EN 16602-70-61:2022
(Main)Space product assurance - High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections
Space product assurance - High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections
This standard defines:
- the basic requirements for the verification and approval of automatic machine w ave soldering for use in spacecraft hardware. The process requirements for w ave soldering of doublesided and multilayer boards are also defined.
- the technical requirements and quality assurance provisions for the manufacture and verification of manuallysoldered, high-reliability electrical connections.
- the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.
- the acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to w ithstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight.
- the proper tools, correct materials, design and w orkmanshipt. Workmanship standards are included to permit discrimination betw een proper and improper work.
SCOPE
This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
The Standard defines w orkmanship requirements, the acceptance and rejection criteria for high-reliability assemblies intended to withstand normal terrestrial conditions and the environment imposed by space flight.
The mounting and supporting of components, terminals and conductors specified in this standard applies only to assemblies designed to continuously operate over the mission w ithin the temperature limits of -55 °C to +85 °C at solder joint level.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-60 (equivalent to EN 16602-70-60) and ECSS-Q-ST-70-12 (equivalent to EN 16602-70-12).
This Standard does not cover the qualification and acceptance of the EQM and FM equipment w ith high-reliability electronic circuits of surface mount, through hole and solderless assemblies.
This Standard does not cover verification of thermal properties for component assembly.
This Standard does not cover pressfit connectors.
The qualification and acceptance tests of equipment manufactured in accordance w ith this Standard are covered by ECSS-EST-10-03 (equivalent to EN 16603-10-03).
Raumfahrtproduktsicherung - Hochzuverlässiges Löten von Oberflächen-Befestigungen und Durchgangslochverbindungen
Assurance produit des projets spatiaux - Soudure haute fiabilité pour les connexions électriques à montage en surface, à technologie combinée et montées à la main
La présente norme définit les exigences techniques et les dispositions relatives à l'assurance qualité pour la fabrication et la vérification de circuits électroniques de haute fiabilité, montés en surface avec trou traversant, assemblés sans soudure, et pour le brasage d'interconnexions de fils et de faisceaux de fils.
Cette norme définit les exigences d'exécution et les critères d'acceptation et de rejet pour les assemblages de haute fiabilité destinés à résister aux conditions d'essai au sol, y compris le LTS (stockage à long terme) et l'environnement imposé par les vols spatiaux et les lanceurs.
Le montage et le support des composants, bornes et conducteurs spécifiés dans la présente norme ne s'appliquent qu'aux assemblages conçus pour fonctionner en continu pendant toute la mission dans des limites de température de -55 °C à +85 °C au niveau des joints de soudure.
Les exigences relatives aux circuits imprimés figurent dans l'ECSS-Q-ST-70-60 et l'ECSS-Q-ST-70-12.
La présente norme ne couvre pas le brasage sans queue et les exigences associées.
La présente norme ne couvre pas la qualification et l'acceptation des équipements EQM et FM avec des assemblages de circuits électroniques à haute fiabilité avec montage en surface, trou traversant et sans brasure.
La présente norme ne couvre pas la vérification des propriétés thermiques pour l'assemblage des composants.
La présente norme ne couvre pas les connecteurs à ajustement forcé, à cause des risques d'endommager le PCB qui ne sont pas évalués dans le cadre de cette exigence d'essai.
Les essais de qualification et d'acceptation des équipements fabriqués conformément à la présente norme sont couverts par l'ECSS-E-ST-10-03.
La présente norme peut être adaptée aux caractéristiques et contraintes spécifiques d'un projet spatial, conformément à l'ECSS-S-ST-00.
Zagotavljanje varnih proizvodov v vesoljski tehniki - Visoko zanesljivo spajkanje za površinsko namestitev, mešano tehnologijo in ročno pritrjene električne priključke
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Standards Content (Sample)
SLOVENSKI STANDARD
01-december-2022
Nadomešča:
SIST EN 16602-70-07:2015
SIST EN 16602-70-08:2015
SIST EN 16602-70-38:2019
Zagotavljanje varnih proizvodov v vesoljski tehniki - Visoko zanesljivo spajkanje
za površinsko namestitev, mešano tehnologijo in ročno pritrjene električne
priključke
Space product assurance - High-reliability soldering for surface mount, mixed technology
and hand-mounted electrical connections
Raumfahrtproduktsicherung - Hochzuverlässige Montage von Oberflächen-
Befestigungen und Durchgangslochverbindungen
Assurance produit des projets spatiaux - Soudure haute fiabilité pour les connexions
électriques à montage en surface, à technologie combinée et montées à la main
Ta slovenski standard je istoveten z: EN 16602-70-61:2022
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 16602-70-61
NORME EUROPÉENNE
EUROPÄISCHE NORM
November 2022
ICS 25.160.50; 49.140
Supersedes EN 16602-70-07:2014, EN 16602-70-
08:2015, EN 16602-70-38:2019
English version
Space product assurance - High-reliability soldering for
surface mount, mixed technology and hand-mounted
electrical connections
Assurance produit des projets spatiaux - Soudure haute Raumfahrtproduktsicherung - Hochzuverlässige
fiabilité pour les connexions électriques à montage en Montage von Oberflächen-Befestigungen und
surface, à technologie combinée et montées à la main Durchgangslochverbindungen
This European Standard was approved by CEN on 29 August 2022.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for
giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical
references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to
any CEN and CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC
Management Centre has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Türkiye and United Kingdom.
CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2022 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. EN 16602-70-61:2022 E
reserved worldwide for CEN national Members and for
CENELEC Members.
Table of contents
European Foreword . 13
Introduction . 14
1 Scope . 21
2 Normative references . 22
3 Terms, definitions and abbreviated terms . 24
3.1 Terms from other standards . 24
3.2 Terms specific to the present standard . 24
3.3 Abbreviated terms. 29
3.4 Nomenclature . 31
4 Principles of reliable soldered connections . 32
5 Preparatory conditions . 33
5.1 Facility cleanliness . 33
5.2 Environmental conditions . 33
5.3 Lighting requirements . 34
5.4 Precautions against static discharges . 34
5.4.1 Overview . 34
5.4.2 General . 35
5.4.3 ESD Protected Area . 35
5.4.4 Precautions against ESD during manufacturing . 36
5.4.5 Protective packaging and ESD protection . 37
5.5 Equipment and tools . 37
5.5.1 General . 37
5.5.2 Brushes . 38
5.5.3 Cutters and pliers . 38
5.5.4 Bending tools . 39
5.5.5 Clinching tools . 39
5.5.6 Insulation strippers . 40
5.5.7 Hot air blower . 41
5.5.8 Soldering tools . 41
5.5.9 Baking and curing ovens . 42
5.5.10 Solder deposition equipment . 43
5.5.11 Automatic component placement equipment . 43
5.5.12 Dynamic wave-solder machines . 43
5.5.13 Selective wave solder equipment . 44
5.5.14 Reflow process equipment . 45
5.5.15 Depanelization tool. 47
5.5.16 Cleanliness testing equipment . 47
5.5.17 Optical microscope . 47
5.5.18 Automatic Optical Inspection (AOI) equipment . 47
5.5.19 X-ray inspection equipment . 47
6 Material selection . 49
6.1 General . 49
6.2 Solder . 49
6.2.1 Form . 49
6.2.2 Composition . 50
6.2.3 Storage and handling of paste purity . 52
6.3 Fluxes . 52
6.3.1 Rosin based fluxes . 52
6.4 Solvents . 53
6.5 Flexible insulation materials . 54
6.6 Terminals . 54
6.6.1 Materials . 54
6.6.2 Tin, silver, and gold-plated terminals . 54
6.7 Wires . 55
6.8 Sculptured flex . 55
6.9 Printed circuits substrates . 55
6.9.1 Substrates selection . 55
6.9.2 Gold finish on PCBs footprint . 55
6.9.3 PCB design requirements for wave and selective wave soldering . 56
6.10 Components . 56
6.10.1 General . 56
6.10.2 Moisture sensitive components . 57
6.11 Adhesives, potting, underfill and conformal coatings . 57
7 Preparations prior to mounting and soldering . 58
7.1 General handling . 58
7.2 Storage . 58
7.2.1 Components. 58
7.2.2 PCBs. 58
7.2.3 Materials requiring segregation . 58
7.3 Baking conditions of PCBs . 59
7.4 Baking and storage of moisture sensitive components . 59
7.5 Preparation of components, wires, terminals, and solder cups. 60
7.5.1 Damage to insulation . 60
7.5.2 Damage to conductors and braid . 60
7.5.3 Cleaning before soldering . 61
7.5.4 Insulation clearance . 61
7.5.5 Wire lay . 61
7.6 Degolding and pretinning . 61
7.6.1 General . 61
7.6.2 Solder baths method for degolding and pretinning of components
terminations and terminals . 62
7.6.3 Solder iron method for degolding and pretinning . 64
7.6.4 Pretinning processes . 64
7.7 Preparation of the soldering tip . 65
8 Components mounting requirements prior to soldering . 67
8.1 General requirements . 67
8.2 Mounting of through hole components . 67
8.2.1 General . 67
8.2.2 Heavy components . 68
8.2.3 Metal-case components . 68
8.2.4 Glass-encased components . 68
8.2.5 Stress relief of components with bendable leads . 68
8.2.6 Stress relief of components with non-bendable leads . 71
8.2.7 Bending of component leads . 72
8.2.8 Lead attachment to PCBs . 73
8.2.9 Mounting of through hole connectors to PCBs . 76
8.2.10 Mounting of swage terminals to PCBs . 77
8.2.11 Mounting of components to terminals . 78
8.3 Mounting of surface mount components .
...
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