IEC 60747-14-11:2021(E) defines the terms, definitions, configuration, and test methods can be used to evaluate and determine the performance characteristics of surface acoustic wave-based semiconductor sensors integrated with ultraviolet, illuminance, and temperature sensors. The measurement methods are for DC characteristics and RF characteristics, and the measurement method for RF characteristics includes a direct mode and differential amplifier mode based on feedback oscillation. This document excludes devices dealt with by TC 49: piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection.

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IEC 62435-7:2020 on long-term storage applies to micro-electromechanical devices (MEMS) in long-term storage that can be used as part of obsolescence mitigation strategy. Long-term storage refers to a duration that may be more than 12 months for products scheduled for storage. Philosophy, good working practice, and general means to facilitate the successful long-term storage of electronic components are also addressed.

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This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety test
and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for
magnetic and capacitive couplers for basic insulation and reinforced insulation.

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This part of IEC 60749 provides a means of assessing the resistance to soldering heat of
semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is
destructive.

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This part of IEC 60749 establishes a standard procedure for determining the preconditioning
of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs
representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this
document prior to being submitted to specific in-house reliability testing (qualification and/or
reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).
NOTE 1 Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) in
accordance with IEC 60749-20 and this document and the actual reflow conditions used are dependent upon
identical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore,
the temperature at the top of the package on the hottest moisture sensitive SMD during assembly is monitored to
ensure that it does not exceed the temperature at which the components are evaluated.
NOTE 2 For the purpose of this document, SMD is restricted to include only plastic-encapsulated SMDs and other
packages made with moisture-permeable materials.

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The contents of the corrigendum of September 2020 have been included in this copy.

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This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the soldering temperature encountered in printed
wiring board assembly operations, without degrading their electrical characteristics or internal
connections.
This test is destructive and may be used for qualification, lot acceptance and as a product
monitor.
The heat is conducted through the leads into the device package from solder heat at the
reverse side of the board. This procedure does not simulate wave soldering or reflow heat
exposure on the same side of the board as the package body.

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This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety
tests, as well as the measuring methods for photocouplers.
NOTE The term "optocoupler" can also be used instead of "photocoupler".

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This part of IEC 60749 specifies the procedural requirements for performing valid endurance,
retention and cross-temperature tests based on a qualification specification. Endurance and
retention qualification specifications (for cycle counts, durations, temperatures, and sample
sizes) are specified in JESD47 or are developed using knowledge-based methods such as in
JESD94.

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This part of the IEC 62435 series on long-term storage is applied to passive electronic devices
in long-term storage that can be used as part of obsolescence mitigation strategy. Longterm
storage refers to a duration that can be more than 12 months for product scheduled for
storage. Storage typically begins when components are packed at the originating supplier
where the pack date or date code are assigned to the product. It is the responsibility of the
distributor and the customer to control and manage the aging inventory upon receipt of the
dated product. Alternatively, a supplier-customer agreement can be established to manage
the aging inventory. Philosophy, good working practice, and general means to facilitate the
successful long-term storage of electronic components are also addressed.

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IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.

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IEC 60749-30:2020 is available as IEC 60749-30:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3;
- expansion of 6.7 on solder reflow;
- inclusion of explanatory notes and clarifications.

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IEC 60749-41:2020 specifies the procedural requirements for performing valid endurance, retention and cross-temperature tests based on a qualification specification. Endurance and retention qualification specifications (for cycle counts, durations, temperatures, and sample sizes) are specified in JESD47 or are developed using knowledge-based methods such as in JESD94.

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IEC 60747-5-5:2020(E) specifies the terminology, essential ratings, characteristics, safety tests, as well as the measuring methods for photocouplers.
Note: The term "optocoupler" can also be used instead of "photocoupler".
This edition includes the following significant technical changes with respect to the previous edition:
a) optional data sheet basic insulation rating in accordance with IEC 60664-1:2007, 6.1.3.5;
b) editorial corrections on the use of VIORM;
c) editorial corrections on Figure 2: Time intervals for method b);
d) addition of an alternative surge pulse VIOSM test method.

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IEC 60749-15:2020 is available as IEC 60749-15:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3, Terms and definitions;
- clarification of the use of a soldering iron for producing the heating effect;
- inclusion an option to use accelerated ageing.

