31.180 - Printed circuits and boards
ICS 31.180 Details
Printed circuits and boards
Gedruckte Schaltungen. Leiterplatten
Cartes et circuits imprimes
Tiskana vezja (TIV) in tiskane plošče
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IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
- Draft9 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
- Standard40 pagesEnglish and French languagesale 15% off
IEC 61189-2-805:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
- Standard20 pagesEnglish and French languagesale 15% off
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
- Draft10 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62899-202-8:2024 provides a method for measuring the resistance difference of the printing direction of a printed conductive layer with wire-shaped or wire-type conducting materials. The method described in this document offers a measurement method and conditions for solution processed conductive films, fabricated by coating and printing process.
- Standard13 pagesEnglish languagesale 15% off
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
- Standard21 pagesEnglish and French languagesale 15% off
IEC TS 62878-2-10:2024 provides a general specification for the design of cavity substrates.
- Technical specification9 pagesEnglish languagesale 15% off
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
- Standard24 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard covers finished fabrics woven from ‘‘E’’ glass electrical grade glass fibre yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave.
This specification determines the nomenclature, definitions, general and chemical requirements for the glass, and physical requirements for finished woven glass fibre fabrics.
Annex A of this standard provides a style designator for each finished fabric glass style, with specifications on yarn, fabric count, thickness and weight in both SI and US system.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
- Standard24 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
- Standard42 pagesEnglish and French languagesale 15% off
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.
- Standard292 pagesEnglish languagesale 15% off
This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base
materials and printed boards using a thermomechanical analyser (TMA).
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
- Standard13 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
- Standard16 pagesEnglish and French languagesale 15% off
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
- Standard19 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.
- Standard26 pagesEnglish languagesale 15% off
IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
- Standard14 pagesEnglish languagesale 15% off
IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).
- Standard16 pagesEnglish and French languagesale 15% off
IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
- Standard21 pagesEnglish and French languagesale 15% off
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
- Standard19 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61249-6-3:2023 covers finished fabrics woven from ‘‘E’’ glass electrical grade glass fibre yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave.
This specification determines the nomenclature, definitions, general and chemical requirements for the glass, and physical requirements for finished woven glass fibre fabrics.
Annex A of this document provides a style designator for each finished fabric glass style, with specifications on yarn, fabric count, thickness and weight in both SI and US system.
This standard cancels and replaces IEC/PAS 61249-6-3 published in 2011. This edition constitutes a technical revision.
- Standard42 pagesEnglish and French languagesale 15% off
IEC TR 61191-9:2023, which is a Technical Report, applies to electronic and electromechanical automotive circuit board assemblies and describes current best practices for dealing with electrochemical reactions like migration or corrosion and ionic contamination on the surface of a circuit board as one failure mode under humidity load. This document deals with the evaluation of materials and manufacturing processes for the manufacturing of electronic assemblies with focus on their reliability under humidity loads. The electrical operation of a device in a humid environment can trigger electrochemical reactions that can lead to short circuits and malfunctions on the assembly. In this context, a large number of terms and methods are mentioned, such as CAF (conductive anodic filament), anodic migration phenomena, dendrite growth, cathodic migration, ROSE (resistivity of solvent extract), ionic contamination, SIR (surface insulation resistance), impedance spectroscopy, etc., which are used and interpreted differently. The aim of the document is to achieve a uniform use of language and to list the possibilities and limitations of common measurement methods. The focus of the document is on the error pattern of electrochemical migration on the surface of assemblies with cathodic formation of dendrites.
Evaluation of different test methods of control units under high humidity load are not part of this document.
- Technical report72 pagesEnglish languagesale 15% off
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
- Standard33 pagesEnglish and French languagesale 15% off
IEC 62899-202:2023 is available as IEC 62899-202:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62899-202:2023 defines the terms and specifies the standard test methods for characterization and evaluation of conductive inks. This document also provides measurement methods for evaluating the properties of conductive layers made both from an additive process using conductive inks and from a subtractive process used in printed electronics. This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of conductive material, conductive ink and conductive layer have been revised;
b) a summary of test methods is added;
c) mechanical tests for conductive layer are added.
