This part of IEC 63041 applies to piezoelectric sensors of resonator, delay-line and non acoustic types, which are used in physical and engineering sciences, chemistry and biochemistry, medical and environmental sciences, etc.
The purpose of this document is to specify the terms and definitions for the piezoelectric sensors, and to make sure from a technological perspective that users understand the state-of-art piezoelectric sensors and how to use them correctly.

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This part of IEC 62321 specifies the screening analysis of polybrominated biphenyls (PBBs), polybrominated diphenyl ethers (PBDEs), di-isobutyl phthalate (DIBP), di-n-butyl phthalate (DBP), benzylbutyl phthalate (BBP), di-(2-ethylhexyl) phthalate (DEHP), di-n-octyl phthalate (DNOP), di-isononyl phthalate (DINP), and di-isodecyl phthalate (DIDP) in polymers of electrotechnical products using the analytical technique of gas chromatography-mass spectrometry using a pyrolyser/thermal desorption accessory (Py/TD-GC-MS). This test method has been evaluated through the analysis of PP (polypropylene), PS (polystyrene), and PVC (polyvinyl chloride) materials containing deca-BDE between 100 mg/kg and 1 000 mg/kg and individual phthalates between 100 mg/kg to 4 000 mg/kg as depicted in Annex J. Use of the methods described in this document for other polymer types, PBBs (mono-deca), PBDEs (mono-deca) and phthalates or concentration ranges other than those specified above has not been specifically evaluated. This document has the status of a horizontal standard in accordance with IEC Guide 108 [1]1.

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This part of IEC 62321 specifies two techniques for the determination of hexabromocyclododecane (HBCDD) in polymers of electrotechnical products. The gas chromatography-mass spectrometry (GC-MS) test method is described in the normative part of this document. The GC-MS method is suitable for the determination of hexabromocyclododecane (HBCDD). A method using high-pressure liquid chromatography-mass spectrometry (HPLC-MS) is given in informative Annex A. These test methods have been evaluated for use with EPS (expanded polystyrene foam), XPS (extruded polystyrene foam) and ABS (acrylonitrile butadiene styrene) within the concentration ranges as specified in Table 1. The use of this method for other types of materials or concentration ranges outside those specified below has not been evaluated. [Table 1] This document has the status of a horizontal standard in accordance with IEC Guide 108.

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IEC 62906-5-1:2021(E) specifies the standard measurement conditions and measurement methods for front projection displays without screen which use lasers or laser hybrids as light sources. The hybrid light sources can use both lasers and spontaneous emission-based light sources. This document covers optical performance measurements for full-frame projection technologies such as digital micro mirror devices (DMDs), liquid crystal on silicon (LCOS), and liquid crystal display (LCD) projectors. Other displays, such as raster-scanned (flying spot) projection displays, are not included.

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IEC 62563-2:2021 establishes the performance CRITERIA and test frequencies for the ACCEPTANCE TESTS and CONSTANCY TESTS. The evaluation methods are defined in IEC 62563-1. The scope of this document is directed to practical tests that can be visually evaluated or measured using basic test equipment. This document applies to medical IMAGE DISPLAY SYSTEMS, which can display monochrome image information in the form of greyscale values on colour and greyscale IMAGE DISPLAY SYSTEMS. This document does not apply to information displays and to displays used solely for control of technical settings of all medical information.

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IEC TR 63396:2021(E) documents a method for the sound pressure level measurement on power capacitor units, by which the sound power level of power capacitor units is determined.
This method is applicable to shunt capacitor units and AC filter capacitor units for AC power systems with a nominal voltage of 1 kV and above and a frequency of 50 Hz or 60 Hz.
This method also applies to the DC filter capacitor units.
Other measurements on power capacitor units can be implemented with reference to this method.

