This product standard defines a range of cable outlets, style K, 90°, shielded, sealed, self-locking (anti rotational) for heat shrinkable boot, and or with metallic bands under the following conditions.
The mating connectors are listed in EN 3660-002.
Temperature range,   Class N   :   - 65 °C to 200 °C;
Class K   :   - 65 °C to 260 °C;
Class W   :   - 65 °C to 175 °C;
Class T   :   - 65 °C to 175 °C (Nickel PTFE plating);
Class Z   :   - 65 °C to 175 °C (Black zinc nickel plating).
Associated electrical accessories   : EN 3660-033 Metallic band (for shield termination).
These cable outlets are designed for termination of overall shielding braid and / or individual cable shields. They accommodate/permit the termination of heat shrinkable boots.

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This product standard defines a range of cable outlets, style K, straight, shielded, sealed, self-locking (anti-rotational), heat shrinkable boot, and / or metallic bands for use under the following conditions:
Associated electrical connector(s) EN 3660-002.
Temperature range,   Class N   :   - 65 °C to 200 °C;
Class K   :   - 65 °C to 260 °C;
Class W   :   - 65 °C to 175 °C;
Class T   :   - 65 °C to 175 °C (Nickel PTFE plating);
Class Z   :    - 65 °C to 175 °C (Black zinc nickel plating).
Associated electrical accessories: EN 3660-033 Metallic band (for shield termination).
These cable outlets are designed for termination of overall shielding braid and/or individual cable shields. They accommodate/permit the termination of heat shrinkable boots.

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This product standard defines a range of cable outlets, style K, straight, shielded, sealed, self-locking (anti-rotational), heat shrinkable boot, and / or metallic bands for use under the following conditions:
The mating connectors are listed in EN 3660-002.
Temperature range,   Class N   :   - 65 °C to 200 °C;
Class K   :   - 65 °C to 260 °C;
Class W   :   - 65 °C to 175 °C;
Class T   :   - 65 °C to 175 °C (Nickel PTFE plating);
Class Z   :    - 65 °C to 175 °C (Black zinc nickel plating).
Associated electrical accessories: EN 3660-033 Metallic band (for shield termination).
These cable outlets are designed for termination of overall shielding braid and / or individual cable shields. They accommodate/permit the termination of heat shrinkable boots.

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IEC 63275-2:2022 gives the test method and a procedure using this method to evaluate the on-state voltage change, on-state resistance change and reverse drain voltage change of silicon carbide (SiC) power MOSFET devices due to body diode operation. This test is not generally requested for Si power transistors.

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This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers
- the emission of RF disturbances,
- the immunity against RF disturbances,
- the immunity against impulses and
- the immunity against electrostatic discharges (ESD).

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IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses. This edition includes the following significant technical changes with respect to the previous edition: a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.

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IEC TR 62878-2-9:2022(E) comprises the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members about the “concept of Jisso” as well as the “Jisso product level” for the common understanding on IEC TC 91 (electronic assembly technology) activities was reached. Further discussion on “Jisso Product Level” could be needed among the current JIC members to finalize it in the near future based on this technical report.

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IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:  
covers both unattached components and components attached to printed wiring boards;
tolerance limits modified for peak acceleration and pulse duration;
mathematical formulae added for velocity change and equivalent drop height.

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IEC 60747-5-4:2022(E) specifies the terminology, the essential ratings and characteristics as well as the measuring methods of semiconductor lasers.
This edition includes the following significant technical changes with respect to the previous edition:  
References for the terms and definitions related to the lighting area, IEC 60050-845, are revised based on IEC 60050-845:2020;
Emission angle is changed to radiation angle in 3.3.2;
Definitions of rise time and fall time in 3.4.1 are revised based on the publication IEC 60050-521:2002;
Spectral linewidth is added to Table 1 in Clause 4;
Conditions for carrier-to-noise ratio of Table 1 in Clause 4 is amended.
Error in the equation for carrier-to-noise ratio in 5.2.2 is corrected;
Precaution against the equipment used for carrier-to-noise ratio measurement is added in 5.2.2;
Explanation for the measurement method of the small signal cut-off frequency in 5.3.2 of the first edition is deleted because it has been defined in the latest version of ISO 11554;
Reference document for the lifetime in 5.4 is amended;
Precaution against the measuring arrangement used for the half-intensity width and 1/e2-intensity is added in 5.5.3;
Reference tables in Annex A, Annex B and Annex C are revised by following the latest version of ISO publications.

