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25.160.50 - Brazing and soldering

ICS 25.160.50 Details

Brazing and soldering

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Brasage

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25.160 - Welding, brazing and soldering

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Standardization Organization
Technical Committee
Directive
Mandate
50
SIST
SIST EN 16602-70-40:2023(Main)
Space product assurance - Processing and quality assurance requirements for hard brazing of metallic materials for flight hardware
EN 16602-70-40:2023

This Standard specifies the processing and quality assurance requirements for
brazing processes for space flight applications. Brazing is understood as the
joining and sealing of materials by means of a solidification of a liquid filler
metal.
The term brazing in this standard is used as equivalent to soldering, in cases that
the filler materials have liquidus temperatures below 450 °C.
Brazing and soldering are allied processes to welding and this standard is
supplementing the standard for welding ECSS-Q-ST-70-39.
This standard does not cover requirements for:
• Joining processes by adhesive bonding (ECSS-Q-ST-70-16),
• Soldering for electronic assembly purposes (ECSS-Q-ST-70-61),
• Soldering used in hybrid manufacturing (ESCC 2566000).
The standard covers but is not limited to the following brazing processes:
• Torch brazing,
• Furnace brazing,
• Dip Brazing and Salt-bath brazing,
• Induction Brazing.
This Standard does not detail the brazing definition phase and brazing pre-
verification phase, including the derivation of design allowables.
This standard may be tailored for the specific characteristic and constraints of a
space project in conformance with ECSS-S-ST-00.

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CEN
EN 16602-70-40:2023(Main)
Space product assurance - Processing and quality assurance requirements for hard brazing of metallic materials for flight hardware
SIST EN 16602-70-40:2023

2021-04-21: This EN is based on ECSS-Q-ST-70-40C

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SIST
SIST EN ISO 5179:2023(Main)
Investigation of brazeability with spreading and gap-filling test (ISO 5179:2021)
EN ISO 5179:2023

This document specifies three test methods for investigating brazeability.
A spreading test shows testing method with measurement of the spread area of the filler metals.
A T-joint test describes a scheme to construct a T-shape design by the test pieces and a testing method.
A varying gap test describes a test piece and a testing method for assessing the influence of the various parameters which can influence brazing during manufacture as a function of clearances.

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CEN
EN ISO 5179:2023(Main)
Investigation of brazeability with spreading and gap-filling test (ISO 5179:2021)
SIST EN ISO 5179:2023

This document specifies three test methods for investigating brazeability.
A spreading test shows testing method with measurement of the spread area of the filler metals.
A T-joint test describes a scheme to construct a T-shape design by the test pieces and a testing method.
A varying gap test describes a test piece and a testing method for assessing the influence of the various parameters which can influence brazing during manufacture as a function of clearances.

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SIST
SIST EN ISO 9455-6:2023(Main)
Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:2022)
EN ISO 9455-6:2022

This document specifies three quantitative methods for the determination of the ionic halide (excluding
fluoride) content of soldering fluxes. Halides are calculated as chlorides. A useful qualitative test
method for the detection of ionic halides is also described.
Method A is a potentiometric titration method for the determination of halide (excluding fluoride)
content and is applicable to flux classes 1 and 2, defined in ISO 9454-1. This method, which is considered
the reference method for these fluxes, is suitable for halide contents generally within the range of
0,05 % mass fraction to 2 % mass fraction in the non-volatile matter of the flux.
Method B is a titration method for the determination of the total halide (excluding fluoride) content
of water-soluble fluxes. It is applicable to flux classes 2122 to 2124, 3112 to 3114 and 3212 to 3214, as
defined in ISO 9454-1.
Method C is a titration method for the determination of the halide (excluding fluoride) content of watersoluble fluxes containing phosphates and is applicable to flux class 331, as defined in ISO 9454-1.
Method D is a qualitative test, using silver chromate test paper, for the presence of ionic halides. The
technique can be used for all classes of flux.

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SIST EN ISO 9455-1:2023(Main)
Soft soldering fluxes - Test methods - Part 1: Determination of non-volatile matter, gravimetric method (ISO 9455-1:2022)
EN ISO 9455-1:2022

Specifies a gravimetric method for the determination of the content of non-volatile matter in soft soldering fluxes. Applies to liquid and paste fluxes of type 1, as defined in ISO 9454-1.