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IEC 61051-2:2021 is a sectional specification and is applicable to metal oxide varistors with symmetrical voltage-current characteristics for use in electronic equipment connected to any AC or DC supply system.
These varistors are designed to protect electronic and other sensitive equipment from high transient surges. Varistors under the scope of this sectional specification are not intended to give primary protection against lightning surges.
These varistors have metallic connections and are intended to be mounted as through hole component or directly on to printed boards.
The object of this document is to prescribe preferred ratings and characteristics and to select from IEC 61051-1 the appropriate quality assessment procedures, tests and measuring methods, and to give general performance requirements for this type of varistors.
This edition includes the following significant technical changes with respect to the previous edition:  
revision for the structure in accordance with ISO/IEC Directives, Part 2) to the extent practicable, and for harmonizing with IEC 61051-1:2018;
Annex X has been added for comparison with the previous edition;
two lists of preferred voltage ratings for disk type and SMD type varistors have been added;
permissible numbers of non-conforming items have been set to zero (zero fault) in the test schedule in 8.4.3.

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IEC PAS 61182-2:2014(E) specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

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IEC 63171-6:2021 covers 2-way and 4-way (data/power), shielded, free and fixed connectors for data transmission with frequencies up to 600 MHz and specifies the common dimensions, mechanical, electrical and transmission characteristics and environmental requirements as well as test specifications.
This second edition cancels and replaces the first edition published in 2020. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Mating conditions changed, see Figure 2, Figure 4, Figure 13, Figure 15, Figure 19 and Figure 21.
b) Voltage proof requirement added, 2 250 V DC, see 5.7.2.
c) Mechanical shock requirement added, see 5.7.6 (the requirement itself already was specified indirectly by Ed1 due to the specification of the test EP3 of Table 14 which is still identical to Ed1).
d) Styles added, 6P-M8CI and 6J-M8CI, see Table 1.

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This part of IEC 60444 applies to the measurements of drive level dependence (DLD) of quartz crystal units. Two test methods (A and C) and one referential method (B) are described. "Method A", based on the π-network according to IEC 60444-5, can be used in the complete frequency range covered by this part of IEC 60444. “Reference Method B”, based on the π-network or reflection method according to IEC 60444-5 or IEC 60444-8 can be used in the complete frequency range covered by this part of IEC 60444. “Method C”, an oscillator method, is suitable for measurements of fundamental mode crystal units in larger quantities with fixed conditions. NOTE The measurement methods specified in this document are not only applicable to AT-cut, but also to other crystal cuts and vibration modes, such as doubly rotated cuts (IT,SC) and to tuning fork crystal units (by using a high impedance test fixture).

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IEC 62899-202-4:2021(E) defines the terminology and measurement methods for the properties of stretchable printed layers, such as conductive ink, for forming stretchable conductors by printing, stretchable conductive films obtained from conductive ink, and stretchable printed wiring consisted by conductive ink with insulator.
Stretchable printed layers (conductive and insulating) handled by this document apply to the stretchable electric wiring printed on stretchable substrates, for example fabric integrated wearable devices, skin patchable devices, and so on.

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IEC 62830-8:2021(E) specifies terms, definitions, symbols, test, and evaluation methods used to determine the performance characteristics of flexible and stretchable supercapacitor for practical use in low power electronics such as energy storage devices for energy harvesting, flexible and stretchable electronics, low-power devices, IoT applications, etc. This document is applicable to all the flexible and stretchable supercapacitor for consumers and manufacturers, without any limitations of device technology and size.

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IEC TR 60286-3-4:2021(E) considers the proposed requirements for emboss taping for the Auto Loading Feeder mechanism to mount electric components without leads or with stump type leads used for electric circuits. This document is applicable to the embossed carrier tape, with single round sprocket holes, with tape pitches of 2 mm or more (nominal tape width: 8 mm only) among the tapes of Type 2a in IEC 60286-3.

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IEC TR 60286-3-3:2021(E) describes the possible requirements for paper taping for the Auto Loading Feeder mechanism to mount electronic components without leads or with stump type leads used for electric circuits. This document is applicable to the punched carrier tape with the bottom cover tape (nominal tape width: 8 mm only) among the tapes of Type 1a, and the pressed carrier tape (nominal tape width: 8 mm) of Type 1b in IEC 60286-3.

