31.080.01 - Semiconductor devices in general
ICS 31.080.01 Details
Semiconductor devices in general
Halbleiterbauelemente im allgemeinen
Dispositifs a semi-conducteurs en général
Polprevodniški elementi (naprave) na splošno
General Information
IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:
covers both unattached components and components attached to printed wiring boards;
tolerance limits modified for peak acceleration and pulse duration;
mathematical formulae added for velocity change and equivalent drop height.
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IEC 60747-5-4:2022(E) specifies the terminology, the essential ratings and characteristics as well as the measuring methods of semiconductor lasers.
This edition includes the following significant technical changes with respect to the previous edition:
References for the terms and definitions related to the lighting area, IEC 60050-845, are revised based on IEC 60050-845:2020;
Emission angle is changed to radiation angle in 3.3.2;
Definitions of rise time and fall time in 3.4.1 are revised based on the publication IEC 60050-521:2002;
Spectral linewidth is added to Table 1 in Clause 4;
Conditions for carrier-to-noise ratio of Table 1 in Clause 4 is amended.
Error in the equation for carrier-to-noise ratio in 5.2.2 is corrected;
Precaution against the equipment used for carrier-to-noise ratio measurement is added in 5.2.2;
Explanation for the measurement method of the small signal cut-off frequency in 5.3.2 of the first edition is deleted because it has been defined in the latest version of ISO 11554;
Reference document for the lifetime in 5.4 is amended;
Precaution against the measuring arrangement used for the half-intensity width and 1/e2-intensity is added in 5.5.3;
Reference tables in Annex A, Annex B and Annex C are revised by following the latest version of ISO publications.
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IEC 60749-28:2022 is available as IEC 60749-28:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-28:2022 establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex J. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels. This edition includes the following significant technical changes with respect to the previous edition: - a new subclause and annex relating to the problems associated with CDM testing of integrated circuits and discrete semiconductors in very small packages; - changes to clarify cleaning of devices and testers.
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IEC 60749-28:2022 is available as IEC 60749-28:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-28:2022 establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex J. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels. This edition includes the following significant technical changes with respect to the previous edition:
- a new subclause and annex relating to the problems associated with CDM testing of integrated circuits and discrete semiconductors in very small packages;
- changes to clarify cleaning of devices and testers.
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This part of IEC 60749 details the procedures for the measurement of the characteristic
properties of moisture diffusivity and water solubility in organic materials used in the
packaging of semiconductor components.
These two material properties are important parameters for the effective reliability
performance of plastic packaged semiconductors after exposure to moisture and being
subjected to high-temperature solder reflow.
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IEC 60749-39:2021 is available as IEC 60749-39:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition:
- updated procedure for "dry weight" determination.
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This part of IEC 63244 provides general requirements and specifications of the semiconductor
devices for the performance and reliability evaluations of wireless power transfer and charging
systems. For the performance evaluations, this part covers various characterization parameters
and symbols, general system diagrams, and test setups and test conditions.
This document also describes classifications of the wireless power transfer technologies.
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This part of IEC 62435 specifies storage practices encompassing silicon and semiconductor
device building blocks of all types that are integrated together to into products in the form of
either packages or boards that can be stored as fully assembled units or partial assemblies.
Special attention is given to memories as components and assemblies although methods also
apply to heterogeneous components. Guidelines and requirements for customer-supplier
interaction are provided to manage the complexity.
NOTE In IEC 62435 (all parts), the term "components" is used interchangeably with dice, wafers, passives and
packaged devices.
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This part of IEC 63287 gives guidelines for reliability qualification plans of semiconductor
integrated circuit products. This document is not intended for military- and space-related
applications.
NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this
guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if
it is specified.
NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the
appropriate sample size and test conditions of a given reliability project
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IEC 63287-1:2021 gives guidelines for reliability qualification plans of semiconductor integrated circuit products. This document is not intended for military- and space-related applications.
NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if it is specified.
NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the appropriate sample size and test conditions of a given reliability project.
