This document specifies methods for measuring beam widths (diameter), divergence angles and beam propagation ratios of laser beams. This document is only applicable for stigmatic and simple astigmatic beams. If the type of the beam is unknown, and for general astigmatic beams, ISO 11146‑2 is applicable.

  • Standard
    17 pages
    English language
    sale 15% off
  • Standard
    18 pages
    French language
    sale 15% off
  • Draft
    17 pages
    English language
    sale 15% off
  • Draft
    20 pages
    French language
    sale 15% off

This document specifies methods for measuring beam widths (diameter), divergence angles and beam propagation ratios of laser beams. This document is applicable to general astigmatic beams or unknown types of beams. For stigmatic and simple astigmatic beams, ISO 11146‑1 is applicable. Within this document, the description of laser beams is accomplished by means of the second order moments of the Wigner distribution rather than physical quantities such as beam widths and divergence angles. However, these physical quantities are closely related to the second order moments of the Wigner distribution. In ISO/TR 11146‑3, formulae are given to calculate all relevant physical quantities from the measured second order moments.

  • Standard
    16 pages
    English language
    sale 15% off
  • Standard
    16 pages
    French language
    sale 15% off
  • Draft
    16 pages
    English language
    sale 15% off
  • Draft
    16 pages
    French language
    sale 15% off

IEC 62228-5:2021(E) specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems  100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1; 100BASE-TX according to ISO/IEC/IEEE 8802-3; 1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4  and covers  the emission of RF disturbances; the immunity against RF disturbances; the immunity against impulses; the immunity against electrostatic discharges (ESD).

  • Standard
    112 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61076-3-122:2021 covers 8-way, shielded, free and fixed rectangular connectors for I/O and data transmission with frequencies up to 500 MHz. It is intended to specify the common dimensions, mechanical, electrical and environmental characteristics and tests for this family of connectors. Connectors complying with this document provide an ingress protection level of IP20; however, they are particularly suited for industrial environments with a high level of vibration. There are two classes of connectors defined in this document, indicated by "class A" and "class B" which are distinguished by some electrical and mechanical characteristics to meet the particular sets of requirements of some industrial applications. Class A meets the requirements defined in Ed.1 of this document. With the two classes A and B, the two codings Type I and II, and the two sets of transmission requirements according to the component categories Cat 5 and Cat 6A as defined in ISO/IEC 11801-1, this document specifies 2 × 2 × 2 = 8 variants. All connectors covered by this document feature a current-carrying capacity beyond the minimum requirement of 0,75 A per pin for an ambient temperature of 60° C as defined in ISO/IEC 11801 1. This second edition cancels and replaces the first edition published in 2017. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Title modified. b) Introduction of two sets of requirements for connectors of "class A" and "class B" where class A matches the requirements defined in the previous edition. c) Definition of new performance requirements for frequencies up to 500 MHz in addition to the performance requirements up to 100 MHz provided with the previous edition. d) Re-structuring to reflect the commonalities of and differences between connector Type I and Type II. e) Revision of drawings to clarify some dimensions. e) The derating diagram has been corrected to align it with the upper limiting temperature in the climatic category, with no reduction of performance for the target applications.

  • Standard
    37 pages
    English language
    sale 10% off
    e-Library read for
    1 day

This part of IEC 61189 specifies methods for testing the characteristics of soldering paste using
fine solder particles (hereinafter referred to as solder paste).
This document is applicable to the solder paste using fine solder particle such as type 6, type 7
specified in IEC 61190-1-2 or finer particle sizes.
This type of solder paste is used for connecting wiring and components in high-density printed
circuit boards which are used in electronic or communication equipment and such, equipping
fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 μm or less).
Test methods for the characteristics of solder paste in this document are considering the effect
of surface activation force due to the fine sized solder particles which could affect the test result
by existing test methods.