- Standard37 pagesEnglish languagesale 15% off
- Standard74 pagesEnglish languagesale 15% off
This part of IEC 62496-2 defines a test method for folding flexibility inspection of flexible opto-electric circuits with a MIT folding endurance tester and presents a guideline for a step stress test method for finding the predetermined minimum mechanical folding radii below which the flexible opto-electric circuits can be damaged by intended folding distortion. Here, test samples are used instead of products for the flexibility test of their flexible opto-electric circuits, and the test samples have the same layer structure as the products.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
This International Standard covers finished fabrics woven from ‘‘E’’ glass electrical grade glass fibre yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave. This specification determines the nomenclature, definitions, general and chemical requirements for the glass, and physical requirements for finished woven glass fibre fabrics. Annex A of this standard provides a style designator for each finished fabric glass style, with specifications on yarn, fabric count, thickness and weight in both SI and US system.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
- Standard23 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers. IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.
- Standard55 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible
Copper Clad Laminate) products and related materials. This method determines the resilience
under specified conditions. The test is performed on the sample as manufactured and without
conditioning. The test does not apply to the resilience force lower than 10 mN.
- Standard18 pagesEnglish languagesale 10% offe-Library read for1 day
IEC PAS 61191-10:2022(E) provides guidelines which deal with the requirements for the protective coating,
its properties, as well as the application of liquid coating materials for electronic assemblies. These guidelines help control in practice the application of protective coatings from the layout to the functional test of the assembly after coating.
- Technical specification209 pagesEnglish languagesale 15% off
IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.
- Standard43 pagesEnglish languagesale 10% offe-Library read for1 day
IEC TR 62878-2-9:2022(E) comprises the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members about the “concept of Jisso” as well as the “Jisso product level” for the common understanding on IEC TC 91 (electronic assembly technology) activities was reached. Further discussion on “Jisso Product Level” could be needed among the current JIC members to finalize it in the near future based on this technical report.
- Technical report15 pagesEnglish languagesale 15% off
This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.
- Standard18 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.
- Standard32 pagesEnglish and French languagesale 15% off
This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td)
of base laminate materials using thermogravimetric analysis (TGA).
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62899-202-4:2021(E) defines the terminology and measurement methods for the properties of stretchable printed layers, such as conductive ink, for forming stretchable conductors by printing, stretchable conductive films obtained from conductive ink, and stretchable printed wiring consisted by conductive ink with insulator.
Stretchable printed layers (conductive and insulating) handled by this document apply to the stretchable electric wiring printed on stretchable substrates, for example fabric integrated wearable devices, skin patchable devices, and so on.
- Standard23 pagesEnglish languagesale 15% off
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
- Standard11 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 62899-201-2:2021(E) defines measurement methods for the properties of stretchable substrates, in order to use evaluating stretchable functional layers (conductive, semiconducting, and insulating) formed by printing technologies. If the same types of materials as the substrates are used for the cover lay film, they are also subjected to the measurement defined in this document.
Stretchable substrates handled by this document apply to substrates subjected to repeated bending with wiring elements demanding a high level of performance, such as fabric integrated wearable devices or skin patchable devices.
This document does not define the required characteristics of the stretchable substrate. It provides test methods to characterize (pre-qualify) the substrates that are intended to be used for printing conductors and insulators for the purposes of manufacturing stretchable layers or structures.
- Standard10 pagesEnglish languagesale 15% off
IEC TR 62899-402-4:2021(E), which is a Technical Report, is a preparatory work for the documents dealing with the measurement method of the vertical direction (surface forms) of printed patterns made by printed electronics technology.
The printed pattern of interest in this document is limited to straight lines on substrates with a flat surface. This document focuses on the classification and measurement methods for surface forms from the nanometer scale to the micrometer scale, and suggests the strategy for the subsequent documents.
- Technical report17 pagesEnglish languagesale 15% off
This part of IEC 61188 describes the requirements of design and use for soldering surfaces of
land pattern on circuit boards. This document includes land pattern for surface mounted
components. These requirements are based on the solder joint requirements of
IEC 61191-2:2017.
- Standard28 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This
includes lands and land pattern for surface mounted components and also solderable hole
configurations for through-hole mounted components. These requirements are based on the
solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
- Standard33 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
- Standard17 pagesEnglish and French languagesale 15% off
This part of IEC 62878 specifies the requirements and evaluation methods of electrical
connectivity. It is applicable to stacked electronic modules.
- Standard15 pagesEnglish languagesale 10% offe-Library read for1 day