EN 16602-60-05:2014

Space product assurance - Generic procurement requirements for hybrids

The procurement requirements for hermetic hybrid microcircuits for use in space projects are defined in this Standard.
This Standard also provides details concerning the documentation requirements and the procedures relevant to obtain approval for the
use of hybrid microcircuits in the fabrication of space systems and associated equipment.
The provisions of this Standard apply to all participants in the production of space systems, at all levels and are applicable to manned and unmanned spacecraft, launchers, satellites, payloads, experiments, and their corresponding organizations.
This standard may be tailored for the specific characteristic and constraints of a space project in conformance with ECSS-S-ST-00.

Raumfahrtproduktsicherung - Allgemeine Beschaffungsanforderungen an Hybride

Assurance produit des projets spatiaux - exigences génériques d'approvisionement des composants hybrides

Zagotavljanje varnih proizvodov v vesoljski tehniki - Osnovne zahteve za naročanje hibridnih vezij

Cilj tega standarda je opredeliti zahteve za naročanje hibridnih mikrovezij za uporabo v vesoljskih sistemih. Ta standard obravnava naslednja področja zahtev: – Postopek potrditve za proizvajalca hibridnih mikrovezij. – Projektiranje hibridnih mikrovezij. – Naročanje aktivnih in pasivnih vezij. – Naročanje materialov in delov za kose. – Pregled serij hibridnih mikrovezij. – Preskusi sprejemljivosti serij hibridnih mikrovezij. – Sodelovanje strank, ključne točke za pregled. – Določila glede popravil. – Dobava hibridnih vezij in paketov podatkov.

General Information

• Status: Published
• Publication Date: 16-Sep-2014
• Withdrawal Date: 30-Mar-2015
• ICS: 49.140 - Space systems and operations
• Technical Committee: CEN/CLC/TC 5 - Space
• Drafting Committee: CEN/CLC/TC 5 - Space
• Current Stage: 9060 - Closure of 2 Year Review Enquiry - Review Enquiry
• Start Date: 03-Mar-2020
• Completion Date: 03-Mar-2020
• Mandate: M/496 - Mandate addressed to CEN, CENELEC and ETSI to develop standardisation regarding space industry (Phase 3 of the process)
• Ref Project: SIST EN 16602-60-05:2014 - Space product assurance - Generic procurement requirements for hybrids

Overview

EN 16602-60-05:2014 (EN 16602-60-05) defines space product assurance and generic procurement requirements for hermetic hybrid microcircuits used in space projects. The standard sets out the procurement lifecycle from manufacturer selection and validation through design approval, component procurement, manufacturing, screening, lot acceptance testing (LAT), delivery and documentation. It applies across the space sector - manned and unmanned spacecraft, launchers, satellites, payloads and experiments - and can be tailored to project constraints in conformance with ECSS‑S‑ST‑00.

Keywords: space product assurance, hybrid microcircuits, procurement requirements, hermetic hybrids, EN 16602-60-05, SIST.

Key technical topics and requirements

The standard covers a comprehensive set of procurement and assurance topics for hybrid microcircuits, including:

• Manufacturer selection and validation
  • Categorisation of manufacturers (Category 1 preferred / Category 2 non-preferred)
  • Validation procedures and evidence (e.g., Hybrid Circuit Technology Identification Form - HTIF)
• Design requirements and approvals
  • Detail specifications for hybrid designs
  • Circuit type approval routes for new, similar and recurrent designs
• Procurement of active and passive chips
  • Supplier selection, specification content and lot acceptance testing requirements for chips
• Materials and piece parts
  • Selection, specifications and procurement controls for materials used in hybrids
• Manufacturing, screening and inspection
  • Production controls, marking, thermographic and radiographic inspection, pre-seal burn‑in, and defect detection (PIND, leak tests)
• Lot acceptance tests (LAT) and sampling
  • LAT procedures, sample sizes and acceptance criteria for hybrid lots
• Customer involvement and data deliverables
  • Customer inspection points, required data package contents, certificates of conformity and packaging/dispatch rules
• Repair, rework and disposition
  • Repair provisions, delidding, re-bonding and disposition of rejected lots
• DPA (device/product assurance) test sequences
  • Defined test sequences and documentation expectations