  • Standard
    35 pages
    English language
    sale 10% off
    e-Library read for
    1 day

This part of IEC 60384 applies to fixed capacitors for direct current, with metallized electrodes
and polyethylene-terephthalate dielectric for use in electronic equipment.
These capacitors have a possibility of "self-healing properties" depending on conditions of use.
They are primarily intended for applications where the AC component is small with respect to
the rated voltage. Two performance grades of capacitors are covered: grade 1 for long-life
application and grade 2 for general application.
Capacitors for electromagnetic interference suppression and surface mount fixed metallized
polyethylene-terephthalate film dielectric DC capacitors are not included, but are covered by
IEC 60384-14 and IEC 60384-19, respectively.
The object of this document is to prescribe preferred ratings and characteristics and to select
from IEC 60384-1 the appropriate quality assessment procedures, tests and measuring
methods, and to give general performance requirements for this type of capacitor. Test
severities and requirements prescribed in detail specifications referring to this sectional
specification are of equal or higher performance level, because lower performance levels are
not permitted.

  • Standard
    35 pages
    English language
    sale 10% off
    e-Library read for
    1 day

This document specifies measurement procedures for the precise determination of the high reflectance or high transmittance (>99 %) of optical laser components. The methods given in this document are intended to be used for the testing and characterization of high reflectance of both concave and plane mirrors or high transmittance of plane windows used in laser systems and laser-based instruments. The reflectance of convex mirrors or transmittance of positive or negative lenses can also be tested by taking into consideration the radius of curvature of the mirror surface or the focal length of the lens. This document is complementary to ISO 15368 which specifies the measurement procedures for the determination of reflectance and transmittance of optical components with spectrophotometry. ISO 15368 is applicable to the measurements of reflectance and transmittance in the range from 0 % to 100 % with a typical accuracy of ±0,3 %, and is therefore not applicable to the precise measurements of reflectance and transmittance higher than 99,9 %.

  • Standard
    17 pages
    English language
    sale 15% off
  • Draft
    17 pages
    English language
    sale 15% off

This part of IEC 61587 specifies security aspects and security performance levels of the
mechanical construction of indoor cabinets in accordance with IEC 60917 (all parts) and
IEC 60297 (all parts). This document does not address vandalism.
NOTE Protection against vandalism is typically controlled by user-specific requirements.

  • Standard
    21 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC TS 60747-19-2:2021 provides a guideline of indication of specifications of a low-power sensor being a device or a module allowing autonomous power supply operation, which contributes to the low-power design of a smart sensing unit. Here, the smart sensing unit comprises a smart sensor, a terminal module, and a power supply, which can send output data of the smart sensor to the outside. This part also provides a guideline of indication of specifications of the power supply to drive the smart sensor(s) in the smart sensing unit. Based on these, the three components of the smart sensing unit can be easily selected and combined from the point-of-view of newly designed, low-power, smart sensing units.

  • Technical specification
    20 pages
    English language
    sale 15% off

IEC/TR 62471-2:2009(E) provides the basis for optical radiation safety requirements of non-laser products, serving as a guide for development of safety requirements in vertical product standards and assisting lamp system manufacturers in the interpretation of safety information provided by the lamp manufacturers. This report provides guidance on:
- requirements for optical radiation safety assessment;
- allocation of safety measures;
- labelling of products.
This technical report does not address safety requirements of intentional exposure to optical radiation from sun tanning equipment, ophthalmic instruments or other medical/cosmetic devices whose specific safety issues are addressed through appropriate standards.

  • Technical report
    45 pages
    English language
    sale 15% off

IEC 62595-2-5:2021 specifies the measurement methods for measuring the optical characteristics of convex and concave cylindrical light sources. These non-planar light sources (NPLSs) can have either a continuous, distinct, segmented or block-wised light radiating surface, for example OLED panels, integrated LEDs, integrated mini-LEDs, micro-LEDs, laser diodes, each being either monochromatic or polychromatic.

  • Standard
    51 pages
    English language
    sale 15% off

This part of IEC 61967 specifies a method to measure the conducted electromagnetic emission
(EME) of integrated circuits by direct radio frequency (RF) current measurement with a
1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These
methods ensure a high degree of reproducibility and correlation of EME measurement results.