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IEC 63284:2022 covers the protocol of performing a stress procedure and a corresponding test method to evaluate the reliability of gallium nitride (GaN) power transistors by inductive load switching, specifically hard-switching stress

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IEC 63275-1:2022 gives a test method to evaluate gate threshold voltage shift of silicon carbide (SiC) power metal-oxide-semiconductor field-effect transistors (MOSFETs) using room temperature readout after applying continuous positive gate-source voltage stress at elevated temperature. The proposed method accepts a certain amount of recovery by allowing large delay times between stress and measurement (up to 10 h).

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IEC 60749-28:2022 is available as IEC 60749-28:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-28:2022 establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex J. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels. This edition includes the following significant technical changes with respect to the previous edition: - a new subclause and annex relating to the problems associated with CDM testing of integrated circuits and discrete semiconductors in very small packages; - changes to clarify cleaning of devices and testers.

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In general, dynamic ON-resistance testing is a measure of charge trapping phenomena in GaN power transistors. This publication describes the guidelines for testing dynamic ON-resistance of GaN lateral power transistor solutions. The test methods can be applied to the following:
a) GaN enhancement and depletion-mode discrete power devices [1]
b) GaN integrated power solutions
c) the above in wafer and package levels
Wafer level tests are recommended to minimize parasitic effects when performing high precision measurements. For package level tests, the impact of package thermal characteristics should be considered so as to minimize any device under test (DUT) self-heating implications.
The prescribed test methods may be used for device characterization, production testing, reliability evaluations and application assessments of GaN power conversion devices. This document is not intended to cover the underlying mechanisms of dynamic ON-resistance and its symbolic representation for product specifications.

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This part of IEC 60512 is used for the assessment of connectors within the scope of SC 48B
that are used in twisted pair communication cabling with remote power, such as
ISO/IEC 11801-1 Class D, or better, balanced cabling in support of IEEE 802.3btTM (Power over
Ethernet, supporting up to 90 W from the power sourcing equipment).
The object of this document is to detail a test schedule to determine the ability of sets of
connectors to withstand a minimum of 100 mechanical operations with electrical load, where an
electrical current is being passed through the connectors in accordance with IEC 60512-9-3
during the separation (unmating) step.

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IEC 60477-1:2022 applies to resistors intended for use as laboratory DC resistors (hereinafter referred to as "resistors") comprising standard resistors, single or multiple resistors of accuracy Classes 0,000 05 to 10 and single or multi-dial resistors of accuracy Classes 0,000 5 to 10.
This document does not apply to:
1) resistors which are intended for use solely as permanently mounted circuit components,
2) resistors used on alternating current or on pulsed current,
3) active resistors,
4) series resistors and shunts which are considered as accessories of electrical measuring instruments in the relevant IEC document (examples of these are as follows).
IEC 60477-1:2022 cancels and replaces the first edition of IEC 60477 published in 1974, and its Amendment 1:1997. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) extended the resistor accuracy classes;
b) deleted the resistor accuracy class expression in parts per million (ppm);
c) excluded the active resistor from the scope of this document;
d) updated the terms and definitions according to new IEC 60050 series;
e) changed the term "resistance decade" to "resistance dial" to cover the multi-dial resistors with other resistance step values;
f) updated the intrinsic error to intrinsic uncertainty according to IEC 60359;
g) added the limits of relative stability for resistors of classes 0,000 05 to 0,01;
h) added the requirements of high voltage resistors;
i) updated the safety symbols and requirements according to the new IEC 61010 series;
j) updated the insulation resistance requirements of resistors;
k) added the requirements of temperature coefficient;
l) updated the temperature requirements for transport and storage of resistors.

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IEC 60477-2:2022 applies to resistors intended as laboratory AC resistors for use over a range of frequencies from DC up to a stated frequency which is not in excess of 1 MHz. Such resistors are hereinafter referred to as "AC resistors".
In addition to satisfying the requirements of IEC 60477-1, resistors satisfying the requirements of this document are designed to have a small variation of resistance and a small phase displacement over the stated frequency range.
IEC 60477-2:2022 cancels and replaces the first edition published in 1979, and Amendment 1:1997. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) extended the AC resistor frequency range to 1 MHz;
b) updated the terms and definitions according to IEC 60050 series;
c) added the definition of AC/DC difference of an AC resistor;
d) added the resistor classification according to the AC resistance or AC/DC difference index;
e) updated the classification according to the AC resistor construction;
f) updated the safety symbols and requirements according to IEC 60477-1;
g) added the three-element equivalent circuits of an AC resistor in Annex C;
h) added the annex on constructions of AC resistors.

