ASTM D6412/D6412M-99
(Specification)Standard Specification for Epoxy (Flexible) Adhesive for Bonding Metallic and Nonmetallic Materials
Standard Specification for Epoxy (Flexible) Adhesive for Bonding Metallic and Nonmetallic Materials
SCOPE
1.1 The specification covers a two-part modified epoxy paste adhesive for bonding metallic and nonmetallic materials. The adhesive should be suitable for forming bonds that can withstand environmental exposure to temperatures from -184 to 82 °C (-300 to 180 °F) when exposed to an expected combination of stress, temperature, and relative humidity to be encountered in service.
Note 1-When coordinated through the Department of Defense (DoD) and the National Aeronautics and Space Administration (NASA), this practice will be a direct replacement of MIL-A-82720 (OS), MIS-26872 and MSFC-SPEC-2037.
1.2 The values stated in SI units or inch-pound units are to be regarded separately as standard. Within the text, the inch-pound units are shown in brackets. The values stated in each system are not exact equivalents; therefore, each system must be used independently of the other. Combining values from the two systems may result in nonconformance with this specification.
1.3 The following precautionary statement pertains to the test method portion only, Section 8, of this specification: This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
General Information
Relations
Standards Content (Sample)
NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: D 6412/D 6412M – 99
Standard Specification For
Epoxy (Flexible) Adhesive For Bonding Metallic And
Nonmetallic Materials
This standard is issued under the fixed designation D 6412/D 6412M; the number immediately following the designation indicates the
year of original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last
reapproval. A superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope D 907 Terminology of Adhesives
D 1002 Test Method forApparent Shear Strength of Single-
1.1 The specification covers a two-part modified epoxy
Lap-Joint Adhesively Bonded Metal Specimens by Ten-
paste adhesive for bonding metallic and nonmetallic materials.
sion Loading (Metal-to-Metal)
The adhesive should be suitable for forming bonds that can
D 1876 Test Method for Peel Resistance of Adhesives
withstand environmental exposure to temperatures from –184
(T-Peel Test)
to 82 °C (–300 to 180 °F) when exposed to an expected
D 2240 Test Method for Rubber Property Durometer Hard-
combination of stress, temperature, and relative humidity to be
ness
encountered in service.
D 2651 Guide for Preparation of Metal Surfaces for Adhe-
NOTE 1—When coordinated through the Department of Defense (DoD) 4
sive Bonding
and the National Aeronautics and Space Administration (NASA), this
D 3951 Practice for Commercial Packaging
practice will be a direct replacement of MIL-A-82720 (OS), MIS-26872,
D 4142 Guide for Testing Epoxy Resins
and MSFC-SPEC-2037.
E 595 Test Method for Total Mass Loss and Collected
1.2 The values stated in SI units or inch-pound units are to
Volatile Condensable Materials from Outgassing in a
be regarded separately as standard. Within the text, the
Vacuum Environment
inch-pound units are shown in brackets. The values stated in
2.2 National Aeronautics and Space Administration
each system are not exact equivalents; therefore, each system
(NASA):
must be used independently of the other. Combining values
JSC Sp-R-0022 General Specification, Vacuum Stability
from the two systems may result in nonconformance with this
Requirement of Polymeric Material for Spacecraft Appli-
specification.
cation
1.3 The following precautionary statement pertains to the
MSFC-HDBK-527/JSC-09604 Material Selection List for
test method portion only, Section 8, of this specification: This
Hardware Systems
standard does not purport to address all of the safety concerns,
GSFC RP 1124 Outgassing Data for Selecting Spacecraft
if any, associated with its use. It is the responsibility of the user
Materials
of this standard to establish appropriate safety and health
NOTE 2—Copiesofspecifications,standards,drawingsandpublications
practices and determine the applicability of regulatory limita-
required by suppliers in connection with specific purchases should be
tions prior to use.
obtained from the purchaser or as directed by his contracting officer.
2. Referenced Documents
3. Terminology
2.1 ASTM Standards:
3.1 Definitions—Many terms in this specification are de-
A 109 Specification for Steel, Strip, Carbon (0.25 Maxi-
fined in Terminology D 907.
mum Percent), Cold Rolled
3.2 Definitions of Terms Specific to This Standard:
A 167 Specification for Stainless and Heat-Resisting
3.2.1 epoxy-polyamide high viscosity adhesive, n—an ep-
Chromium-Nickel Steel Plate, Sheet, and Strip
oxy paste base (B) and a modified amide paste accelerator (A)
B 209 Specification for Aluminum and Aluminum Alloy
when mixed in a proper ratio results in a viscous paste.
Sheet and Plate
Annual Book of ASTM Standards, Vol 15.06.
1 5
This specification is under the jurisdiction of ASTM Committee D-14 on Annual Book of ASTM Standards, Vol 09.01.
adhesivesandisthedirectresponsibilityofsubcommitteeD14.80onMetalBonding Annual Book of ASTM Standards, Vol 15.09.
adhesives. Annual Book of ASTM Standards, Vol 06.03.