  • Standard
    46 pages
    English language
    sale 10% off
    e-Library read for
    1 day

This document is applicable to both self-healing capacitor units and self-healing capacitor banks
intended to be used, particularly, for power-factor correction of AC power systems having a
rated voltage above 1 000 V and fundamental frequencies of 15 Hz to 60 Hz.
The following capacitors are excluded from this document:
– shunt power capacitors of the self-healing type for AC systems having a rated voltage up to
and including 1 000 V (IEC 60831-1, -2);
– shunt power capacitors of the non-self-healing type for AC systems having a rated voltage
up to and including 1 000 V (IEC 60931-1, -2 and -3);
– shunt capacitors of the non-self-healing type for AC power systems having a rated voltage
above 1 000 V (IEC 60871-1, -2, -3 and -4);
– capacitors for inductive heat-generating plants operating at frequencies between 40 Hz and
24 000 Hz (IEC 60110-1 and -2);
– series capacitors (IEC 60143-1, -2, -3 and -4);
– AC motor capacitors (IEC 60252-1 and -2);
– coupling capacitors and capacitor dividers (IEC 60358-1, -2, -3, -4);
– capacitors for power electronic circuits (IEC 61071);
– small AC capacitors to be used for fluorescent and discharge lamps (IEC 61048 and
IEC 61049);
– capacitors for suppression of radio interference;
– capacitors intended to be used in various types of electrical equipment, and thus considered
as components;
– capacitors intended for use with DC voltage superimposed on the AC voltage.
Requirements for accessories such as insulators, switches, instrument transformers and
external fuses are given in the relevant IEC standards and are not covered by the scope of this
document.
The object of this document is to:
a) formulate uniform rules regarding performances, testing and rating;
b) formulate specific safety rules;
c) provide a guide for installation and operation.

  • Standard
    59 pages
    English language
    sale 10% off
    e-Library read for
    1 day

This document covers shielded and unshielded free and fixed connectors, circular or
rectangular, for balanced single-pair data transmission, with current-carrying capacity.
It specifies the IEC 63171 series' common mechanical, electrical and transmission
characteristics and environmental requirements, as well as required test specifications.
This document does not describe a specific mating interface. Detail specifications of mating
interfaces complying with this document can be found in the family of detail specification
standards IEC 63171-X (type X).
Within their own type, the shielded and unshielded connectors are interoperable for their
transmission performance and can be exchanged; though the shielded version has improved
alien crosstalk and coupling attenuation properties.

  • Standard
    40 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

  • Standard
    23 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

  • Standard
    55 pages
    English language
    sale 10% off
    e-Library read for
    1 day

This part of IEC 61760 gives a reference set of requirements, process conditions and related
test conditions to be used when compiling specifications of electronic components that are
intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole
reflow and surface mounting components can be subjected to the same placement and
mounting processes. Hereto, this document defines test and requirements that need to be part
of any component generic, sectional or detail specification, when through-hole reflow soldering
is intended.
Furthermore, this document provides component users and manufacturers with a reference set
of typical process conditions used in through-hole reflow soldering technology.

  • Standard
    32 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 62430:2019 describes principles, specifies requirements and provides guidance for organizations intending to integrate environmental aspects into the design and development in order to minimize the adverse environmental impacts of their products.
This document applies to processes on how ECD (environmentally conscious design) are integrated into the design and development. This document applies to any organization, regardless of its size, type or sector.
This document does not provide requirements for assessing the conformity of individual products.
This horizontal standard is primarily intended for use by technical committees in the preparation of standards in accordance with the principles laid down in IEC Guide 108.
One of the responsibilities of a technical committee is, wherever applicable, to make use of horizontal standards in the preparation of its publications. The contents of this horizontal standard will not apply unless specifically referred to or included in the relevant publications.
IEC 62430:2019 cancels and replaces the first edition published in 2009. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Scope is extended from electrotechnical product and systems to all products including services.
b) As a consequence of the scope expansion, non-electrotechnical products, services in particular, are taken into account to modify requirements.
c) Clause 6 is added as a guidance.

