IEC 62228-5:2021(E) specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems  100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1; 100BASE-TX according to ISO/IEC/IEEE 8802-3; 1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4  and covers  the emission of RF disturbances; the immunity against RF disturbances; the immunity against impulses; the immunity against electrostatic discharges (ESD).

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This part of IEC 61967 specifies a method to measure the conducted electromagnetic emission
(EME) of integrated circuits by direct radio frequency (RF) current measurement with a
1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These
methods ensure a high degree of reproducibility and correlation of EME measurement results.

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IEC 62228-5:2021(E) specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems
100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1;
100BASE-TX according to ISO/IEC/IEEE 8802-3;
1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4  and covers
the emission of RF disturbances;
the immunity against RF disturbances;
the immunity against impulses;
the immunity against electrostatic discharges (ESD).

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IEC 61967-4:2021 is available as IEC 61967-4:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-4:2021 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree of reproducibility and correlation of EME measurement results. This edition includes the following significant technical changes with respect to the previous edition:
- frequency range of 150 kHz to 1 GHz has been deleted from the title;
- recommended frequency range for 1 Ω method has been reduced to 30 MHz;
- Annex G with recommendations and guidelines for frequency range extension beyond 1 GHz has been added.

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This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF current on one or a combination of wires. This standard establishes a common base for the evaluation of semiconductor devices to be applied in equipment used in environments that are subject to unwanted radio frequency electromagnetic signals.

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This part of IEC 62566 provides requirements for achieving highly reliable HDL-Programmed
Devices (HPDs), for use in I&C systems of nuclear power plants performing functions of safety
category B or C as defined by IEC 61226.
The programming of HPDs relies on Hardware Description Languages (HDL) and related
software tools. They are typically based on blank Field Programmable Gate Arrays (FPGAs) or
similar micro-electronic technologies such as Programmable Logic Devices (PLD), Complex
Programmable Logic Devices (CPLDs), etc. General purpose integrated circuits such as
microprocessors are not HPDs. Annex B.8 provides descriptions of a number of different types
of integrated circuits.
This document provides requirements on:
a) a dedicated HPD life-cycle addressing each phase of the development of HPDs, including
specification of requirements, design, implementation, integration and validation, as well as
verification activities associated with each phase,
b) planning and complementary activities such as modification and production,
c) selection of pre-developed components. This includes micro-electronic technologies and
Pre-Developed Blocks (PDBs),
d) tools used to design, implement and verify HPDs.
This document does not put requirements on the development of the micro-electronic
technologies, which are usually available as "commercial off-the-shelf" items and are not
developed under nuclear quality assurance standards. It addresses the developments made
with these micro-electronic technologies in an I&C project with HDLs and related tools.
This document provides guidance to avoid as far as possible latent faults remaining in HPDs,
and to reduce the susceptibility to single failures as well as to potential Common Cause Failures
(CCFs).
Reliability aspects related to environmental qualification and failures due to ageing or physical
degradation are not handled in this document. Other standards, especially IEC 60987,
IEC/IEEE 60780-323 and IEC 62342, address these topics.
This document does not cover cybersecurity for HDL aspects of I&C systems. IEC 62645
provides requirements for security programmes for I&C programmable digital systems.
This document provides guidance and requirements to produce verifiable HPD designs and
implementations requiring justification due for their role in carrying out category B or C safety
functions. This document describes the activities to develop HPDs, organized in the framework
of a dedicated life-cycle. It also describes activities and guidelines to be used in addition to the
requirements of IEC 61226 for system classification and IEC 61513 for system integration and
validation when HPDs are included.