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IEC TR 60825-14:2022 This second edition cancels and replaces the first edition published in 2004. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:  
incorporates changes made in IEC 60825-1:2014;
adds information to users of laser equipment on administrative controls to ensure safety in the workplace, including the training and appointment of people to specific laser safety management roles;
updates an approach to risk assessment;
includes updated guidance on the management of incidents and accidents;
includes updated guidance on medical surveillance for laser workers;
includes revised examples of calculations.  This document is intended to help laser users and their employers to understand the general principles of safety management, to identify the hazards that can be present, to assess the risks of harm that can arise, and to set up and maintain appropriate control measures. Although the guidance given in this document is aimed principally at organizations (whether private, corporate or public), where systems of safety management would be expected to be in place, it can be applied by anyone using lasers.
Laser control measures vary widely. They depend on the type of laser equipment in use, the task or process being performed, the environment in which the equipment is used and the personnel who are at risk of harm. Specific requirements for certain laser applications are given in other documents in the IEC 60825 series.

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This International Standard defines common charging interoperability guidelines for power sources (external power supplies (EPS) and other Sources) used with computing and consumer electronics devices that implement the IEC 62680-1-3: USB Type-C®1 Cable and Connector Specification.
This document defines normative requirements for an EPS to ensure interoperability, in particular it specifies the data communicated from a power source to a device (Figure 1) and certain safety elements of the EPS, cable, and device. While the requirements focus of this document is on the EPS (External Power Supply) and the behavior at its USB Type-C connector interface, it is also important to comprehend cable assembly and device capabilities and behaviors in order to assure end-to-end charging interoperability. The scope does not apply to all design aspects of an EPS. An EPS compliant with this standard is also expected to follow other applicable global standards and regulatory compliance requirements for aspects such as product safety, EMC and energy efficiency.
[Figure 1]
This International Standard provides recommendations for the behavior of a device when used with a power source compliant with this document. This International Standard specifies the minimum hardware specification for an EPS implementing IEC 62680-1-3: USB Type-C. This document also specifies the data objects used by a charging system utilizing IEC 62680-1-2: USB Power Delivery Specification to understand the identity, design and performance characteristics, and operating status of an external power supply. IEC 62680-1-2 and IEC 62680-1-3 focus on power delivery applications ranging to 100W for a variety of computing and consumer electronic devices including notebook computers, tablets, smartphones, small form-factor desktops, monitor displays and other related multimedia devices.
Future updates to IEC 62680-1-2 and IEC 62680-1-3 specifications will extend to enable power delivery applications that require more than 100W while remaining within the technical limitations of the USB Type-C cable and connector solution.
This document relies on established mechanical and electrical specifications, and communication protocols specified by IEC 62680-1-2 and IEC 62680-1-3. These specifications support methods for establishing the best performing interoperability between untested combinations of EPS and devices with the aim of improving consumer satisfaction.
Information describing the USB charging interoperability model, overview of USB Type-C and USB Power Delivery specifications, and factors for charging performance are also provided to support implementation of this standard.

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IEC 60747-5-14:2022(E) specifies the measuring method of the surface temperature of single LED die or package, based on the thermoreflectance (TR) method. TR is the effect that the reflectance of light changes with the temperature of a substance. This part measures relative change in the reflectance of light from a metal film deposited nearby on the metallurgical pn junction as the relative change in the LED junction temperature. The surface temperature can be approximated as the junction temperature when the thermal resistance effect between the metal surface and the pn junction is negligibly small.

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This part of IEC 61587 specifies environmental requirements, test set-ups, as well as safety
aspects for empty enclosures, i.e. cabinets, racks, subracks, chassis, chassis integrated
subracks and associated plug-in units under indoor condition use and transportation. It defines
classifications (product performance levels) for these products, regarding and simulating the
usually arising loads during their use. For mechanical static and dynamic load tests typical
examples with dummy loads are used.
The purpose of this document is to establish defined levels of physical performance in order to
meet certain requirements of manufacture, storage, transport and final location conditions.
This document applies in general only to the above cited mechanical structures.