  • Standard
    32 pages
    English language
    sale 10% off
    e-Library read for
    1 day

This part of IEC 61189 is used to quantify the deleterious effects of flux residues on surface
insulation resistance (SIR) in the presence of moisture.
Interdigitated comb patterns comprising long parallel electrodes on an IPC B53 standardized
test coupon are used for the evaluation. Coupons are conditioned and measurements taken at
a high temperature and humidity. The electrodes are electrically biased during conditioning to
facilitate electrochemical reactions, as shown in Figure 1 and Figure 3.
Reference can be made to IEC TR 61189-5-506, which examines different geometry comb
patterns: 400 μm x 500 μm; 400 μm x 200 μm; and 318 μm x 318 μm.
Specifically, this method is designed to simultaneously assess:
• leakage current caused by ionized water films and electrochemical degradation of test
vehicle, (corrosion, dendritic growth);
• provide metrics that can appropriately be used for binary classification (e.g. go/no go;
pass/fail);
• compare, rank or characterize materials and processes.
This test is carried out at high humidity and heat conditions.

  • Standard
    23 pages
    English language
    sale 10% off
    e-Library read for
    1 day

Amendment of EN 60825-1 in relation to European regulation (LVD2)

  • Amendment
    17 pages
    English language
    sale 10% off
    e-Library read for
    1 day

This part of IEC 61189 is used for evaluating the changes to the surface insulation resistance
of a pre-selected material set on a representative test coupon and quantifies the deleterious
effects of improperly used materials and processes that can lead to decreases in electrical
resistance.
An assembly process involves a number of different process materials including solder flux,
solder paste, solder wire, underfill materials, adhesives, staking compounds, temporary
masking materials, cleaning solvents, conformal coatings and more. The test employs two
different test conditions of 85 °C and 85 % relative humidity (RH), preferred for a process that
includes cleaning, or 40 °C and 90 % relative humidity (RH), preferred for processes where no
cleaning is involved.
NOTE 40 °C and 93 % RH can be used as an alternative to 40 °C and 90 % RH. Additional information is provided
in 5.4 and A.5.2.
Testing is material (set) and process / equipment specific. Qualifications are to be performed
using the production intent equipment, processes and materials.

  • Standard
    25 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC TR 62977-1-31:2021(E) provides practical information on light measuring devices (luminance meters, colorimeters, and spectroradiometers) with luminance measuring optics for the characterization of electronic displays.

  • Technical report
    69 pages
    English language
    sale 15% off

IEC 62228-5:2021(E) specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems
100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1;
100BASE-TX according to ISO/IEC/IEEE 8802-3;
1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4  and covers
the emission of RF disturbances;
the immunity against RF disturbances;
the immunity against impulses;
the immunity against electrostatic discharges (ESD).

  • Standard
    108 pages
    English language
    sale 15% off

IEC 61076-3-122:2021 covers 8-way, shielded, free and fixed rectangular connectors for I/O and data transmission with frequencies up to 500 MHz. It is intended to specify the common dimensions, mechanical, electrical and environmental characteristics and tests for this family of connectors.
Connectors complying with this document provide an ingress protection level of IP20; however, they are particularly suited for industrial environments with a high level of vibration.
There are two classes of connectors defined in this document, indicated by "class A" and "class B" which are distinguished by some electrical and mechanical characteristics to meet the particular sets of requirements of some industrial applications.
Class A meets the requirements defined in Ed.1 of this document.
With the two classes A and B, the two codings Type I and II, and the two sets of transmission requirements according to the component categories Cat 5 and Cat 6A as defined in ISO/IEC 11801-1, this document specifies 2 × 2 × 2 = 8 variants.
All connectors covered by this document feature a current-carrying capacity beyond the minimum requirement of 0,75 A per pin for an ambient temperature of 60° C as defined in ISO/IEC 11801 1.
This second edition cancels and replaces the first edition published in 2017. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Title modified.
b) Introduction of two sets of requirements for connectors of "class A" and "class B" where class A matches the requirements defined in the previous edition.
c) Definition of new performance requirements for frequencies up to 500 MHz in addition to the performance requirements up to 100 MHz provided with the previous edition.
d) Re-structuring to reflect the commonalities of and differences between connector Type I and Type II.
e) Revision of drawings to clarify some dimensions.
e) The derating diagram has been corrected to align it with the upper limiting temperature in the climatic category, with no reduction of performance for the target applications.