This first edition of IEC 63287-1 cancels and replaces the first edition of IEC 60749-43 published in 2017. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
the document has been renamed and renumbered to distinguish it from the IEC 60749 (all parts);
a new section concerning the concept of "family" has been added with appropriate renumbering of the existing text.
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IEC 60747-14-11:2021(E) defines the terms, definitions, configuration, and test methods can be used to evaluate and determine the performance characteristics of surface acoustic wave-based semiconductor sensors integrated with ultraviolet, illuminance, and temperature sensors. The measurement methods are for DC characteristics and RF characteristics, and the measurement method for RF characteristics includes a direct mode and differential amplifier mode based on feedback oscillation. This document excludes devices dealt with by TC 49: piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection.
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IEC Corrected Version
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IEC 62435-7:2020 on long-term storage applies to micro-electromechanical devices (MEMS) in long-term storage that can be used as part of obsolescence mitigation strategy. Long-term storage refers to a duration that may be more than 12 months for products scheduled for storage. Philosophy, good working practice, and general means to facilitate the successful long-term storage of electronic components are also addressed.
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This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety test
and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for
magnetic and capacitive couplers for basic insulation and reinforced insulation.
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This part of IEC 60749 provides a means of assessing the resistance to soldering heat of
semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is
destructive.
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The contents of the corrigendum of September 2020 have been included in this copy.
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This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the soldering temperature encountered in printed
wiring board assembly operations, without degrading their electrical characteristics or internal
connections.
This test is destructive and may be used for qualification, lot acceptance and as a product
monitor.
The heat is conducted through the leads into the device package from solder heat at the
reverse side of the board. This procedure does not simulate wave soldering or reflow heat
exposure on the same side of the board as the package body.
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This part of IEC 60749 establishes a standard procedure for determining the preconditioning
of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs
representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this
document prior to being submitted to specific in-house reliability testing (qualification and/or
reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).
NOTE 1 Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) in
accordance with IEC 60749-20 and this document and the actual reflow conditions used are dependent upon
identical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore,
the temperature at the top of the package on the hottest moisture sensitive SMD during assembly is monitored to
ensure that it does not exceed the temperature at which the components are evaluated.
NOTE 2 For the purpose of this document, SMD is restricted to include only plastic-encapsulated SMDs and other
packages made with moisture-permeable materials.
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This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety
tests, as well as the measuring methods for photocouplers.
NOTE The term "optocoupler" can also be used instead of "photocoupler".
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This part of the IEC 62435 series on long-term storage is applied to passive electronic devices
in long-term storage that can be used as part of obsolescence mitigation strategy. Longterm
storage refers to a duration that can be more than 12 months for product scheduled for
storage. Storage typically begins when components are packed at the originating supplier
where the pack date or date code are assigned to the product. It is the responsibility of the
distributor and the customer to control and manage the aging inventory upon receipt of the
dated product. Alternatively, a supplier-customer agreement can be established to manage
the aging inventory. Philosophy, good working practice, and general means to facilitate the
successful long-term storage of electronic components are also addressed.
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This part of IEC 60749 specifies the procedural requirements for performing valid endurance,
retention and cross-temperature tests based on a qualification specification. Endurance and
retention qualification specifications (for cycle counts, durations, temperatures, and sample
sizes) are specified in JESD47 or are developed using knowledge-based methods such as in
JESD94.
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IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.
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IEC 60749-30:2020 is available as IEC 60749-30:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3;
- expansion of 6.7 on solder reflow;
- inclusion of explanatory notes and clarifications.
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IEC 60749-41:2020 specifies the procedural requirements for performing valid endurance, retention and cross-temperature tests based on a qualification specification. Endurance and retention qualification specifications (for cycle counts, durations, temperatures, and sample sizes) are specified in JESD47 or are developed using knowledge-based methods such as in JESD94.
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IEC 60747-5-5:2020 specifies the terminology, essential ratings, characteristics, safety tests, as well as the measuring methods for photocouplers.
Note: The term "optocoupler" can also be used instead of "photocoupler".