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This part of IEC 62435 describes the aspects of data storage that are necessary for
successful use of electronic components being stored after long periods while maintaining
traceability or chain of custody. It defines what sort of data needs to be stored alongside the
components or dies and the best way to do so in order to avoid losing data during the storage
period. As defined in this document, long-term storage refers to a duration that can be more
than twelve months for products scheduled for long duration storage. Philosophy, good
working practice, and general means to facilitate the successful long-term-storage of
electronic components are also addressed.
NOTE In IEC 62435 (all parts), the term "components" is used interchangeably with dice, wafers, passives and
packaged devices.

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IEC 62933-5-2:2020 primarily describes safety aspects for people and, where appropriate, safety matters related to the surroundings and living beings for grid-connected energy storage systems where an electrochemical storage subsystem is used.

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IEC 62779-4:2020 defines general requirements on the electrical performances of a semiconductor interface for capsule endoscope using galvanic coupling human body communication. It includes general and functional specifications of the interface. The semiconductor interface that is covered in this document is the interface to handle or deliver an electrical signal between the capsule endoscope inside the human body and the HBC modem in the receiving device outside the human body.
NOTE Additional information on capsule endoscope using the human body communication is provided in Annex A of this document.

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IEC 60747-18-2:2020(E) specifies the evaluation process of lens-free CMOS photonic array sensor package modules. This document includes the measurement environment of each process, statistical analysis of test data, middle layer effect under various user light, evaluation of calibrated lens-free CMOS photonic array sensor package modules, and test report.

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IEC 60747-9:2019 specifies product specific standards for terminology, letter symbols, essential ratings and characteristics, verification of ratings and methods of measurement for insulated-gate bipolar transistors (IGBTs).
This third edition includes the following significant technical changes with respect to the previous edition:  
reverse-blocking IGBT and its related technical contents have been added;
reverse-conducting IGBT and its related technical contents have been added;
some parts of the previous edition have been amended, combined or deleted.

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IEC 60747-14-10:2019 specifies the terms, definitions, symbols, tests, and performance evaluation methods used to determine the performance characteristics of wearable electrochemical-glucose sensors for practical use. This document is applicable to all wearable electrochemical-glucose sensors for consumers and manufacturers, without any limitations on device technology and size.

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IEC 63033-3:2019 specifies measurement methods for the drive monitoring system that is specified in IEC TS 63033-1:2017.

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This standard specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

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IEC 60749-20-1:2019 is available as IEC 60749-20-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.
The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition:
- updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions;
- addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.

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IEC 60749-18:2019 is available as IEC 60749-18:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-18:2019 provides a test procedure for defining requirements for testing packaged semiconductor integrated circuits and discrete semiconductor devices for ionizing radiation (total dose) effects from a cobalt-60 (60Co) gamma ray source. Other suitable radiation sources can be used. This document addresses only steady-state irradiations, and is not applicable to pulse type irradiations. It is intended for military- and aerospace-related applications. It is a destructive test. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with MIL-STD 883J, method 1019, including the use of enhanced low dose rate sensitivity (ELDRS) testing; - addition of a Bibliography, which includes ASTM standards relevant to this test method.

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IEC 60749-18:2019 is available as IEC 60749-18:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-18:2019 provides a test procedure for defining requirements for testing packaged semiconductor integrated circuits and discrete semiconductor devices for ionizing radiation (total dose) effects from a cobalt-60 (60Co) gamma ray source. Other suitable radiation sources can be used. This document addresses only steady-state irradiations, and is not applicable to pulse type irradiations. It is intended for military- and aerospace-related applications. It is a destructive test. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with MIL-STD 883J, method 1019, including the use of enhanced low dose rate sensitivity (ELDRS) testing; - addition of a Bibliography, which includes ASTM standards relevant to this test method.

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The neutron irradiation test is performed to determine the susceptibility of semiconductor
devices to non-ionizing energy loss (NIEL) degradation. The test described herein is
applicable to integrated circuits and discrete semiconductor devices and is intended for
military- and aerospace-related applications. It is a destructive test.
The objectives of the test are as follows:
a) to detect and measure the degradation of critical semiconductor device parameters as
a function of neutron fluence, and
b) to determine if specified semiconductor device parameters are within specified limits after
exposure to a specified level of neutron fluence (see Clause 6).

