EN 62047-12:2011
(Main)Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 μm to 1 000 μm in the plane direction and from 1 μm to 100 μm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 μm and 10 μm in thickness. The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 12: Verfahren zur Prüfung der Biege-Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 12: Méthode d'essai de fatigue en flexion des matériaux en couche mince utilisant les vibrations à la résonance des structures à systèmes microélectromécaniques (MEMS)
La CEI 62047-12:2011 spécifie une méthode d'essai de fatigue en flexion utilisant les vibrations à la résonance des structures mécaniques à très petite échelle des systèmes microélectromécaniques (MEMS), et des micromachines. La présente norme s'applique aux structures vibrantes dont la taille est dans la gamme allant de 10 μm à 1 000 μm dans le plan et de 1 μm à 100 μm d'épaisseur, ainsi qu'à des matériaux d'essai mesurant moins de 1 mm de longueur, moins de 1 mm de largeur et entre 0,1 μm et 10 μm d'épaisseur. Les matériaux de construction principaux pour les systèmes microélectromécaniques, les micromachines, etc., comportent des caractéristiques spéciales telles que des dimensions typiques de l'ordre de quelques microns, la fabrication des matériaux par dépôt et la fabrication d'éprouvettes d'essai par usinage non mécanique, par exemple la photolithographie. Les structures à systèmes micro-électromécaniques présentent souvent une fréquence de résonance fondamentale et une résistance supérieures à celles des macro-structures. Pour évaluer et garantir la durée de vie des structures à systèmes microélectromécaniques, on doit établir une méthode d'essai de fatigue avec des cycles de charge très élevés (jusqu'à 1012). Le but de la méthode d'essai est d'évaluer les propriétés de fatigue mécanique des matériaux à très petite échelle sur une courte durée en appliquant une contrainte de flexion à charge élevée et à haute fréquence cyclique en utilisant des vibrations à la résonance.
Polprevodniški elementi - Mikroelektromehanski elementi - 12. del: Metoda za preskušanje upogibne utrujenosti tankoplastnih materialov z uporabo resonančnih tresljajev struktur mikroelektromehanskih sistemov (MEMS)
Ta del IEC 62047 določa metodo za preskušanje upogibne utrujenosti z uporabo resonančnih tresljajev mikromehanskih struktur MEMS (mikroelektromehanskih sistemov) in mikrostrojev. Ta standard velja za vibrirajoče strukture v razponu velikosti od 10 μm do 1000 μm v smeri ravnine in debeline od 1 μm do 1000 μm ter za preskusne materiale, ki merijo manj kot 1 mm v dolžino, manj kot 1 mm v širino in med 0,1 μm in 10 μm v debelino. Glavni strukturni materiali za MEMS, mikrostroje itd. imajo posebne lastnosti, kot so značilna velikost nekaj mikronov, izdelava materiala z usedanjem in preskušanci, narejeni z nemehansko strojno obdelavo, vključno s fotolitografijo. Strukture MEMS imajo pogosto višjo osnovno resonančno frekvenco in višjo trdnost kot makrostrukture. Za ocenjevanje in zagotavljanje življenjske dobe struktur MEMS je treba vzpostaviti preskusno metodo utrujenosti z ultravisokimi cikli (do 1012) obremenitve. Cilj preskusne metode je v kratkem času oceniti lastnosti mehanske utrujenosti materialov na mikroravni z uporabo visokih obremenitev in visokih cikličnih frekvenc upogibne napetosti z uporabo resonančne vibracije.