Practical applications

SIST EN 16602-60-05 is used to:

• Specify procurement contracts and supplier requirements for space-grade hermetic hybrids
• Define acceptance criteria and test sequences for hybrid lots destined for flight hardware
• Structure design approval and change control for hybrid circuits in spacecraft systems
• Guide supplier audits, manufacturing oversight and customer inspection activities

Who should use this standard

• Space systems engineers and product assurance teams
• Procurement and quality managers in aerospace/space supply chains
• Hybrid microcircuit manufacturers and subcontractors
• Test laboratories and inspection authorities involved in flight hardware acceptance

Related standards

• ECSS‑Q‑ST‑60‑05 (source origin: EN document stems from ECSS-Q-ST-60-05C Rev.1)
• ECSS‑S‑ST‑00 (tailoring guidance for project-specific requirements)

This standard is a practical reference for ensuring reliable procurement, qualification and acceptance of hermetic hybrid microcircuits in space applications.

Standards Content (Sample)

SLOVENSKI STANDARD
01-november-2014
=DJRWDYOMDQMHYDUQLKSURL]YRGRYYYHVROMVNLWHKQLNL2VQRYQH]DKWHYH]D
QDURþDQMHKLEULGQLKYH]LM
Space product assurance - Generic procurement requirements for hybrids
Raumfahrtproduktsicherung - Allgemeine Beschaffungsanforderungen an Hbyride
Assurance produit des projets spatiaux - exigences génériques d'approvisionement des
composants hybrides
Ta slovenski standard je istoveten z: EN 16602-60-05:2014
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 16602-60-05
NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2014
ICS 49.140
English version
Space product assurance - Generic procurement requirements
for hybrids
Assurance produit des projets spatiaux - exigences Raumfahrtproduktsicherung - Allgemeine
génériques d'approvisionement des composants hybrides Beschaffungsanforderungen an Hybride
This European Standard was approved by CEN on 13 March 2014.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-60-05:2014 E
worldwide for CEN national Members and for CENELEC
Members.
Table of contents
Foreword . 6
Introduction . 7
1 Scope . 8
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 10
3.1 Terms from other standards . 10
3.2 Terms specific to the present standard . 10
3.3 Abbreviated terms. 11
4 Sequence of procurement activities . 13
5 Selection of hybrid microcircuit manufacturer . 16
5.1 General . 16
5.2 Hybrid microcircuit manufacturer categories . 16
5.2.1 Category 1 manufacturer (preferred case) . 16
5.2.2 Category 2 manufacturer (non-preferred case) . 16
6 Validation procedure for a hybrid microcircuit manufacturer . 17
6.1 General . 17
6.2 Hybrid circuit technology identification form (HTIF) . 17
6.2.1 General . 17
6.2.2 HTIF for approved manufacturers (category 1) . 17
6.2.3 HTIF for manufacturer pending capability approval by the approving
authority (category 1) . 18
6.2.4 HTIF for manufacturer not approved by the approving authority
(category 2) . 18
6.3 Validation of category 2 manufacturers . 19
6.3.1 General . 19
6.3.2 Construction analysis on representative samples . 19
6.3.3 Quality and technical audit . 19
7 Design requirements . 21
7.1 General . 21
7.1.1 Overview . 21
7.1.2 Design activities . 21
7.2 Detail specification for hybrid circuits . 22
7.3 Design approval (circuit type approval) . 22
7.3.1 General . 22
7.3.2 Procedure for a new hybrid circuit which is “non similar” to a
reference circuit . 23
7.3.3 Procedure for a new hybrid circuit which is “similar” to a reference
circuit . 24
7.3.4 Procedure for a “recurrent” hybrid circuit . 24
8 Procurement of passive and active chips . 25
8.1 General . 25
8.1.1 Introduction . 25
8.1.2 Selecting chip suppliers . 27
8.1.3 Specifications . 27
8.1.4 Requirements for chip lots . 27
8.2 Procurement of passive chips . 28
8.2.1 General . 28
8.2.2 Bondability test . 28
8.2.3 Lot acceptance test (LAT) . 28
8.3 Procurement of active chips . 29
8.3.1 General . 29
8.3.2 Bondability test . 30
8.3.3 User LAT . 30
8.4 Procurement of hermetically encapsulated chips . 32
9 Procurement of materials and piece parts . 33
9.1 Overview . 33
9.2 Selection of materials and piece parts . 33
9.3 Specifications . 33
9.4 Requirements for materials and piece parts . 34
10 Manufacturing and screening of hybrid circuit lots . 35
10.1 Manufacturing . 35
10.2 Marking . 35
10.2.1 General . 35
10.2.2 Special cases . 36
10.3 Screening . 36
10.3.1 General . 36
10.3.2 Thermographic test . 39
10.3.3 Pre-seal burn-in . 40
10.3.4 Photograph of circuits . 40
10.3.5 Conditions for constant acceleration and mechanical shock . 40
10.3.6 Test condition for PIND . 40
10.3.7 Leak tests . 41
10.3.8 Physical dimensions . 41
10.3.9 Burn-in test . 41
10.3.10 Radiographic inspection . 41
10.4 Lot rejection . 41
10.4.1 Definition of failure modes . 41
10.4.2 Criteria for lot rejection . 42
10.4.3 Disposition of rejected lots . 43
10.5 Repair provisions . 43
10.5.1 General . 43
10.5.2 Element replacement . 43
10.5.3 Wire re-bonding . 43
10.5.4 Compound bonding . 44
10.5.5 Delidding of hybrid circuits . 44
11 Customer inspection and review . 45
12 Lot acceptance tests for hybrid circuits . 46
12.1 General . 46
12.1.1 Overview . 46
12.1.2 Samples . 46
12.2 Category 1 manufacturer . 47
12.2.1 Option 1: Production lot control . 47
12.2.2 Option 2: Lines under TRB management and statistical process
control . 48
12.3 Category 2 manufacturer (validated for the project) . 49
13 Hybrid delivery and data package . 53
13.1 General . 53
13.2 Data documentation . 53
13.2.1 General . 53
13.2.2 Cover sheets . 54
13.2.3 Certificate of conformity . 54
13.3 Packaging and despatch. 54
14 DPA test sequence . 55
Bibliography . 76

