is given on how imperfections are to be assessed in individual cases because this depends on the requirements for the particular brazed joint. These imperfections are not always detectable by the use of non-destructive testing alone. This document covers only imperfections that can occur in connection with brazing without the effect of any additional service loads. Only the type, shape and position of such imperfections are covered; no indication is given of the conditions of occurrence or causes. For requirements for brazed joints which are relevant and essential to the particular function of the component, reference can be made to the relevant documentation, for example manufacturing documents or procedure sheets. It is important that these requirements be precisely prescribed and that conformity with them be verifiable. Conformity can be established by testing either the brazed assembly itself or a test piece produced under comparable conditions. This document does not specify requirements for acceptance levels for imperfections, since these will differ very markedly depending on the application, but it does suggest some quality levels which can be of value in the absence of more detailed information.
- Standard15 pagesEnglish languagesale 15% off
- Standard18 pagesFrench languagesale 15% off
This Standard specifies the processing and quality assurance requirements for
brazing processes for space flight applications. Brazing is understood as the
joining and sealing of materials by means of a solidification of a liquid filler
metal.
The term brazing in this standard is used as equivalent to soldering, in cases that
the filler materials have liquidus temperatures below 450 °C.
Brazing and soldering are allied processes to welding and this standard is
supplementing the standard for welding ECSS-Q-ST-70-39.
This standard does not cover requirements for:
• Joining processes by adhesive bonding (ECSS-Q-ST-70-16),
• Soldering for electronic assembly purposes (ECSS-Q-ST-70-61),
• Soldering used in hybrid manufacturing (ESCC 2566000).
The standard covers but is not limited to the following brazing processes:
• Torch brazing,
• Furnace brazing,
• Dip Brazing and Salt-bath brazing,
• Induction Brazing.
This Standard does not detail the brazing definition phase and brazing pre-
verification phase, including the derivation of design allowables.
This standard may be tailored for the specific characteristic and constraints of a
space project in conformance with ECSS-S-ST-00.
- Standard39 pagesEnglish languagesale 10% offe-Library read for1 day
2021-04-21: This EN is based on ECSS-Q-ST-70-40C
- Standard39 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies three test methods for investigating brazeability.
A spreading test shows testing method with measurement of the spread area of the filler metals.
A T-joint test describes a scheme to construct a T-shape design by the test pieces and a testing method.
A varying gap test describes a test piece and a testing method for assessing the influence of the various parameters which can influence brazing during manufacture as a function of clearances.
- Standard20 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies three test methods for investigating brazeability.
A spreading test shows testing method with measurement of the spread area of the filler metals.
A T-joint test describes a scheme to construct a T-shape design by the test pieces and a testing method.
A varying gap test describes a test piece and a testing method for assessing the influence of the various parameters which can influence brazing during manufacture as a function of clearances.
- Standard20 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies three quantitative methods for the determination of the ionic halide (excluding
fluoride) content of soldering fluxes. Halides are calculated as chlorides. A useful qualitative test
method for the detection of ionic halides is also described.
Method A is a potentiometric titration method for the determination of halide (excluding fluoride)
content and is applicable to flux classes 1 and 2, defined in ISO 9454-1. This method, which is considered
the reference method for these fluxes, is suitable for halide contents generally within the range of
0,05 % mass fraction to 2 % mass fraction in the non-volatile matter of the flux.
Method B is a titration method for the determination of the total halide (excluding fluoride) content
of water-soluble fluxes. It is applicable to flux classes 2122 to 2124, 3112 to 3114 and 3212 to 3214, as
defined in ISO 9454-1.
Method C is a titration method for the determination of the halide (excluding fluoride) content of watersoluble fluxes containing phosphates and is applicable to flux class 331, as defined in ISO 9454-1.
Method D is a qualitative test, using silver chromate test paper, for the presence of ionic halides. The
technique can be used for all classes of flux.
- Standard22 pagesEnglish languagesale 10% offe-Library read for1 day
Specifies a gravimetric method for the determination of the content of non-volatile matter in soft soldering fluxes. Applies to liquid and paste fluxes of type 1, as defined in ISO 9454-1.
