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ASTM E1634-02(2007)

(Guide)

Standard Guide for Performing Sputter Crater Depth Measurements

Standard Guide for Performing Sputter Crater Depth Measurements

SIGNIFICANCE AND USE
Sputter crater depth measurements are performed in order to determine a sputter rate (depth/time) for each matrix sputtered during a sputter depth profile or similar in-depth type analyses. From sputter rate values, a linear depth scale can be calculated and displayed for the sputter depth profile.
Data obtained from surface profilometry are useful in monitoring instrumental parameters (for example, raster size, shape, and any irregularities in topography of the sputtered crater) used for depth profiles.
SCOPE
1.1 This guide covers the preferred procedure for acquiring and post-processing of sputter crater depth measurements. This guide is limited to stylus-type surface profilometers equipped with a stage, stylus, associated scan and sensing electronics, video system for sample and scan alignment, and computerized system.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

Status
Historical
Publication Date
31-May-2007
ICS
71.040.50 - Physicochemical methods of analysis
Technical Committee
E42 - Surface Analysis
Drafting Committee
E42.06 - SIMS
Current Stage
Ref Project

Relations

Replaces
ASTM E1634-02 - Standard Guide for Performing Sputter Crater Depth Measurements
Effective Date
01-Jun-2007
Replaced By
ASTM E1634-11 - Standard Guide for Performing Sputter Crater Depth Measurements
Effective Date
01-Nov-2011
Referred By
ASTM E1127-08(2015) - Standard Guide for Depth Profiling in Auger Electron Spectroscopy
Effective Date
01-Jun-2007
Referred By
ASTM E2735-14(2020) - Standard Guide for Selection of Calibrations Needed for X-ray Photoelectron Spectroscopy (XPS) Experiments
Effective Date
01-Jun-2007

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ASTM E1634-02(2007) - Standard Guide for Performing Sputter Crater Depth MeasurementsASTM E1634-02(2007) - Standard Guide for Performing Sputter Crater Depth Measurements
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ASTM E1634-02(2007) - Standard Guide for Performing Sputter Crater Depth Measurements
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: E1634 – 02 (Reapproved 2007)
Standard Guide for
Performing Sputter Crater Depth Measurements
This standard is issued under the fixed designation E1634; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 5. General Procedure
1.1 This guide covers the preferred procedure for acquiring 5.1 Upon completing a sputter depth profile, mark the crater
and post-processing of sputter crater depth measurements.This for future identification (one can mark the exterior corner(s) of
guide is limited to stylus-type surface profilometers equipped a crater with features, for example, lines, holes, etc., produced
with a stage, stylus, associated scan and sensing electronics, using an unrastered ion beam). Note the x- and y-position with
videosystemforsampleandscanalignment,andcomputerized respect to the rastered ion beam and sample geometry or
system. suitable device feature(s).
1.2 This standard does not purport to address all of the 5.2 Place the sample on the profilometer stage surface. If
safety concerns, if any, associated with its use. It is the sample has an area of less than 1 cm , mount the sample onto
responsibility of the user of this standard to establish appro- another larger flat surface to prevent sample movement when
priate safety and health practices and determine the applica- profilometry is performed. The system should be reasonably
bility of regulatory limitations prior to use. leveled; for details on instrumental adjustments, see manufac-
turer’s operational manual(s). Keep the environment as dust-
2. Referenced Documents
free as possible and dust-off the sample surface with clean
2.1 ASTM Standards:
air/gas jet before performing the measurement.
E673 Terminology Relating to Surface Analysis 5.3 Pre-select surface profilometer operational settings;
E1162 Practice for Reporting Sputter Depth Profile Data in
computerized models are commonly used. Most surface profi-
Secondary Ion Mass Spectrometry (SIMS) lometers commonly permit selection of the following param-
eters:
3. Terminology
5.3.1 Stylus type (for example, diamond stylus),
3.1 Definitions:
5.3.2 Stylus radius (for example, 5 µm; various stylus radii
3.1.1 Terms used in surface analysis are defined in Termi-
are available depending upon desired resolution of measure-
nology E673.
ment, and to a certain degree the strength of the stylus tip for
varying hardness of materials),
4. Significance and Use
5.3.3 Stylus force (that is, force exerted on the analytical
4.1 Sputter crater depth measurements are performed in
sample during operation, for example, 15 mg; this is an
order to determine a sputter rate (depth/time) for each matrix
important variable when profiling sample with high hardness
sputtered during a sputter depth profile or similar in-depth type
levels; damage to the stylus may occur, and hence damage to
analyses. From sputter rate values, a linear depth scale can be
the instrumentation or errors in profilometry measurements, or
calculated and displayed for the sputter depth profile.
both, may result),
4.2 Data obtained from surface profilometry are useful in
5.3.4 Scan speed (for example, 50 µm/s; this value is
monitoring instrumental parameters (for example, raster size,
dependent upon permissible noise levels, accuracy, etc., and is
shape, and any irregularities in topography of the sputtered
typically determined experimentally),
crater) used for depth profiles.
5.3.5 Scan length (one typically uses twice the crater size to
allow for scanning over the level areas about the sputtered
crater, and
This guide is under the jurisdiction of ASTM Committee E42 on Surface
5.3.6 Number of scans for signal averaging (for example,
Analysis and is the direct responsibility of Subcommittee E42.06 on SIMS.
three repetitive scans averaged to improve the signal-to-noise
Current edition approved June 1, 2007. Published June 2007. Originally
ratio).
approved in 2002. Last previous edition approved in 2002 as E1634 – 02. DOI:
10.1520/E1634-02R07.
5.4 Lower the stylus in an area outside the sputtered crater,
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
atadistancefromthecrateredgeofapproximatelyone-halfthe
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
actual crater size, and in a reasonably smooth area to traverse
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website. theentirecraterlength.Thescanpathistypicallychosenacross
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
E1634 – 02
...

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5.1 Electron multipliers are commonly used in pulse-counting mode to detect ions from magnetic sector mass spectrometers. The electronics used to amplify, detect and count pulses from the electron multipliers always have a characteristic time interval after the detection of a pulse, during which no other pulses can be counted. This characteristic time interval is known as the “dead time.” The dead time has the effect of reducing the measured count rate compared with the “true” count rate.  
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