Figures
Figure 4-1: Sequence of activities in the procurement of hybrid microcircuits . 14
Figure 4-2: Hybrids procurement flow . 15
Figure 8-1: Flow of Procurement of Active and Passive components . 26
Figure 10-1: Screening test sequence . 37
Figure 12-1: Lot acceptance tests for the first production lot manufactured by a
category 2 manufacturer . 51

Tables
Table 8-1: Sample size and acceptance criteria for LAT of passive chips . 29
Table 8-2: Sample size and acceptance criteria for user LAT on active chips . 31
Table 10-1: Test conditions for constant acceleration and mechanical shock . 40
Table 12-1: Sample size for hybrids lot acceptance tests . 47
Table 12-2: Lot acceptance tests and sample size . 47
Table 12-3: Production acceptance tests and sampling . 50
Table 12-4: Definition of tests . 51

Foreword
This document (EN 16602-60-05:2014) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16602-60-05:2014) originates from ECSS-Q-ST-60-05C Rev. 1.
This European Standard shall be given the status of a national standard, either
by publication of an identical text or by endorsement, at the latest by March
2015, and conflicting national standards shall be withdrawn at the latest by
March 2015.
Attention is drawn to the possibility that some of the elements of this document
may be the subject of patent rights. CEN [and/or CENELEC] shall not be held
responsible for identifying any or all such patent rights.
This document has been prepared under a mandate given to CEN by the
European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
According to the CEN-CENELEC Internal Regulations, the national standards
organizations of the following countries are bound to implement this European
Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United
Kingdom.
Introduction
The objective of this Standard is to define the requirements for the procurement
of hybrid microcircuits for use in space systems.
This Standard covers the following requirement domains:
• Validation procedure for a hybrid microcircuit manufacturer.
• Design of hybrid microcircuits.
• Procurement of active and passive chips.
• Procurement of materials and piece parts.
• Screening of hybrid microcircuit lots.
• Lot acceptance tests for hybrid microcircuits.
• Customer involvement, key inspection points.
• Repair provisions.
• Hybrids and data package delivery.
Scope
The procurement requirements for hermetic hybrid microcircuits for use in
space projects are defined in this Standard.
This Standard also provides details concerning the documentation
requirements and the procedures relevant to obtain approval for the use of
hybrid microcircuits in the fabrication of space systems and associated
equipment.
The provisions of this Standard apply to all participants in the production of
space systems, at all levels and are applicable to manned and unmanned
spacecraft, launchers, satellites, payloads, experiments, and their corresponding
organizations.
This standard may be tailored for the specific characteristic and constraints of a
space project in conformance with ECSS-S-ST-00.
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references subsequent amendments to, or revisions of any of these publications
do not apply. However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the most recent editions of
the normative documents indicated below. For undated references the latest
edition of the publication referred to applies.

EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system — Glossary of terms
EN 16602-60 ECSS-Q-ST-60 Space product assurance — Electrical, electronic and
electromechanical (EEE) components
EN 16602-60-12 ECSS-Q-ST-60-12 Space product assurance - Design, selection,
procurement and use of die form monolithic
microwave integrated circuits (MMICs)
EN 16602-30-11 ECSS-Q-ST-30-11 Space product assurance — Derating - EEE
components
EN 16602-70 ECSS-Q-ST-70 Space product assurance — Materials, mechanical
parts and processes
MIL-STD-883G Tests methods and procedures for microelectronics
MIL-STD-750D Test method standard for semiconductor devices
ESCC 20600 Preservation, packaging and despatch of ESCC
components
ESCC 2043000 Internal visual inspection of capacitors
ESCC 2044000 Internal visual inspection of resistors
ESCC 2045010 Internal visual inspection of microwave devices
ESCC 2049010 Internal visual inspection of monolithic microwave
devices
ESCC 2053000 External visual inspection of capacitors
ESCC 2054000 External visual inspection of resistors
ESCC 2093000 Radiographic inspection of capacitors
ESCC 2094000 Radiographic inspection of resistors
Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this standard, the terms and definitions of ECSS-S-ST-00-01
apply.
3.2 Terms specific to the present standard
3.2.1 approving authority
organization supplying approval certificate
NOTE In Europe the approving authority for space
systems components is the ESCC system.
3.2.2 category 1 manufacturer
manufacturer with a technology domain approved or pending approval by the
approving authority
3.2.3 category 2 manufacturer
manufacturer with a technology domain not approved by the approving
authority
3.2.4 EM quality level hybrid
hybrid manufactured with the same parts (types, sources and design),
materials, and processes as flight models but with acceptance of a lower quality
level for visual inspection or screening during procurement or manufacturing
3.2.5 hybrid
see “hybrid microcircuit”
3.2.6 hybrid circuit
see “hybrid microcircuit”
3.2.7 hybrid microcircuit
combination of elements (interconnection substrate, added active or passive
chips) sealed inside a package in order to perform an electronic function
NOTE 1 Interconnection substrate (e.g. thick film, thin film,
co-fired, DBC) can be with or without integrated
passive components (e.g. resistors, inductors,
capacitors).
NOTE 2 Active parts can be monolithic or discrete, chips or
packaged components.
NOTE 3 Electronic functions that are performed by hybrids
include digital or analog, low frequency or
radiofrequency, low power or high power
functions. These functions may be mixed
according to the application.
NOTE 4 The terms “hybrid circuits” and “hybrids” are
synonymous for “Hybrid microcircuits”.
3.2.8 process identification document
document that defines the approved technology domain, the reference of
approval status, and one that freezes the configuration of the manufacturing
line and the approved domain
3.2.9 process performance index
the long-term capability of the process which reflects the process centering and
the variability with respect to specification requirements
3.2.10 production lot
number of units of a single device type manufactured on the same production
line using the same production techniques, in one uninterrupted period,
according to the same component or part design and having the same chips lots
and the same materials
3.2.11 representative production lot
lot that represents several production lots grouping products from the same
family, covered by one SEC type, manufactured on the same production line, in
one uninterrupted period, using the same materials and processes
3.2.12 standard evaluation circuit
device that represents a family of products using the same materials and
processes and which is processed on the same production line with the same
manufacturing equipment and tools
3.2.13 technology review board
formal group at manufacturer level where design, materials and parts
procurement, manufacturing, testing, reliability, and quality assurance
functions are represented
3.3 Abbreviated terms
For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01
and the following apply:
Abbreviation Meaning
CENELEC Electronic Components Committee
CECC
circuit type approval
CTA
certificate of conformance
COC
declared component list
DCL
document requirements definition
