31.040.10 - Fixed resistors

IEC 60115-1:2020 is a generic specification and is applicable to fixed resistors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.
This edition contains the following significant technical changes with respect to the previous edition:  
this 5th edition employs a new document structure, where the tests of prior Clause 4 are given in Clauses 6 to 12 now, with an informative Annex X providing cross-references for references to the prior revision of this standard;
the terms and definitions have been revised and amended, supplemented by a new section on resistor technologies and a new section on product classification levels;
a new Subclause 4.7 on recommendations for permissible substitutions has been added;
the provisions for packaging, storage and transportation in Subclauses 4.8, 4.9 and 4.10 have been completely revised;
a new Subclause 5.3 on default tolerances for the most common test parameters has been added;
the generic method of measuring resistance, now Sublause 5.6, has been separated from the test for compliance with a prescribed resistance value in 6.1, as a revision of the prior 4.5;
the test for the temperature coefficient of resistance of Subclause 6.2 is a revision of the prior test 4.8, variation of resistance with temperature, where the special concessions for resistors below 10 Ω have been waived;
the test methods for endurance testing of Subclauses 7.1 to 7.3 (prior 4.25.1 to 4.25.3) have been completely revised;
the single‑pulse high‑voltage overload test of Subclause 8.2 (prior 4.27) has been completely revised, and now offers adjustable severities for the 1,2/50 and for the 10/700 pulse shape for the benefit of detail specifications with improved significance;
the periodic-pulse high-voltage overload test of Subclause 8.3 (prior 4.28) has been revised and a corrected table of severities provided;
the period-pulse overload test of Subclause 8.4 (prior 4.39) has been deprecated and streamlined to only offer the severity historically applied in subordinate specifications;
the Subclauses 9.1 on visual inspection, 9.2 on the gauging of dimensions, and 9.3 on the assessment of detail dimensions (all parts of prior 4.4) have been completely revised;
the tests for robustness of terminations (prior 4.16) have been revised and separated into tests for the robustness of solderable terminations, Subclause 9.5, and tests for the robustness of threaded stud or screw terminations, Subclause 9.6;
the bump test of Subclause 9.9 (prior 4.20) and the shock test of Subclause 9.10 (prior 4.21) have been revised to reflect the merged relevant test standard IEC 60068-2-29;
the dry heat and cold test of the climatic sequence of Subclause 10.3 (prior 4.23) have been revised to reflect the changes of the relevant test standards IEC 60068‑2‑2 and IEC 60068‑2‑1;
the accelerated damp heat, steady state test of Subclause 10.5 (prior 4.37) has been amended with an option for a reduced number of bias voltages;
the corrosion test of Subclause 10.6 has been completely revised in order to employ the better suitable test method of IEC 60068-2-52 instead of the prior used IEC 60068-2-11;
the whisker growth test of Subclause 10.7 has been revised to reflect the changes of the new revision of the test methods of IEC 60068-2-82;
the test methods for solderability of Subclause 11.1 (prior 4.17) and for resistance to soldering heat of Subclause 11.2 (prior 4.18) have been completely revised to incorporate the necessary option for the variety of lead-bearing and lead-free solder alloys and respective process conditions;
the solvent resistance test of Subclause 11.3 combines the prior tests 4.29, component solvent resistance, and 4.30, solvent resistance of marking, in one test;
the accidental overload test of Subclause 12.3 (prior 4.26) has been completely

Specific Amendment to the EN 140402 to add an Annex D which, owing to the nature of a Blank Detail Specification, consists of the blank template for the Annex with respective editorial comments.

IEC TR 63091:2017(E) is a technical report and is applicable to SMB resistors with sizes equal or smaller than the RR6332M, including the typical rectangular and cylindrical SMD resistors mentioned in IEC 60115-8.

Amendment of the detail specification, aiming to amend the ordering information for a proper discrimination between two different permissible product variants.

Amendment of the detail specification, aiming to amend the ordering information for a proper discrimination between two different permissible product variants.

Amendment of the detail specification, aiming to amend the ordering information for a proper discrimination between two different permissible product variants.

Amendment of the detail specification, aiming to amend the ordering information for a proper discrimination between two different permissible product variants.

Specific Amendment to the EN 140402 to add an Annex D which, owing to the nature of a Blank Detail Specification, consists of the blank template for the Annex with respective editorial comments.