General Information
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 12: Verfahren zur Prüfung der Biege-Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-StrukturenDispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 12: Méthode d'essai de fatigue en flexion des matériaux en couche mince utilisant les vibrations à la résonance des structures à systèmes microélectromécaniques (MEMS)Semiconductor devices - Microelectromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:Ta slovenski standard je istoveten z:EN 62047-12:2011SIST EN 62047-12:2012en01-januar-2012SIST EN 62047-12:2012SLOVENSKI
STANDARD
EUROPEAN STANDARD EN 62047-12 NORME EUROPÉENNE
EUROPÄISCHE NORM October 2011
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2011 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-12:2011 E
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices -
Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
Dispositifs à semiconducteurs -
Dispositifs microélectromécaniques -
Partie 12: Méthode d'essai de fatigue en flexion des matériaux en couche mince utilisant les vibrations à la résonance des structures à systèmes microélectromécaniques (MEMS) (CEI 62047-12:2011)
Halbleiterbauelemente -
Bauelemente der Mikrosystemtechnik -
Teil 12: Verfahren zur Prüfung der Biege-Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen (IEC 62047-12:2011)
This European Standard was approved by CENELEC on 2011-10-18. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2012-07-18 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2014-10-18
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62047-12:2011 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 62047-2:2006 NOTE
Harmonized as EN 62047-2:2006 (not modified).
- 3 - EN 62047-12:2011 Annex ZA
(normative) Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 62047-3 2006 Semiconductor devices - Micro-electromechanical devices -
Part 3: Thin film standard test piece for tensile-testing EN 62047-3 2006
ISO 12107 - Metallic materials - Fatigue testing - Statistical planning and analysis of data - -
IEC 62047-12 Edition 1.0 2011-09 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices – Micro-electromechanical devices –
Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 12: Méthode d'essai de fatigue en flexion des matériaux en couche mince utilisant les vibrations à la résonance des structures à systèmes microélectromécaniques (MEMS)
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE U ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-88912-689-7
– 2 – 62047-12 IEC:2011 CONTENTS
FOREWORD . 4 1 Scope . 6 2 Normative references . 6 3 Terms and definitions . 6 4 Test equipment . 7 4.1 General . 7 4.2 Actuator . 8 4.3 Sensor . 8 4.4 Controller . 8 4.5 Recorder . 9 4.6 Parallel testing . 9 5 Specimen . 9 5.1 General . 9 5.2 Resonant properties . 9 5.3 Test part. 9 5.4 Specimen fabrication . 9 6 Test conditions . 9 6.1 Test amplitude. 9 6.2 Load ratio . 10 6.3 Vibration frequency . 10 6.4 Waveform . 10 6.5 Test time . 10 6.6 Test environment. 10 7 Initial measurement . 10 7.1 Reference strength measurement . 10 7.2 Frequency response test . 11 8 Test . 11 8.1 General . 11 8.2 Initial load application . 11 8.3 Monitoring . 12 8.4 Counting the number of cycles . 12 8.5 End of the test . 12 8.6 Recorded data . 12 9 Test report. 12 Annex A (informative)
Example of testing using an electrostatic device with an integrated actuation component and displacement detection component . 14 Annex B (informative)
Example of testing using an external drive and a device with an integrated strain gauge for detecting displacement . 17 Annex C (informative)
Example of electromagnetic drive out-of-plane vibration test
(external drive vibration test) . 20 Annex D (informative)
Theoretical expression on fatigue life of brittle materials based on Paris’ law and Weibull distribution . 23 Annex E (informative)
Analysis examples. 27 Bibliography . 29 SIST EN 62047-12:2012
62047-12 IEC:2011 – 3 –
Figure 1 – Block diagram of the test method . 7 Figure A.1 – Microscope image of the specimen . 14 Figure A.2 – Block diagram of test equipment . 15 Figure B.1 – The specimens’ structure . 17 Figure B.2 – Block diagram of test equipment . 18 Figure C.1 – Specimen for out-of-plane vibration testing . 20 Figure C.2 – Block diagram of test equipment . 21 Figure E.1 – Example of fatigue test results for silicon materials . 27 Figure E.2 – Static strength and fatigue life of polysilicon plotted in 3D . 28
– 4 – 62047-12 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 12: Bending fatigue testing method of thin film materials
using resonant vibration of MEMS structures
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conform
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