This edition includes the following significant technical changes with respect to the previous edition:
a) optional data sheet basic insulation rating in accordance with IEC 60664-1:2007, 6.1.3.5;
b) editorial corrections on the use of VIORM;
c) editorial corrections on Figure 2: Time intervals for method b);
d) addition of an alternative surge pulse VIOSM test method.
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IEC 60749-15:2020 is available as IEC 60749-15:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3, Terms and definitions;
- clarification of the use of a soldering iron for producing the heating effect;
- inclusion an option to use accelerated ageing.
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This part of IEC 62435 describes the aspects of data storage that are necessary for
successful use of electronic components being stored after long periods while maintaining
traceability or chain of custody. It defines what sort of data needs to be stored alongside the
components or dies and the best way to do so in order to avoid losing data during the storage
period. As defined in this document, long-term storage refers to a duration that can be more
than twelve months for products scheduled for long duration storage. Philosophy, good
working practice, and general means to facilitate the successful long-term-storage of
electronic components are also addressed.
NOTE In IEC 62435 (all parts), the term "components" is used interchangeably with dice, wafers, passives and
packaged devices.
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IEC 62933-5-2:2020 primarily describes safety aspects for people and, where appropriate, safety matters related to the surroundings and living beings for grid-connected energy storage systems where an electrochemical storage subsystem is used.
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IEC 60747-18-2:2020(E) specifies the evaluation process of lens-free CMOS photonic array sensor package modules. This document includes the measurement environment of each process, statistical analysis of test data, middle layer effect under various user light, evaluation of calibrated lens-free CMOS photonic array sensor package modules, and test report.
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IEC 62779-4:2020 defines general requirements on the electrical performances of a semiconductor interface for capsule endoscope using galvanic coupling human body communication. It includes general and functional specifications of the interface. The semiconductor interface that is covered in this document is the interface to handle or deliver an electrical signal between the capsule endoscope inside the human body and the HBC modem in the receiving device outside the human body.
NOTE Additional information on capsule endoscope using the human body communication is provided in Annex A of this document.
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IEC 60747-9:2019 specifies product specific standards for terminology, letter symbols, essential ratings and characteristics, verification of ratings and methods of measurement for insulated-gate bipolar transistors (IGBTs).
This third edition includes the following significant technical changes with respect to the previous edition:
reverse-blocking IGBT and its related technical contents have been added;
reverse-conducting IGBT and its related technical contents have been added;
some parts of the previous edition have been amended, combined or deleted.
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IEC 60747-14-10:2019 specifies the terms, definitions, symbols, tests, and performance evaluation methods used to determine the performance characteristics of wearable electrochemical-glucose sensors for practical use. This document is applicable to all wearable electrochemical-glucose sensors for consumers and manufacturers, without any limitations on device technology and size.
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IEC 63033-3:2019 specifies measurement methods for the drive monitoring system that is specified in IEC TS 63033-1:2017.
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This standard specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.
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IEC 60749-20-1:2019 is available as IEC 60749-20-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.
The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition:
- updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions;
- addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.
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IEC 60749-18:2019 is available as IEC 60749-18:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-18:2019 provides a test procedure for defining requirements for testing packaged semiconductor integrated circuits and discrete semiconductor devices for ionizing radiation (total dose) effects from a cobalt-60 (60Co) gamma ray source. Other suitable radiation sources can be used. This document addresses only steady-state irradiations, and is not applicable to pulse type irradiations. It is intended for military- and aerospace-related applications. It is a destructive test. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with MIL-STD 883J, method 1019, including the use of enhanced low dose rate sensitivity (ELDRS) testing; - addition of a Bibliography, which includes ASTM standards relevant to this test method.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60749-18:2019 is available as IEC 60749-18:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-18:2019 provides a test procedure for defining requirements for testing packaged semiconductor integrated circuits and discrete semiconductor devices for ionizing radiation (total dose) effects from a cobalt-60 (60Co) gamma ray source. Other suitable radiation sources can be used. This document addresses only steady-state irradiations, and is not applicable to pulse type irradiations. It is intended for military- and aerospace-related applications. It is a destructive test. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with MIL-STD 883J, method 1019, including the use of enhanced low dose rate sensitivity (ELDRS) testing; - addition of a Bibliography, which includes ASTM standards relevant to this test method.