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IEC 60749-28:2022 is available as IEC 60749-28:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-28:2022 establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex J. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels. This edition includes the following significant technical changes with respect to the previous edition:
- a new subclause and annex relating to the problems associated with CDM testing of integrated circuits and discrete semiconductors in very small packages;
- changes to clarify cleaning of devices and testers.

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IEC 62228-7:2022 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers
the emission of RF disturbances,
the immunity against RF disturbances,
the immunity against impulses and
the immunity against electrostatic discharges (ESD).

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IEC TR 63362-1:2022(E) establishes guidelines for the application and use of aluminium electrolytic capacitors in electronic equipment.
The information given in this document applies to capacitors with non-solid electrolyte but can, in its appropriate clauses, apply to capacitors with solid electrolyte as well.
Electrolytic capacitors in general – and aluminium electrolytic capacitors in particular – are an exception in the capacitor field because of the components’ close interaction of physics and chemistry. Therefore, aluminium electrolytic capacitors show, in various aspects, a technical behaviour unaccustomed to the user. That could easily lead to misapplications and even to endangering of persons and goods. The aim of this document is to minimize these risks by providing detailed information on the specific peculiarities of the component.
This first edition cancels and replaces CLC/TR 50454 published in 2008. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:  
Complete technical revision, details of cleaning processes and failure modes added.
Inclusion of parts of JEITA RCR 2367D.

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IEC 63373:2022 In general, dynamic ON-resistance testing is a measure of charge trapping phenomena in GaN power transistors. IEC 63373:2022 provides guidelines for testing dynamic ON-resistance of GaN lateral power transistor solutions. The test methods can be applied to the following:
a) GaN enhancement and depletion-mode discrete power devices;
b) GaN integrated power solutions;
c) the above in wafer and package levels.
The prescribed test methods can be used for device characterization, production testing, reliability evaluations and application assessments of GaN power conversion devices. This document is not intended to cover the underlying mechanisms of dynamic ON-resistance and its symbolic representation for product specifications.

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IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

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This part of IEC 60749 details the procedures for the measurement of the characteristic
properties of moisture diffusivity and water solubility in organic materials used in the
packaging of semiconductor components.
These two material properties are important parameters for the effective reliability
performance of plastic packaged semiconductors after exposure to moisture and being
subjected to high-temperature solder reflow.

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This International Standard defines type, production and optional tests on thyristor valves used in thyristor controlled reactors (TCR), thyristor switched reactors (TSR) and thyristor switched capacitors (TSC) forming part of static VAR compensators (SVC) for power system applications. The requirements of the standard apply both to single valve units (one phase) and to multiple valve units (several phases).
Clauses 4 to 7 detail the type tests, i.e. tests which are carried out to verify that the valve design meets the requirements specified. Clause 8 covers the production tests, i.e. tests which are carried out to verify proper manufacturing. Clauses 9 and 10 detail optional tests, i.e. tests additional to the type and production tests.

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No scope available

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This part of IEC 61051 is a sectional specification and is applicable to metal oxide varistors with symmetrical voltage-current characteristics for use in electronic equipment connected to any AC or DC supply system.
These varistors are designed to protect electronic and other sensitive equipment from high transient surges. Varistors under the scope of this sectional specification are not intended to give primary protection against lightning surges.
These varistors have metallic connections and are intended to be mounted as through hole component or directly on to printed boards.
The object of this document is to prescribe preferred ratings and characteristics and to select from IEC 61051-1 the appropriate quality assessment procedures, tests and measuring methods, and to give general performance requirements for this type of varistors. Test severities and requirements prescribed in detail specifications referring to this sectional specification should be of equal or higher performance level, because lower performance levels are not permitted.

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IEC 60317-4:2015 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a sole coating based on polyurethane resin, which may be modified provided it retains the chemical identity of the original resin and meets all specified wire requirements. The range of nominal conductor diameters covered by this standard is:
- Grade 1: 0,018 mm up to and including 2,000 mm;
- Grade 2: 0,020 mm up to and including 2,000 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This fourth edition cancels and replaces the third edition published in 1990, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
- new 3.2.3 containing requirements for appearance;
- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
- consolidation of 17.1 and 17.2 of the solderability requirements;
- revision to Clause 19, dielectric dissipation factor;
- new Clause 23, pin hole test. Keywords: insulated wires used for windings
This publication is to be read in conjunction with IEC 60317-0-1:2013.