Current edition approved April 10, 1999. Published July 1999. Annual Book of ASTM Standards, Vol 15.03.
Annual Book of ASTM Standards, Vol 01.03.
Unless otherwise indicated, copies of the above documents are available from
Annual Book of ASTM Standards, Vol 02.02.
ant NASA installation library or document repository.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
D 6412/D 6412M – 99
3.2.2 epoxy-polyamide low viscosity adhesive, n—an epoxy Although,itisnotlistedinTable1,TypeIImaterialsshallmeet
liquid base (B) and a modified amide liquid accelerator (A) the same requirements as Type I materials.
when mixed in a proper ratio results in a viscous liquid.
8. Test Methods
4. Significance and Use
8.1 Qualification Tests—For qualification, the adhesive
4.1 General—Thisspecificationprovidestestingprocedures
shall be tested using the tests described in this section. Test
and specimen requirements to differentiate between the physi-
methods and requirements are included in Table 1.
cal and adhesive bonding properties of two types of epoxy-
8.2 Preparation of Test Specimens:
polyamide adhesive.
8.2.1 Tensile Shear:
5. Classification
8.2.1.1 Adherend—The metal bonded shall be 6061-T6 or
2024-T3 aluminum alloy.
5.1 Theepoxy-polyamideadhesiveshallbefurnishedasone
of the following types:
NOTE 3—The use of steel substrates for the evaluation and lot accep-
5.1.1 Type I—Consists of two-part kits of Part B, base and
tance of the material is optional at the discretion of the procuring agency.
Part A, accelerator.
Use A 109 Grade 2 Steel or A 167, Type 302 corrosion resistant steel.
5.1.1.1 Grade 1—The high viscosity adhesive system is
8.2.1.2 Surface Treatment—Adherend surfaces shall be
composed of an epoxy base (B) and a modified polyamide
cleaned and etched in accordance with Test Method D 2651.
accelerator (A).
8.2.1.3 Cure—Cure time, temperature and pressure shall be
5.1.1.2 Grade 2—The low viscosity adhesive system is
in accordance with the adhesive manufacturer’s recommenda-
composed of an epoxy liquid base (B) and a modified polya-
tion.
mide liquid accelerator (A).
5.1.2 Type II—Consists of premixed, frozen, Type I, Grade
NOTE 4—Test panels or specimens, or both, other than the breakaway
1 or Type I, Grade 2.
type shall be cut in such a manner that minimum vibration or heat is
generated during the cutting operation.
6. Ordering Information
NOTE 5—Adhesive bondline thickness for tensile shear specimens shall
be 0.05 to 0.13 mm [0.002 in. to 0.005 in.] and 0.25 to 0.43 mm [0.010 to
6.1 Procurement Documents—Purchasers may select any of
0.017 in.] for T-Peel specimens. Control of bondline thickness shall be
the desired options offered herein and the procurement docu-
accomplished by placing two lengths of appropriate diameter stainless
ments should specify the following:
wire [0.13 mm for tensile shear and 0.43 mm forT-Peel] in the lengthwise
6.1.1 Title, number and dated revision letter of this specifi-
direction on the specimen bond area during the adhesive bonding
cation,
operation; the use of the same diameter glass beads approximately 0.5 %
6.1.2 Adhesive type and grade numbers,
by weight, thoroughly mixed in the adhesive may also be used to maintain
uniform bondine thickness.
6.1.3 Amounts and unit quantities of adhesive required,
6.1.4 Curing conditions,
8.2.2 Hardness specimens shall be prepared using a mixture
6.1.5 Level of Packaging and packing required, and
of resin and catalyst for Type I Grades 1 or 2 in the ratios
6.1.6 Whether or not qualification (see 6.2) is necessary.
specified by the manufacturer or Type II premixed. Pour the
6.2 Qualification—In the case the adhesives for which the
thoroughly mixed material into an aluminum foil cup approxi-
purchaser requires qualification, the procurement documents
mately 7.6 cm [3.0 in.] in diameter to a minimum thickness of
should state that the awards will be made only for adhesives
6.3 mm [0.25 in.]; cure per manufacturer’s recommendation.
that are qualified at the time set for opening of bids.
8.3 Test Procedures:
8.3.1 Room-Temperature Tensile Shear—Subject at least
7. Test Requirements
five specimens to a tensile shear test at normal temperature 25
7.1 Material—The adhesive shall be thermosetting and,
6 3°C [77 6 5°F] in accordance with Test Method D 1002.
when tested using the tests described in Section 8 shall meet
8.3.2 High-Temperature Tensile Shear—Test at least five
the strength requirements of this specification. The adhesive
specimensat60 63°C[140 65°F]and82 63°C[180 65°F]
shallnothaveadetrimentaleffectonthesurfacesbeingbonded
in accordance withTest Method D 100
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.