IEC 60194-1:2021 covers terms and definitions closely related with TC91 technology.
This document, together with IEC 60194-2:2017, cancel and replace IEC 60194:2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
1) exclusion of 32 general terms better served by other TCs;
2) exclusion of 47 terms no longer used by the electronic assembly industry;
3) inclusion of 14 new terms related with...
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    • Standard
      403 pages
      English and French language

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

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    • Standard
      49 pages
      English and French language

IEC 61760-3:2021 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need...
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      57 pages
      English and French language

IEC TR 61188-8:2021(E) describes the configuration of part shape data of semiconductor devices and electrical components registered in the CAD library. This document mainly describes the configuration of 2D and 3D parts shape data.

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    • Technical report
      17 pages
      English language

This part of IEC 61189 is a test method designed to determine the proportion of soluble ionic
residues present upon a circuit board, electronic component or assembly. The conductivity of
the solution used to dissolve the ionic residues is measured to evaluate the level of ionic
residues.

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IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

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      115 pages
      English language

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

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IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
...
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      38 pages
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IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for ...
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      112 pages
      English and French language

This part of IEC 60068 specifies tests for the whiskering propensity of surface finishes of
electric or electronic components and mechanical parts such as punched/stamped parts (for
example, jumpers, electrostatic discharge protection shields, mechanical fixations, press-fit
pins and other mechanical parts used in electronic assemblies) representing the finished
stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds,
plastics and the like during the requi...
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IEC 60068-2-82:2019 specifies tests for the whiskering propensity of surface finishes of electric or electronic components and mechanical parts such as punched/stamped parts (for example, jumpers, electrostatic discharge protection shields, mechanical fixations, press‑fit pins and other mechanical parts used in electronic assemblies) representing the finished stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds, plastics and the like during the required test...view more

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IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

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      12 pages
      English language

This document specifies a test method to determine the amount of water absorbed by metalclad
laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

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      10 pages
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      10 pages
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NEW!IEC 61191-1:2018 is available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. Th...view more

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IEC 61191-1:2018 is also available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processe...
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      89 pages
      English and French language

This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic ...
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IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the fol...view more

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      46 pages
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This document applies to labels on the packaging of electronic components for automatic
handling in B2B processes. These labels use linear bar code and two-dimensional (2D)
symbols. Labels for direct product marking and shipping labels are excluded. Labels required
on the packaging of electronic components that are intended for the retail channel of
distribution in B2C processes are also excluded from this document.
Bar code and 2D symbol markings are used, in general, for automatic identif...
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IEC 60194-2:2017(E) covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies.
This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC 60194:2015:
a) exclusion of 32 general terms better served by other TCs;
b) exclusion of 47 terms no longer used by the ele...
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    • Standard
      45 pages
      English language

IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
This edition includes the fo...
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    • Standard
      86 pages
      English and French language

This part of IEC 61191 gives the requirements for surface mount solder connections. The
requirements pertain to those assemblies that are totally surface mounted or to the surface
mounted portions of those assemblies that include other related technologies (e.g. throughhole,
chip mounting, terminal mounting, etc.).

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IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: a)   the requirements have been updated to be compliant with the acceptance crite...view more

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This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the
solder globule wetting balance method to determine, quantitatively, the solderability of the
terminations. Data obtained by these methods are not intended to be used as absolute
quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule
wetting balance method. They are applicable to components and printed boards with metallic
termin...
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IEC 62090:2017(E) applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution in B2C processes are also excluded from this document. Bar code and 2D symbol markings are used, in general, for automatic identifi...view more

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IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminati...view more

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    • Standard
      55 pages
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IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria...
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    • Standard
      66 pages
      English and French language

IEC 62090:2017 applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution in B2C processes are also excluded from this document.
Bar code and 2D symbol markings are used, in general, for automatic identifica...
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      64 pages
      English and French language

IEC 62739-3:2017(E) describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

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This part of IEC 61189 specifies a test method of relative permittivity and loss tangent of
printed board and assembly materials, expected to be determined 2 to 10 of relative
permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz.

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      23 pages
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IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations a...
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    • Standard
      110 pages
      English and French language

IEC 62739-3:2017 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

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    • Standard
      63 pages
      English and French language

This part of IEC 61189 is a catalogue of test methods representing methodologies and
procedures that can be applied to test printed board assemblies.
This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as
guidance documents and handbooks for printed board assemblies.

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IEC 62739-2:2016 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.

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      19 pages
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IEC 62739-2:2016 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.

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    • Standard
      32 pages
      English and French language

This part of IEC 61189 specifies a test method to monitor the resistance of single platedthrough
holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under
thermo-mechanical stress induced by temperature cycling.

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IEC TR 62878-2-2:2015 describes the necessary information on electrical testing for device embedded substrate. This includes the interconnection open- and short-circuit tests as well as the device functional test. It also provides guidelines by demonstrating the electrical test for device embedded substrate.

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    • Technical report
      29 pages
      English and French language

This part of IEC 61189 is a catalogue of test methods representing methodologies and
procedures that can be applied to test printed board assemblies.
This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid
wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for
solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.

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      25 pages
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This part of IEC 62878 specifies the test methods of passive and active device embedded
substrates. The basic test methods of printed wiring substrate materials and substrates
themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device embedded substrates fabricated by use of
organic base material, which include for example active or passive devices, discrete
components formed in the fabrication process of electronic wiring board, and sheet formed
components.
T...
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This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD).
This standard provides procedures for determining the solderability and resistance to
soldering heat of devices in applications using solder alloys, which are eutectic or near
eutectic tin lead (Pb), or lead-free alloys.
The procedures use either a solder bath or reflow method and are applicable only to
specimens or products designed to withstand short term immersion in molten solder or limited
exposure ...
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This part of IEC 61189 is a catalogue of test methods representing methodologies and
procedures that can be applied to test printed board assemblies.
This part of IEC 61189 focuses on test methods for soldering paste based on the existing
IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead
free soldering.

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      42 pages
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Corrigendum to add the missing superseding information in the title pages and in the foreword

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