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The objective of this part of IEC 62433 is to describe the extraction flow for deriving an
immunity macro-model of an Integrated Circuit (IC) against conducted Electrostatic Discharge
(ESD) according to IEC 61000-4-2 and Electrical Fast Transients (EFT) according to
IEC 61000-4-4.
The model addresses physical damages due to overvoltage, thermal damage and other failure
modes. Functional failures can also be addressed.
This model allows the immunity simulation of the IC in an application. This model is commonly
called "Integrated Circuit Immunity Model Conducted Pulse Immunity", ICIM-CPI.
The described approach is suitable for modelling analogue, digital and mixed-signal ICs.
Several terminals of an IC can be part of a single model (e.g. input, output and supply pins).
The implementation of the model is capable of representing the non-linear behaviour of
overvoltage protection circuits.
The model can be implemented for the use in different software tools for circuit simulation in
time-domain. The described modelling approach allows simulating device failure due to ESD
or EFT at component and system level considering all components necessary for the immunity
simulation of an IC, such as a PCB or external protection elements.
This document demonstrates, in detail, the construction of models in a defined XML-based
format which is suitable for the exchange of models without any deeper knowledge of the
semiconductor circuit. However, the model functionality can be implemented in different
formats including, but not limited to, tables, SPICE[1] 1 netlists, hardware description
languages such as VHDL-AMS [2] and Verilog-AMS [3].
This document provides:
• the description of ICIM-CPI macro-model elements representing electrical, thermal or
logical behaviour of the IC.
• a universal data exchange format based on XML.

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The contents of the corrigendum of September 2020 have been included in this copy.

  • Amendment
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IEC 62433-6:2020 describes the extraction flow for deriving an immunity macro-model of an Integrated Circuit (IC) against conducted Electrostatic Discharge (ESD) according to IEC 61000-4-2 and Electrical Fast Transients (EFT) according to IEC 61000-4-4.
The model addresses physical damages due to overvoltage, thermal damage and other failure modes. Functional failures can also be addressed. This model allows the immunity simulation of the IC in an application. This model is commonly called "Integrated Circuit Immunity Model Conducted Pulse Immunity", ICIM-CPI.
This document provides:
- the description of ICIM-CPI macro-model elements representing electrical, thermal or logical behaviour of the IC.
- a universal data exchange format based on XML.

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TAN - // IEC Corrigendum

  • Corrigendum
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This standard specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

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This part of IEC 62228 specifies test and measurement methods for EMC evaluation of CAN
transceiver ICs under network condition. It defines test configurations, test conditions, test
signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN
standard transceivers, CAN transceivers with partial networking functionality and CAN
transceivers with flexible data rate capability and covers
• the emission of RF disturbances,
• the immunity against RF disturbances,
• the immunity against impulses, and
• the immunity against electrostatic discharges (ESD).

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This part of IEC 62433 specifies the framework and methodology for EMC IC macro-modelling.
Terms that are commonly used in IEC 62433 (all parts), different modelling approaches,
requirements and data-exchange format for each model category that is standardized in this
series are defined in this document.

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This part of IEC 62228 specifies test and measurement methods for EMC evaluation of CAN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN standard transceivers, CAN transceivers with partial networking functionality and CAN transceivers with flexible data rate capability and covers - the emission of RF disturbances, - the immunity against RF disturbances, - the immunity against impulses, and - the immunity against electrostatic discharges (ESD).

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IEC 62433-1:2019(E) specifies the framework and methodology for EMC IC macro-modelling. Terms that are commonly used in IEC 62433 (all parts), different modelling approaches, requirements and data-exchange format for each model category that is standardized in this series are defined in this document. IEC 62433-1 cancels and replaces IEC TS 62433-1 published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC TS 62433 1:2011: Incorporation of a data exchange format for an integrated circuit’s model representation.

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This part of IEC 61967 provides general information and definitions on the measurement of
conducted and radiated electromagnetic disturbances from integrated circuits. It also provides
a description of measurement conditions, test equipment and set-up as well as the test
procedures and content of the test reports. Test method comparison tables are included in
Annex A to assist in selecting the appropriate measurement method(s).
The object of this document is to describe general conditions in order to establish a uniform
testing environment and to obtain a quantitative measure of RF disturbances from integrated
circuits (IC). Critical parameters that are expected to influence the test results are described.
Deviations from this document are noted explicitly in the individual test report. The
measurement results can be used for comparison or other purposes.
Measurement of the voltage and current of conducted RF emissions or radiated RF
disturbances, coming from an integrated circuit under controlled conditions, yields information
about the potential for RF disturbances in an application of the integrated circuit.
The applicable frequency range is described in each part of IEC 61967.

