EN IEC 63287-2:2023
(Main)Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile
This part of IEC 63287 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product. This document is not intended for military- and space-related applications.
Halbleiterbauelemente - Richtlinien für Zuverlässigkeitsqualifizierungspläne - Teil 2: Konzept des Einsatzprofils
Dispositifs à semiconducteurs - Lignes directrices concernant les plans de qualification de la fiabilité - Partie 2: Concept de profil de mission
L’IEC 63287-2:2023 fournit des lignes directrices pour l'élaboration de plans de qualification de la fiabilité à l’aide du concept de profil de mission, sur la base des conditions environnementales et de l’utilisation prévue du produit. Le présent document n’est pas destiné aux applications militaires et spatiales.
Polprevodniški elementi - Smernice za načrtovanje ocenjevanja zanesljivosti - 2. del: Koncept profila namembnosti (IEC 63287-2:2023)
Ta del standarda IEC 63287 določa smernice za načrtovanje ocenjevanja zanesljivosti z uporabo koncepta profila namembnosti na podlagi okoljskega kondicioniranja in predlagane uporabe izdelka. Ta dokument ni namenjen za vojaško uporabo in uporabo v vesolju.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 63287-2:2023
01-julij-2023
Polprevodniški elementi - Smernice za načrtovanje ocenjevanja zanesljivosti - 2.
del: Koncept profila namembnosti (IEC 63287-2:2023)
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of
mission profile (IEC 63287-2:2023)
Halbleiterbauelemente - Richtlinien für Zuverlässigkeitsqualifizierungspläne - Teil 2:
Konzept des Einsatzprofils (IEC 63287-2:2023)
Dispositifs à semiconducteurs - Lignes directrices concernant les plans de qualification
de la fiabilité - Partie 2: Concept de profil de mission (IEC 63287-2:2023)
Ta slovenski standard je istoveten z: EN IEC 63287-2:2023
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 63287-2:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 63287-2:2023
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SIST EN IEC 63287-2:2023
EUROPEAN STANDARD EN IEC 63287-2
NORME EUROPÉENNE
EUROPÄISCHE NORM May 2023
ICS 31.080.01
English Version
Semiconductor devices - Guidelines for reliability qualification
plans - Part 2: Concept of mission profile
(IEC 63287-2:2023)
Dispositifs à semiconducteurs - Lignes directrices Halbleiterbauelemente - Richtlinien für
concernant les plans de qualification de la fiabilité - Partie 2: Zuverlässigkeitsqualifizierungspläne - Teil 2: Konzept des
Concept de profil de mission Einsatzprofils
(IEC 63287-2:2023) (IEC 63287-2:2023)
This European Standard was approved by CENELEC on 2023-05-03. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
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© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 63287-2:2023 E
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SIST EN IEC 63287-2:2023
EN IEC 63287-2:2023 (E)
European foreword
The text of document 47/2796/FDIS, future edition 1 of IEC 63287-2, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 63287-2:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-02-03
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-05-03
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
This document is read in conjunction with EN IEC 63287-1.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 63287-2:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 60068-2-1 NOTE Approved as EN 60068-2-1
IEC 60068-2-30 NOTE Approved as EN 60068-2-30
IEC 60749-11 NOTE Approved as EN 60749-11
2
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SIST EN IEC 63287-2:2023
EN IEC 63287-2:2023 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their con
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