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CEN
EN ISO 9455-6:2022(Main)
Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:2022)
SIST EN ISO 9455-6:2023

This document specifies three quantitative methods for the determination of the ionic halide (excluding fluoride) content of soldering fluxes. Halides are calculated as chlorides. A useful qualitative test method for the detection of ionic halides is also described.
Method A is a potentiometric titration method for the determination of halide (excluding fluoride) content and is applicable to flux classes 1 and 2, defined in ISO 9454-1. This method, which is considered the reference method for these fluxes, is suitable for halide contents generally within the range of 0,05 % mass fraction to 2 % mass fraction in the non-volatile matter of the flux.
Method B is a titration method for the determination of the total halide (excluding fluoride) content of water-soluble fluxes. It is applicable to flux classes 2122 to 2124, 3112 to 3114 and 3212 to 3214, as defined in ISO 9454-1.
Method C is a titration method for the determination of the halide (excluding fluoride) content of water-soluble fluxes containing phosphates and is applicable to flux class 331, as defined in ISO 9454-1.
Method D is a qualitative test, using silver chromate test paper, for the presence of ionic halides. The technique can be used for all classes of flux.

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CEN
EN ISO 9455-1:2022(Main)
Soft soldering fluxes - Test methods - Part 1: Determination of non-volatile matter, gravimetric method (ISO 9455-1:2022)
SIST EN ISO 9455-1:2023

This document specifies a gravimetric method for the determination of the content of non-volatile matter in soft soldering fluxes. It is applicable to liquid and paste fluxes of type 1, as defined in ISO 9454-1.

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ISO
ISO 9455-6:2022(Main)
Soft soldering fluxes — Test methods — Part 6: Determination and detection of halide (excluding fluoride) content

This document specifies three quantitative methods for the determination of the ionic halide (excluding fluoride) content of soldering fluxes. Halides are calculated as chlorides. A useful qualitative test method for the detection of ionic halides is also described. Method A is a potentiometric titration method for the determination of halide (excluding fluoride) content and is applicable to flux classes 1 and 2, defined in ISO 9454-1. This method, which is considered the reference method for these fluxes, is suitable for halide contents generally within the range of 0,05 % mass fraction to 2 % mass fraction in the non-volatile matter of the flux. Method B is a titration method for the determination of the total halide (excluding fluoride) content of water-soluble fluxes. It is applicable to flux classes 2122 to 2124, 3112 to 3114 and 3212 to 3214, as defined in ISO 9454-1. Method C is a titration method for the determination of the halide (excluding fluoride) content of water-soluble fluxes containing phosphates and is applicable to flux class 331, as defined in ISO 9454-1. Method D is a qualitative test, using silver chromate test paper, for the presence of ionic halides. The technique can be used for all classes of flux.

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ISO
ISO 9455-1:2022(Main)
Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method

This document specifies a gravimetric method for the determination of the content of non-volatile matter in soft soldering fluxes. It is applicable to liquid and paste fluxes of type 1, as defined in ISO 9454-1.

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SIST
SIST EN 16602-70-61:2022(Main)
Space product assurance - High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections
EN 16602-70-61:2022

This standard defines:
- the basic requirements for the verification and approval of automatic machine w ave soldering for use in spacecraft hardware. The process requirements for w ave soldering of doublesided and multilayer boards are also defined.
- the technical requirements and quality assurance provisions for the manufacture and verification of manuallysoldered, high-reliability electrical connections.
- the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
- the acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to w ithstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight.
- the proper tools, correct materials, design and w orkmanshipt. Workmanship standards are included to permit discrimination betw een proper and improper work.
SCOPE
This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
The Standard defines w orkmanship requirements, the acceptance and rejection criteria for high-reliability assemblies intended to withstand normal terrestrial conditions and the environment imposed by space flight.
The mounting and supporting of components, terminals and conductors specified in this standard applies only to assemblies designed to continuously operate over the mission w ithin the temperature limits of -55 °C to +85 °C at solder joint level.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-60 (equivalent to EN 16602-70-60) and ECSS-Q-ST-70-12 (equivalent to EN 16602-70-12).
This Standard does not cover the qualification and acceptance of the EQM and FM equipment w ith high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
This Standard does not cover verification of thermal properties for component assembly.
This Standard does not cover pressfit connectors.
The qualification and acceptance tests of equipment manufactured in accordance w ith this Standard are covered by ECSS-EST-10-03 (equivalent to EN 16603-10-03).