IEC 62153-4-16:2016(E) describes a method to extrapolate the test results of transfer impedance to higher frequencies and the test results of screening attenuation to lower frequencies when measured with the triaxial set-up according to IEC 62153-4-3 (method B) respectively IEC 62153-4-4. A similar approach to extrapolate the test results of transfer impedance to higher frequencies was already described in IEC 61196-1:1995 Subclause 12.2. This method is applicable for homogenous screens, i.e. screens having a transfer impedance directly proportional to length. The transfer impedance may have any frequency behaviour, i.e. it could have a behaviour where it does not increase with 20 dB per decade as observed for screens made of a foil and a braid.

This International Standard specifies a method of measurement and associated test
conditions to assess the "noisiness", or magnitude of current noise, generated in fixed
resistors of any given type. The method applies to all classes of fixed resistors. The aim is to
provide comparable results for the determination of the suitability of resistors for use in
electronic circuits having critical noise requirements.
The current noise in resistive materials reflects the granular structure of the resistive material.
For some resistor technologies utilizing homogenous layers it is regarded as providing an
indication of defects, which are considered as a root cause for abnormal ageing of the
component under the influence of temperature and time.
The method described in this International Standard is not a general specification requirement
and therefore is applied if prescribed by a relevant component specification, or, if agreed
between a customer and a manufacturer.

IEC 60195:2016 specifies a method of measurement and associated test conditions to assess the "noisiness", or magnitude of current noise, generated in fixed resistors of any given type. The method applies to all classes of fixed resistors. The aim is to provide comparable results for the determination of the suitability of resistors for use in electronic circuits having critical noise requirements. This edition includes the following significant technical changes with respect to the previous edition: - harmonization of the allocation of isolation resistors RM in the recommended operating conditions given in Table 2; - correction of erroneous numeric values of the contribution of system noise, f(T - S) in Table 3; - addition of advice on the prescription of requirements in a relevant component specification; - addition of a set of recommended measuring conditions for specimens with a rated dissipation of less than 100 mW; - complete editorial revision.

IEC 60195:2016 specifies a method of measurement and associated test conditions to assess the "noisiness", or magnitude of current noise, generated in fixed resistors of any given type. The method applies to all classes of fixed resistors. The aim is to provide comparable results for the determination of the suitability of resistors for use in electronic circuits having critical noise requirements. This edition includes the following significant technical changes with respect to the previous edition:
- harmonization of the allocation of isolation resistors RM in the recommended operating conditions given in Table 2;
- correction of erroneous numeric values of the contribution of system noise, f(T - S) in Table 3;
- addition of advice on the prescription of requirements in a relevant component specification;
- addition of a set of recommended measuring conditions for specimens with a rated dissipation of less than 100 mW;
- complete editorial revision.

IEC 60115-1: 2008(E) is a generic specification and is applicable to fixed resistors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. This fourth edition cancels and replaces the third edition issued in 1999 and Amendment 1 (2001). It constitutes a technical revision. It contains the following significant technical changes with respect to the previous edition:  a) implementation of Annex Q which replaces Clause 3;  b) addition of new tests procedures in 4.34 through 4.38;  c) removal of the property 'temperature characteristics' from 4.8;  d) introduction of a new system of test severities for the shear test in  4.32;  e) introduction of new bias voltages for the damp heat steady-state test in 4.24;  f) furthermore, this fourth edition cancels and replaces the third edition published in 1999 and constitutes minor revisions related to tables, figures and references.

SIST EN 60115-8-1 specifies the characteristics and ratings of fixed surface mount (SMD) resistors. The resistors covered herein are classified to level G, as defined in IEC 60115-8-1, 1.5 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals.

This part of IEC 60115 is applicable to leaded fixed low-power film resistors for use in
electronic equipment.
These resistors are typically described according to types (different geometric shapes) and
styles (different dimensions) and product technology. The resistive element of these resistors
is typically protected by a conformal lacquer coating. These resistors have wire terminations
and are primarily intended to be mounted on a circuit board in through-hole technique.
The object of this standard is to prescribe preferred ratings and characteristics and to select
from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring
methods and to give general performance requirements for this type of resistor.

