EN 16602-60-05:2014
(Main)Space product assurance - Generic procurement requirements for hybrids
Space product assurance - Generic procurement requirements for hybrids
The procurement requirements for hermetic hybrid microcircuits for use in space projects are defined in this Standard.
This Standard also provides details concerning the documentation requirements and the procedures relevant to obtain approval for the
use of hybrid microcircuits in the fabrication of space systems and associated equipment.
The provisions of this Standard apply to all participants in the production of space systems, at all levels and are applicable to manned and unmanned spacecraft, launchers, satellites, payloads, experiments, and their corresponding organizations.
This standard may be tailored for the specific characteristic and constraints of a space project in conformance with ECSS-S-ST-00.
Raumfahrtproduktsicherung - Allgemeine Beschaffungsanforderungen an Hybride
Assurance produit des projets spatiaux - exigences génériques d'approvisionement des composants hybrides
Zagotavljanje varnih proizvodov v vesoljski tehniki - Osnovne zahteve za naročanje hibridnih vezij
Cilj tega standarda je opredeliti zahteve za naročanje hibridnih mikrovezij za uporabo v vesoljskih sistemih. Ta standard obravnava naslednja področja zahtev: – Postopek potrditve za proizvajalca hibridnih mikrovezij. – Projektiranje hibridnih mikrovezij. – Naročanje aktivnih in pasivnih vezij. – Naročanje materialov in delov za kose. – Pregled serij hibridnih mikrovezij. – Preskusi sprejemljivosti serij hibridnih mikrovezij. – Sodelovanje strank, ključne točke za pregled. – Določila glede popravil. – Dobava hibridnih vezij in paketov podatkov.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-november-2014
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Space product assurance - Generic procurement requirements for hybrids
Raumfahrtproduktsicherung - Allgemeine Beschaffungsanforderungen an Hbyride
Assurance produit des projets spatiaux - exigences génériques d'approvisionement des
composants hybrides
Ta slovenski standard je istoveten z: EN 16602-60-05:2014
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD
EN 16602-60-05
NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2014
ICS 49.140
English version
Space product assurance - Generic procurement requirements
for hybrids
Assurance produit des projets spatiaux - exigences Raumfahrtproduktsicherung - Allgemeine
génériques d'approvisionement des composants hybrides Beschaffungsanforderungen an Hybride
This European Standard was approved by CEN on 13 March 2014.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-60-05:2014 E
worldwide for CEN national Members and for CENELEC
Members.
Table of contents
Foreword . 6
Introduction . 7
1 Scope . 8
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 10
3.1 Terms from other standards . 10
3.2 Terms specific to the present standard . 10
3.3 Abbreviated terms. 11
4 Sequence of procurement activities . 13
5 Selection of hybrid microcircuit manufacturer . 16
5.1 General . 16
5.2 Hybrid microcircuit manufacturer categories . 16
5.2.1 Category 1 manufacturer (preferred case) . 16
5.2.2 Category 2 manufacturer (non-preferred case) . 16
6 Validation procedure for a hybrid microcircuit manufacturer . 17
6.1 General . 17
6.2 Hybrid circuit technology identification form (HTIF) . 17
6.2.1 General . 17
6.2.2 HTIF for approved manufacturers (category 1) . 17
6.2.3 HTIF for manufacturer pending capability approval by the approving
authority (category 1) . 18
6.2.4 HTIF for manufacturer not approved by the approving authority
(category 2) . 18
6.3 Validation of category 2 manufacturers . 19
6.3.1 General . 19
6.3.2 Construction analysis on representative samples . 19
6.3.3 Quality and technical audit . 19
7 Design requirements . 21
7.1 General . 21
7.1.1 Overview . 21
7.1.2 Design activities . 21
7.2 Detail specification for hybrid circuits . 22
7.3 Design approval (circuit type approval) . 22
7.3.1 General . 22
7.3.2 Procedure for a new hybrid circuit which is “non similar” to a
reference circuit . 23
7.3.3 Procedure for a new hybrid circuit which is “similar” to a reference
circuit . 24
7.3.4 Procedure for a “recurrent” hybrid circuit . 24
8 Procurement of passive and active chips . 25
8.1 General . 25
8.1.1 Introduction . 25
8.1.2 Selecting chip suppliers . 27
8.1.3 Specifications . 27
8.1.4 Requirements for chip lots . 27
8.2 Procurement of passive chips . 28
8.2.1 General . 28
8.2.2 Bondability test . 28
8.2.3 Lot acceptance test (LAT) . 28
8.3 Procurement of active chips . 29
8.3.1 General . 29
8.3.2 Bondability test . 30
8.3.3 User LAT . 30
8.4 Procurement of hermetically encapsulated chips . 32
9 Procurement of materials and piece parts . 33
9.1 Overview . 33
9.2 Selection of materials and piece parts . 33
9.3 Specifications . 33
9.4 Requirements for materials and piece parts . 34
10 Manufacturing and screening of hybrid circuit lots . 35
10.1 Manufacturing . 35
10.2 Marking . 35
10.2.1 General . 35
10.2.2 Special cases . 36
10.3 Screening . 36
10.3.1 General . 36
10.3.2 Thermographic test . 39
10.3.3 Pre-seal burn-in . 40
10.3.4 Photograph of circuits . 40
10.3.5 Conditions for constant acceleration and mechanical shock . 40
10.3.6 Test condition for PIND . 40
10.3.7 Leak tests . 41
10.3.8 Physical dimensions . 41
10.3.9 Burn-in test . 41
10.3.10 Radiographic inspection . 41
10.4 Lot rejection . 41
10.4.1 Definition of failure modes . 41
10.4.2 Criteria for lot rejection . 42
10.4.3 Disposition of rejected lots . 43
10.5 Repair provisions . 43
10.5.1 General . 43
10.5.2 Element replacement . 43
10.5.3 Wire re-bonding . 43
10.5.4 Compound bonding . 44
10.5.5 Delidding of hybrid circuits . 44
11 Customer inspection and review . 45
12 Lot acceptance tests for hybrid circuits . 46
12.1 General . 46
12.1.1 Overview . 46
12.1.2 Samples . 46
12.2 Category 1 manufacturer . 47
12.2.1 Option 1: Production lot control . 47
12.2.2 Option 2: Lines under TRB management and statistical process
control . 48
12.3 Category 2 manufacturer (validated for the project) . 49
13 Hybrid delivery and data package . 53
13.1 General . 53
13.2 Data documentation . 53
13.2.1 General . 53
13.2.2 Cover sheets . 54
13.2.3 Certificate of conformity . 54
13.3 Packaging and despatch. 54
14 DPA test sequence . 55
Bibliography .
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