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CEN
EN 16602-70-61:2022(Main)
Space product assurance - High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections
SIST EN 16602-70-61:2022

This standard defines:
- the basic requirements for the verification and approval of automatic machine w ave soldering for use in spacecraft hardware. The process requirements for w ave soldering of doublesided and multilayer boards are also defined.
- the technical requirements and quality assurance provisions for the manufacture and verification of manuallysoldered, high-reliability electrical connections.
- the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
- the acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to w ithstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight.
- the proper tools, correct materials, design and w orkmanshipt. Workmanship standards are included to permit discrimination betw een proper and improper work.
SCOPE
This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
The Standard defines w orkmanship requirements, the acceptance and rejection criteria for high-reliability assemblies intended to withstand normal terrestrial conditions and the environment imposed by space flight.
The mounting and supporting of components, terminals and conductors specified in this standard applies only to assemblies designed to continuously operate over the mission w ithin the temperature limits of -55 °C to +85 °C at solder joint level.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-60 (equivalent to EN 16602-70-60) and ECSS-Q-ST-70-12 (equivalent to EN 16602-70-12).
This Standard does not cover the qualification and acceptance of the EQM and FM equipment w ith high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
This Standard does not cover verification of thermal properties for component assembly.
This Standard does not cover pressfit connectors.
The qualification and acceptance tests of equipment manufactured in accordance w ith this Standard are covered by ECSS-EST-10-03 (equivalent to EN 16603-10-03).

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CEN
EN ISO 18496:2021(Main)
Brazing - Fluxes for brazing - Classification and technical delivery conditions (ISO 18496:2020)
SIST EN ISO 18496:2022

This document specifies the classification of fluxes used for brazing metals and characterizes these fluxes on the basis of their properties and use, and gives technical delivery conditions and health and safety precautions.
This document covers two classes of flux, FH and FL. Class FH is used for the brazing of heavy metals (steels, stainless steels, copper and its alloys, nickel and its alloys, precious metals, molybdenum and tungsten). Class FL is used for the brazing of aluminium and its alloys.

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SIST EN ISO 18496:2022(Main)
Brazing - Fluxes for brazing - Classification and technical delivery conditions (ISO 18496:2020)
EN ISO 18496:2021

The document classifies fluxes used for brazing metals and characterizes these fluxes on the basis of their properties and use, and gives technical delivery conditions and health and safety precautions.

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EN ISO 9454-2:2020(Main)
Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:2020)
SIST EN ISO 9454-2:2020

This document specifies the performance requirements for fluxes in solid, liquid and paste forms intended for use with soft solders.
NOTE 1    ISO 9454‑1 specifies the requirements for labelling and packaging as well as the coding system for the classification of the fluxes.
NOTE 2    Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria in Tables 1 and 2.
Requirements for these fluxes are agreed between the purchaser and the supplier.

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EN ISO 9455-9:2020(Main)
Soft soldering fluxes - Test methods - Part 9: Determination of ammonia content (ISO 9455-9:2020)
SIST EN ISO 9455-9:2020

This document specifies a distillation method for the determination of the ammonia content of solid, paste or liquid fluxes. The method is applicable to fluxes of class 311 and 321 only, as defined in ISO 9454‑1.

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EN ISO 9455-5:2020(Main)
Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2020)
SIST EN ISO 9455-5:2020

This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper.
The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.

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CEN
EN ISO 9453:2020(Main)
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
SIST EN ISO 9453:2020

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.

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ISO
ISO 5179:2021(Main)
Investigation of brazeability with spreading and gap-filling test

This document specifies three test methods for investigating brazeability. A spreading test shows testing method with measurement of the spread area of the filler metals. A T-joint test describes a scheme to construct a T-shape design by the test pieces and a testing method. A varying gap test describes a test piece and a testing method for assessing the influence of the various parameters which can influence brazing during manufacture as a function of clearances.

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EN ISO 9455-3:2020(Main)
Soft soldering fluxes - Test methods - Part 3: Determination of acid value, potentiometric and visual titration methods (ISO 9455-3:2019)
SIST EN ISO 9455-3:2020

This document specifies two methods for the determination of the acid value of a flux of types 1 and 2 only, as defined in ISO 9454‑1.
Method A is a potentiometric titration method and is to be considered as the reference method.
Method B is an alternative, visual end‑point, titration method.

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SIST EN ISO 9454-2:2020(Main)
Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:2020)
EN ISO 9454-2:2020

This document specifies the performance requirements for fluxes in solid, liquid and paste forms
intended for use with soft solders.
NOTE 1 ISO 9454-1 specifies the requirements for labelling and packaging as well as the coding system for the
classification of the fluxes.
NOTE 2 Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria
in Tables 1 and 2.
Requirements for these fluxes are agreed between the purchaser and the supplier.

