IEC 62830-7:2021 defines terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of linear sliding mode triboelectric energy harvesting devices for practical use. This document is applicable to energy harvesting devices for consumer, general industries, military and aerospace applications without any limitations on device technology and size.

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      62 pages
      English and French language

IEC 62830-5:2021 specifies the test method for measuring generated electric power from flexible thermoelectric devices under bending conditions. This document provides terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance of flexible thermoelectric devices. This document also describes the test conditions such as temperature, temperature difference, contact conditions, insulation and bending radius of flexible thermoelectric devi...view more

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      32 pages
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IEC 60747-17:2020 specifies the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for magnetic and capacitive couplers for basic insulation and reinforced insulation.
This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a technical revision.
This edition includes the following significant te...
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      104 pages
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This document specifies performance requirements for electronic controlgear for use on DC or
AC supplies up to 1 000 V (alternating current at 50 Hz or 60 Hz) and with an output
frequency which can deviate from the supply frequency, associated with LED modules
according to IEC 62031. Controlgear for LED modules specified in this document are
designed to provide constant voltage or current. Deviations from the pure voltage and current
types do not exclude the gear from this document.
NOTE 1...
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The contents of the corrigendum of September 2020 have been included in this copy.

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      5 pages
      English language
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      9 pages
      English and French language

IEC 63068-3:2020 provides definitions and guidance in use of photoluminescence for detecting as-grown defects in commercially available 4H-SiC (Silicon Carbide) epitaxial wafers. Additionally, this document exemplifies photoluminescence images and emission spectra to enable the detection and categorization of the defects in SiC homoepitaxial wafers.

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      51 pages
      English and French language

IEC 62384:2020 is available as IEC 62384:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62384:2020 specifies performance requirements for electronic controlgear for use on DC or AC supplies up to 1 000 V (alternating current at 50 Hz or 60 Hz) and with an output frequency which can deviate from the supply frequency, associated with LED modules according to IEC 62031. Controlgear for L...
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IEC 62047-37:2020 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric p...view more

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      34 pages
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NEW!IEC 62031:2018 is available as IEC 62031:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62031:2018 specifies general and safety requirements for light-emitting diode (LED) modules: - non-integrated LED modules (LEDni modules) and semi-integrated LED modules (LEDsi modules) for operation under constant voltage, constant current or constant power; - Integrated LED modules (LEDi module...view more

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IEC 60747-5-10:2019(E) specifies the measuring method of the internal quantum efficiency (IQE) of single light emitting diode (LED) chips or packages without phosphor. White LEDs for lighting applications are out of the scope of this document. This document utilizes only the relative external quantum efficiency (EQE) measured at an operating room temperature. In order to identify the reference IQE, an operating current corresponding to the injection efficiency of 100 % is found and the radiative...view more

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      16 pages
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IEC 60747-5-9:2019(E) specifies the measuring method of the internal quantum efficiency (IQE) of single light emitting diode (LED) chips or packages without phosphor. White LEDs for lighting applications are out of the scope of this document. This document utilizes the relative external quantum efficiencies (EQEs) measured at cryogenic temperatures and at an operating temperature, which is called temperature-dependent electroluminescence (TDEL). In order to identify the reference IQE of 100 %, t...view more

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      19 pages
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IEC 60747-18-3:2019(E) specifies the fluid flow characteristics of lens-free CMOS photonic array sensor package modules with fluidic system for bio analysis. This document includes the measurement set-up, measurement and calculation at initial state flow, criteria of the fluidic system for quality assurance, measurement and calculation at steady-state flow, and test report.

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      22 pages
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IEC 60747-5-11:2019(E) specifies the measuring methods of radiative and nonradiative currents of single light emitting diode (LED) chips or packages without phosphor. White LEDs for lighting applications are out of the scope of this document. This document utilizes the internal quantum efficiency (IQE) as a function of current, whose measurement methods are discussed in other documents.