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The neutron irradiation test is performed to determine the susceptibility of semiconductor devices to non-ionizing energy loss (NIEL) degradation. The test described herein is applicable to integrated circuits and discrete semiconductor devices and is intended for military- and aerospace-related applications. It is a destructive test. The objectives of the test are as follows: a) to detect and measure the degradation of critical semiconductor device parameters as a function of neutron fluence, and b) to determine if specified semiconductor device parameters are within specified limits after exposure to a specified level of neutron fluence (see Clause 6).

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IEC 60749-18:2019 is available as IEC 60749-18:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-18:2019 provides a test procedure for defining requirements for testing packaged semiconductor integrated circuits and discrete semiconductor devices for ionizing radiation (total dose) effects from a cobalt-60 (60Co) gamma ray source. Other suitable radiation sources can be used. This document addresses only steady-state irradiations, and is not applicable to pulse type irradiations. It is intended for military- and aerospace-related applications. It is a destructive test. This edition includes the following significant technical changes with respect to the previous edition:
- updates to subclauses to better align the test method with MIL-STD 883J, method 1019, including the use of enhanced low dose rate sensitivity (ELDRS) testing;
- addition of a Bibliography, which includes ASTM standards relevant to this test method.

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IEC 60749-17:2019 is performed to determine the susceptibility of semiconductor devices to non-ionizing energy loss (NIEL) degradation. The test described herein is applicable to integrated circuits and discrete semiconductor devices and is intended for military- and aerospace-related applications. It is a destructive test.
This edition includes the following significant technical changes with respect to the previous edition:  
updates to better align the test method with MIL-STD 883J, method 1017, including removal of restriction of use of the document, and a requirement to limit the total ionization dose;
addition of a Bibliography, including US MIL- and ASTM standards relevant to this test method.

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This part of IEC 62435 on long-term storage applies to packaged or finished devices in longterm
storage that can be used as part of obsolescence mitigation strategy. Long-term storage
refers to a duration that can be more than 12 months for product scheduled for storage. Philosophy,
good working practice, and general means to facilitate the successful long-term storage
of electronic components are also addressed.

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This part of IEC 62969 specifies a method of directly fault injection test for automotive
semiconductor sensor interface that can be used to support the conformance assurance in the
vehicle communications interface.

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This part of IEC 62435 specifies long-term storage methods and recommended conditions for
long-term storage of electronic components including logistics, controls and security related to
the storage facility. Long-term storage refers to a duration that may be more than 12 months
for products scheduled for long duration storage. The philosophy of such storage, good
working practices and general means to facilitate the successful long-term storage of
electronic components are also addressed.

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This part of IEC 62969 describes terms, definitions, symbols, configurations, and test
methods that can be used to evaluate and determine the performance characteristics of
mechanical shock driven piezoelectric energy harvesting devices for automotive vehicle
sensor applications.
This document is also applicable to energy harvesting devices for motorbikes, automobiles,
buses, trucks and their respective engineering subsystems applications without any limitations
of device technology and size.

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This part of IEC 62969 specifies procedures and definitions for measuring the efficiency of the
wireless power transmission system for the automotive vehicles sensors. This document deals
with the power range below 500 mW.

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This part of IEC 60749 describes a salt atmosphere test that determines the resistance of
semiconductor devices to corrosion. It is an accelerated test that simulates the effects of
severe sea-coast atmosphere on all exposed surfaces. It is only applicable to those devices
specified for a marine environment.
The salt atmosphere test is considered destructive.

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IEC 60974-9:2018 is also available as IEC 60974-9:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60974-9:2018 is applicable to requirements for installation and instructions for use of equipment for arc welding and allied processes designed in accordance with safety requirements of IEC 60974-1, IEC 60974-6 or equivalent. This standard cancels and replaces the first edition published in 2010. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- addition of a new Clause 8;
- addition of interpolation details in Table 1.

