ASTM B32-08
(Specification)Standard Specification for Solder Metal
Standard Specification for Solder Metal
ABSTRACT
This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Included here are solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbons, wires, and solder pastes. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not taken into account here. Solder alloys shall adhere to chemical composition requirements specified for the following flux types: Types R, RMA, and RA, which are composed of Grade WW or WG gum rosin; Type OA, which is composed of water-soluble organic materials; Type OS, which is composed of water-insoluble organic materials; and Type IS, which is composed of inorganic saltsor acids. Solders shall also meet physical property requirements such as paste texture, powder mesh size, viscosity, solder pool, and dryness, and pass performance requirements such as chlorides and bromides test, copper mirror test, and visual inspection. Other properties to which the alloys should conform to are dimensions and unit weights, spread factor, and resistivity of water extract.
SCOPE
1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC – Association Connecting Electronic Industries.
1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).
1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste.
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.
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Designation:B32 −08
StandardSpecification for
1
Solder Metal
ThisstandardisissuedunderthefixeddesignationB32;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope D269Test Method for Insoluble Matter in Rosin and Rosin
Derivatives
1.1 Thisspecificationcoverssoldermetalalloys(commonly
D464Test Methods for Saponification Number of Naval
known as soft solders) used in non-electronic applications,
Store Products Including Tall Oil and Other Related
including but not limited to, tin-lead, tin-antimony, tin-
Products
antimony-copper-silver,tin-antimony-copper-silver-nickel,tin-
D465Test Methods for Acid Number of Naval Stores
silver, tin-copper-silver, and lead-tin-silver, used for the pur-
Products Including Tall Oil and Other Related Products
pose of joining together two or more metals at temperatures
D509Test Methods of Sampling and Grading Rosin
below their melting points. Electronic grade solder alloys and
E28Test Methods for Softening Point of Resins Derived
fluxed and non-fluxed solid solders for electronic soldering
from Naval Stores by Ring-and-Ball Apparatus
applications are not covered by this specification as they are
E29Practice for Using Significant Digits in Test Data to
undertheauspicesofIPC–AssociationConnectingElectronic
Determine Conformance with Specifications
Industries.
E46Test Methods for Chemical Analysis of Lead- and
1.1.1 These solders include those alloys having a liquidus
3
Tin-Base Solder (Withdrawn 1994)
temperature not exceeding 800°F (430°C).
E51Method for Spectrographic Analysis of Tin Alloys by
1.1.2 Thisspecificationincludessoldersintheformofsolid
3
the Powder Technique (Withdrawn 1983)
bars,ingots,powderandspecialforms,andintheformofsolid
E55Practice for Sampling Wrought Nonferrous Metals and
and flux-core ribbon, wire, and solder paste.
Alloys for Determination of Chemical Composition
1.2 The values stated in inch-pound units are to be regarded
E87MethodsforChemicalAnalysisofLead,Tin,Antimony
as standard. The values given in parentheses are mathematical
and Their Alloys (Photometric Method) (Withdrawn
3
conversions to SI units that are provided for information only
1983)
and are not considered standard.
E88Practice for Sampling Nonferrous Metals andAlloys in
1.3 This standard does not purport to address all of the Cast Form for Determination of Chemical Composition
4
safety concerns, if any, associated with its use. It is the
2.2 Federal Standard:
responsibility of the user of this standard to become familiar
Fed. Std. No. 123Marking for Shipment (Civil Agencies)
5
with all hazards including those identified in the appropriate
2.3 Military Standard:
Material Safety Data Sheet (MSDS) for this product/material
MIL-STD-129Marking for Shipment and Storage
as provided by the manufacturer, to establish appropriate
safety and health practices, and determine the applicability of 3. Terminology
regulatory limitations prior to use.
3.1 Definitions:
3.1.1 producer, n—the primary manufacturer of the mate-
2. Referenced Documents
rial.
2
2.1 ASTM Standards:
3.2 Definitions of Terms Specific to This Standard:
3.2.1 lot, n—The term “lot” as used in this specification is
defined as follows:
1
This specification is under the jurisdiction of ASTM Committee B02 on
Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee
B02.02 on Refined Lead, Tin, Antimony, and Their Alloys.