DRD
direct bonded copper
DBC
destructive physical analysis
DPA
engineering model
EM
European Space Agency
ESA
European Space Components Coordination
ESCC
electrostatic discharge
ESD
flight model
FM
failure modes effects and criticality analysis
FMECA
hybrid circuit technology identification form
HTIF
lot acceptance test
LAT
monolithic microwave integrated circuit
MMIC
mandatory inspection points
MIP
nonconformance report
NCR
product assurance
PA
part approval document
PAD
percent defective allowable
PDA
preliminary design review
PDR
process identification document
PID
particle impact noise detection
PIND
process performance index
Ppk
request for deviation
RFD
request for waiver
RFW
scanning acoustic microscope
SAM
standard evaluation circuit
SEC
scanning electronic microscope
SEM
statistical process control
SPC
technological characterization vehicle
TCV
technology review board
TRB
Sequence of procurement activities
The sequences of activities involved in the procurement of hybrid microcircuits
are illustrated in Figure 4-1. A more detailed illustration is further provided in
Figure 4-2.
The initial steps in the process are the selection and validation of the
manufacturer and the technology.
The technology of a hybrid circuit is defined as the set of processes and
materials used to manufacture the hybrid, i.e.
• the substrate network and material: thick film or thin film;
• integrated components, i.e. resistors, capacitors and inductors used in the
network;
• processes and materials for the attachment and connection of the
added-on components (active and passive chips);
• packaging type and material.
Technology
Selection of manufacturer
Clause 5
Validation
Clause 6
Hybrid microcircuits
Design
(Clause 7)
Procurement of active and passive parts
(Clause 8)
Procurement of materials and piece parts
(Clause 9)
Manufacturing
(Clause 10)
Customer inspection and review
(Clause 11)
Screening
Clause 10
Lot acceptance tests
(Clause 12)
Accept or reject lot
Delivery of hybrids and data package
(Clause 13)
Figure 4-1: Sequence of activities in the procurement of hybrid microcircuits
Figure 4-2: Hybrids procurement flow
Selection of hybrid microcircuit
manufacturer
5.1 General
a. All manufacturers that are selected for producing hybrids shall be
validated as described in Clause 6.
5.2 Hybrid microcircuit manufacturer categories
5.2.1 Category 1 manufacturer (preferred case)
a. A supplier who wishes to use (or manufacture) hybrid circuits for a space
project shall procure (or produce) them from a production line that has
been approved or is pending approval by the approving authority.
b. All hybrid circuits shall be manufactured using the basic processes and
materials, and in conformance with the manufacturing and inspection
procedures as described in the PID that has been approved by the
approving authority.
c. The PID shall contain as a minimum:
1. the manufacturing and inspection flow chart;
2. the list of applicable documents with approved revision;
3. the general organization of the production line;
4. the approved domain: authorized parts, materials, processes and
reworks;
5. the list of manufacturing, inspection and failure analysis
equipment;
6. the list of hybrids manufactured in conformance with the
approved PID.
5.2.2 Category 2 manufacturer (non-preferred
case)
a. A supplier wishing to use (or manufacture) hybrid circuits from a
production line that has not been approved by the approving authority
shall:
1. justify its requirements to the customer (especially if this involves
developing a new circuit), and
2. satisfy the validation conditions described in Clause 6.
Validation procedure for a hybrid
microcircuit manufacturer
6.1 General
a. Validation of manufacturers and production lines shall be conducted
jointly by the supplier using the hybrid circuit and the customer, and
involving upper level customers where relevant.
b. In the case of confidential information, these activities may be conducted
with the support of the approving authority.
6.2 Hybrid circuit technology identification form (HTIF)
6.2.1 General
a. Whatever his status (category 1 or 2) regarding the capability approval, a
manufacturer wishing to produce or use hybrid circuits shall complete a
hybrid circuit technology identification form (HTIF) for each circuit, in
conformance with Annex A.
b. For category 2 manufacturers, this form shall be included with the part