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ISO/IEC PAS 16898:2012 specifies a designation system as well as the shapes and dimensions for secondary lithium-ion cells for integration into battery packs and systems used in electrically propelled road vehicles including the position of the terminals and any over-pressure safety device (OPSD). It is related to cylindrical, prismatic and pouch cells.
The cell designation according to ISO/IEC PAS 16898:2012 is intended to be applied to the cells used for electrically propelled road vehicles. ISO/IEC PAS 16898:2012 does not apply to cells specifically used for mopeds, motorcycles and vehicles not primarily defined as road vehicles, i.e. material handling trucks or forklifts.
The cell dimensions listed in ISO/IEC PAS 16898:2012 are recommended but not restricted for use in passenger cars up to 3,5 t.
The inner design, the cell chemistry, the electrical characteristics and any further properties of the cells are not defined in ISO/IEC PAS 16898:2012.

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IEC 62899-201-2:2021(E) defines measurement methods for the properties of stretchable substrates, in order to use evaluating stretchable functional layers (conductive, semiconducting, and insulating) formed by printing technologies. If the same types of materials as the substrates are used for the cover lay film, they are also subjected to the measurement defined in this document.
Stretchable substrates handled by this document apply to substrates subjected to repeated bending with wiring elements demanding a high level of performance, such as fabric integrated wearable devices or skin patchable devices.
This document does not define the required characteristics of the stretchable substrate. It provides test methods to characterize (pre-qualify) the substrates that are intended to be used for printing conductors and insulators for the purposes of manufacturing stretchable layers or structures.

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IEC TR 60747-5-12:2021(E) discusses the terminology and the measuring methods of optoelectronic efficiencies of single light emitting diode (LED) chip or package without phosphor. White LEDs for lighting applications are out of the scope of this part.
This technical report provides guidance on
- terminology of optoelectronic efficiencies of single LED chip or package without phosphor, such as the power efficiency (PE), the external quantum efficiency (EQE), the voltage efficiency (VE), the light extraction efficiency (LEE), the internal quantum efficiency (IQE), the injection efficiency (IE), and the radiative efficiency (RE);
- test methods of optoelectronic efficiencies of the PE, the EQE, the VE, the LEE, and the IQE;
- review of various IQE measurement methods reported so far in view of accuracy and practical applicability;
- the measuring method of the LED IQE based on the temperature-dependent electroluminescence (TDEL);
- the measuring method of the LED IQE based on the room-temperature reference-point method (RTRM);
- the measuring method of the radiative and nonradiative currents of an LED;
- the relationship between the IQE and the VE, which leads to introduction of a new LED efficiency, the active efficiency (AE) as AE = VE × IQE.

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This document defines the relevant properties for coupling lightwaves into and out of integrated optical chips (IOC) and chips with photonic integrated circuits (PIC). This document mainly focuses on butt coupling via the waveguide endfaces. The definitions provide the basis for specifying the elements to be coupled (e. g. fibres, integrated optical chips) related to coupling properties.

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This document defines basic terms for integrated optical devices, their related optical chips and optical elements which find applications, for example, in the fields of optical communications and sensors. —   The coordinate system used in Clause 3 is described in Annex A. —   The symbols and units defined in detail in Clause 3 are listed in Annex B.

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This document defines terms used in the classification of integrated optical elements, integrated optical components and integrated optical devices, which find applications, for example, in the fields of optical communications and sensors.

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IEC 61954:2021 is available as IEC 61954:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61954:2021 defines type, production and optional tests on thyristor valves used in thyristor controlled reactors (TCR), thyristor switched reactors (TSR) and thyristor switched capacitors (TSC) forming part of static VAR compensators (SVC) for power system applications. The requirements of the document apply both to single valve units (one phase) and to multiple valve units (several phases). Clauses 4 to 7 detail the type tests, i.e. tests which are carried out to verify that the valve design meets the requirements specified. Clause 8 covers the production tests, i.e. tests which are carried out to verify proper manufacturing. Clauses 9 and 10 detail optional tests, i.e. tests additional to the type and production tests. This edition includes the following significant technical changes with respect to the previous edition: important clarifications were made in 4.4.1.2, 5.1.2.2, 5.1.3.2, 5.2.3.2, 6.1.2.2, 6.1.2.4, 6.1.3.2, 6.2.2.2, 6.2.2.4, 6.3.2.2 and 9.3.2.