3
Current edition approved May 1, 2008. Published May 2008. Originally The last approved version of this historical standard is referenced on
approved in 1919. Last previous edition approved in 2004 as B32-04. DOI: www.astm.org.
4
10.1520/B0032-08. Available from Global Engineering Documents, 15 Inverness Way, East
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or Englewood, CO 80112-5704, http://global.ihs.com.
5
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,
Standards volume information, refer to the standard’s Document Summary page on Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http://
the ASTM website. www.dodssp.daps.mil.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1
---------------------- Page: 1 ----------------------
B32−08
3.2.1.1 Discussion—For solid solder metal, a lot consists of 7. Chemical Composition
all solder of the same type designation, produced from the
7.1 Solder Alloy—The solder alloy composition is as speci-
same batch of raw mate
...
This document is not anASTM standard and is intended only to provide the user of anASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation:B32–04 Designation: B 32 – 08
Standard Specification for
1
Solder Metal
ThisstandardisissuedunderthefixeddesignationB32;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoptionor,inthecaseofrevision,theyearoflastrevision.Anumberinparenthesesindicatestheyearoflastreapproval.Asuperscript
epsilon (e) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope
1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications,
including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver,
tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their
melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not
covered by this specification as they are under the auspices of IPC – Association Connecting Electronic Industries.
1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).
1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid
and flux-core ribbon, wire, and solder paste.
1.2The values stated in inch-pound units are to be regarded as the standard.The values given in parentheses are for information
only.
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical
conversions to SI units that are provided for information only and are not considered standard.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data
Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and
determine the applicability of regulatory limitations prior to use.
2. Referenced Documents
2
2.1 ASTM Standards:
D269 Test Method for Insoluble Matter in Rosin and Rosin Derivatives
D464 Test Methods for Saponification Number of Naval Store Products Including Tall Oil and Other Related Products
D465 Test Methods for Acid Number of Naval Stores Products Including Tall Oil and Other Related Products
D509 Test Methods of Sampling and Grading Rosin
E28 Test Methods for Softening Point of Resins Derived from Naval Stores by Ring-and-Ball Apparatus
E29 Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications
3
E46 Test Methods for Chemical Analysis of Lead- and Tin-Base Solder
0
E51 Method for Spectrographic Analysis of Tin Alloys by the Powder Technique
E55 Practice for Sampling Wrought Nonferrous Metals and Alloys for Determination of Chemical Composition
0
E87 Methods for Chemical Analysis of Lead, Tin, Antimony, and Their Alloys (Photometric Method)
E88 Practice for Sampling Nonferrous Metals and Alloys in Cast Form for Determination of Chemical Composition
4
2.2 Federal Standard:
Fed. Std. No. 123 Marking for Shipment (Civil Agencies)
5
2.3 Military Standard:
MIL-STD-129 Marking for Shipment and Storage
1
ThisspecificationisunderthejurisdictionofASTMCommitteeB02onNonferrousMetalsandAlloysandisthedirectresponsibilityofSubcommitteeB02.02onRefined
Lead, Tin, Antimony, and Their Alloys.
Current edition approved Nov.May 1, 2004.2008. Published November 2004.May 2008. Originally approved in 1919. Last previous edition approved in 20032004 as
B32-034.
2
ForreferencedASTMstandards,visittheASTMwebsite,www.astm.org,orcontactASTMCustomerServiceatservice@astm.org.For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
3
Withdrawn.
4
Available from Global Engineering Documents, 15 Inverness Way East,Way, East Englewood, CO 80112-5704, http://global.ihs.com.
5
Available from Standardization Documents Order Desk, DODSSP, Bldg. 4, Section D, 700 Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.19111-5098,
http://www.dodssp.daps.mil.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
1
---------------------- Page: 1 ----------------------
B32–08
3. Terminology
3.1 Definition:
3.1.1 producer, n—the primary manufacturer of the materia
...
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