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      13 pages
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IEC 60747-19-1:2019(E) specifies the control scheme of a sensor which is a device or a module which achieves a sensing function, data processing function and data output function, by employing a digital processing unit and a means of bidirectional communication between the sensor and an external terminal module

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      21 pages
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IEC 62047-35:2019 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 mm to 1 mm, but these are not limiting values. The test method is so designed as to bend de...view more

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      41 pages
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IEC 60747-5-8:2019 specifies the terminology and the measuring methods of various efficiencies of single light emitting diode (LED) chips or packages without phosphor. White LEDs for lighting applications are out of the scope of this part of IEC 60747. The efficiencies whose measuring methods are defined in this part are the power efficiency (PE), the external quantum efficiency (EQE), the voltage efficiency (VE), and the light extraction efficiency (LEE). To measure the LEE, the measurement dat...view more

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IEC 6074716-6:2019 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

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IEC 62830-6:2019(E) defines terms, definitions, symbols, and specifies configurations and test methods to be used to evaluate and determine the performance characteristics of vertical contact mode triboelectric energy harvesting devices for practical use. This document is applicable to energy harvesting devices as power sources for wearable devices and wireless sensors used in healthcare monitoring, consumer electronics, general industries, military and aerospace applications without any limitat...view more

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      24 pages
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IEC 6074716-6:2019 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

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      50 pages
      English and French language

IEC 60747-18-1:2019 (E) specifies the test methods and data analysis for the calibration of lens-free CMOS photonic array sensors. This document includes the test conditions of each process, configuration of lens-free CMOS photonic array sensors, statistical analysis of test data, calibration for planarization and linearity, and test reports.

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      26 pages
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IEC 63150-1:2019 specifies terms and definitions, and test methods for kinetic energy harvesting devices for one-dimensional mechanical vibrations to determine the characteristic parameters under a practical vibration environment. Such vibration energy harvesting devices often have their own non-linear mechanisms to efficiently capture vibration energy in a broadband frequency range. This document is applicable to vibration energy harvesting devices with different power generation principles (su...view more

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      74 pages
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IEC 62951-6:2019 specifies terms, as well as the test method and report of sheet resistance of the flexible conducting film under bending and folding tests. The measurement methods include the 2-point probe, 4-point probe and Montgomery method, which can be applied to in-situ and ex-situ measurement and the measurements of anisotropic sheet resistance.

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      50 pages
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IEC 62951-2:2019 specifies terms, definitions, symbols, configurations and evaluation methods that can be used to evaluate and determine the performance characteristics of flexible thin‑film transistor (TFT) devices. This document specifies test methods and characteristic parameters for accurately evaluating the performance and reliability in practical use of flexible TFT devices under the bending status.

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      21 pages
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IEC 62047-34:2019 (E) describes test conditions and test methods of electric character, static performances and thermal performances for MEMS pressure-sensitive devices. This document applies to test for both open and closed loop piezoresistive MEMS pressure devices on wafer.

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      16 pages
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IEC 62047-36:2019 (E) specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical stress, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of converse piezoelectric proper...view more

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IEC 62047-33:2019 (E) defines terms, definitions, essential ratings and characteristics, as well as test methods applicable to MEMS piezoresistive pressure-sensitive device. This document applies to piezoresistive pressure-sensitive devices for automotive, medical treatment, electronic products.

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      24 pages
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IEC 62047-31:2019 (E) specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there are many layered material interfaces, and their adhesion energies are critical to the reliability of the MEMS devices. The four-point bending test utilizes a pure bending moment applied to a test piece of layered MEMS device, and the ...view more

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      12 pages
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IEC 62951-7:2019 specifies evaluation conditions and gives a method of measurement as well as a test set-up for the measurement of barrier performance for thin-film layer with ultra‑low permeation rate under both flat and bending conditions. This document also includes the preparation of specimen, electrical contacts, sensor films and calculation procedures. For these purposes, this document provides terms, definitions, symbols, configurations, and test methods including test conditions such as ...view more

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      28 pages
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IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are su...view more

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      33 pages
      English and French language

IEC 62830-4:2019 describes terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of flexible piezoelectric energy harvesting devices for practical use. This document is applicable to energy harvesting devices for consumers, general industries, wearable electronics, military, and biomedical applications without any limitations of device technology and size.

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      61 pages
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IEC 62951-4:2019 specifies an evaluation method of the bending fatigue properties of conductive thin film and flexible substrate for the application at flexible semiconductor devices. The films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film used for flexible semiconductor devices. The electrical and mechanical behaviours of films on the substrate are evaluated. The fatigue test method...view more

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      26 pages
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IEC 63068-1:2019(E) gives a classification of defects in as-grown 4H-SiC (Silicon Carbide) epitaxial layers. The defects are classified on the basis of their crystallographic structures and recognized by non-destructive detection methods including bright-field OM (optical microscopy), PL (photoluminescence), and XRT (X-ray topography) images.

