Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, andtest piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 6: Prüfverfahren zur uniaxialen Dauerschwingfestigkeit von Dünnschicht-Werkstoffen

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 6: Méthodes d'essais de fatigue axiale des matériaux en couche mince

La CEI 62047-6:2009 spécifie la méthode relative à l'essai de fatigue pour une force axiale de traction-traction des matériaux en couche mince de longueur et largeur inférieures à 1 mm et d'une épaisseur comprise entre 0,1 µm et 10 µm dans le cadre d'une gamme de force constante ou d'une gamme de déplacement constant. Les couches minces sont utilisées comme matériaux de construction principaux pour les systèmes micro-électromécaniques (MEMS, Micro-Electromechanical Systems) et les micromachines. Les matériaux de construction principaux pour les MEMS, les micromachines, etc. comportent des caractéristiques spéciales telles que des dimensions typiques de l'ordre de quelques microns, une fabrication de matériau par dépôt, et une fabrication d'éprouvettes d'essai au moyen d'un usinage non mécanique, qui peut être la photolithographie. La présente Norme internationale spécifie les méthodes d'essais de fatigue pour force axiale pour des éprouvettes lisses microminiaturisées, qui garantissent une précision correspondant aux caractéristiques spéciales. Les essais sont effectués à températures ambiantes, à l'air, en appliquant la charge à l'éprouvette le long de l'axe longitudinal.

Polprevodniški elementi - Mikroelektromehanski elementi - 6. del: Metode za preskušanje osne utrujenosti tankoplastnih materialov (IEC 62047-6:2009)

Ta mednarodni standard določa metodo za preskušanje osne utrujenosti tankoplastnih materialov dolžine in širine pod 1 mm in debeline med 0,1 μm in 10 μm pod silo ali spodrivom v nespremenljivem razponu. Tanki filmi se uporabljajo kot glavni strukturni materiali za MEMS in mikrostroje. Glavni strukturni materiali za MEMS, mikrostroje, itd. imajo posebne lastnosti, kot so značilna velikost nekaj mikronov, izdelava materiala z usedanjem in preskušanci, narejeni s pomočjo nemehanske strojne obdelave, vključno s fotolitografijo. Ta mednarodni standard določa metode za preskušanje osne utrujenosti gladkih preskušancev mikro velikosti, kar zagotavlja natančnost, ki ustreza posebnim lastnostim. Preskusi se opravljajo pri sobni temperaturi, v zraku, z obremenitvijo preskušanca po vzdolžni osi.

General Information

Status
Published
Publication Date
04-Mar-2010
Withdrawal Date
28-Feb-2013
Technical Committee
Drafting Committee
Parallel Committee
Current Stage
6060 - Document made available - Publishing
Start Date
05-Mar-2010
Completion Date
05-Mar-2010

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62047-6:2010
01-maj-2010
Polprevodniški elementi - Mikroelektromehanski elementi - 6. del: Metode za
preskušanje osne utrujenosti tankoplastnih materialov (IEC 62047-6:2009)
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing
methods of thin film materials (IEC 62047-6:2009)
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 6: Prüfverfahren zur
uniaxialen Dauerschwingfestigkeit von Dünnschicht-Werkstoffen (IEC 62047-6:2009)
Dispositifs à semiconducteurs - Dispositifs micro-électromécaniques - Partie 6: Méthodes
d'essais de fatigue axiale des matériaux en couche (CEI 62047-6:2009)
Ta slovenski standard je istoveten z: EN 62047-6:2010
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-6:2010 en,fr
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62047-6:2010

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SIST EN 62047-6:2010

EUROPEAN STANDARD
EN 62047-6

NORME EUROPÉENNE
March 2010
EUROPÄISCHE NORM

ICS 31.080.99


English version


Semiconductor devices -
Micro-electromechanical devices -
Part 6: Axial fatigue testing methods of thin film materials
(IEC 62047-6:2009)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 6: Méthodes d'essais de fatigue Teil 6: Prüfverfahren zur uniaxialen
axiale des matériaux en couche mince Dauerschwingfestigkeit von Dünnschicht-
(CEI 62047-6:2009) Werkstoffen
(IEC 62047-6:2009)




This European Standard was approved by CENELEC on 2010-03-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: Avenue Marnix 17, B - 1000 Brussels


© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-6:2010 E

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SIST EN 62047-6:2010
EN 62047-6:2010 - 2 -
Foreword
The text of document 47F/15/FDIS, future edition 1 of IEC 62047-6, prepared by SC 47F, Micro-
electromechanical systems, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC
parallel vote and was approved by CENELEC as EN 62047-6 on 2010-03-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2010-12-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-03-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62047-6:2009 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 62047-6:2010
- 3 - EN 62047-6:2010
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year
...

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