approval document (PAD) as described in 6.2.4.
NOTE The format of the PAD is defined in ECSS-Q-ST-60,
Annex A.
6.2.2 HTIF for approved manufacturers
(category 1)
a. With justification, it is not mandatory, for a category 1 manufacturer, to
deliver the HTIF to the customer.
b. A category 1 manufacturer shall issue a CoC to the customer to confirm
that the proposed hybrid circuit conforms to the domain approved by the
approving authority.
c. As a minimum, the HTIF reference and CoC shall be included in the PAD
with reference to the applicable PID.
d. If the technologies used are not entirely covered by the applicable PID,
the manufacturer shall carry out additional (delta-)evaluation tests or
prove that he has adequate in-house test results.
NOTE See the relevant PSS evaluation plans in ESA-PSS-
01-605, ESA-PSS-01-606, and ESA-PSS-01-612.
e. This (delta-)evaluation programme shall be referenced in the PAD.
f. The test results shall be approved by the first level supplier.
g. The manufacturer shall supply these circuits according to the
procurement rules defined for the project as per the requirements in this
standard.
6.2.3 HTIF for manufacturer pending capability
approval by the approving authority
(category 1)
6.2.3.1 Overview
Manufacturers of hybrid circuits are considered to be pending capability
approval by the approving authority when:
• they have successfully completed the “evaluation” phase,
• their PID has been approved, and
• they have begun the “approval” phase (see ESA-PSS-01-605, ESA-PSS-01-
606, and ESA-PSS-01-612).
6.2.3.2 Requirements
a. Manufacturers shall only use the technologies that have been tested in
the evaluation phase and are referenced in the PID.
b. Manufacturers may manufacture circuits while the approval phase is
being carried out in conformance with the PID.
c. Manufacturers shall not deliver these circuits until capability approval
has been formally acquired.
6.2.4 HTIF for manufacturer not approved by the
approving authority (category 2)
6.2.4.1 Overview
For category 2 manufacturers, the review and validation activities for the
production lines are described in clause 6.3.
6.2.4.2 Requirements
a. The review and validation activities for the production lines for
category 2 manufacturers shall be implemented at the PDR milestone of
the project.
b. A category 2 manufacturer shall supply an HTIF in conformance with
Annex A and include it as part of the PAD.
c. In case of confidentiality of particular materials or processes, claimed by
category 2 manufacturers, the HTIF attached to the PAD may leave
undisclosed the confidentiality elements, provided that these aspects are
covered and discussed during the quality and technical audit as
described in clause 6.3.3.
d. The HTIF shall be in conformance with the technological domain
validated for the project.
e. The manufacturer shall produce the hybrid circuits for the project which
conform to the same common requirements as for category 1
manufacturers and additional requirements as defined in this Standard.
6.3 Validation of category 2 manufacturers
6.3.1 General
a. Category 2 manufacturers shall be validated in conformance with the
requirements in this clause 6.3.
6.3.2 Construction analysis on representative
samples
a. Two circuits per hybrid type shall be supplied by the supplier for
construction analysis.
b. The quality level of these circuits shall be the same as the one specified by
the project.
6.3.3 Quality and technical audit
a. After construction analysis, a quality and technical audit shall be carried
out by the supplier as follows:
1. Present the results of the construction analysis.
2. Analyse the results of internal evaluations of the technologies
implemented by the manufacturer. Compare these previously
obtained results to the tests defined in the evaluation plans (see
ESA-PSS-01-606, ESA-PSS-01-605, and ESA-PSS-01-612), and apply
the following criteria.
(a) If the results of the tests are successful, consider the
manufacturer “validated”, but only for the project.
(b) If only some of the results are successful, perform additional
tests pertaining to the failures (see the evaluation plans ESA-
PSS-01-606, ESA-PSS-01-605, and ESA-PSS-01-612).
(c) If all the results are unsuccessful, draw up a completely new
evaluation plan (see ESA-PSS-01-606, ESA-PSS-01-605, and
ESA-PSS-01-612).
3. Judge the validity of manufacturer’s in-house data in conformance
