ASTM E2444-11(2018)
(Terminology)Standard Terminology Relating to Measurements Taken on Thin, Reflecting Films
Standard Terminology Relating to Measurements Taken on Thin, Reflecting Films
SCOPE
1.1 This standard consists of terms and definitions pertaining to measurements taken on thin, reflecting films, such as found in microelectromechanical systems (MEMS) materials. In particular, the terms are related to the standards in Section 2, which were generated by Committee E08 on Fatigue and Fracture. Terminology E1823 Relating to Fatigue and Fracture Testing is applicable to this standard.
1.2 The terms are listed in alphabetical order.
1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
General Information
- Status
- Published
- Publication Date
- 30-Apr-2018
- Technical Committee
- E08 - Fatigue and Fracture
- Drafting Committee
- E08.02 - Terminology
Relations
- Effective Date
- 01-May-2018
- Effective Date
- 15-Feb-2024
- Effective Date
- 01-Feb-2024
- Effective Date
- 01-Feb-2020
- Effective Date
- 01-May-2018
- Effective Date
- 01-May-2018
- Effective Date
- 01-May-2018
- Effective Date
- 15-Dec-2012
- Effective Date
- 15-Nov-2012
- Effective Date
- 01-Sep-2012
- Effective Date
- 01-Aug-2012
- Effective Date
- 15-May-2012
- Effective Date
- 15-Mar-2012
- Effective Date
- 01-Nov-2011
- Effective Date
- 01-Nov-2011
Overview
ASTM E2444-11(2018), titled Standard Terminology Relating to Measurements Taken on Thin, Reflecting Films, provides a comprehensive set of standardized terms and definitions pertinent to the characterization and measurement of thin films, especially those found in microelectromechanical systems (MEMS) materials. Developed by ASTM Committee E08 on Fatigue and Fracture, this terminology standard is foundational for ensuring consistent communication and interpretation of measurement activities involving thin, reflecting films across various scientific and industrial fields.
This standard is aligned with internationally recognized principles, supporting global trade and compliance by adhering to the World Trade Organization's Technical Barriers to Trade (TBT) Committee's guidelines.
Key Topics
- Measurement Terminology: Defines key terms related to thin-film measurement, including terms specific to MEMS fabrication methods such as bulk micromachining and surface micromachining.
- MEMS Structures: Standardizes definitions for features such as cantilevers, fixed-fixed beams, anchors, and test structures frequently used in MEMS mechanical testing.
- Quantitative Measurements: Covers important measurement types like in-plane length, residual strain, and strain gradient, guiding proper interpretation and reporting of data.
- Instrument Definitions: Includes terminology for essential equipment like optical interferometers used in measuring thin, reflecting films.
- Material Layers: Establishes terms for different layers in MEMS devices, such as structural layers, sacrificial layers, and substrates.
This standardized language helps to avoid ambiguity and improves collaboration across teams working in research, development, and manufacturing of micro-fabricated devices.
Applications
ASTM E2444-11(2018) is vital for a broad range of applications involving thin, reflecting films, including:
- MEMS Device Fabrication: Provides clear terminology for process engineers designing, fabricating, and testing MEMS components, ensuring precise communication regarding structures and measurements.
- Materials Science Research: Supports academic and industrial research by standardizing measurement language, facilitating reproducibility, and comparability of experimental results.
- Quality Assurance and Testing: Used by quality control teams to systematically measure characteristics such as residual strain and length in thin films, contributing to enhanced product reliability.
- Instrument Development: Instrument manufacturers reference these terms to align product documentation and functionality, particularly for interferometric and optical measurement systems.
- Standard Compliance: Assists organizations in meeting industry and international compliance requirements by utilizing consistent, globally recognized terminology.
Related Standards
Several closely associated ASTM standards complement E2444-11(2018):
- ASTM E2244: Test Method for In-Plane Length Measurements of Thin, Reflecting Films Using an Optical Interferometer
- ASTM E2245: Test Method for Residual Strain Measurements of Thin, Reflecting Films Using an Optical Interferometer
- ASTM E2246: Test Method for Strain Gradient Measurements of Thin, Reflecting Films Using an Optical Interferometer
- ASTM E1823: Terminology Relating to Fatigue and Fracture Testing
Together, these standards create a robust framework for the measurement, analysis, and reporting of properties in thin-film and MEMS applications.
Keywords: thin films, reflecting films, MEMS, microelectromechanical systems, optical interferometry, residual strain, in-plane length measurements, strain gradient, ASTM standards, material characterization, micromachining, quality control, test structures.
