EN 60191-6-13:2007

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ('FBGA' hereafter) and Fine-pitch Land Grid Array ('FLGA' hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.

Mechanische Normung von Halbleiterbauelementen -Teil 6-13: Konstruktionsleitfaden für Open-top-Fassungen für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-13: Guide de conception pour les supports sans couvercle pour les boîtiers matriciels à billes et à pas fins et les boîtiers matriciels à zone de contact plate et à pas fins (FBGA/FLGA)

La CEI 60191-6-13:2007 fournit un guide de conception des supports à semi-conducteurs sans couvercle pour les boîtiers matriciels à billes et à pas fins (désignés ci-après "FBGA" abréviation de Fine-pitch Ball Grid Array) et les boîtiers matriciels à zone de contact plate et à pas fins (désignés ci-après "FLGA", Fine-pitch Land Grid Array). La présente norme est destinée à établir les dessins et dimensions d'encombrement du support sans couvercle parmi les supports d'essai et de rodage appliqués aux FBGA et aux FLGA.

Mehanska standardizacija polprevodniških elementov - 6-13. del: Smernica za načrtovanje zgoraj odprtih podstavkov za fini raster mreže krogličnih priključkov in fini raster mreže priključkov v ravnini (FBGA/FLGA) (IEC 60191-6-13:2007)

General Information

• Status: Withdrawn
• Publication Date: 29-Nov-2007
• Withdrawal Date: 31-Aug-2010
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Parallel Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 01-Nov-2019
• Completion Date: 01-Nov-2019
• Ref Project: SIST EN 60191-6-13:2008 - Mechanical standardization of semiconductor devices -- Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

Relations

• Replaced By: EN 60191-6-13:2016 - Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
• Effective Date: 28-Jan-2023

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Mechanische Normung von Halbleiterbauelementen - -Teil 6-13: Konstruktionsleitfaden für Open-top-Fassungen für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA)Normalisation mécanique des dispositifs à semi-conducteurs. - Partie 6-13 : Guide de conception pour les supports sans couvercle pour les boîtiers FBGA et FLGAMechanical standardization of semiconductor devices -- Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)31.240Mehanske konstrukcije za elektronsko opremoMechanical structures for electronic equipment31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in general01.100.25Electrical and electronics engineering drawingsICS:Ta slovenski standard je istoveten z:EN 60191-6-13:2007SIST EN 60191-6-13:2008en01-februar-2008SIST EN 60191-6-13:2008SLOVENSKI
STANDARD



SIST EN 60191-6-13:2008



EUROPEAN STANDARD EN 60191-1 NORME EUROPÉENNE
EUROPÄISCHE NORM June 2007
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2007 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-1:2007 E
ICS 31.080.01
English version
Mechanical standardization of semiconductor devices -
Part 1: General rules for the preparation
of outline drawings of discrete devices (IEC 60191-1:2007)
Normalisation mécanique des dispositifs
à semi-conducteurs -
Partie 1: Règles générales
pour la préparation du dessin
des boîtiers des dispositifs
à semi-conducteurs (CEI 60191-1:2007)
Mechanische Normung
von Halbleiterbauelementen -
Teil 1: Allgemeine Regeln
für die Erstellung
von Gehäusezeichnungen
von Einzelhalbleiterbauelementen (IEC 60191-1:2007)
This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 60191-6-13:2008



EN 60191-1:2007
- 2 -
Foreword The text of document 47D/678/FDIS, future edition 2 of IEC 60191-1, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-1 on 2007-05-01. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2008-02-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2010-05-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60191-1:2007 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 60191-6 NOTE
Harmonized as EN 60191-6:2004 (not modified). __________
SIST EN 60191-6-13:2008



- 3 - EN 60191-1:2007 Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60191-2 + supplements + amendments 1966 Mechanical standardization of semiconductor devices -
Part 2: Dimensions - -
IEC 60191-4 -1) Mechanical standardization of semiconductor devices -
Part 4: Coding system and classification into forms of package outlines for semiconductor device packages EN 60191-4 199
...