with the following criteria:
(a) Equivalence of the test structure(s) subjected to the in-house
evaluation tests and the hybrid circuits proposed by the
project, this “equivalence” including assessment of the
following:
− technology of the circuit,
− circuit function,
− circuit complexity,
− power dissipation.
− Comparison between the in-house evaluation tests and
the reference evaluation plans with respect to the severity
of the tests (e.g. level, duration, temperature) and the
accept or reject criteria applied.
4. Validate the capability of the production line to meet the quality
requirements of the project and ensure the following:
(a) The components, materials and processes used are governed
by specifications written, approved by the manufacturer’s
quality control departments and that this documentation is
applied at the time of the manufacturer’s in-house
evaluation tests.
(b) The quality control operations on the production line
conform in frequency and severity to the “high reliability”
requirements.
(c) The traceability of the finished product and its component
parts is guaranteed by the manufacturer and can be used by
the customer.
(d) All the documentation relating to production and quality
assurance specified in the process identification document
(PID) is approved by the customer.
NOTE For guidelines for carrying out such audits see
ESA-PSS-01-607 and ESA-PSS-01-611.
Design requirements
7.1 General
7.1.1 Overview
The “design” of a hybrid circuit includes the initial activities to be undertaken
by a manufacturer in order to implement specific electrical functions, derived
from a circuit diagram, in a finished hybrid.
7.1.2 Design activities
a. The design activities of a hybrid circuit shall, as a minimum, include the
following:
1. Selection of technology.
2. Selection of added-on components, i.e. defining the types of chip
components used in the hybrid and their manufacturers.
3. Definition of the physical layout of the hybrid circuit, i.e. the
interconnections in the hybrid to enable the electrical function.
4. Application of the derating requirements in conformance with
ECSS-Q-ST-30-11.
5. Implementation of the thermal management criteria in the case of
power circuits.
6. Mechanical, dimensional verification.
7. Verification of the radiation related requirements for the added-on
components and the whole hybrid circuit.
8. The activities requested by the customer to ensure that the
predicted failure rate of the hybrid circuit is compatible with the
reliability target of the equipment concerned (FMECA, reliability
calculation and worst case analysis).
b. When selecting the technology in conformance with 7.1.2a.1, the
technology shall be as specified in the PID and described in the hybrid
technology identification form (HTIF) specified in Annex A.
c. When selecting the added-on components in conformance with 7.1.2a.2,
the selection shall conform to the requirements specified in the PID.
d. When defining the physical layout of the hybrid circuit in conformance
with 7.1.2a.3, the layout of the hybrid circuit shall conform to the design
rules defined in the specification called up by the approved PID.
7.2 Detail specification for hybrid circuits
a. A detail specification for each type of hybrid circuit shall be drawn up in
conformance with Annex B.
b. The maximum rating and drifts of electrical parameters shall be
established from the following:
1. the detail specification for the chip components,
2. the results obtained on prototypes and engineering models.
c. The manufacturer shall demonstrate the consistency between the
maximum ratings and drifts specified for the hybrid circuit and those for
each of the chip components.
d. Any deviations in the burn-in and life test temperatures as specified in
the detail specification (Annex B) shall be subject to a request for
deviation.
7.3 Design approval (circuit type approval)
7.3.1 General
7.3.1.1 Overview
The procedure for design approval of a hybrid circuit depends on the
following:
• Its “non similarity” to a circuit developed or being developed for the
project, or a circuit already developed and approved within the
framework of a previous project.
• Its “similarity” to a circuit developed or being developed for the project,
or a circuit already developed and approved within the framework of a
previous project.
• The “recurrence” of a circuit which has already been used (developed,