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This document specifies the acceptance tests for verifying the performance of a laser tracker by
measuring calibrated test lengths, according to the specifications of the manufacturer. It also specifies
the reverification tests that enable the user to periodically reverify the performance of the laser tracker.
The acceptance and reverification tests given in this document are applicable to laser trackers utilizing
a retroreflector, or a retroreflector in combination with a stylus or optical distance sensor, as a probing
system. Laser trackers that use interferometric measurement (IFM), absolute distance measurement
(ADM) or both can be verified using this document. This document can also be used to specify and
verify the relevant performance tests of other spherical coordinate measurement systems that use
cooperative targets, such as “laser radar” systems.
NOTE Systems which do not track the target, such as laser radar systems, will not be tested for probing
performance.
This document does not explicitly apply to measuring systems that do not use a spherical coordinate
system. However, interested parties can apply this document to such systems by mutual agreement.
This document specifies:
— performance requirements that can be assigned by the manufacturer or the user of the laser tracker;
— the manner of execution of the acceptance and reverification tests to demonstrate the stated
requirements;
— rules for proving comformity;
— applications for which the acceptance and reverification tests can be used.

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This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

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This document specifies two separate methods for determining the resistance of a material to wet and
dry abrasion.
It is applicable to the coated surface or surfaces of coated fabrics.
It does not apply to determining the abrasion behaviour of an uncoated surface of a coated fabric, for
which the methods for uncoated textiles described in the ISO 12947 series apply.

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IEC TR 62899-402-4:2021(E), which is a Technical Report, is a preparatory work for the documents dealing with the measurement method of the vertical direction (surface forms) of printed patterns made by printed electronics technology.
The printed pattern of interest in this document is limited to straight lines on substrates with a flat surface. This document focuses on the classification and measurement methods for surface forms from the nanometer scale to the micrometer scale, and suggests the strategy for the subsequent documents.

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IEC 63041-1:2021 is available as IEC 63041-1:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 63041-1:2021 applies to piezoelectric sensors of resonator, delay-line and non-acoustic types, which are used in physical and engineering sciences, chemistry and biochemistry, medical and environmental sciences, etc. The purpose of this document is to specify the terms and definitions for piezoelectric sensors, and to make sure from a technological perspective that users understand the state-of-art piezoelectric sensors and how to use them correctly. This edition includes the following significant technical changes with respect to the previous edition:
- the new terms "piezoelectric sensor system" and "wireless SAW sensor system" and their definitions have been added;
- new types of sensor modules and sensor system have been added;
- some symbols of sensor elements are added in Clause 4;
- a new Figure B.3 has been added in Annex B;
- Annex C has been added.

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IEC 62629-1-2:2021 is available as IEC 62629-1-2:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62629-1-2:2021 provides a list of the terminologies that are frequently used in describing 3D display technologies in the -IEC 62629 series. Terms for various 3D display technologies on stereoscopic, autostereoscopic, volumetric, and :holographic displays are included. This edition includes the following significant technical changes with respect to the previous edition:
- added new terms related to holographic display and light field display;
- added new terms on the performance specifications used in other IEC 62629 series documents;
- added Annex C to explain the depth perception in 3D displays in more detail.

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This part of IEC 60384 applies to fixed tantalum electrolytic surface mount capacitors with conductive polymer solid electrolyte primarily intended for DC applications for use in electronic equipment.
Fixed tantalum electrolytic surface mount capacitors with solid (MnO2) electrolyte are not included but are covered by IEC 60384-3.
These capacitors are primarily intended for use in electronic equipment to be mounted directly on substrates for hybrid circuits or to printed boards.
Capacitors for special-purpose applications may need additional requirements.
The object of this document is to prescribe preferred ratings and characteristics and to select from IEC 60384-1:2016 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements prescribed in detail specifications referring to this sectional specification shall be of equal or higher performance level, because lower performance levels are not permitted.

