EN IEC 62969-4:2018

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors

IEC 62969-4:2018 specifies a method of directly fault injection test for automotive semiconductor sensor interface that can be used to support the conformance assurance in the vehicle communications interface.

Halbleiterbauelemente - Halbleiterschnittstelle für Automobile - Teil 4: Bewertungsverfahren für Datenschnittstellen bei Automobil-Sensoren

Dispositifs à semiconducteurs - Interface à semiconducteurs pour les véhicules automobiles - Partie 4: Méthode d’évaluation de l’interface de données destinée aux capteurs de véhicules automobiles

L’IEC 62969-4:2018 spécifie une méthode d’essai par injection directe de défaut pour l’interface à semiconducteurs des capteurs de véhicules automobiles, pouvant être utilisée pour assurer la conformité de l’interface de communication du véhicule.

Polprevodniški elementi - Polprevodniški vmesniki za motorna vozila - 4. del: Metoda vrednotenja podatkovnega vmesnika za senzorje motornih vozil (IEC 62969-4:2018)

Ta del standarda IEC 62969 določa neposredno preskusno metodo za odkrivanje napak pri vbrizgavanju za polprevodniški vmesnik za motorna vozila, ki se lahko uporablja za zagotavljanje skladnosti delovanja komunikacijskega vmesnika vozila.

General Information

• Status: Published
• Publication Date: 23-Aug-2018
• Withdrawal Date: 21-Aug-2021
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 24-Aug-2018
• Completion Date: 24-Aug-2018
• Ref Project: SIST EN IEC 62969-4:2018 - Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors (IEC 62969-4:2018)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 62969-4:2018
01-november-2018
Polprevodniški elementi - Polprevodniški vmesniki za motorna vozila - 4. del:
Metoda vrednotenja podatkovnega vmesnika za senzorje motornih vozil (IEC
62969-4:2018)

Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 4:

Evaluation method of data interface for automotive vehicle sensors (IEC 62969-4:2018)

Ta slovenski standard je istoveten z: EN IEC 62969-4:2018
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
43.040.10 (OHNWULþQDLQHOHNWURQVND Electrical and electronic
RSUHPD equipment
SIST EN IEC 62969-4:2018 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 62969-4:2018
---------------------- Page: 2 ----------------------
SIST EN IEC 62969-4:2018
EUROPEAN STANDARD EN IEC 62969-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
August 2018
ICS 31.080.99
English Version
Semiconductor devices - Semiconductor interface for automotive
vehicles - Part 4: Evaluation method of data interface for
automotive vehicle sensors
(IEC 62969-4:2018)

Dispositifs à semiconducteurs - Interface à Halbleiterbauelemente - Halbleiterschnittstelle für

semiconducteurs pour les véhicules automobiles - Partie 4: Automobile - Teil 4: Bewertungsverfahren für

Méthode d'évaluation de l'interface de données destinée Datenschnittstellen bei Automobil-Sensoren

aux capteurs de véhicules automobiles (IEC 62969-4:2018)
(IEC 62969-4:2018)

This European Standard was approved by CENELEC on 2018-08-22. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,

Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62969-4:2018 E
---------------------- Page: 3 ----------------------
SIST EN IEC 62969-4:2018
EN IEC 62969-4:2018 (E)
European foreword

The text of document 47/2470/FDIS, future edition 1 of IEC 62969-4, prepared by IEC/TC 47

"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 62969-4:2018.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2019-05-22

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2021-08-22

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 62969-4:2018 was approved by CENELEC as a European

Standard without any modification.
---------------------- Page: 4 ----------------------
SIST EN IEC 62969-4:2018
IEC 62969-4
Edition 1.0 2018-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 4: Evaluation method of data interface for automotive vehicle sensors
Dispositifs à semiconducteurs – Interface à semiconducteurs pour les véhicules
automobiles –
Partie 4: Méthode d’évaluation de l’interface de données destinée aux capteurs
de véhicules automobiles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-5791-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 5 ----------------------
SIST EN IEC 62969-4:2018
– 2 – IEC 62969-4:2018 © IEC 2018
CONTENTS

FOREWORD ........................................................................................................................... 3

INTRODUCTION ..................................................................................................................... 5

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms, definitions and abbreviated terms ........................................................................ 6

3.1 Terms and definitions .............................................................................................. 6

3.2 Abbreviated terms ................................................................................................... 7

4 Evaluation and tests ........................................................................................................ 7

4.1 Evaluation test setup .............................................................................................. 7

4.2 Block diagram ......................................................................................................... 7

4.3 Input and output connector setup ............................................................................ 8

4.4 Test conditions and configurations .......................................................................... 8

4.5 Disturbances test conditions ................................................................................... 9

5 Disturbance test item ..................................................................................................... 10

5.1 Data interface load ................................................................................................ 10

5.1.1 Variable impedance ....................................................................................... 10

5.1.2 Direct crosstalk .............................................................................................. 11

5.1.3 Diagonal crosstalk ......................................................................................... 11

5.2 Data interface line status ...................................................................................... 11

5.2.1 Short circuit ................................................................................................... 11

5.2.2 Data interface break ...................................................................................... 12

5.3 Fault injection ....................................................................................................... 12

5.3.1 Disturbing signals .......................................................................................... 12

5.3.2 Overwrite signals ........................................................................................... 14

5.3.3 Signal generator ............................................................................................ 15

5.3.4 Trigger ........................................................................................................... 15

Annex A (informative) Description of disturbance detail items .............................................. 17

Bibliography .......................................................................................................................... 19

Figure 1 – The semiconductor-based sensor data interface test with fault injection ................. 7