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SIST
SIST EN ISO 9455-9:2020(Main)
Soft soldering fluxes - Test methods - Part 9: Determination of ammonia content (ISO 9455-9:2020)
EN ISO 9455-9:2020

The principle of the method specified is to distil a prepared flux solution with sodium hydroxide to expel the ammonia present in the flux, to pass the resulting distillate into a standard sulfuric acid solution, to titrate the excess acid with sodium hydroxide solution and to calculate the ammonia content of the flux. Applies to fluxes of class 3.1.1 only, as defined in ISO 9454-1.

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SIST
SIST EN ISO 9455-5:2020(Main)
Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2020)
EN ISO 9455-5:2020

This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper.
The test is applicable to all fluxes of type 1 as defined in ISO 9454-1.

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SIST
SIST EN ISO 9453:2020(Main)
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
EN ISO 9453:2020

This document specifies the requirements for chemical composition for soft solder alloys containing
two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.

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ISO
ISO 9455-9:2020(Main)
Soft soldering fluxes — Test methods — Part 9: Determination of ammonia content

This document specifies a distillation method for the determination of the ammonia content of solid, paste or liquid fluxes. The method is applicable to fluxes of class 311 and 321 only, as defined in ISO 9454‑1.

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ISO
ISO 9454-2:2020(Main)
Soft soldering fluxes — Classification and requirements — Part 2: Performance requirements

This document specifies the performance requirements for fluxes in solid, liquid and paste forms intended for use with soft solders. NOTE 1 ISO 9454‑1 specifies the requirements for labelling and packaging as well as the coding system for the classification of the fluxes. NOTE 2 Some of the fluxes intended for inert gas and vapour phase soldering may not pass some of the criteria in Tables 1 and 2. Requirements for these fluxes are agreed between the purchaser and the supplier.

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ISO
ISO 9455-5:2020(Main)
Soft soldering fluxes — Test methods — Part 5: Copper mirror test

This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.

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ISO
ISO 9453:2020(Main)
Soft solder alloys — Chemical compositions and forms

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.

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ISO
ISO 18496:2020(Main)
Brazing — Fluxes for brazing — Classification and technical delivery conditions

This document specifies the classification of fluxes used for brazing metals and characterizes these fluxes on the basis of their properties and use, and gives technical delivery conditions and health and safety precautions. This document covers two classes of flux, FH and FL. Class FH is used for the brazing of heavy metals (steels, stainless steels, copper and its alloys, nickel and its alloys, precious metals, molybdenum and tungsten). Class FL is used for the brazing of aluminium and its alloys.

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SIST
SIST EN ISO 9455-3:2020(Main)
Soft soldering fluxes - Test methods - Part 3: Determination of acid value, potentiometric and visual titration methods (ISO 9455-3:2019)
EN ISO 9455-3:2020

This document specifies two methods for the determination of the acid value of a flux of types 1 and 2
only, as defined in ISO 9454-1.
Method A is a potentiometric titration method and is to be considered as the reference method.
Method B is an alternative, visual end‑point, titration method.

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CEN
EN ISO 9455-16:2019(Main)
Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2019)
SIST EN ISO 9455-16:2020

This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454‑1.
NOTE       It is hoped that future developments using improved techniques for obtaining a reproducible range of test surfaces will enable this method for assessing flux efficacy to be quantitative. For this reason, several alternative procedures for preparing the surface of the test piece are included in the present method.

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SIST
SIST EN ISO 9455-16:2020(Main)
Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2019)
EN ISO 9455-16:2019

This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454-1.

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ISO
ISO 9455-16:2019(Main)
Soft soldering fluxes — Test methods — Part 16: Flux efficacy test, wetting balance method

This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454‑1. NOTE It is hoped that future developments using improved techniques for obtaining a reproducible range of test surfaces will enable this method for assessing flux efficacy to be quantitative. For this reason, several alternative procedures for preparing the surface of the test piece are included in the present method.

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ISO 9455-3:2019(Main)
Soft soldering fluxes — Test methods — Part 3: Determination of acid value, potentiometric and visual titration methods

This document specifies two methods for the determination of the acid value of a flux of types 1 and 2 only, as defined in ISO 9454‑1. Method A is a potentiometric titration method and is to be considered as the reference method. Method B is an alternative, visual end‑point, titration method.

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SIST
SIST EN IEC 61190-1-3:2018(Main)
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
EN IEC 61190-1-3:2018

This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Examples of special
solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy
solder powders.