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IEC 62228-3:2019 specifies test and measurement methods for EMC evaluation of CAN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN standard transceivers, CAN transceivers with partial networking functionality and CAN transceivers with flexible data rate capability and covers
- the emission of RF disturbances,
- the immunity against RF disturbances,
- the immunity against impulses, and
- the immunity against electrostatic discharges (ESD).
This first edition cancels and replaces the first edition of IEC TS 62228 published in 2007 and constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC TS 62228:
a) introduction of CAN transceivers with partial networking functionality and CAN transceivers with flexible data rate capability and addition of operation modes and test descriptions in the respective subclauses of the document;
b) introduction of minimal communication network with two CAN transceivers;
c) update of the test requirements and targets in Annex C;
d) addition of Annex D for common mode choke characterization.

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IEC 62433-1:2019 specifies the framework and methodology for EMC IC macro-modelling. Terms that are commonly used in IEC 62433 (all parts), different modelling approaches, requirements and data-exchange format for each model category that is standardized in this series are defined in this document.
IEC 62433-1 cancels and replaces IEC TS 62433-1 published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC TS 62433 1:2011:
Incorporation of a data exchange format for an integrated circuit’s model representation.
The contents of the corrigendum of July 2020 have been included in this copy.

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    59 pages
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  • Standard
    122 pages
    English and French language
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This part of IEC 61967 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. Test method comparison tables are included in Annex A to assist in selecting the appropriate measurement method(s). The object of this document is to describe general conditions in order to establish a uniform testing environment and to obtain a quantitative measure of RF disturbances from integrated circuits (IC). Critical parameters that are expected to influence the test results are described. Deviations from this document are noted explicitly in the individual test report. The measurement results can be used for comparison or other purposes. Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit. The applicable frequency range is described in each part of IEC 61967.

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IEC 61967-1:2018 is available as IEC 61967-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61967-1:2018 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. Test method comparison tables are include in Annex A to assist in selecting the appropriate measurement method(s). The object of this document is to describe general conditions in order to establish a uniform testing environment and to obtain a quantitative measure of RF disturbances from integrated circuits (IC). Critical parameters that are expected to influence the test results are described. Deviations from this document are noted explicitly in the individual test report. The measurement results can be used for comparison or other purposes. Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit. The applicable frequency range is described in each part of IEC 61967.
This edition includes the following significant technical changes with respect to the previous edition:
- the frequency range of 150 kHz to 1 GHz has been deleted from the title;
- the frequency step above 1 GHz has been added to Table 1, Table 2 and to 5.4;
- Table A.1 has been divided into two tables, and IEC 61967-8 has been added to Table A.2 of Annex A;
- the general test board description has been moved to Annex D.

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IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.

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IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

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    28 pages
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IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

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This part of IEC 62228 provides general information and definitions for electromagnetic
compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network
applications under network condition. It defines general test conditions, general test setups
and test and measurement methods are applied to all parts of IEC 62228.

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IEC 62228-1:2018(E) provides general information and definitions for electromagnetic compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network applications under network condition. It defines general test conditions, general test setups and test and measurement methods are applied to all parts of IEC 62228.

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Defines how to apply the principles and requirements given in IEC 61739 to monolithic integrated circuits. The standard is applicable to those manufacturers of integrated circuits (ICs) who apply for manufacturing line approval.[
]The objective is to establish consistency in the requirements used by manufacturers and auditors for techniques related to integrated circuit manufacturing.[
]Each manufacturer may use his own methods for satisfying the requirements of this standard, provided that the required level of control in the manufacturing line is reached.

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    22 pages
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IEC 62228-1:2018 provides general information and definitions for electromagnetic compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network applications under network condition. It defines general test conditions, general test setups and test and measurement methods are applied to all parts of IEC 62228.

