ASTM F584-87(2005)
(Practice)Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
SCOPE
1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.
1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.
1.3 Photographs (Figs. X1-X1.5 ) are included in Appendix X1 as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.
1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.
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Designation:F 584–87(Reapproved2005)
Standard Practice for
Visual Inspection of Semiconductor Lead-Bonding Wire
This standard is issued under the fixed designation F 584; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope ments, Controlled Environment
1.1 Thispracticecoversconditionsfornondestructivevisual
3. Terminology
inspection of the surface finish of spooled aluminum and gold
3.1 Definitions of Terms Specific to This Standard:
wire used for making internal semiconductor device connec-
3.1.1 chatter marks—for the purposes of this practice—
tions and hybrid microelectronic connections.
repetitive closely spaced wire surface blemishes.
1.2 This practice specifies the recommended lighting, mag-
3.1.2 dark area—for the purposes of this practice—wire
nification, and specimen positioning for inspecting spooled
surface shadowed from direct light-source illumination.
wire under an optical microscope.
3.1.3 fingerprint—for the purposes of this practice—
1.3 Photographs (Figs. X1.1-X1.5 ) are included in Appen-
residual surface contamination deposited during handling.
dix X1 as guides to aid the inspector in identifying particular
surface conditions. These photographs are not intended as
4. Summary of Practice
standards for specifying wire surface quality.
4.1 The wire spool to be inspected is first mounted on a
1.4 The values stated in SI units are to be regarded as the
holding fixture that permits rotation of the spool about its axis.
standard. The values given in parentheses are for information
The spool fixture is then placed on the stage of a binocular
only.
microscope. The wire surface is illuminated with light incident
1.5 This standard does not purport to address all of the
at a grazing angle; the microscope and fixture are positioned so
safety concerns, if any, associated with its use. It is the
that the microscope field shows the partially shadowed wire
responsibility of the user of this standard to establish appro-
wrap just adjacent to the brilliantly lit surface at the top of the
priate safety and health practices and determine the aplicabil-
spool.
ity of regulatory limitations prior to use.
4.2 Inspection is accomplished by slowly rotating the spool
2. Referenced Documents about its axis and moving the fixture over the microscope stage
2 until the operator has viewed the entire exposed wire surface
2.1 ASTM Standards:
area under partially shadowed illumination.
F72 Specification for Gold Wire for Semiconductor Lead
4.3 The defects to be identified, the manner in which their
Bonding
presence is reported, and the manner in which the wire surface
F 487 Specification for Fine Aluminum-1 % Silicon Wire
quality is to be characterized should be agreed upon by the
for Semiconductor Lead-Bonding
parties to the inspection.
F 638 Specification for Fine Aluminum-1 % Magnesium
Wire for Semiconductor Lead–Bonding
NOTE 1—Viewing a wire spool in the partial shadow of glancing
2.2 Federal Standard: illumination is particularly revealing of surface flaws and soil. The
viewing arrangement amounts to dark-field illumination with imperfec-
Fed. Std. No. 209B Clean Room andWork Station Require-
tions appearing as bright glints on the wire surface.
5. Significance and Use
5.1 Spooled wire viewed under bright direct lighting or in
This practice is under the jurisdiction ofASTM Committee F01 on Electronics
deep shadow generally exhibits a flawless appearance. Proper
and is the direct responsibility of Subcommittee F01.07 on Interconnection
arrangement of the viewing angle and illumination, however,
Bonding/Carrier Bonding.
permits accurate observation of wire-surface condition. This
Current edition approved May 1, 2005. Published June 2005. Originally
approved in 1978. Last previous edition approved in 1999 as F 584 – 87(1999).
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
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F 584–87 (2005)
practice specifies the conditions under which reliable and 7.2.1 If sampling by lot is used, the definition of what
reproducible surface finish inspection may be achieved. Such constitutes a lot should be agreed upon by the parties to the
inspection is appropriate for evaluating surface quality with inspection.
respect to the requirements in Specifications F 72, F 487, and
F 638.
8. Procedure
5.2 Surface smoothness and degree of cleanliness may
8.1 Inthecleanroomoratthecleanworkstation,mountthe
affect the performance of wire. This practice may be used to
spool to be examined onto the jig or V-block.
determine whether or not spooled wire meets performance-
8.2 PositionthejigorV-blocksothatthespoolisinthefield
based surface finish criteria agreed upon between a manufac-
of view of the microscope.
turer or supplier and a wire purchaser.
8.3 Position the light source so that (1) the light strikes the
5.3 The magnification recommended may not be sufficient
spoolatanangleofapproximately45°tothehorizontal,(2)the
to permit detection of all defects on the wire surface affecting
light source is in the vertical plane that includes the spool axis,
wire performance; however, it is sufficient to permit an
and (3) the
...
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