Standard Specification for Type 58 Borosilicate Sealing Glass

ABSTRACT
This specification covers type 58 borosilicate sealing glass for use in electronic applications. The glass material shall conform to the chemical composition requirements prescribed. The material shall conform to the physical and electrical properties prescribed. The glass shall have a finish that ensures smooth, even surfaces and freedom from cracks, checks, bubbles, and other flaws of a character detrimental to the strength or life of the component or device for which its use is intended. The softening point and annealing point shall be tested to meet the requirements prescribed. The thermal expansion coefficient of the glass material shall be determined using the required procedure. The contracting coefficient of the glass material shall be tested to meet the requirements prescribed. The thermal contraction match between the glass and a sealing alloy may be determined by preparing and testing an assembly to meet the requirements prescribed.
SCOPE
1.1 This specification covers Type 58 borosilicate sealing glass for use in electronic applications. Note 1 This specification is primarily intended to consider glass as most generally used, that is, glass in its transparent form as normally encountered in fabricating electronic devices. refers to a sealing alloy that is compatible with this glass. Type 58 glass in other forms such as powdered, crushed, sintered, fibrous, etc., are excluded. The requirements of this specification, as applied to these forms, must be established in the raw glass prior to its conversion.

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Publication Date
31-Aug-2005
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ASTM F105-72(2005) - Standard Specification for Type 58 Borosilicate Sealing Glass
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information.
Designation: F105 – 72 (Reapproved 2005)
Standard Specification for
Type 58 Borosilicate Sealing Glass
ThisstandardisissuedunderthefixeddesignationF105;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope F140 PracticeforMakingReferenceGlass-MetalButtSeals
and Testing for Expansion Characteristics by Polarimetric
1.1 This specification covers Type 58 borosilicate sealing
Methods
glass for use in electronic applications.
F144 Practice for Making Reference Glass-Metal Sandwich
NOTE 1—This specification is primarily intended to consider glass as
Seal and Testing for Expansion Characteristics by Polari-
most generally used, that is, glass in its transparent form as normally
metric Methods
encountered in fabricating electronic devices. X1.3 refers to a sealing
alloy that is compatible with this glass. Type 58 glass in other forms such
3. Ordering Information
as powdered, crushed, sintered, fibrous, etc., are excluded. The require-
3.1 Orders for material under this specification shall include
ments of this specification, as applied to these forms, must be established
in the raw glass prior to its conversion.
the following information:
3.1.1 Form,
2. Referenced Documents
3.1.2 Type of glass,
2.1 ASTM Standards:
3.1.3 Dimensions,
C336 Test Method for Annealing Point and Strain Point of
3.1.4 Marking and packaging, and
Glass by Fiber Elongation
3.1.5 Certification (if required).
C338 Test Method for Softening Point of Glass
4. Chemical Composition
C598 Test Method for Annealing Point and Strain Point of
Glass by Beam Bending
4.1 The typical chemical composition of this glass is as
D150 Test Methods for AC Loss Characteristics and Per-
follows (Note 2):
mittivity (Dielectric Constant) of Solid Electrical Insula-
Weight %
tion
Major Constituents:
D257 Test Methods for DC Resistance or Conductance of
Silica (SiO ) 65.0
Insulating Materials
Alumina (Al O)7.5
2 3
Boron oxide (B O ) 18.0
E29 Practice for Using Significant Digits in Test Data to 2 3
Soda (Na O) 2.0
Determine Conformance with Specifications
Potash (K O) 3.0
E228 Test Method for Linear Thermal Expansion of Solid
Barium oxide (BaO) 3.0
Minor Constituents:
Materials With a Push-Rod Dilatometer
Lithium oxide (Li O) 0.6
F14 PracticeforMakingandTestingReferenceGlass-Metal
Fluorine (F) 0.6, max
Bead-Seal
Reducible oxides (Note 3) 0.05, max
F15 Specification for Iron-Nickel-Cobalt Sealing Alloy
NOTE 2—Major constituents may be adjusted to give the desired
electricalandphysicalpropertiestotheglass.However,nochangeshallbe
made that alters any of these properties without due notification of, and
This specification is under the jurisdiction of ASTM Committee C14 on Glass
approval by, the user.
and Glass Products and is the direct responsibility of Subcommittee C14.04 on
NOTE 3—Total of arsenic trioxide (As O ), antimony trioxide (Sb O ),
2 3 2 3
Physical and Mechanical Properties.
and lead oxide (PbO).
Current edition approved Sept. 1, 2005. Published October 2005. Originally
approved in 1968. Last previous edition approved in 2000 as F105 – 72 (2000).
5. Physical Requirements
DOI: 10.1520/F0105-72R05.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
5.1 The material shall conform to the physical properties
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
prescribed in Table 1. For electrical properties see Table 2, and
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website.
its Footnote A.
Withdrawn.thelastapprovedversionofthishistoricalstandardisreferencedon
www.astm.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
F105 – 72 (2005)
TABLE 1 Physical Requirements
A
Property ASTM Test Method Condition Value
Softening point C338 see 7.1 715 6 10°C
Annealing point C336 or C598 see 7.2 480 6 10°C
Thermal expansion coefficient E228 see 7.3 4.65 6 0.20 ppm/°C
0 to 300°C
Contraction coefficient E228 see 7.4 5.8 6 0.20 ppm/°C
(annealing point minus 15 to 30°C)
A
Test methods and conditions are detailed in the appropriately referenced section of this specification.
A
TABLE 2 Electrical Properties
hold it at that temperature for 15 min; then cool at a rate of
ASTM Test Condition, from 1.0 to 1.5°C/min to a temperature below 200°C. The rate
Property Typical Value
Method °C
of cooling from the point below 200 to 100°C shall not exceed
Volume resistivity (dc) D257 25 log R (V·cm)
5°C/min. The rate of cooling from 100°C to room temperature
17.0
is optional. During this cooling schedule, determine the ther-
250 log R (V·cm)
mal contraction curve and calculate the mean coefficient of
9.1
350 log R (V·cm)
linear thermal contraction between a point 15°C below the
7.3
annealing point and 30°C in accordance with Procedure B of
Dielectric constant (1 MHz) D150 20 5.0
Test Method E228.
Dissipation factor (1 MHz) D150 20 0.0027
7.5 Bead Seal Test—The thermal contraction match
...

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