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    17 pages
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This part of IEC 60749 gives guidelines for reliability qualification plans of semiconductor
integrated circuit products (ICs). This document is not intended for military- and space-related
applications.
NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this
guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if
it is specified.
NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the
appropriate sample size and test conditions of a given reliability project.

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IEC 62766-5-2:2017(E) specifies a profile of HTML5, CSS and other related web technologies for connected TVs. Its goal is to describe a common profile that can be relied on by content and service providers and implemented by manufacturers. It does not describe extensions or modification to any of the referenced technologies but only tries to define a subset of web standards that are suitable and useful for TV deployments and at the same time stable enough to provide a good degree of confidence that real interoperability can be achieved. It may add clarifications and/or additional constraints where these are needed due to the nature of the target deployment environment.

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This part of IEC 62433 provides a method for deriving a macro-model to allow the simulation
of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called
Integrated Circuit Emission Model – Radiated Emission, ICEM-RE. The model is intended to
be used for modelling a complete IC, with or without its associated package, a functional
block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output
pins, digital core and supply), when measured or simulated data cannot be directly imported
into simulation tools.
The proposed IC macro-model will be inserted in 3D electromagnetic simulation tools so as to:
• predict the near-radiated emissions from the IC
• evaluate the effect of the radiated emissions on neighbouring ICs, cables, transmission
lines, etc.
This part of IEC 62433 has two main parts:
• the first is the electrical description of ICEM-RE macro-model elements,
• the second part proposes a universal data exchange format called REML based on XML.
This format allows encoding the ICEM-RE in a more useable and generic form for
emission simulation.

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IEC 62090:2017(E) applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution in B2C processes are also excluded from this document. Bar code and 2D symbol markings are used, in general, for automatic identification and automatic handling of components in electronics assembly lines. Intended applications include systems that automate the control of component packages during production, inventory and distribution. This edition includes the following significant technical changes with respect to the previous edition: a) Applicable data elements have been added. Data identifiers of those data elements are “10D”, “14D”, ”2P”, “25L”, “18V”, “V”, “J”, “3S”, “13E”, “33L” and “34L”. b) The following new informative annexes have been added: - Annex C, URL; - Annex D, Examples of data element short titles; - Annex E, Package levels for component package labels.

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IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE.  The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or simulated data cannot be directly imported into simulation tools.

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IEC 62433-2:2008(E) specifies macro-models for ICs to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE model can also be used for modelling an IC-die, a functional block and an Intellectual Property block (IP). The ICEM-CE model can be used to model both digital and analogue ICs. Basically, conducted emissions have two origins:  - conducted emmissions through power supply terminals and ground reference structure;  - conducted emmisions through input/output (I/O) terminals.  The ICEM-CE model addresses those two types of origins in a single approach. This standard defines structures and components of the macro-model for EMI simulation taking into account the IC's internal activities. This standard gives general data, which can be implemented in different formats or languages such as IBIS, IMIC, SPICE, VHDL-AMS and Verilog. SPICE is however chosen as default simulation environment to cover all the conducted emissions. This standard also specifies requirements for information that shall be incorporated in each ICEM-CE model or component part of the model for model circulation, but description syntax is not within the scope of this standard.

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IEC 62433-2:2008(E) specifies macro-models for ICs to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE model can also be used for modelling an IC-die, a functional block and an Intellectual Property block (IP). The ICEM-CE model can be used to model both digital and analogue ICs. Basically, conducted emissions have two origins: - conducted emmissions through power supply terminals and ground reference structure; - conducted emmisions through input/output (I/O) terminals. The ICEM-CE model addresses those two types of origins in a single approach. This standard defines structures and components of the macro-model for EMI simulation taking into account the IC's internal activities. This standard gives general data, which can be implemented in different formats or languages such as IBIS, IMIC, SPICE, VHDL-AMS and Verilog. SPICE is however chosen as default simulation environment to cover all the conducted emissions. This standard also specifies requirements for information that shall be incorporated in each ICEM-CE model or component part of the model for model circulation, but description syntax is not within the scope of this standard.