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies three quantitative methods for the determination of the ionic halide (excluding fluoride) content of soldering fluxes. Halides are calculated as chlorides. A useful qualitative test method for the detection of ionic halides is also described.
Method A is a potentiometric titration method for the determination of halide (excluding fluoride) content and is applicable to flux classes 1 and 2, defined in ISO 9454-1. This method, which is considered the reference method for these fluxes, is suitable for halide contents generally within the range of 0,05 % mass fraction to 2 % mass fraction in the non-volatile matter of the flux.
Method B is a titration method for the determination of the total halide (excluding fluoride) content of water-soluble fluxes. It is applicable to flux classes 2122 to 2124, 3112 to 3114 and 3212 to 3214, as defined in ISO 9454-1.
Method C is a titration method for the determination of the halide (excluding fluoride) content of water-soluble fluxes containing phosphates and is applicable to flux class 331, as defined in ISO 9454-1.
Method D is a qualitative test, using silver chromate test paper, for the presence of ionic halides. The technique can be used for all classes of flux.
- Standard22 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies a gravimetric method for the determination of the content of non-volatile matter in soft soldering fluxes. It is applicable to liquid and paste fluxes of type 1, as defined in ISO 9454-1.
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies three quantitative methods for the determination of the ionic halide (excluding fluoride) content of soldering fluxes. Halides are calculated as chlorides. A useful qualitative test method for the detection of ionic halides is also described. Method A is a potentiometric titration method for the determination of halide (excluding fluoride) content and is applicable to flux classes 1 and 2, defined in ISO 9454-1. This method, which is considered the reference method for these fluxes, is suitable for halide contents generally within the range of 0,05 % mass fraction to 2 % mass fraction in the non-volatile matter of the flux. Method B is a titration method for the determination of the total halide (excluding fluoride) content of water-soluble fluxes. It is applicable to flux classes 2122 to 2124, 3112 to 3114 and 3212 to 3214, as defined in ISO 9454-1. Method C is a titration method for the determination of the halide (excluding fluoride) content of water-soluble fluxes containing phosphates and is applicable to flux class 331, as defined in ISO 9454-1. Method D is a qualitative test, using silver chromate test paper, for the presence of ionic halides. The technique can be used for all classes of flux.
- Standard15 pagesEnglish languagesale 15% off
- Standard15 pagesFrench languagesale 15% off
This document specifies a gravimetric method for the determination of the content of non-volatile matter in soft soldering fluxes. It is applicable to liquid and paste fluxes of type 1, as defined in ISO 9454-1.
- Standard4 pagesEnglish languagesale 15% off
- Standard4 pagesFrench languagesale 15% off
This standard defines:
- the basic requirements for the verification and approval of automatic machine w ave soldering for use in spacecraft hardware. The process requirements for w ave soldering of doublesided and multilayer boards are also defined.
- the technical requirements and quality assurance provisions for the manufacture and verification of manuallysoldered, high-reliability electrical connections.
- the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
- the acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to w ithstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight.
- the proper tools, correct materials, design and w orkmanshipt. Workmanship standards are included to permit discrimination betw een proper and improper work.
SCOPE
This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
The Standard defines w orkmanship requirements, the acceptance and rejection criteria for high-reliability assemblies intended to withstand normal terrestrial conditions and the environment imposed by space flight.
The mounting and supporting of components, terminals and conductors specified in this standard applies only to assemblies designed to continuously operate over the mission w ithin the temperature limits of -55 °C to +85 °C at solder joint level.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-60 (equivalent to EN 16602-70-60) and ECSS-Q-ST-70-12 (equivalent to EN 16602-70-12).
This Standard does not cover the qualification and acceptance of the EQM and FM equipment w ith high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
This Standard does not cover verification of thermal properties for component assembly.
This Standard does not cover pressfit connectors.
The qualification and acceptance tests of equipment manufactured in accordance w ith this Standard are covered by ECSS-EST-10-03 (equivalent to EN 16603-10-03).
- Standard253 pagesEnglish languagesale 10% offe-Library read for1 day
This standard defines:
- the basic requirements for the verification and approval of automatic machine w ave soldering for use in spacecraft hardware. The process requirements for w ave soldering of doublesided and multilayer boards are also defined.