IEC 60115-8-1:2014 is applicable to the drafting of detail specifications for fixed surface mount (SMD) low-power film resistors in rectangular chip shape (styles RR) or in cylindrical MELF shape (styles RC) classified to level G, which is defined in IEC 60115-8:2009, 1.5 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This edition includes the following significant technical changes with respect to the previous edition: - It includes minor revisions related to tables, figures and references. - Dedication to resistors of product classification level G, which is for general electronic equipment, typically operated under benign or moderate environmental conditions, like e.g. consumer products, or telecommunication user terminals. - Implementation of the zero defect policy with the application of the single assessment level EZ in all test schedules. - Substitution of the temperature coefficient of resistance (TCR), specified over the full defined temperature range, for the inferior and less significant temperature characteristic. - Adition of a test for the immunity against electrostatic discharge. - Implementation of the concept of stability classes with coordinated requirements to the performance at all prescribed tests. - Addition of information relevant for the component user in his assembly process. - Addition of an Annex providing special provisions for 0 resistors (jumpers), which may be part of a range of products covered by a detail specification derived from this blank detail specification.

A blank detail specification is a supplementary document to the sectional specification and contains
requirements for style and layout and minimum content of detail specifications. Detail specifications not
complying with these requirements should not be considered as being in accordance with European
Standards nor should they be so described.
In the preparation of the detail specification the content of EN 60115-8:2012, 1.4 should be taken into
account.
The detail specification should be written by using the preferred values given in EN 60115-8.
The detail specification should contain a table of contents prior the first page of the actual specification.
For the use of SI units refer to EN ISO 80000-1, for the use of letter symbols to be used in electrical
technology, refer to EN 60027-1.

Various parameters of this component are precisely defined in this specification. Unspecified parameters
may vary from one component to another.

IEC 60115-1: 2008(E) is a generic specification and is applicable to fixed resistors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. This fourth edition cancels and replaces the third edition issued in 1999 and Amendment 1 (2001). It constitutes a technical revision. It contains the following significant technical changes with respect to the previous edition: a) implementation of Annex Q which replaces Clause 3; b) addition of new tests procedures in 4.34 through 4.38; c) removal of the property 'temperature characteristics' from 4.8; d) introduction of a new system of test severities for the shear test in 4.32; e) introduction of new bias voltages for the damp heat steady-state test in 4.24; f) furthermore, this fourth edition cancels and replaces the third edition published in 1999 and constitutes minor revisions related to tables, figures and references.

Various parameters of this component are precisely defined in this specification. Unspecified parameters may vary from one component to another.

Various parameters of this component are precisely defined in this specification. Unspecified parameters may vary from one component to another.

IEC 60115-2:2014 is applicable to leaded fixed low-power film resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor. This edition includes the following significant technical changes with respect to the previous edition: - it includes test conditions and requirements for lead-free soldering and assessment procedures meeting the requirements of a "zero defect" approach; - it introduces a product classification based on application requirements; - it includes an extension of the list of styles and dimensions; - it includes the use of an extended scope of stability class definitions; - it includes the extension of the lists of preferred values of ratings; - it includes test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD); - it includes a new set of severities for a shear test; - it includes definitions for a test board; - it includes the replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach; - it includes an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test; - it includes requirements applicable to 0-ohm resistors (jumpers); - it includes recommendations for the denomination, description, packaging and quality assessment of radial formed styles; - it includes prescriptions for endurance testing at room temperature, supplementary to the rulings of IEC 60115-1.

IEC 61755-2-5:2015 defines a set of prescribed conditions that should be maintained in order to satisfy the requirements of angled polished reference connections. The prescribed conditions include dimensional limits and optical fibre requirements of the optical interface to meet specific requirements for reference connection (plugs and adaptors) used for attenuation measurements. Two different grades for reference connections are defined in this standard. The use of each of these grades depends on the application and on the targeted attenuation measurement uncertainty. The model uses a Gaussian distribution of light intensity over the specified restricted mode field diameter (MFD) range. This standard is intended to be used for shipping and acceptance inspections. The reference connector plug is specified for B1.1, B1.3 and B6 fibres as specified in IEC 60793-2-50. The use of the reference connector plug would not be recommended where classification of fibre is difficult, for example construction and maintenance of cable plant. Keywords: angled polished reference connections, plugs and adaptors, attenuation measurements

CLC/TC 40XB request - Correction to two translation mistakes in Table 2a in the D version of EN 140401-802:2007.