  • Standard
    65 pages
    English and French language
    sale 15% off

This part of IEC 61189 specifies the reflow soldering ability test method for components
mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid
printed boards, and the reflow soldering ability test method for the lands of organic rigid printed
boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or
lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass
laminated sheets that are specified in IEC 61249-2 (all parts).
The objective of this document is to ensure the soldering ability of the solder joint and of the
lands of the printed boards. In addition, test methods are provided to ensure that the printed
boards can resist the heat load to which they are exposed during soldering.
This document covers tests Tg1, Tg2, Tg3, Tg4, Tg5, and Tg6 listed in Table 1:

  • Standard
    44 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 61587-6:2021 specifies security aspects and security performance levels of the mechanical construction of indoor cabinets in accordance with IEC 60917 (all parts) and IEC 60297 (all parts). This document does not address vandalism.
This second edition cancels and replaces the first edition published in 2017. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Revised and expanded terms and definitions.
b) Additional information in 4.2 Access security level of the cabinet.
c) Revised requirements for Security performance levels of cabinets and added additional levels in Table 2 – Security performance levels of cabinets.
d) Added a column for panel strength in Table 3 – Security performance levels of cabinet – mechanical.
e) Revised test for mechanical lock (and hinges added) in 5.2.2 Tests for strength of mechanical locks and hinges.
f) Added 5.2.4 Tests for panel strength.
g) Added additional description of Key function in Table 5 – Security performance levels of key.
h) Revised test method for handles in Annex A.

  • Standard
    37 pages
    English and French language
    sale 15% off

IEC 60384-2:2021(E) applies to fixed capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment.
These capacitors have a possibility of "self-healing properties" depending on conditions of use. They are primarily intended for applications where the AC component is small with respect to the rated voltage. Two performance grades of capacitors are covered: grade 1 for long-life application and grade 2 for general application.
Capacitors for electromagnetic interference suppression and surface mount fixed metallized polyethylene-terephthalate film dielectric DC capacitors are not included, but are covered by IEC 60384-14 and IEC 60384-19, respectively.
The object of this document is to prescribe preferred ratings and characteristics and to select from IEC 60384-1 the appropriate quality assessment procedures, tests and measuring methods, and to give general performance requirements for this type of capacitor. Test severities and requirements prescribed in detail specifications referring to this sectional specification are of equal or higher performance level, because lower performance levels are not permitted.
This edition includes the following significant technical changes with respect to the previous edition:
a) revision of all parts of the document based on the ISO/IEC Directives, Part 2:2018 and harmonization with other similar kinds of documents;
b) the document structure has been organized to follow the new sectional specification structure decided by TC 40;
c) revision of tables and Clause 5 so as to prevent duplications and contradictions.

  • Standard
    32 pages
    English language
    sale 15% off

IEC 62899-402-3:2021(E) specifies the optical measurement method for acquiring two-dimensional images of voids and obtaining the void-related attributes in the dried or cured printed patterns which are part of the electronic products in the field of printed electronics. The measurable voids using this document are limited to those that are distinguishable by the optical image measurement.
NOTE In this document, void means an imperfection of pattern observed from a two-dimensional (2D) top-view.

  • Standard
    18 pages
    English language
    sale 15% off

IEC 63229:2021(E) gives guidelines for the definition and classification of defects in GaN epitaxial film grown on SiC substrate. They are identified and described on the basis of examples, mainly by schematic illustrations, optical microscope images, and transmission electron microscope images for these defects. This document covers only defects in as-grown GaN epitaxial film on SiC substrate and does not include defects caused by subsequent processes.

  • Standard
    21 pages
    English language
    sale 15% off

IEC TR 61191-8:2021(E) gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components with printed boards (PBs). Voids in other solder joints (e.g. in a joint between a silicon die and a substrate within an electronic component, solder joints of through-hole components, etc.) are not considered. The technical background for the occurrence of voids in solder joints, the potential impact of voiding on printed board assembly reliability and functionality, the investigation of voiding levels in sample- and series-production by use of X‑ray inspection as well as typical voiding levels in different types of solder joints are discussed. Recommendations for the control of voiding in series production are also given. Annex A collects typical voiding levels of components and recommendations for acceptability.

  • Technical report
    34 pages
    English language
    sale 15% off

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).
This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes.
This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 µm or less).
Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which could affect the test result by existing test methods.

