EN 60749-37:2008
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d’un accéléromètre
La présente partie de la CEI 60749 fournit une méthode d'essai destinée à évaluer et comparer la performance de chute des composants à montage en surface dans des applications de produits électroniques portatifs dans un environnement d'essai accéléré, où une flexion excessive d'une carte de circuit imprimé provoque une défaillance de produit. Le but est de normaliser la carte d'essai et la méthodologie d'essai pour fournir une évaluation reproductible de la performance d'essai de chute des composants à montage en surface, en reproduisant les mêmes modes de défaillances que ceux observés normalement au cours d'un essai au niveau du produit.
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 37. del: Metoda preskušanja s padcem z namizne višine z uporabo pospeševalnika (IEC 60749-37:2008)
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2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008)Polprevodniški elementi - Mehanske in klimatske preskusne metode - 37. del: Metoda preskušanja s padcem z namizne višine z uporabo pospeševalnika (IEC 60749-37:2008)Dispositifs a semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d’un accélérometre (CEI 60749-37:2008)Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes (IEC 60749-37:2008)31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:SIST EN 60749-37:2008en,frTa slovenski standard je istoveten z:EN 60749-37:200801-junij-2008SIST EN 60749-37:2008SLOVENSKI
STANDARD
EUROPEAN STANDARD EN 60749-37 NORME EUROPÉENNE
EUROPÄISCHE NORM April 2008
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2008 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-37:2008 E
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods -
Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008)
Dispositifs à semiconducteurs -
Méthodes d'essais mécaniques
et climatiques -
Partie 37: Méthode d'essai
de chute au niveau de la carte
avec utilisation d’un accéléromètre (CEI 60749-37:2008)
Halbleiterbauelemente -
Mechanische und klimatische Prüfverfahren -
Teil 37: Prüfverfahren Fall
der Leiterplatte unter Verwendung
eines Beschleunigungs-Messgerätes (IEC 60749-37:2008)
This European Standard was approved by CENELEC on 2008-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
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Foreword The text of document 47/1937/FDIS, future edition 1 of IEC 60749-37, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-37 on 2008-03-01. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2008-12-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2011-03-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60749-37:2008 was approved by CENELEC as a European Standard without any modification. __________
- 3 - EN 60749-37:2008 Annex ZA(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60749-10 2002 Semiconductor devices - Mechanical and climatic test methods -
Part 10: Mechanical shock EN 60749-10 2002
IEC 60749-20 -1) Semiconductor devices - Mechanical and climatic test methods -
Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat EN 60749-20 20032)
IEC 60749-20-1 -3) Semiconductor devices - Mechanical and climatic test methods -
Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat - -
1) Undated reference. 2) Valid edition at date of issue. 3) At draft stage.
IEC 60749-37Edition 1.0 2008-01INTERNATIONAL STANDARD NORME INTERNATIONALESemiconductor devices – Mechanical and climatic test methods –
Part 37: Board level drop test method using an accelerometer
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –Partie 37: Méthode d’essai de chute au niveau de la carte avec utilisation d’un accéléromètre
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE RICS 31.080.01 PRICE CODECODE PRIXISBN 2-8318-9569-3
– 2 – 60749-37 © IEC:2008 CONTENTS FOREWORD.3 INTRODUCTION.5
1 Scope and object.6 2 Normative references.6 3 Terms and definitions.6 4 Test apparatus and components.7 4.1 Test apparatus.7 4.2 Test components.8 4.3 Test board.8 4.4 Test board assembly.8 4.5 Number of components and sample size.9 5 Test procedure.9 5.1 Test equipment and parameters.9 5.2 Pre-test characterization.10 5.3 Drop testing.12 6 Failure criteria and failure analysis.12 7 Summary.14
Annex A (informative)
Preferred board construction, material, design and layout.15
Bibliography.19
Figure 1 – Typical drop test apparatus and mounting scheme for PCB assembly.10 Figure 2 – Typical shock test half-sine pulse graphic and formulae.11 Figure 3 – Fundamental mode of vibration of PCB supported with four screws.14 Figure A.1 – Recommended test board size and layout.18
Table 1 – Quantity of test boards and components required for testing.9 Table 2 – Component locations for test boards.13 Table A.1 – Test board stack-up and material.15 Table A.2 – Mechanical property requirements for dielectric materials.16 Table A.3 – Recommended test board pad sizes and solder mask openings.17 Table A.4 – X, Y locations for components’ centre.18
60749-37 © IEC:2008 – 3 – INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 37: Board level drop test method using an accelerometer
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-37 has been prepared by IEC technical committee 47: Semiconductor devices. This standard cancels and replaces IEC/PAS 62050 published in 2004. This first edition constitutes a technical revision.
The text of this standard is based on the following documents: FDIS Report on voting 47/1937/FDIS 47/1948/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table.
– 4 – 60749-37 © IEC:2008 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 60749 series, under the general title Semiconductor devices – Mechanical and climatic test methods, can be found in the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed; • withdrawn; • replaced by a revised edition, or • amended.
60749-37 © IEC:2008 – 5 – INTRODUCTION Handheld electronic products fit into the consumer and portable market segments. Included in handheld electronic products are cameras, calculators, cell phones, cordless phones, pagers, palm size PCs, personal computer memory card international association (PCMCIA) cards, smart cards,
personal digital assistants (PDAs) and other electronic products that can be conveniently stored in a pocket and used while held in user’s hand. These handheld electronic products are more prone to being dropped during their useful service life because of their size and weight. This dropping event can not only cause mechanical failures in the housing of the device but also create electrical failures in the printed circuit board (PCB) assemblies mounted inside the housing due to transfer of energy through PCB supports. The electrical failures may result from various failure modes such as cracking of the circuit board, track cracking on the board, cracking of solder interconnections between the components and the board, and component cracks. The primary driver of these failures is excessive flexing of the circuit board due to input acceleration to the board created from dropping the handheld electronic product. This flexing of the board causes relative motion between the board and the components mounted on it, resulting in component, interconnect or board failures. The failure is a function of the combination of the board design, construction, material, thickness and surface finish; interconnect material and standoff height and component size. Correlation between test and field
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