IEC 60115-8-1:2014 is applicable to the drafting of detail specifications for fixed surface mount (SMD) low-power film resistors in rectangular chip shape (styles RR) or in cylindrical MELF shape (styles RC) classified to level G, which is defined in IEC 60115-8:2009, 1.5 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This edition includes the following significant technical changes with respect to the previous edition:
- It includes minor revisions related to tables, figures and references.
- Dedication to resistors of product classification level G, which is for general electronic equipment, typically operated under benign or moderate environmental conditions, like e.g. consumer products, or telecommunication user terminals.
- Implementation of the zero defect policy with the application of the single assessment level EZ in all test schedules.
- Substitution of the temperature coefficient of resistance (TCR), specified over the full defined temperature range, for the inferior and less significant temperature characteristic.
- Adition of a test for the immunity against electrostatic discharge.
- Implementation of the concept of stability classes with coordinated requirements to the performance at all prescribed tests.
- Addition of information relevant for the component user in his assembly process.
- Addition of an Annex providing special provisions for 0 resistors (jumpers), which may be part of a range of products covered by a detail specification derived from this blank detail specification.

This blank detail specification is a supplementary  document to the sectional specification and  contains requirements for style and layout and  minimum content of detail specifications. Detail  specifications not complying with these  requirements shall not be considered as being in  accordance with European standards nor shall  they be so described.

CLC/TC 40XB request - Correction to two translation mistakes in Table 2a in the D version of EN 140401-802:2007.

CLC/TC 40XB request - Correction to a translation mistake in Table 2b in the D version of EN 140101-806:2008.

IEC 60115-2:2014 is applicable to leaded fixed low-power film resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor. This edition includes the following significant technical changes with respect to the previous edition:
- it includes test conditions and requirements for lead-free soldering and assessment procedures meeting the requirements of a "zero defect" approach;
- it introduces a product classification based on application requirements;
- it includes an extension of the list of styles and dimensions;
- it includes the use of an extended scope of stability class definitions;
- it includes the extension of the lists of preferred values of ratings;
- it includes test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
- it includes a new set of severities for a shear test;
- it includes definitions for a test board;
- it includes the replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
- it includes an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
- it includes requirements applicable to 0-ohm resistors (jumpers);
- it includes recommendations for the denomination, description, packaging and quality assessment of radial formed styles;
- it includes prescriptions for endurance testing at room temperature, supplementary to the rulings of IEC 60115-1.

IEC 60050-395:2014 gives the general terminology used in nuclear concepts, instruments, systems, equipment and detectors. This terminology is consistent with the terminology published in the other specialized parts of the IEV.
It has the status of a horizontal standard in accordance with IEC Guide 108.

IEC 60695-10-2:2014 specifies the ball pressure test as a method for evaluating the softening temperature and accelerated material flow under load of polymeric materials and parts of end products in their ability to resist abnormal heat. It is applicable to the materials used in electrotechnical equipment, subassemblies and components, and to solid electrical insulating materials except ceramics. The Ball Pressure test method is not appropriate for certain elastomers, foamed materials, and other materials that tend to be soft at room temperature. Product Committees are encouraged to evaluate these materials using other methods such as IEC 60695-10-3. This third edition cancels and replaces the second edition of IEC 60695-10-2 published in 2003. It constitutes a technical revision. The main changes with respect to the previous edition are as follows:
- The addition of an introduction introduces the user to the basic guidance documents published by TC 89,
- Addition of a reference to IEC Guide 104 and ISO/IEC Guide 51 in the Scope,
- Additional relevant Terms and Definitions in new Clause 3,
- 5.2: Additional requirements to the test specimen support at the suggestion of IECEE-CTL to improve reproducibility,
- 5.3: Clarification of heating oven requirements at the suggestion of IECEE-CTL to improve reproducibility,
- 5.4: Specification of minimum resolution consistent with method requirements for optical measurement instrument,
- New Test Procedure in Clauses 6 and 8 which introduces separate methods for End Product proof testing (Method A) and material performance testing (Method B) and
- Updated Clause 11 Test Report to be consistent with other IEC 60695 documents.
Key words: Abnormal heat, Ball pressure test method, Fire hazard

This blank detail specification is a supplementary  document to the sectional specification and  contains requirements for style and layout and  minimum content of detail specifications. Detail  specifications not complying with these  requirements shall not be considered as being in  accordance with European standards nor shall  they be so described.