- the technical requirements and quality assurance provisions for the manufacture and verification of manuallysoldered, high-reliability electrical connections.
- the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
- the acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to w ithstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight.
- the proper tools, correct materials, design and w orkmanshipt. Workmanship standards are included to permit discrimination betw een proper and improper work.
SCOPE
This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
The Standard defines w orkmanship requirements, the acceptance and rejection criteria for high-reliability assemblies intended to withstand normal terrestrial conditions and the environment imposed by space flight.
The mounting and supporting of components, terminals and conductors specified in this standard applies only to assemblies designed to continuously operate over the mission w ithin the temperature limits of -55 °C to +85 °C at solder joint level.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-60 (equivalent to EN 16602-70-60) and ECSS-Q-ST-70-12 (equivalent to EN 16602-70-12).
This Standard does not cover the qualification and acceptance of the EQM and FM equipment w ith high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
This Standard does not cover verification of thermal properties for component assembly.
This Standard does not cover pressfit connectors.
The qualification and acceptance tests of equipment manufactured in accordance w ith this Standard are covered by ECSS-EST-10-03 (equivalent to EN 16603-10-03).
- Standard253 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies the classification of fluxes used for brazing metals and characterizes these fluxes on the basis of their properties and use, and gives technical delivery conditions and health and safety precautions.
This document covers two classes of flux, FH and FL. Class FH is used for the brazing of heavy metals (steels, stainless steels, copper and its alloys, nickel and its alloys, precious metals, molybdenum and tungsten). Class FL is used for the brazing of aluminium and its alloys.
- Standard16 pagesEnglish languagesale 10% offe-Library read for1 day
The document classifies fluxes used for brazing metals and characterizes these fluxes on the basis of their properties and use, and gives technical delivery conditions and health and safety precautions.
- Standard16 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies the performance requirements for fluxes in solid, liquid and paste forms intended for use with soft solders.
NOTE 1 ISO 9454‑1 specifies the requirements for labelling and packaging as well as the coding system for the classification of the fluxes.
NOTE 2 Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria in Tables 1 and 2.
Requirements for these fluxes are agreed between the purchaser and the supplier.
- Standard14 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies a distillation method for the determination of the ammonia content of solid, paste or liquid fluxes. The method is applicable to fluxes of class 311 and 321 only, as defined in ISO 9454‑1.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper.
The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
- Standard21 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies three test methods for investigating brazeability. A spreading test shows testing method with measurement of the spread area of the filler metals. A T-joint test describes a scheme to construct a T-shape design by the test pieces and a testing method. A varying gap test describes a test piece and a testing method for assessing the influence of the various parameters which can influence brazing during manufacture as a function of clearances.
- Standard12 pagesEnglish languagesale 15% off
- Standard12 pagesEnglish languagesale 15% off
- Standard12 pagesFrench languagesale 15% off
- Standard12 pagesFrench languagesale 15% off
This document specifies two methods for the determination of the acid value of a flux of types 1 and 2 only, as defined in ISO 9454‑1.
Method A is a potentiometric titration method and is to be considered as the reference method.
Method B is an alternative, visual end‑point, titration method.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
The principle of the method specified is to distil a prepared flux solution with sodium hydroxide to expel the ammonia present in the flux, to pass the resulting distillate into a standard sulfuric acid solution, to titrate the excess acid with sodium hydroxide solution and to calculate the ammonia content of the flux. Applies to fluxes of class 3.1.1 only, as defined in ISO 9454-1.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies the performance requirements for fluxes in solid, liquid and paste forms
intended for use with soft solders.
NOTE 1 ISO 9454-1 specifies the requirements for labelling and packaging as well as the coding system for the
classification of the fluxes.
NOTE 2 Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria
in Tables 1 and 2.
Requirements for these fluxes are agreed between the purchaser and the supplier.
- Standard14 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper.
The test is applicable to all fluxes of type 1 as defined in ISO 9454-1.