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This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete
devices, including discrete surface-mounted semiconductor devices with lead count less than
8.
For the preparation of outline drawings of surface-mounted discrete devices with a lead count
higher or equal to 8, IEC 60191-6 should be referred to as well.
The primary object of these drawings is to indicate the space to be allowed for devices in
equipment, together with other dimensional characteristics required to ensure mechanical
interchangeability.
Complete interchangeability involves other considerations such as the electrical and thermal
characteristics of the semiconductor devices concerned.
The international standardization represented by these drawings therefore encourages the
manufacturers of devices to comply with the tolerances shown on the drawings in order to
extend their range of customers internationally. It also gives equipment designers an
assurance of mechanical interchangeability between the devices obtained from suppliers in
different countries, provided they allow the space in their equipment that is indicated by the
drawings and take note of the more precise information on bases, studs, etc.
NOTE Additional details of reference letter symbols used in this document are given in Annex A.

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This part of IEC 60749 establishes the procedure for testing, evaluating, and classifying
components and microcircuits according to their susceptibility (sensitivity) to damage or
degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).
The purpose of this document is to establish a test method that will replicate HBM failures and
provide reliable, repeatable HBM ESD test results from tester to tester, regardless of
component type. Repeatable data will allow accurate classifications and comparisons of HBM
ESD sensitivity levels.
ESD testing of semiconductor devices is selected from this test method, the machine model
(MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series.
Unless otherwise specified, this test method is the one selected.

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IEC 60749-13:2018 describes a salt atmosphere test that determines the resistance of semiconductor devices to corrosion. It is an accelerated test that simulates the effects of severe sea-coast atmosphere on all exposed surfaces. It is only applicable to those devices specified for a marine environment. The salt atmosphere test is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) alignment with MIL-STD-883J Method 1009.8, Salt Atmosphere (Corrosion), including information on conditioning and maintenance of the test chamber and mounting of test specimens (including explanatory figures).

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IEC 60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. This edition includes the following significant technical changes with respect to the previous edition: a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8; b) a definition of the term "stand-off" has been added; c) the methods for locating the datum have been extended to be suitable for SMD-packages; d) the visual identification of terminal position one for automatic handling has been clarified; e) the rules for the drawing of terminals have been clarified; f) Table A.1 has been completed with symbols specifically for SMD-packages; g) Annex B "Standardization philosophy" has been deleted; h) a normative Annex with special rules for SMD-packages has been added; i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.

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This part of IEC 60749 describes a test to determine the effect of variable frequency vibration,
within the specified frequency range, on internal structural elements. This is a destructive test.
It is normally applicable to cavity-type packages.
NOTE This test method describes a swept sine test. A random vibration test is described in JEDEC document
JESD 22-B103.

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Specifies a small-scale laboratory screening procedure for comparing the relative burning behaviour of vertically or horizontally oriented specimens made from plastic and other non-metallic materials, exposed to a small-flame ignition source of 50 W nominal power.  These test methods determine the linear burning rate and the afterflame/afterglow times, as well as the damaged length of specimens.  Applicable to solid and cellular materials that have an apparent density of not less than 250 kg/m3, determined in accordance with ISO 845.  They do not apply to materials that shrink away from applied flame without igniting;  ISO 9773 should be used for thin flexible materials.  The test methods described provide classification systems which may be used for quality assurance, or the pre-selection of component materials of products.  May be used for the pre-selection of a material, providing positive results are obtained at a thickness equal to the smallest thickness used in the application.  Has the status of a basic safety publication in accordance with Guide 104.

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IEC 60749-26:2018 establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The purpose of this document is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels. ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. Unless otherwise specified, this test method is the one selected. This fourth edition cancels and replaces the third edition published in 2013. This edition constitutes a technical revision. This standard is based upon ANSI/ESDA/JEDEC JS-001-2014. It is used with permission of the copyright holders, ESD Association and JEDEC Solid state Technology Association. This edition includes the following significant technical changes with respect to the previous edition: a) a new subclause relating to HBM stressing with a low parasitic simulator is added, together with a test to determine if an HBM simulator is a low parasitic simulator; b) a new subclause is added for cloned non-supply pins and a new annex is added for testing cloned non-supply pins.

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IEC 60749-12:2017 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It is normally applicable to cavity-type packages This second edition cancels and replaces the first edition published in 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) alignment with MIL-STD-883J Method 2007, Vibration, variable frequency.

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