Various parameters of this component are precisely specified in this specification. Unspecified parameters may vary from one component to another. The following combinations of temperature coefficient, tolerance on rated resistance shall be used for qualification approval according to 2.2.1 and quality conformance inspection according to 2.3. Resistance values of E-series according to IEC 60063 shall be used. The qualification of resistance values below or beyond the specified resistance values is permitted, if they fulfill the requirements of the closest stability class.

Various parameters of this component are precisely specified in this specification. Unspecified parameters may vary from one component to another.

Various parameters of this component are precisely specified in this specification.Unspecified parameters may vary from one component to another.

2013-09-09: Publication allocated to fdufour@cencenelec.eu
2021: CLC legacy converted by DCLab NISOSTS

2013-09-09: Publication allocated to fdufour@cencenelec.eu
2021: CLC legacy converted by DCLab NISOSTS

2013-09-09: Publication allocated to fdufour@cencenelec.eu
2021: CLC legacy converted by DCLab NISOSTS

2013-09-09: Publication allocated to fdufour@cencenelec.eu
2021: CLC legacy converted by DCLab NISOSTS

Various parameters of this component are precisely specified in this specification. Unspecified parameters may vary from one component to another.

2012-11-19: Publication editing allocated to cpalagi@cencenelec.eu
2021: CLC legacy converted by DCLab NISOSTS

IEC 61689:2013 is applicable to ultrasonic equipment designed for physiotherapy containing an ultrasonic transducer generating continuous or quasi-continuous wave ultrasound in the frequency range 0,5 MHz to 5 MHz. This standard only relates to ultrasonic physiotherapy equipment employing a single plane non-focusing circular transducer per treatment head, producing static beams perpendicular to the face of the treatment head. This standard specifies:
- methods of measurement and characterization of the output of ultrasonic physiotherapy equipment based on reference testing methods;
- characteristics to be specified by manufacturers of ultrasonic physiotherapy equipment based on reference testing methods;
- guidelines for safety of the ultrasonic field generated by ultrasonic physiotherapy equipment;
- methods of measurement and characterization of the output of ultrasonic physiotherapy equipment based on routine testing methods;
- and acceptance criteria for aspects of the output of ultrasonic physiotherapy equipment based on routine testing methods. Therapeutic value and methods of use of ultrasonic physiotherapy equipment are not covered by the scope of this standard. This third edition cancels and replaces the second edition published in 2007. It constitutes a technical revision which includes the following significant technical changes with respect to the previous edition:
- restriction introduced of 0,2 W/cm2 effective intensity during hydrophone measurements for treatment heads with ka≤20, to limit the likelihood of cavitation;
- change in the factor Fac, to determine the effective radiating area, from 1,354 to 1,333;
- and change to SI units for terms and definitions.
This publication is to be read in conjunction with IEC 60601-2-5:2009.

This part of EN 60115 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions). They have metallized terminations and are primarily intended to be mounted directly on to a circuit board.

IEC 60115-8:2009(E) is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions). They have metallized terminations and are primarily intended to be mounted directly on to a circuit board. This second edition constitutes a technical revision and includes test conditions and requirements for lead-free soldering and assessment procedures meeting the requirements of a 'zero defect' approach. The major technical changes with regard to the first edition are the following: - introduction of a product classification based on application requirements; - extension of the list of styles and dimensions; - use of an extended scope of stability class definitions; - extension of the lists of preferred values of ratings; - inclusion of test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD); - inclusion of a new set of severities for a shear test; - inclusion of definitions for a test board; - replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a 'zero defect' approach; - inclusion of an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test; - inclusion of requirements applicable to 0 resistors (jumpers).

Various parameters of this component are precisely specified in this specification. Unspecified parameters may vary from one component to another. The following combinations of temperature coefficient, tolerance on rated resistance shall be used for qualification approval according to 2.2.1 and quality conformance inspection according to 2.3. Resistance values of E-series according to IEC 60063 shall be used. The qualification of resistance values below or beyond the specified resistance values is permitted, if they fulfill the requirements of the closest stability class.

D140/C021: Issue of a corrigendum to EN 140401-804:2011 approved to cover shortcomings that would cause difficulties to the user

Various parameters of this component are precisely specified in this specification. Unspecified parameters may vary from one component to another. The following combinations of temperature coefficient, tolerance on rated resistance shall be used for qualification approval according to 2.2.1 and quality conformance inspection according to 2.3. Resistance values of E-series according to IEC 60063 shall be used. The qualification of resistance values below or beyond the specified resistance values is permitted, if they fulfill the requirements of the closest stability class.