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      23 pages
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IEC 63068-2:2019(E) provides definitions and guidance in use of optical inspection for detecting as-grown defects in commercially available 4H-SiC (Silicon Carbide) epitaxial wafers. Additionally, this document exemplifies optical images to enable the detection and categorization of the defects for SiC homoepitaxial wafers. This document deals with a non-destructive test method for the defects so that destructive methods such as preferential etching are out of scope in this document.

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      25 pages
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IEC 62047-32:2019 specifies the test method and test condition for the nonlinear vibration of MEMS resonators. The statements made in this document apply to the development and manufacture for MEMS resonators.

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      37 pages
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IEC 60050-523:2018 gives the general terminology used for micro-electromechanical devices including the process of production of such devices. This terminology is consistent with the terminology developed in the other specialized parts of the IEV.
It has the status of a horizontal standard in accordance with IEC Guide 108.

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      47 pages
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IEC 62951-3:2018(E) specifies the method for evaluating thin film transistor characteristics on flexible substrates under bulging. The thin film transistor is fabricated on flexible substrates, including polyethylene terephthalate (PET), polyimide (PI), elastomer and others. The stress is applied by applying a uniformly-distributed pressure to the flexible substrate using the equipment.

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      22 pages
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IEC 62969-4:2018 specifies a method of directly fault injection test for automotive semiconductor sensor interface that can be used to support the conformance assurance in the vehicle communications interface.

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IEC 62969-3:2018 describes terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of mechanical shock driven piezoelectric energy harvesting devices for automotive vehicle sensor applications. This document is also applicable to energy harvesting devices for motorbikes, automobiles, buses, trucks and their respective engineering subsystems applications without any limitations of device technology and size.

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IEC 62969-4:2018 specifies a method of directly fault injection test for automotive semiconductor sensor interface that can be used to support the conformance assurance in the vehicle communications interface.

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      39 pages
      English and French language

IEC 62969-3:2018 describes terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of mechanical shock driven piezoelectric energy harvesting devices for automotive vehicle sensor applications.
This document is also applicable to energy harvesting devices for motorbikes, automobiles, buses, trucks and their respective engineering subsystems applications without any limitations of device technology and size.

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      48 pages
      English and French language

IEC 62969-2:2018 specifies procedures and definitions for measuring the efficiency of the wireless power transmission system for the automotive vehicles sensors. This document deals with the power range below 500 mW.

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IEC 62969-2:2018 specifies procedures and definitions for measuring the efficiency of the wireless power transmission system for the automotive vehicles sensors. This document deals with the power range below 500 mW.

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      21 pages
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IEC 62031:2018 is also available as IEC 62031:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62031:2018 specifies general and safety requirements for light-emitting diode (LED) modules:
- non-integrated LED modules (LEDni modules) and semi-integrated LED modules (LEDsi modules) for operation under constant voltage, constant current or constant power;
- Integrated LED modules (LEDi...
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IEC 62969-1:2017(E) provides general requirements for performance evaluations and environmental conditions for the power interface of automotive vehicle sensors. For performance evaluations, various electrical performances such as voltage drop from power source to automotive sensors, AC noises and voltage level are included. For environmental conditions, various test conditions such as temperature, humidity and vibration are included. In addition, terms, definitions, symbols and configurations a...view more

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IEC 62969-1:2017 provides general requirements for performance evaluations and environmental conditions for the power interface of automotive vehicle sensors. For performance evaluations, various electrical performances such as voltage drop from power source to automotive sensors, AC noises and voltage level are included. For environmental conditions, various test conditions such as temperature, humidity and vibration are included. In addition, terms, definitions, symbols and configurations are ...view more

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      34 pages
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IEC 62047-29:2017(E) specifies a relaxation test method for measuring electromechanical properties of freestanding conductive thin films for micro-electromechanical systems (MEMS) under controlled strain and room temperature. Freestanding thin films of conductive materials are extensively utilized in MEMS, opto-electronics, and flexible/wearable electronics products. Freestanding thin films in the products experience external and internal stresses which could be relaxed even under room temperatu...view more

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      12 pages
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IEC 62047-30:2017(E) specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film used for micro sensors and micro actuators, and its reporting schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films fabricated by MEMS process

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