Frequently Asked Questions
ASTM E2444-11(2018) is a standard published by ASTM International. Its full title is "Standard Terminology Relating to Measurements Taken on Thin, Reflecting Films". This standard covers: SCOPE 1.1 This standard consists of terms and definitions pertaining to measurements taken on thin, reflecting films, such as found in microelectromechanical systems (MEMS) materials. In particular, the terms are related to the standards in Section 2, which were generated by Committee E08 on Fatigue and Fracture. Terminology E1823 Relating to Fatigue and Fracture Testing is applicable to this standard. 1.2 The terms are listed in alphabetical order. 1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
SCOPE 1.1 This standard consists of terms and definitions pertaining to measurements taken on thin, reflecting films, such as found in microelectromechanical systems (MEMS) materials. In particular, the terms are related to the standards in Section 2, which were generated by Committee E08 on Fatigue and Fracture. Terminology E1823 Relating to Fatigue and Fracture Testing is applicable to this standard. 1.2 The terms are listed in alphabetical order. 1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
ASTM E2444-11(2018) is classified under the following ICS (International Classification for Standards) categories: 01.040.31 - Electronics (Vocabularies); 31.240 - Mechanical structures for electronic equipment. The ICS classification helps identify the subject area and facilitates finding related standards.
ASTM E2444-11(2018) has the following relationships with other standards: It is inter standard links to ASTM E2444-11e1, ASTM E1823-24a, ASTM E1823-24, ASTM E1823-20, ASTM E2245-11(2018), ASTM E2246-11(2018), ASTM E2244-11(2018), ASTM E1823-12e, ASTM E1823-12d, ASTM E1823-12c, ASTM E1823-12b, ASTM E1823-12a, ASTM E1823-12, ASTM E2245-11e1, ASTM E2246-11. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
ASTM E2444-11(2018) is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation: E2444 −11 (Reapproved 2018)
Standard Terminology Relating to
Measurements Taken on Thin, Reflecting Films
This standard is issued under the fixed designation E2444; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 3-D data set—a three-dimensional group of points with a
topographical z-value for each (x, y) pixel location within the
1.1 This standard consists of terms and definitions pertain-
interferometric microscope’s field of view. E2244, E2245,
ing to measurements taken on thin, reflecting films, such as
E2246
found in microelectromechanical systems (MEMS) materials.
In particular, the terms are related to the standards in Section 2,
anchor—in a surface-micromachining process, the portion of
which were generated by Committee E08 on Fatigue and
the test structure where a structural layer is intentionally
Fracture. Terminology E1823 Relating to Fatigue and Fracture
attached to its underlying layer. E2244, E2245, E2246
Testing is applicable to this standard.
anchor lip—in a surface-micromachining process, the free-
1.2 The terms are listed in alphabetical order.
standing extension of the structural layer of interest around
1.3 This international standard was developed in accor-
the edges of the anchor to its underlying layer.
DISCUSSION—In some processes, the width of the anchor lip may be
dance with internationally recognized principles on standard-
zero. E2244, E2245, E2246
ization established in the Decision on Principles for the
Development of International Standards, Guides and Recom-
bulk micromachining—a MEMS fabrication process where
mendations issued by the World Trade Organization Technical
the substrate is removed at specified locations. E2244,
Barriers to Trade (TBT) Committee.
E2245, E2246
cantilever—a test structure that consists of a freestanding
2. Referenced Documents
2 beam that is fixed at one end. E2244, E2245, E2246
2.1 ASTM Standards:
E1823 Terminology Relating to Fatigue and FractureTesting
fixed-fixed beam —a test structure that consists of a freestand-
E2244 Test Method for In-Plane Length Measurements of
ing beam that is fixed at both ends. E2244, E2245
Thin, Reflecting Films Using an Optical Interferometer
in-plane length (or deflection) measurement, L (or D)
E2245 Test Method for Residual Strain Measurements of
[L]—the experimental determination of the straight-line
Thin, Reflecting Films Using an Optical Interferometer
distance between two transitional edges in a MEMS device.
E2246 Test Method for Strain Gradient Measurements of
DISCUSSION—This length (or deflection) measurement is made paral-
Thin, Reflecting Films Using an Optical Interferometer
lel to the underlying layer (or the xy-plane of the interferometric
microscope). E2244, E2245, E2246
3. Terminology
interferometer—a non-contact optical instrument used to
3.1 Terms and Their Definitions:
obtain topographical 3-D data sets.
DISCUSSION—The height of the sample is measured along the z-axis
2-D data trace—a two-dimensional group of points that is
of the interferometer. The x-axis is typically aligned parallel or
extracted from a topographical 3-D data set and that is
perpendicular to the transitional edges to be measured. E2244,
parallel to the xz-or yz-plane of the interferometric
E2245, E2246
microscope. E2244, E2245
MEMS—microelectromechanical systems. E2244, E2245,
E2246
This test method is under the jurisdiction ofASTM Committee E08 on Fatigue
microelectromechanical systems, MEMS—in general, this
and Fracture and is the direct responsibility of Subcommittee E08.02 on Standards
and Terminology. term is used to describe micron-scale structures, sensors,
Current edition approved May 1, 2018. Published May 2018. Orginially
actuators, and technologies used for their manufacture (such
ε1
approved in 2005. Last previous edition approved in 2011 as E2444–11 . DOI:
as, silicon process technologies), or combinations thereof.
10.1520/E2444-11R18.
E2244, E2245, E2246
...
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