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This part of IEC 60384 applies to fixed aluminium electrolytic surface mount capacitors with conductive polymer solid electrolyte, primarily intended for DC applications for use in electronic equipment.
Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) are not included but are covered by IEC 60384-18.
These capacitors are primarily intended for use in electronic equipment to be mounted directly on substrates for hybrid circuits or to printed boards.
Capacitors for special-purpose applications may need additional requirements.
The object of this document is to prescribe preferred ratings and characteristics and to select from IEC 60384-1:2016, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements prescribed in detail specifications referring to this sectional specification shall be of equal or higher performance level, because lower performance levels are not permitted.

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IEC 63244-1:2021 provides general requirements and specifications of the semiconductor devices for the performance and reliability evaluations of wireless power transfer and charging systems. For the performance evaluations, this part covers various characterization parameters and symbols, general system diagrams, and test setups and test conditions.
This document also describes classifications of the wireless power transfer technologies.

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This part of IEC 61188 describes the requirements of design and use for soldering surfaces of
land pattern on circuit boards. This document includes land pattern for surface mounted
components. These requirements are based on the solder joint requirements of
IEC 61191-2:2017.

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This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This
includes lands and land pattern for surface mounted components and also solderable hole
configurations for through-hole mounted components. These requirements are based on the
solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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This part of IEC 60384 is a generic specification and is applicable to fixed capacitors for use in electronic equipment.
It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.

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This document provides terminology frequently used in literature related to wearable electronic
devices and technologies in the IEC 63203 series. This list includes wearable electronic devices
and technologies, near-body wearable electronics, on-body wearable electronics, in-body
wearable electronics, and electronic textiles.

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IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

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IEC 62047-40:2021(E) specifies the test conditions and methods of micro-electromechanical inertial shock switch threshold. This document applies to normally open micro-electromechanical inertial shock switch.

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IEC 60444-6:2021 is available as IEC 60444-6:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60444-6:2021 applies to the measurements of drive level dependence (DLD) of quartz crystal units. Two test methods (A and C) and one referential method (B) are described. “Method A”, based on the p-network according to IEC 60444-5, can be used in the complete frequency range covered by this part of IEC 60444. “Reference Method B”, based on the p-network or reflection method according to IEC 60444-5 or IEC 60444-8 can be used in the complete frequency range covered by this part of IEC 60444. “Method C”, an oscillator method, is suitable for measurements of fundamental mode crystal units in larger quantities with fixed conditions.
NOTE The measurement methods specified in this document are not only applicable to AT-cut, but also to other crystal cuts and vibration modes, such as doubly rotated cuts (IT,SC) and to tuning fork crystal units (by using a high impedance test fixture). This edition includes the following significant technical changes with respect to the previous edition:
- some equations have been removed and corrected;
- it has been specified in the note of the Scope that the measurement methods specified in this document are not only applicable to AT-cut but also to other crystal cuts and vibration modes.

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This part of IEC 62878 specifies the requirements and evaluation methods of electrical
connectivity. It is applicable to stacked electronic modules.

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IEC 62435-9:2021 specifies storage practices encompassing silicon and semiconductor device building blocks of all types that are integrated together to into products in the form of either packages or boards that can be stored as fully assembled units or partial assemblies. Special attention is given to memories as components and assemblies although methods also apply to heterogeneous components. Guidelines and requirements for customer-supplier interaction are provided to manage the complexity.
NOTE In IEC 62435 (all parts), the term "components" is used interchangeably with dice, wafers, passives and packaged devices.

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IEC 63287-1:2021 gives guidelines for reliability qualification plans of semiconductor integrated circuit products. This document is not intended for military- and space-related applications.
NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if it is specified.
NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the appropriate sample size and test conditions of a given reliability project.
This first edition of IEC 63287-1 cancels and replaces the first edition of IEC 60749-43 published in 2017. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:  
the document has been renamed and renumbered to distinguish it from the IEC 60749 (all parts);
a new section concerning the concept of "family" has been added with appropriate renumbering of the existing text.

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IEC 62899-503-3:2021(E) specifies a measuring method of contact resistance for printed thin film transistors (TFTs) by the transfer length method (TLM). The method requires the fabrication of a test element group (TEG) with varying channel length (L) between source and drain electrodes. The method is intended for quality assessment of TFT electrode contacts and is suited for determining whether the contact resistance lies within a desired range.

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