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies the requirements for chemical composition for soft solder alloys containing
two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
- Standard21 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies the performance requirements for fluxes in solid, liquid and paste forms intended for use with soft solders. NOTE 1 ISO 9454‑1 specifies the requirements for labelling and packaging as well as the coding system for the classification of the fluxes. NOTE 2 Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria in Tables 1 and 2. Requirements for these fluxes are agreed between the purchaser and the supplier.
- Standard6 pagesEnglish languagesale 15% off
- Standard6 pagesEnglish languagesale 15% off
- Standard7 pagesFrench languagesale 15% off
- Standard7 pagesFrench languagesale 15% off
This document specifies a distillation method for the determination of the ammonia content of solid, paste or liquid fluxes. The method is applicable to fluxes of class 311 and 321 only, as defined in ISO 9454‑1.
- Standard6 pagesEnglish languagesale 15% off
- Standard6 pagesEnglish languagesale 15% off
- Standard6 pagesFrench languagesale 15% off
- Standard6 pagesFrench languagesale 15% off
This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.
- Standard4 pagesEnglish languagesale 15% off
- Standard4 pagesEnglish languagesale 15% off
- Standard5 pagesFrench languagesale 15% off
- Standard5 pagesFrench languagesale 15% off
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
- Standard13 pagesEnglish languagesale 15% off
- Standard13 pagesEnglish languagesale 15% off
- Standard13 pagesFrench languagesale 15% off
- Standard13 pagesFrench languagesale 15% off
This document specifies the classification of fluxes used for brazing metals and characterizes these fluxes on the basis of their properties and use, and gives technical delivery conditions and health and safety precautions. This document covers two classes of flux, FH and FL. Class FH is used for the brazing of heavy metals (steels, stainless steels, copper and its alloys, nickel and its alloys, precious metals, molybdenum and tungsten). Class FL is used for the brazing of aluminium and its alloys.
- Standard9 pagesEnglish languagesale 15% off
- Standard9 pagesEnglish languagesale 15% off
- Standard10 pagesFrench languagesale 15% off
- Standard10 pagesFrench languagesale 15% off
- Standard10 pagesFrench languagesale 15% off
This document specifies two methods for the determination of the acid value of a flux of types 1 and 2
only, as defined in ISO 9454-1.
Method A is a potentiometric titration method and is to be considered as the reference method.
Method B is an alternative, visual end‑point, titration method.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454‑1.
NOTE It is hoped that future developments using improved techniques for obtaining a reproducible range of test surfaces will enable this method for assessing flux efficacy to be quantitative. For this reason, several alternative procedures for preparing the surface of the test piece are included in the present method.
- Standard26 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454-1.
- Standard26 pagesEnglish languagesale 10% offe-Library read for1 day
This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454‑1. NOTE It is hoped that future developments using improved techniques for obtaining a reproducible range of test surfaces will enable this method for assessing flux efficacy to be quantitative. For this reason, several alternative procedures for preparing the surface of the test piece are included in the present method.
- Standard19 pagesEnglish languagesale 15% off
- Standard19 pagesEnglish languagesale 15% off
- Standard19 pagesFrench languagesale 15% off
- Standard19 pagesFrench languagesale 15% off
This document specifies two methods for the determination of the acid value of a flux of types 1 and 2 only, as defined in ISO 9454‑1. Method A is a potentiometric titration method and is to be considered as the reference method. Method B is an alternative, visual end‑point, titration method.
- Standard6 pagesEnglish languagesale 15% off
- Standard6 pagesEnglish languagesale 15% off
- Standard7 pagesFrench languagesale 15% off
- Standard7 pagesFrench languagesale 15% off
This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Examples of special
solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy
solder powders.
- Standard46 pagesEnglish languagesale 10% offe-Library read for1 day
ISO 9455-13:2017 specifies a method for estimating the tendency of a flux to spatter in use. It is a qualitative (comparative) method and is only applicable to liquid fluxes, as defined in ISO 9454‑1.
The method is not applicable to flux cored solder wire or to solder pastes.
- Standard10 pagesEnglish languagesale 10% offe-Library read for1 day
- 1 (current)
- 2
- 3
- 4
- 5