approved, manufactured) within the framework of a previous project.
7.3.1.2 Requirements
a. Similarity shall be proposed by the manufacturer to the customer by
using a similarity form in conformance with Annex C.
NOTE Similarity is assessed on the basis of the HTIF and
this similarity form.
b. The similarity form shall be enclosed with the request for use (PAD).
7.3.2 Procedure for a new hybrid circuit which is
“non similar” to a reference circuit
a. The procedure for the design approval for a new circuit which is not
similar to an approved circuit shall respect the following:
1. Manufacture four hybrids with, as a minimum, an EM quality
level.
2. Take electrical measurements at ambient temperature in
conformance with Tables 2 and 4 of the detail specification
provided in Annex B.
NOTE Table 3 is optional.
3. Subject the four hybrids to burn-in over a period of 240 h in
conformance with Table 5 of the detail specification provided in
Annex B.
4. Take electrical measurements in conformance with Tables 4, 2 and
3 of the detail specification provided in Annex B.
5. Measure the internal water vapour content of one hybrid in
conformance with MIL-STD-883 method 1018, taking as acceptance
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criterion: 5 000 × 10 parts water vapour maximum at 100 °C.
6. Perform a DPA on the hybrid submitted to 7.3.2a.5 in conformance
with clause 14.
7. Analyse the observed defect to determine its cause
NOTE For example, basic technology, component
quality, design.
(a) No failure allowed.
(b) For category 1 manufacturers the DPA is optional.
8. Perform a life test shall for a duration of 1 000 h on three hybrids,
in conformance with Table 7 of the detail specification provided in
Annex B.
9. Take electrical measurements in conformance with Tables 2, 3 and
6 of the detail specification provided in Annex B.
(a) No failure allowed.
10. Perform a DPA on one of the three hybrids submitted to life test.
(a) No failure allowed.
(b) For category 1 manufacturers the DPA is optional.
NOTE CTA can be performed on the first flight model
hybrid providing project agreement.
b. To perform the internal water vapour content measurement in
conformance with 7.3.2.a.5, a screening reject may be used.
7.3.3 Procedure for a new hybrid circuit which is
“similar” to a reference circuit
a. The procedure for the design approval of a new hybrid which is similar
to an approved circuit shall be as follows:
1. Manufacture two hybrids with, as a minimum, an EM quality
level.
2. Take electrical measurements in conformance with Tables 2 and 3
of the detail specification provided in Annex B.
(a) No failure allowed.
3. Perform a DPA shall be performed on one of the two hybrids,
(a) No failure allowed.
(b) For category 1 manufacturers the DPA is optional.
7.3.4 Procedure for a “recurrent” hybrid circuit
a. A hybrid circuit shall be considered to be “recurrent” when the following
conditions apply:
1. Its design has already been approved without any deviations (in
conformance with the procedures described in clause 7.3.2 or 7.3.3)
for a previous project.
2. Its FM version has the same references, detail specification, HTIF
and list of chip component suppliers (if not included in the HTIF)
as the flight hybrid produced within the framework of a previous
project, taking into account alerts and deviations.
3. Its conditions of use and constraints are similar in nature and
severity to those for a previous project.
b. A “recurrent” hybrid circuit may be manufactured without any further
design validation.
c. If one of the conditions described not be met, the design shall be
approved in conformance with clause 7.3.2 or 7.3.3.
d. The customer may reject the case for a recurrent circuit if the information
supplied is considered to be inadequate.
Procurement of passive and active chips
8.1 General
8.1.1 Introduction
The procurement of add on parts is detailed below. The flow for chip
components is illustrated in Figure 8-1.
Active and passive chips form a subset of all electronic components.
Active chips are diodes, transistors, and integrated circuits supplied in the form
of bare chips.
The most commonly used passive chips include resistors, capacitors and
inductors.
NOTE: The tests inside the dashed area can be carried out by a supplier under the
responsibility of the hybrid manufac
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