Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Relates to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. Includes only those dimensions which are essential for the taping of components for the above-mentioned purposes.

Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten

Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants appropriés au montage en surface en bandes continues

Pakiranje komponent za avtomatsko ravnanje - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2007)

General Information

Status
Withdrawn
Publication Date
13-Sep-2007
Withdrawal Date
31-Aug-2010
Current Stage
9960 - Withdrawal effective - Withdrawal
Start Date
21-Jun-2016
Completion Date
21-Jun-2016

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SLOVENSKI STANDARD
01-januar-2008
1DGRPHãþD
SIST EN 60286-3:2002
Pakiranje komponent za avtomatsko ravnanje - 3. del: Pakiranje komponent za
površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2007)
Packaging of components for automatic handling - Part 3: Packaging of surface mount
components on continuous tapes (IEC 60286-3:2007)
Gurtung und Magazinierung von Bauelementen für die automatische Verarbeitung - Teil
3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-
3:2007)
Emballage de composants pour opérations automatisées - Partie 3: Emballage des
composants appropriés au montage en surface en bandes continues (IEC 60286-
3:2007)
Ta slovenski standard je istoveten z: EN 60286-3:2007
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.060 Tulci. Vretena Spools. Bobbins
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60286-3
NORME EUROPÉENNE
September 2007
EUROPÄISCHE NORM
ICS 31.020; 31.240 Supersedes EN 60286-3:1998

English version
Packaging of components for automatic handling -
Part 3: Packaging of surface mount components on continuous tapes
(IEC 60286-3:2007)
Emballage de composants  Gurtung und Magazinierung
pour opérations automatisées - von Bauelementen
Partie 3: Emballage des composants für die automatische Verarbeitung -
appropriés au montage en surface Teil 3: Gurtung von
oberflächenmontierbaren Bauelementen
en bandes continues
(CEI 60286-3:2007) auf Endlosgurten
(IEC 60286-3:2007)
This European Standard was approved by CENELEC on 2007-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60286-3:2007 E
Foreword
The text of document 40/1838/FDIS, future edition 4 of IEC 60286-3, prepared by IEC TC 40, Capacitors
and resistors for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 60286-3 on 2007-09-01.
This European Standard supersedes EN 60286-3:1998.
– implementation of Type IV (adhesive-backed punched plastic carrier tape for singulated bare die and
other surface mount components);
– minor revisions related to tables, figures and references.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-06-01
national standard or by endorsement
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60286-3:2007 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60286-3:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
IEC 60191-2 1966 Mechanical standardization of - -
semiconductor devices -
Part 2: Dimensions
IEC/TS 61340-5-1 1998 Electrostatics -
+ corr. February 1999 Part 5-1: Protection of electronic devices EN 61340-5-1 2001
from electrostatic phenomena - General + corr. April 2001
requirements
IEC/TS 61340-5-2 1999 Electrostatics - EN 61340-5-2 2001
Part 5-2: Protection of electronic devices + corr. August 2001
from electrostatic phenomena - User guide

IEC/TR 62258-3 2005 Semiconductor die products - CLC/TR 62258-3 2007
Part 3: Recommendations for good practice
in handling, packing and storage

ISO/IEC 16388 1999 Information technology - Automatic - -
identification and data capture techniques -
Bar code symbology specifications - Code 39

ISO 11469 2000 Plastics - Generic identification and marking EN ISO 11469 2000
of plastic products
INTERNATIONAL IEC
STANDARD 60286-3
Fourth edition
2007-06
Packaging of components for automatic handling –
Part 3:
Packaging of surface mount components
on continuous tapes
PRICE CODE
Commission Electrotechnique Internationale U
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 60286-3 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 General .6
1.1 Scope.6
1.2 Normative references .6
2 Terms and definitions.7
3 Structure of the specification .7
3.1 Type I – Punched carrier tape, with top and bottom cover tape (8 mm and
12 mm).8
3.2 Type II – Blister carrier tape, with single sprocket holes (8 mm, 12 mm,
16 mm and 24 mm) .10
3.3 Type III – Blister carrier tape, with double sprocket holes (32 mm to 200 mm).12
3.4 Type IV – Adhesive-backed punched plastic carrier tape for singulated bare
die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) .14
3.4.1 Component positioning and lateral displacement (see Figures 11 and 12) .16
3.4.2 Coordinate system.17
4 Polarity and orientation of components in the tape .18
4.1 All tapes.18
4.2 Tape reeling .18
4.2.1 All types .18
4.2.2 Type I.18
4.2.3 Types I, II and III only.18
4.2.4 Type IV only .19
5 Fixing of components and additional tape requirements.19
5.1 All types .19
5.2 Requirements for Types I, II and III where cover tape is used.20
5.3 Specific requirements for Type IV tapes .20
5.4 Peel force of the cover tape (for Types I, II and III only) .20
5.5 Minimum bending radius (for all Types) .20
5.6 Break force of the cover tapes (for Types I, II & III only) .21
5.7 Taping materials.21
5.8 Camber .21
6 Specific requirements for tapes containing die products .22
6.1 Tape design for tapes containing die products.22
6.2 Cleanliness .22
6.3 Component lateral movement (Types I and II) .22
7 Packing .23
7.1 Leader and trailer tape .23
7.1.1 Leader.23
7.1.2 Trailer.23
7.2 Reels .23
7.2.1 Reel dimensions related to tape (see Figure 18 and Table 12).24
7.2.2 Reel hole dimensions (see Figure 19 and Table 13) .25
7.2.3 Recycling .25
7.3 Missing components.25
8 Marking .26

60286-3 © IEC:2007(E) – 3 –
Table 1 – Constant dimensions of 8 mm and 12 mm punched carrier tape .9
Table 2 – Variable dimensions of 8 mm and 12 mm punched carrier tape .9
Table 3 – Constant dimensions of 8 mm to 24 mm blister carrier tape.11
Table 4 – Variable dimensions of 8 mm to 24 mm blister carrier tape.11
Table 5 – Constant dimensions of 32 mm to 200 mm blister carrier tape .13
Table 6 – Variable dimensions of 32 mm to 200 mm blister carrier tape .13
Table 7 – Constant dimensions of adhesive backed punched carrier tape .15
Table 8 – Variable dimensions of adhesive-backed punched carrier tape.15
Table 9 – Absolute referencing data for component target position .17
Table 10 – Peel force.20
Table 11 – Minimum bending radius.21
Table 12 – Reel dimensions.24
Table 13 – Reel hole dimensions .25

Figure 1 – 8 mm and 12 mm punched carrier-tape dimensions.8
Figure 2 – Illustration of 2 mm cavity pitch .8
Figure 3 – Maximum component tilt, rotation and lateral movement .8
Figure 4 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm).10
Figure 5 – Illustration of 2 mm cavity pitch .10
Figure 6 – Maximum component tilt, rotation and lateral movement .10
Figure 7 – Blister carrier tape .12
Figure 8 – Maximum component tilt, rotation and lateral movement .12
Figure 9 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment pitch) .14
Figure 10 – Illustration of 2 mm compartment pitch .14
Figure 11 – Component clearance and positioning method .16
Figure 12 – Maximum component tilt and lateral displacement.16
Figure 13 – Type IV coordinate system .17
Figure 14 – Tape reeling and label area on the reel .19
Figure 15 – Bending radius .
...

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