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IEC 62090:2017 applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution in B2C processes are also excluded from this document.
Bar code and 2D symbol markings are used, in general, for automatic identification and automatic handling of components in electronics assembly lines. Intended applications include systems that automate the control of component packages during production, inventory and distribution.
This edition includes the following significant technical changes with respect to the previous edition:
a) Applicable data elements have been added. Data identifiers of those data elements are “10D”, “14D”, ”2P”, “25L”, “18V”, “V”, “J”, “3S”, “13E”, “33L” and “34L”.
b) The following new informative annexes have been added:
- Annex C, URL;
- Annex D, Examples of data element short titles;
- Annex E, Package levels for component package labels.

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IEC 62766-4-2:2017(E) provides informative examples of features defined in IEC 62766-4-1.

  • Standard
    88 pages
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This part of IEC 62228 specifies test and measurement methods for EMC evaluation of LIN
transceiver ICs under network condition. It defines test configurations, test conditions, test
signals, failure criteria, test procedures, test setups and test boards. It is applicable for
standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers
• the emission of RF disturbances,
• the immunity against RF disturbances,
• the immunity against impulses and
• the immunity against electrostatic discharges (ESD).

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IEC 62228-2:2016 specifies test and measurement methods for EMC evaluation of LIN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers: - the emission of RF disturbances, - the immunity against RF disturbances, - the immunity against impulses and - the immunity against electrostatic discharges (ESD).

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This part of IEC 60050 gives the general terminology used in the fields of semiconductor
technology and semiconductor design and for types of semiconductors.
This terminology is of course consistent with the terminology developed in the other
specialized parts of the IEV.

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  • Standard – translation
    70 pages
    Slovenian language
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IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE. The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or simulated data cannot be directly imported into simulation tools.

  • Standard
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IEC 62433-2:2017 specifies macro-models for an Integrated Circuit (IC) to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE macro-model can also be used for modelling an IC-die, a functional block and an Intellectual Property (IP) block. The ICEM-CE macro-model can be used to model both digital and analogue ICs. This edition includes the following significant technical changes with respect to the previous edition:
Incorporation of an XML based exchange format for model representation.

  • Standard
    217 pages
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IEC 61987-11:2016 provides:
- a characterisation of industrial process measuring equipment (device type dictionary) for integration in the Common Data Dictionary (CDD), and
- generic structures for operating lists of properties (OLOP) and device lists of properties (DLOP) of measuring equipment in conformance with IEC 61987-10.
This second edition cancels and replaces the first edition published in 2012. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) The classification in Table A.1 has been amended to reflect the changes in the classification scheme of process measuring equipment in the CDD due to the development of IEC 61987-14, IEC 61987-15 and IEC 61987-16.
b) Annex A has become “informative”.

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IEC 62228-2:2016 specifies test and measurement methods for EMC evaluation of LIN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers:
- the emission of RF disturbances,
- the immunity against RF disturbances,
- the immunity against impulses and
- the immunity against electrostatic discharges (ESD).

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    85 pages
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IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

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This part of IEC 62433 specifies a flow for deriving a macro-model to allow the simulation of
the conducted immunity levels of an integrated circuit (IC). This model is commonly called
Integrated Circuit Immunity Model – Conducted Immunity, ICIM-CI. It is intended to be used
for predicting the levels of immunity to conducted RF disturbances applied on IC pins.
In order to evaluate the immunity threshold of an electronic device, this macro-model will be
inserted in an electrical circuit simulation tool.
This macro-model can be used to model both analogue and digital ICs (input/output, digital
core and supply). This macro-model does not take into account the non-linear effects of the IC.
The added value of ICIM-CI is that it could also be used for immunity prediction at board and
system level through simulations.
This part of IEC 62433 has two main parts:
• the electrical description of ICIM-CI macro-model elements;
• a universal data exchange format called CIML based on XML. This format allows ICIM-CI
to be encoded in a more useable and generic form for immunity simulation.

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