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2021-05-26: This A11 includes the updated Annexes ZA & ZZ, it will allow citation of EN IEC 62031:2020, published without the link to LVD directive

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This part of IEC 62321 provides strategies of sampling along with the mechanical preparation
of samples from electrotechnical products. These samples can be used for analytical testing to
determine the levels of certain substances as described in the test methods in other parts of
the IEC 62321 series. Restrictions for substances will vary between geographic regions and
can be updated on a regular basis. This document describes a generic process for obtaining
and preparing samples prior to the determination of any substance of concern.
This document does not provide:
– full guidance on each and every product that could be classified as electrotechnical product.
Since there is a huge variety of electrotechnical parts, with various structures and
compositions, along with the continuous innovations in the industry, it is unrealistic to
attempt to provide procedures for the disjointment of every type of part;
– guidance regarding other routes to gather additional information on certain substances in a
product, although the information collected has relevance to the sampling strategies in this
document;
– safe disassembly and mechanical disjointment instructions related to electrotechnical
products (e.g. mercury-containing switches) and the recycling industry (e.g. how to handle
CRTs or the safe removal of batteries). See IEC 62554 [1] 1 for the disjointment and
mechanical sample preparation of mercury-containing fluorescent lamps;
– sampling procedures for packaging and packaging materials;
– analytical procedures to measure the levels of certain substances. This is covered by other
standards (e.g. other parts of the IEC 62321 series), which are referred to as "test
standards" in this document;
– guidelines for assessment of compliance.
This document has the status of a horizontal standard in accordance with IEC Guide 108 [2].

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This document provides definitions and specifies the particular requirements for consumer products
containing lasers. The objective of this document is to ensure that laser products available to consumers
are safe. This document specifies requirements that are additional to those specified in EN 60825-1.
Consumer laser products that are battery powered are included, as well as consumer laser products
powered by other means.
The requirements of this document are intended to address only the laser radiation hazards to the eyes
and skin. Other hazards are not included within its scope. Compliance with this document may not be
sufficient to conform to the applicable performance and testing requirements of other applicable product
safety standards.
The scope of this document does not include consumer laser products that are designed to project laser
radiation in the wavelength range of 380 nm to 780 nm onto the retina, with an intended daily usage
duration of potentially many hours (such as for virtual reality or augmented reality applications), because
it is currently not possible to provide emission limits that preclude any potential adverse effects for daylong usage, day after day.
NOTE 1 The level of radiation permitted by Class 1 in the visible wavelength range results in an extremely bright
image which will be dazzling and uncomfortable, and therefore such a high emission level, that reaches Class 1
limits, is not reasonably foreseeable for this type of device (see also New Work Item Proposal 76/660/NP for the
project IEC/TS 60825-20).
The scope of this document does not include products intended for professional use (non-consumer
(professional) laser products) and restrictions as specified in this document do not apply to nonconsumer laser products. For non-consumer laser products, compliance with EN 60825-1 is sufficient
to achieve the necessary level of safety.
This document also specifies which subgroups of lasers are permitted as consumer products. A
restricted group of Class 3R laser products are included. The risk of injury is low enough to be accepted
under reasonably foreseeable conditions of use (including foreseeable misuse) for compliance with the
general product safety directive (GPSD) and low voltage directive (LVD) for consumer products.
Electric toys containing lasers, which are covered by EN 62115, are excluded from the scope of this
document.
Class 1C consumer laser products are not in the scope of this document. For example, cosmetic and
beauty care Class 1C laser products are covered by prEN IEC 60335-2-113:202X1).
NOTE 2 National requirements can be more restrictive than the requirements in 6.1 and 6.2.

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IEC 60749-39:2021 is available as IEC 60749-39:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition:
- updated procedure for "dry weight" determination.

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This part of IEC 63041 applies to piezoelectric sensors of resonator, delay-line and non acoustic types, which are used in physical and engineering sciences, chemistry and biochemistry, medical and environmental sciences, etc.
The purpose of this document is to specify the terms and definitions for the piezoelectric sensors, and to make sure from a technological perspective that users understand the state-of-art piezoelectric sensors and how to use them correctly.

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This document defines terms used in the classification of integrated optical elements, integrated optical
components and integrated optical devices, which find applications, for example, in the fields of optical
communications and sensors

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This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td)
of base laminate materials using thermogravimetric analysis (TGA).