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The neutron irradiation test is performed to determine the susceptibility of semiconductor
devices to non-ionizing energy loss (NIEL) degradation. The test described herein is
applicable to integrated circuits and discrete semiconductor devices and is intended for
military- and aerospace-related applications. It is a destructive test.
The objectives of the test are as follows:
a) to detect and measure the degradation of critical semiconductor device parameters as
a function of neutron fluence, and
b) to determine if specified semiconductor device parameters are within specified limits after
exposure to a specified level of neutron fluence (see Clause 6).
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The neutron irradiation test is performed to determine the susceptibility of semiconductor devices to non-ionizing energy loss (NIEL) degradation. The test described herein is applicable to integrated circuits and discrete semiconductor devices and is intended for military- and aerospace-related applications. It is a destructive test. The objectives of the test are as follows: a) to detect and measure the degradation of critical semiconductor device parameters as a function of neutron fluence, and b) to determine if specified semiconductor device parameters are within specified limits after exposure to a specified level of neutron fluence (see Clause 6).
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60749-18:2019 is available as IEC 60749-18:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-18:2019 provides a test procedure for defining requirements for testing packaged semiconductor integrated circuits and discrete semiconductor devices for ionizing radiation (total dose) effects from a cobalt-60 (60Co) gamma ray source. Other suitable radiation sources can be used. This document addresses only steady-state irradiations, and is not applicable to pulse type irradiations. It is intended for military- and aerospace-related applications. It is a destructive test. This edition includes the following significant technical changes with respect to the previous edition:
- updates to subclauses to better align the test method with MIL-STD 883J, method 1019, including the use of enhanced low dose rate sensitivity (ELDRS) testing;
- addition of a Bibliography, which includes ASTM standards relevant to this test method.
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IEC 60749-17:2019 is performed to determine the susceptibility of semiconductor devices to non-ionizing energy loss (NIEL) degradation. The test described herein is applicable to integrated circuits and discrete semiconductor devices and is intended for military- and aerospace-related applications. It is a destructive test.
This edition includes the following significant technical changes with respect to the previous edition:
updates to better align the test method with MIL-STD 883J, method 1017, including removal of restriction of use of the document, and a requirement to limit the total ionization dose;
addition of a Bibliography, including US MIL- and ASTM standards relevant to this test method.
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This part of IEC 62435 on long-term storage applies to packaged or finished devices in longterm
storage that can be used as part of obsolescence mitigation strategy. Long-term storage
refers to a duration that can be more than 12 months for product scheduled for storage. Philosophy,
good working practice, and general means to facilitate the successful long-term storage
of electronic components are also addressed.
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This part of IEC 62969 specifies a method of directly fault injection test for automotive
semiconductor sensor interface that can be used to support the conformance assurance in the
vehicle communications interface.
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This part of IEC 62435 specifies long-term storage methods and recommended conditions for
long-term storage of electronic components including logistics, controls and security related to
the storage facility. Long-term storage refers to a duration that may be more than 12 months
for products scheduled for long duration storage. The philosophy of such storage, good
working practices and general means to facilitate the successful long-term storage of
electronic components are also addressed.
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This part of IEC 62969 describes terms, definitions, symbols, configurations, and test
methods that can be used to evaluate and determine the performance characteristics of
mechanical shock driven piezoelectric energy harvesting devices for automotive vehicle
sensor applications.
This document is also applicable to energy harvesting devices for motorbikes, automobiles,
buses, trucks and their respective engineering subsystems applications without any limitations
of device technology and size.
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This part of IEC 62969 specifies procedures and definitions for measuring the efficiency of the
wireless power transmission system for the automotive vehicles sensors. This document deals
with the power range below 500 mW.
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This part of IEC 60749 describes a salt atmosphere test that determines the resistance of
semiconductor devices to corrosion. It is an accelerated test that simulates the effects of
severe sea-coast atmosphere on all exposed surfaces. It is only applicable to those devices
specified for a marine environment.
The salt atmosphere test is considered destructive.
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