  • Standard
    64 pages
    English and French language
    sale 15% off

IEC 60825-2:2021 provides requirements and specific guidance for the safe operation and maintenance of optical fibre communication systems (OFCSs). In these systems, optical power is possibly accessible outside the confines of the transmitting equipment and/or at great distance from the optical source.
This document requires the assessment of hazard level at each accessible location of the OFCS as a replacement for product classification according to IEC 60825-1. It applies to the installed OFCS as an engineered, end-to-end assembly for the generation, transfer and receipt of optical radiation arising from lasers, light-emitting diodes (LEDs) or optical amplifiers, in which the transference is by means of optical fibre for communication and/or control purposes.
Individual components and subassemblies that fall under the definition of a laser product are subject to the applicable subclause(s) of IEC 60825-1. This document is applicable to individual components and subassemblies intended to be installed within OFCSs.
This document does not apply to optical fibre systems primarily designed to transmit optical power for applications such as material processing or medical treatment.
In addition to the hazards resulting from laser radiation, OFCSs possibly give rise to other hazards, such as fire.
This document does not address safety issues associated with explosion or fire with respect to OFCSs deployed in explosive atmospheres.
This fourth edition cancels and replaces the third edition published in 2004, Amendment 1:2006 and Amendment 2:2010. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition.
a) Recommendations for individual components and subassemblies have been clarified; see Clause 1, paragraph 3.
b) C7 has been revised in accordance with IEC 60825-1:2014, but with an additional limitation related to the skin MPE; see 4.7.2.
c) Condition 2 has been changed, and a detailed description of the measurement and determination method for hazard level has been added; see 4.7.1 and 4.7.2.
d) Annex B has been moved into 4.9. Annex F has been moved forward as Annex B.
e) Clause D.4 Hazard level evaluation examples – Additional examples have been added.
f) Clause D.5 Fault analysis – Explanation and guidance has been simplified.

  • Standard
    117 pages
    English and French language
    sale 15% off

IEC 61967-4:2021 is available as IEC 61967-4:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-4:2021 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree of reproducibility and correlation of EME measurement results. This edition includes the following significant technical changes with respect to the previous edition:
- frequency range of 150 kHz to 1 GHz has been deleted from the title;
- recommended frequency range for 1 Ω method has been reduced to 30 MHz;
- Annex G with recommendations and guidelines for frequency range extension beyond 1 GHz has been added.

  • Standard
    88 pages
    English and French language
    sale 15% off

IEC 63210:2021 is applicable to both self-healing capacitor units and self-healing capacitor banks intended to be used, particularly, for power-factor correction of AC power systems having a rated voltage above 1 000 V and fundamental frequencies of 15 Hz to 60 Hz.
The following capacitors are excluded from this document:
- shunt power capacitors of the self-healing type for AC systems having a rated voltage up to and including 1 000 V (IEC 60831-1, -2);
- shunt power capacitors of the non-self-healing type for AC systems having a rated voltage up to and including 1 000 V (IEC 60931-1, -2 and -3);
- shunt capacitors of the non-self-healing type for AC power systems having a rated voltage above 1 000 V (IEC 60871-1, -2, -3 and -4);
- capacitors for inductive heat-generating plants operating at frequencies between 40 Hz and 24 000 Hz (IEC 60110-1 and -2);
- series capacitors (IEC 60143-1, -2, -3 and -4);
- AC motor capacitors (IEC 60252-1 and -2);
- coupling capacitors and capacitor dividers (IEC 60358-1, -2, -3, -4);
- capacitors for power electronic circuits (IEC 61071);
- small AC capacitors to be used for fluorescent and discharge lamps (IEC 61048 and IEC 61049);
- capacitors for suppression of radio interference;
- capacitors intended to be used in various types of electrical equipment, and thus considered as components;
- capacitors intended for use with DC voltage superimposed on the AC voltage.
Requirements for accessories such as insulators, switches, instrument transformers and external fuses are given in the relevant IEC standards and are not covered by the scope of this document.
The object of this document is to:
a) formulate uniform rules regarding performances, testing and rating;
b) formulate specific safety rules;
c) provide a guide for installation and operation.

