EN 62047-6:2010

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, andtest piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 6: Prüfverfahren zur uniaxialen Dauerschwingfestigkeit von Dünnschicht-Werkstoffen

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 6: Méthodes d'essais de fatigue axiale des matériaux en couche mince

La CEI 62047-6:2009 spécifie la méthode relative à l'essai de fatigue pour une force axiale de traction-traction des matériaux en couche mince de longueur et largeur inférieures à 1 mm et d'une épaisseur comprise entre 0,1 µm et 10 µm dans le cadre d'une gamme de force constante ou d'une gamme de déplacement constant. Les couches minces sont utilisées comme matériaux de construction principaux pour les systèmes micro-électromécaniques (MEMS, Micro-Electromechanical Systems) et les micromachines. Les matériaux de construction principaux pour les MEMS, les micromachines, etc. comportent des caractéristiques spéciales telles que des dimensions typiques de l'ordre de quelques microns, une fabrication de matériau par dépôt, et une fabrication d'éprouvettes d'essai au moyen d'un usinage non mécanique, qui peut être la photolithographie. La présente Norme internationale spécifie les méthodes d'essais de fatigue pour force axiale pour des éprouvettes lisses microminiaturisées, qui garantissent une précision correspondant aux caractéristiques spéciales. Les essais sont effectués à températures ambiantes, à l'air, en appliquant la charge à l'éprouvette le long de l'axe longitudinal.

Polprevodniški elementi - Mikroelektromehanski elementi - 6. del: Metode za preskušanje osne utrujenosti tankoplastnih materialov (IEC 62047-6:2009)

Ta mednarodni standard določa metodo za preskušanje osne utrujenosti tankoplastnih materialov dolžine in širine pod 1 mm in debeline med 0,1 μm in 10 μm pod silo ali spodrivom v nespremenljivem razponu. Tanki filmi se uporabljajo kot glavni strukturni materiali za MEMS in mikrostroje. Glavni strukturni materiali za MEMS, mikrostroje, itd. imajo posebne lastnosti, kot so značilna velikost nekaj mikronov, izdelava materiala z usedanjem in preskušanci, narejeni s pomočjo nemehanske strojne obdelave, vključno s fotolitografijo. Ta mednarodni standard določa metode za preskušanje osne utrujenosti gladkih preskušancev mikro velikosti, kar zagotavlja natančnost, ki ustreza posebnim lastnostim. Preskusi se opravljajo pri sobni temperaturi, v zraku, z obremenitvijo preskušanca po vzdolžni osi.

General Information

• Status: Published
• Publication Date: 04-Mar-2010
• Withdrawal Date: 28-Feb-2013
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/SC 47F - IEC_SC_47F
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 05-Mar-2010
• Completion Date: 05-Mar-2010
• Ref Project: SIST EN 62047-6:2010 - Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009)

Overview

EN 62047-6:2010 (adoption of IEC 62047-6:2009) specifies axial tensile–tensile fatigue testing methods for micro-sized thin film materials used as structural layers in MEMS and micromachines. The standard covers specimens with length and width under 1 mm and thickness between 0.1 µm and 10 µm, and defines procedures for testing under a constant force range or constant displacement range. Tests are performed at room temperature, in air, with loading applied along the test-piece longitudinal axis.

Key topics and technical requirements

• Scope and specimen geometry
  • Test-piece dimensions should match device-relevant sizes; parallel gauge length must be > 2.5 × width.
  • Dimensional tolerances: plane shape dimensions within ±1% (referenced to IEC 62047-2).
  • Curved transition radii should avoid stress concentration and premature fracture.
• Material and fabrication
  • Test pieces should be fabricated using processes representative of the target device (deposition, photolithography); substrate removal must avoid damage.
• Thickness and measurement
  • Film thickness must be measured for each specimen (film non-uniformity acknowledged); measurement accuracy within 5%. Non-contact measurement at a window step is permitted to avoid mechanical damage.
• Testing method and apparatus
  • Machine must provide appropriate gripping (mounting) mechanism and cyclic loading in tensile–tensile mode; loading applied along longitudinal axis.
  • Tests may be controlled by force range or displacement range; environment: room temperature, in air.
• Pre-test handling
  • Storage conditions can affect fatigue; if surface deterioration occurs during storage, testing is not performed.
• Reporting and termination
  • Endurance (test termination) criteria and test reporting requirements are specified to ensure reproducibility and traceability.

Applications and who uses this standard

• MEMS designers and manufacturers validating structural thin films (e.g., polysilicon, metal films) for fatigue life and reliability.
• Materials and process engineers qualifying deposition, etch, and release processes for micromachined devices.
• Test laboratories and QA teams performing standardized fatigue characterization for product development and failure analysis.
• R&D groups studying thin-film fatigue mechanisms and comparing materials under consistent axial fatigue protocols.

Keywords: EN 62047-6:2010, axial fatigue testing, thin film materials, MEMS reliability, tensile–tensile fatigue, micro-electromechanical devices, test specimen, force range, displacement range.

Related standards

• IEC/EN 62047-2:2006 - Tensile testing methods of thin film materials (normative reference for specimen design, measurement methods and annex guidance).