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CEN
EN ISO 9455-14:2017(Main)
Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)
SIST EN ISO 9455-14:2018

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

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EN ISO 9455-13:2017(Main)
Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering (ISO 9455-13:2017)
SIST EN ISO 9455-13:2018

ISO 9455-13:2017 specifies a method for estimating the tendency of a flux to spatter in use. It is a qualitative (comparative) method and is only applicable to liquid fluxes, as defined in ISO 9454‑1.
The method is not applicable to flux cored solder wire or to solder pastes.

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EN ISO 9455-11:2017(Main)
Soft soldering fluxes - Test methods - Part 11: Solubility of flux residues (ISO 9455-11:2017)
SIST EN ISO 9455-11:2018

ISO 9455-11:2017 specifies a qualitative method for assessing the solubility of flux residues in a selected solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 9454‑1.

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EN ISO 9455-15:2017(Main)
Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:2017)
SIST EN ISO 9455-15:2018

ISO 9455-15:2017 specifies a qualitative method for determination of the corrosive properties of flux residues on a copper substrate when subjected to controlled environmental conditions. The test is applicable to type 1 fluxes, as defined in ISO 9454‑1.

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CEN
EN 3875:2017(Main)
Aerospace series - Metallic materials, Filler metal for brazing - Technical specification
SIST EN 3875:2017

This European Standard defines the requirements for the ordering, manufacture, testing, inspection and delivery of all forms of filler metal for brazing for aerospace applications. It shall be applied when referred to in the EN material standard unless otherwise specified on the drawing, order or inspection schedule.

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SIST EN ISO 9455-13:2018(Main)
Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering (ISO 9455-13:2017)
EN ISO 9455-13:2017

This document specifies a method for estimating the tendency of a flux to spatter in use. It is a
qualitative (comparative) method and is only applicable to liquid fluxes, as defined in ISO 9454-1.
The method is not applicable to flux cored solder wire or to solder pastes.

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SIST EN ISO 9455-15:2018(Main)
Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:2017)
EN ISO 9455-15:2017

This document specifies a qualitative method for determination of the corrosive properties of flux
residues on a copper substrate when subjected to controlled environmental conditions. The test is
applicable to type 1 fluxes, as defined in ISO 9454-1.

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SIST EN ISO 9455-14:2018(Main)
Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)
EN ISO 9455-14:2017

This document specifies a qualitative method for the assessment of the tackiness of the residues of a
soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and
flux cored solder wires. The method is particularly appropriate for applications where flux residues are
left in situ on electrical and electronic equipment.

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SIST EN ISO 9455-11:2018(Main)
Soft soldering fluxes - Test methods - Part 11: Solubility of flux residues (ISO 9455-11:2017)
EN ISO 9455-11:2017

This document specifies a qualitative method for assessing the solubility of flux residues in a selected
solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 9454-1.
NOTE This test gives no assurance that post-cleaning residues, which may be present in sufficiently small
amounts to pass the test, will not be detrimental to the soldered assembly in the long term.

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SIST EN 62739-3:2018(Main)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test method
EN 62739-3:2017

This part of IEC 62739 describes the selection methodology of an appropriate evaluating test
method for the erosion of the metal materials without or with surface processing intended to
be used for lead-free wave soldering equipment as a solder bath and other components which
are in contact with the molten solder.

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SIST EN 3875:2017(Main)
Aerospace series - Metallic materials, Filler metal for brazing - Technical specification
EN 3875:2017

This European Standard defines the requirements for the ordering, manufacture, testing, inspection and delivery of all forms of filler metal for brazing for aerospace applications. It shall be applied when referred to in the EN material standard unless otherwise specified on the drawing, order or inspection schedule.

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ISO
ISO 9455-11:2017(Main)
Soft soldering fluxes — Test methods — Part 11: Solubility of flux residues

ISO 9455-11:2017 specifies a qualitative method for assessing the solubility of flux residues in a selected solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 9454‑1.

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ISO 9455-14:2017(Main)
Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

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ISO 9455-13:2017(Main)
Soft soldering fluxes — Test methods — Part 13: Determination of flux spattering

ISO 9455-13:2017 specifies a method for estimating the tendency of a flux to spatter in use. It is a qualitative (comparative) method and is only applicable to liquid fluxes, as defined in ISO 9454‑1. The method is not applicable to flux cored solder wire or to solder pastes.

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ISO 9455-15:2017(Main)
Soft soldering fluxes — Test methods — Part 15: Copper corrosion test

ISO 9455-15:2017 specifies a qualitative method for determination of the corrosive properties of flux residues on a copper substrate when subjected to controlled environmental conditions. The test is applicable to type 1 fluxes, as defined in ISO 9454‑1.

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