Figure 2 – Block diagram of the data interface example of duplex channel .............................. 8

Figure 3 – Fault injection test configuration example of the sensor data interface ................. 10

Figure 4 – Disturbing signal put onto the data interface ........................................................ 13

Figure 5 – The node receives invalid signals ......................................................................... 14

---------------------- Page: 6 ----------------------
SIST EN IEC 62969-4:2018
IEC 62969-4:2018 © IEC 2018 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES –
Part 4: Evaluation method of data interface
for automotive vehicle sensors
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62969-4 has been prepared by IEC technical committee 47:

Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2470/FDIS 47/2487/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 7 ----------------------
SIST EN IEC 62969-4:2018
– 4 – IEC 62969-4:2018 © IEC 2018

A list of all parts in the IEC 62969 series, published under the general title Semiconductor

devices – Semiconductor interface for automotive vehicles, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 8 ----------------------
SIST EN IEC 62969-4:2018
IEC 62969-4:2018 © IEC 2018 – 5 –
INTRODUCTION
The IEC 62969 series is composed of four parts as follow:

• IEC 62969-1 Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 1: General requirements of power interface for automotive vehicle sensors

• IEC 62969-2 Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 2: Efficiency evaluation methods of wireless power transmission using resonance for

automotive vehicle sensors

• IEC 62969-3 Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors

• IEC 62969-4 Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 4: Evaluation method of data interface for automotive vehicle sensors

The IEC 62969 series covers power and data interfaces for sensors in automotive vehicles.

The first part covers general requirements of test conditions such as temperature, humidity,

vibration, etc., for automotive sensor power interface. It also includes various electrical

performances of power interface such as voltage drop from power source to automotive

sensors, noises, voltage level, etc. The second part covers “Efficiency evaluation methods of

wireless power transmission using resonance for automotive vehicle sensors “. The third part

covers “Shock driven piezoelectric energy harvesting for automotive vehicle sensors”. The

fourth part covers “Evaluation methods of data interface for automotive vehicle sensors”.

---------------------- Page: 9 ----------------------
SIST EN IEC 62969-4:2018
– 6 – IEC 62969-4:2018 © IEC 2018
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES –
Part 4: Evaluation method of data interface
for automotive vehicle sensors
1 Scope

This part of IEC 62969 specifies a method of directly fault injection test for automotive

semiconductor sensor interface that can be used to support the conformance assurance in the

vehicle communications interface.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.
There are no normative references in this document.
3 Terms, definitions and abbreviated terms
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 Terms and definitions
3.1.1
data interface

transfer of data with electrical signal from a sensor source to another ECU in vehicle such as

ECU and sensors via cable or electric and/or magnetic fields through air or medium

3.1.2
fault injection

technique for improving the coverage of a test by introducing faults to device under test

3.1.3
disturbance

temporary change of environmental conditions that can cause a fault to the device under test

3.1.4
crosstalk

appearance of undesired energy in a channel, owing to the presence of a signal in another

channel, caused by, for example induction, conduction or non-linearity
[SOURCE: IEC 60050-722:1992, 722-15-03]
---------------------- Page: 10 ----------------------
SIST EN IEC 62969-4:2018
IEC 62969-4:2018 © IEC 2018 – 7 –
3.2 Abbreviated terms
ECU: Electronic Control Unit (see IEC 60050-442:1998, 442-04-22)
DUT: Device Under Test
4 Evaluation and tests
4.1 Evaluation test setup

Figure 1 shows the conceptual diagram of the semiconductor-based sensor data interface test

with fault injection.
Sensor ECU (Electronic Control Unit)
Sensor(s) Microprocessor
Fault Injection
Example: Example:
MEMS sensor, Micro-controller,
CMOS image sensor, Communication controller,
Etc. Etc.
Example:
SPI (Serial Peripheral Interface),
SCI (Serial Communication Interface),
IIC (Inter-Integrated Circuit),
Etc.
In-Vehicle Network ECU
Example:
Fault Injection
CAN, LIN, FlexRay,
Etc.
IEC

Figure 1 – The semiconductor-based sensor data interface test with fault injection

The fault injection tool can do the fault injection to a semiconductor type sensor and works as

a communication monitoring for the fault injection node and system during fault injection. The

fault injection tool provides fault injection of physical level and monitoring of node level.

It offers many new possibilities for the analysis of data interface errors. A representation of

the physical layer is often indispensable, particularly during the execution of conformity tests.

With data interface-specific trigger conditions and time synchronization, it can find the causes

of protocol errors much quicker than with a traditional test method.
4.2 Block diagram

The block diagrams of the data communication interfaces and digital or analog disturbance

units clarify the terminal assignments and uses of the externally accessible interface lines.

Figure 2 shows conceptual block diagram of the data interface example of duplex channel.

The signals for generating trigger events are evaluated via the trig-high and trig-low

connections. The digital disturbance types 'recessive' and 'dominant' are also output over

these two connections.

V represents the reference voltage of the data interface signals. If the high-speed interface

Ref

is being used, V shall be connected to the GND. When using the low-speed interface,

Ref
connection to the GND is optional.
---------------------- Page: 11 ----------------------
SIST EN IEC 62969-4:2018
– 8 – IEC 62969-4:2018 © IEC 2018

The supply voltage for the low-speed transceiver is fed in via V – which acts as the

Bat

operating voltage for the rest of the transceivers used in the system. Alternatively, V may

Bat

be left unconnected, and in this case an internal power supply generates a regulated voltage

of vehicle for the transceiver supply. V is not necessary for operation of the high-speed

Bat
interface.
RTH and RTL supply the voltages needed
...