Standards Content (Sample)

SLOVENSKI STANDARD
01-maj-2010
Polprevodniški elementi - Mikroelektromehanski elementi - 6. del: Metode za
preskušanje osne utrujenosti tankoplastnih materialov (IEC 62047-6:2009)
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing
methods of thin film materials (IEC 62047-6:2009)
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 6: Prüfverfahren zur
uniaxialen Dauerschwingfestigkeit von Dünnschicht-Werkstoffen (IEC 62047-6:2009)
Dispositifs à semiconducteurs - Dispositifs micro-électromécaniques - Partie 6: Méthodes
d'essais de fatigue axiale des matériaux en couche (CEI 62047-6:2009)
Ta slovenski standard je istoveten z: EN 62047-6:2010
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 62047-6
NORME EUROPÉENNE
March 2010
EUROPÄISCHE NORM
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices -
Part 6: Axial fatigue testing methods of thin film materials
(IEC 62047-6:2009)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 6: Méthodes d'essais de fatigue Teil 6: Prüfverfahren zur uniaxialen
axiale des matériaux en couche mince Dauerschwingfestigkeit von Dünnschicht-
(CEI 62047-6:2009) Werkstoffen
(IEC 62047-6:2009)
This European Standard was approved by CENELEC on 2010-03-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: Avenue Marnix 17, B - 1000 Brussels

© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-6:2010 E
Foreword
The text of document 47F/15/FDIS, future edition 1 of IEC 62047-6, prepared by SC 47F, Micro-
electromechanical systems, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC
parallel vote and was approved by CENELEC as EN 62047-6 on 2010-03-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2010-12-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-03-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62047-6:2009 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 62047-6:2010
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 62047-2 2006 Semiconductor devices - Micro- EN 62047-2 2006
electromechanical devices -
Part 2: Tensile testing methods of thin film
materials
IEC 62047-6 ®
Edition 1.0 2009-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 6: Axial fatigue testing methods of thin film materials

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 6: Méthodes d’essais de fatigue axiale des matériaux en couche mince

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
P
CODE PRIX
ICS 31.080.99 ISBN 2-8318-1035-8
– 2 – 62047-6 © IEC:2009
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms and definitions .5
4 Test piece .7
4.1 Design of test piece.7
4.2 Preparation of test piece .7
4.3 Test piece thickness.7
4.4 Storage prior to testing.7
5 Testing method and test apparatus.7
5.1 General .7
5.2 Method of gripping (mounting of test piece).8
5.3 Static loading test.8
5.4 Method of loading.8
5.5 Speed of testing .8
5.6 Environment control .8
6 Endurances (test termination).9
7 Test report.9
Annex A (informative) Technical background of this standard .10
Annex B (informative) Test piece .11
Annex C (informative) Displacement measurement .12
Annex D (informative) Testing environment.13
Annex E (informative) Number of test pieces .14
Bibliography.15

62047-6 © IEC:2009 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 6: Axial fatigue testing methods of thin film materials

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-6 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/15/FDIS 47F/17/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62047 series, under the general title Semiconductor devices –
Micro-electromechanical devices, can be found on the IEC website.

– 4 – 62047-6 © IEC:2009
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
62047-6 © IEC:2009 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 6: Axial fatigue testing methods of thin film materials

1 Scope
This International Standard specifies the method for axial tensile–tensile force fatigue testing
of thin film materials with a length and width under 1 mm and a thickness in the range
between 0,1 μm and 10 μm under constant force range or constant displacement range. Thin
films are used as main structural materials for MEMS and micromachines.
The main structural materials for MEMS, micromachines, etc., have special features, such as
typical dimensions of a few microns, material fabrication by deposition, and test piece
fabrication by means of non-mechanical machining, including photolithography. This
International Standard specifies the axial force fatigue testing methods for micro-sized smooth
specimens, which enables a guarantee of accuracy corresponding to the special features. The
tests are carried out at room temperatures, in air, with loading applied to the test piece along
the longitudinal axis.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 62047-2:2006, Semiconductor devices – Micro-electromechanical devices – Part 2:
Tensile testing method of thin film materials
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
maximum force
P
max
highest algebraic value of applied force in a cycle
NOTE Adapted from ASTM E 1823-05a [1] .
3.2
minimum force
P
min
lowest algebraic value of applied force in a cycle
NOTE Adapted from ASTM E 1823-05a [1].
3.3
mean force
P
mean
algebraic average of the maximum and minimum forces in constant amplitude loading, or of
individual cycles
NOTE Adapted from ASTM E 1823-05a [1].
—————————
The figures between brackets refer to the Bibliography.

– 6 – 62047-6 © IEC:2009
3.4
force range
ΔP
algebraic difference between the maximum and minimum forces in constant amplitude loading
3.5
maximum stress
σ
max
highest algebraic value of applied stress in a cycle
3.6
minimum stress
σ
min
lowest algebraic value of applied force in a cycle
3.7
mean stress
σ
mean
algebraic average of the maximum and minimum stress in constant amplitude loading, or of
individual cycles
3.8
stress range
Δσ
algebraic difference between the maximum and minimum stresses in constant amplitude
loading
3.9
maximum displacement
δ
max
highest algebraic value of applied displacement in a cycle
3.10
minimum displacement
δ
min
lowest algebraic value of applied displacement in a cycle
3.11
mean displacement
δ
mean
algebraic average of the maximum and
...