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This part of IEC 63244 provides general requirements and specifications of the semiconductor
devices for the performance and reliability evaluations of wireless power transfer and charging
systems. For the performance evaluations, this part covers various characterization parameters
and symbols, general system diagrams, and test setups and test conditions.
This document also describes classifications of the wireless power transfer technologies.

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This document defines the relevant properties for coupling lightwaves into and out of integrated optical
chips (IOC) and chips with photonic integrated circuits (PIC). This document mainly focuses on butt
coupling via the waveguide endfaces. The definitions provide the basis for specifying the elements to be
coupled (e. g. fibres, integrated optical chips) related to coupling properties

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This part of IEC 62321 specifies the screening analysis of polybrominated biphenyls (PBBs), polybrominated diphenyl ethers (PBDEs), di-isobutyl phthalate (DIBP), di-n-butyl phthalate (DBP), benzylbutyl phthalate (BBP), di-(2-ethylhexyl) phthalate (DEHP), di-n-octyl phthalate (DNOP), di-isononyl phthalate (DINP), and di-isodecyl phthalate (DIDP) in polymers of electrotechnical products using the analytical technique of gas chromatography-mass spectrometry using a pyrolyser/thermal desorption accessory (Py/TD-GC-MS). This test method has been evaluated through the analysis of PP (polypropylene), PS (polystyrene), and PVC (polyvinyl chloride) materials containing deca-BDE between 100 mg/kg and 1 000 mg/kg and individual phthalates between 100 mg/kg to 4 000 mg/kg as depicted in Annex J. Use of the methods described in this document for other polymer types, PBBs (mono-deca), PBDEs (mono-deca) and phthalates or concentration ranges other than those specified above has not been specifically evaluated. This document has the status of a horizontal standard in accordance with IEC Guide 108 [1]1.

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This document defines basic terms for integrated optical devices, their related optical chips and optical
elements which find applications, for example, in the fields of optical communications and sensors.
— The coordinate system used in Clause 3 is described in Annex A.
— The symbols and units defined in detail in Clause 3 are listed in Annex B

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This part of IEC 62321 specifies two techniques for the determination of
hexabromocyclododecane (HBCDD) in polymers of electrotechnical products.
The gas chromatography-mass spectrometry (GC-MS) test method is described in the
normative part of this document. The GC-MS method is suitable for the determination of
hexabromocyclododecane (HBCDD).
A method using high-pressure liquid chromatography-mass spectrometry (HPLC-MS) is given
in informative Annex A.
These test methods have been evaluated for use with EPS (expanded polystyrene foam),
XPS (extruded polystyrene foam) and ABS (acrylonitrile butadiene styrene) within the
concentration ranges as specified in Table 1. The use of this method for other types of materials
or concentration ranges outside those specified below has not been evaluated.
This document has the status of a horizontal standard in accordance with IEC Guide 108.

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IEC 62906-5-1:2021(E) specifies the standard measurement conditions and measurement methods for front projection displays without screen which use lasers or laser hybrids as light sources. The hybrid light sources can use both lasers and spontaneous emission-based light sources. This document covers optical performance measurements for full-frame projection technologies such as digital micro mirror devices (DMDs), liquid crystal on silicon (LCOS), and liquid crystal display (LCD) projectors. Other displays, such as raster-scanned (flying spot) projection displays, are not included.

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IEC 62563-2:2021 establishes the performance CRITERIA and test frequencies for the ACCEPTANCE TESTS and CONSTANCY TESTS. The evaluation methods are defined in IEC 62563-1. The scope of this document is directed to practical tests that can be visually evaluated or measured using basic test equipment. This document applies to medical IMAGE DISPLAY SYSTEMS, which can display monochrome image information in the form of greyscale values on colour and greyscale IMAGE DISPLAY SYSTEMS. This document does not apply to information displays and to displays used solely for control of technical settings of all medical information.

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IEC TR 63396:2021(E) documents a method for the sound pressure level measurement on power capacitor units, by which the sound power level of power capacitor units is determined.
This method is applicable to shunt capacitor units and AC filter capacitor units for AC power systems with a nominal voltage of 1 kV and above and a frequency of 50 Hz or 60 Hz.
This method also applies to the DC filter capacitor units.
Other measurements on power capacitor units can be implemented with reference to this method.

  • Technical report
    22 pages
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