  • Standard
    115 pages
    English and French language
    sale 15% off

IEC 63171:2021 covers shielded and unshielded free and fixed connectors, circular or rectangular, for balanced single-pair data transmission, with current-carrying capacity.
It specifies the IEC 63171 series' common mechanical, electrical and transmission characteristics and environmental requirements, as well as required test specifications.
This document does not describe a specific mating interface. Detail specifications of mating interfaces complying with this document can be found in the family of detail specification standards IEC 63171-X (type X).
Within their own type, the shielded and unshielded connectors are interoperable for their transmission performance and can be exchanged; though the shielded version has improved alien crosstalk and coupling attenuation properties

  • Standard
    70 pages
    English and French language
    sale 15% off

IEC TR 62977-5-2:2021, which is a Technical Report, describes the visual assessment method of the viewing direction characteristics of display devices. This document reviews the visual assessment of viewing direction by using special test patterns to estimate colour changes, image structure, and image luminance.
Experimental results are shown to reveal the effectiveness of this kind of visual assessment.
This method is a valuable tool for identifying image quality issues, but physical measurements will be used to confirm display performance specifications.
NOTE The visual assessment results will depend on the test pattern parameters and display setup conditions. As the viewing direction changes, characteristics such as contrast ratio, resolution, and device colour-shift simultaneously change in the perceived image.

  • Technical report
    35 pages
    English language
    sale 15% off

IEC 62830-7:2021 defines terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of linear sliding mode triboelectric energy harvesting devices for practical use. This document is applicable to energy harvesting devices for consumer, general industries, military and aerospace applications without any limitations on device technology and size.

  • Standard
    62 pages
    English and French language
    sale 15% off

IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

  • Standard
    12 pages
    English language
    sale 15% off

IEC 60747-14-11:2021(E) defines the terms, definitions, configuration, and test methods can be used to evaluate and determine the performance characteristics of surface acoustic wave-based semiconductor sensors integrated with ultraviolet, illuminance, and temperature sensors. The measurement methods are for DC characteristics and RF characteristics, and the measurement method for RF characteristics includes a direct mode and differential amplifier mode based on feedback oscillation. This document excludes devices dealt with by TC 49: piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection.

  • Standard
    21 pages
    English language
    sale 15% off

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

  • Standard
    63 pages
    English and French language
    sale 15% off

IEC 60352-7:2020 is available as IEC 60352-7:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60352-7:2020 is applicable to spring clamp connections made with stripped wire without further preparation:
- solid conductors of 0,32 mm to 3,7 mm nominal diameter (0,08 mm2 to 10 mm2 cross‑section), or
- stranded conductors of 0,08 mm2 to 10 mm2 cross-section, or
- flexible conductors of 0,08 mm2 to 10 mm2 cross-section,
according to IEC 60228 or IEC 60189-3 for use in electrical and electronic equipment and components.
Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this document is to determine the suitability of spring clamp connections under specified mechanical, electrical and atmospheric conditions. This second edition cancels and replaces the first edition of IEC 60352-7, published in 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) correction of the two flow charts in Figure 6 and Figure 7,
b) split the content into more clauses for better separation between full test schedule and basic test schedule,
c) relocating the content of former Clause 6 Practical guidance into an informative Annex A, as now common in the IEC 60352 series for solderless connections,
d) clarification on conductor types with reference to classes defined in IEC 60228.

  • Standard
    34 pages
    English language
    sale 10% off
    e-Library read for
    1 day

IEC 60194-1:2021 covers terms and definitions closely related with TC91 technology.
This document, together with IEC 60194-2:2017, cancel and replace IEC 60194:2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
1) exclusion of 32 general terms better served by other TCs;
2) exclusion of 47 terms no longer used by the electronic assembly industry;
3) inclusion of 14 new terms related with device embedded substrate technology;
4) inclusion of 113 synonymous terms;
5) removal of identification codes for terms and annexes.

  • Standard
    403 pages
    English and French language
    sale 15% off

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

  • Standard
    49 pages
    English and French language
    sale 15% off

IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.

  • Standard
    45 pages
    English and French language
    sale 15% off