EN 61076-4-115:2003
(Main)Connectors for electronic equipment - Part 4-115: Printed board connectors - Backplane connector for InfiniBand equipment
Connectors for electronic equipment - Part 4-115: Printed board connectors - Backplane connector for InfiniBand equipment
Describes a single-part hybrid connector, with a section for high-speed on a 3 mm grid and a low-speed section with power and ground connections on a 2 mm grid, for printed boards and backplanes in accordance with EN 60917-2-2
Steckverbinder für elektronische Einrichtungen - Teil 4-115: Steckverbinder für gedruckte Schaltungen - Rückplatten-Steckverbinder für InfiniBand-Geräte
Connecteurs pour équipements électroniques - Partie 4-115: Connecteurs pour cartes imprimées - Connecteur de fond de panier pour équipement InfiniBand
Décrit un connecteur hybride en une partie, avec une section pour connexions à débits élevés au pas de 3 mm et une section à bas débits avec contacts de puissance et continuité de masse au pas de 2 mm, pour cartes imprimées et fonds de panier selon la EN 60917-2-2
Konektorji za elektronsko opremo - 4-115. del: Konektorji za tiskane plošče - Konektorji za hrbtne plošče za opremo InfiniBand (IEC 61076-4-115:2003)
General Information
Standards Content (Sample)
SLOVENSKI SIST EN 61076-4-115:2004
STANDARD
november 2004
Konektorji za elektronsko opremo - 4-115. del: Konektorji za tiskane plošče -
Konektorji za hrbtne plošče za opremo InfiniBand (IEC 61076-4-115:2003)
Connectors for electronic equipment - Part 4-115: Printed board connectors -
Backplane connectors for InfiniBand equipment (IEC 61076-4-115:2003)
ICS 31.220.10 Referenčna številka
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
EUROPEAN STANDARD EN 61076-4-115
NORME EUROPÉENNE
EUROPÄISCHE NORM August 2003
ICS 31.220.10
English version
Connectors for electronic equipment
Part 4-115: Printed board connectors –
Backplane connector for InfiniBand equipment
(IEC 61076-4-115:2003)
Connecteurs pour équipements Steckverbinder für elektronische
électroniques Einrichtungen
Partie 4-115: Connecteurs pour cartes Teil 4-115: Steckverbinder für gedruckte
imprimées – Schaltungen –
Connecteur de fond de panier pour Rückplatten-Steckverbinder für
équipement InfiniBand InfiniBand-Geräte
(CEI 61076-4-115:2003) (IEC 61076-4-115:2003)
This European Standard was approved by CENELEC on 2003-05-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61076-4-115:2003 E
Foreword
The text of document 48B/1288/FDIS, future edition 1 of IEC 61076-4-115, prepared by SC 48B,
Connectors, of IEC TC 48, Electromechanical components and mechanical structures for electronic
equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as
EN 61076-4-115 on 2003-05-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-05-01
The International Electrotechnical Commission (IEC) and CENELEC draw attention to the fact that it is
claimed that compliance with this document may involve the use of a patent concerning
a) an electrical connector assembly for establishing electrical contact with contacting devices of
external terminals, e.g. with solder points of a circuit board;
b) an electrical connector assembly for establishing electrical contact with external terminals having
contacting devices with contact faces, e.g. with solder points of a circuit board;
c) an electrical connector assembly with an electrical connector having a connecting position and
contacting devices for establishing electrical contact between a first and a second printed circuit
board.
The IEC and CENELEC take no position concerning the evidence, validity and scope of this patent
right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences under
reasonable and non-discriminatory terms and conditions with applicants throughout the world. In this
respect, the statement of the holder of this patent right is registered with the IEC. Information may be
obtained from:
Tyco Electronics Cororation
PO Box 3608
Harrisburg, PA 17105-3608
USA
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights other than those identified above. IEC and CENELEC shall not be held responsible for
identifying any or all such patent rights.
Annexes designated "normative" are part of the body of the standard.
In this standard, annexes A, B and ZA are normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61076-4-115:2003 was approved by CENELEC as a
European Standard without any modification.
__________
- 3 - EN 61076-4-115:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance
IEC 60352-5 2001 Solderless connections EN 60352-5 2001
Part 5: Press-in connections - General
requirements, test methods and
practical guidance
IEC 60512 Series Connectors for electronic equipment - EN 60512 Series
Tests and measurements
Part 1: General
IEC 60512-1-100 2001 Connectors for electronic equipment - EN 60512-1-100 2001
Tests and measurements
Part 1-100: General - Applicable
publications
IEC 60917-2-2 1994 Modular order for the development of EN 60917-2-2 1996
mechanical structures for electronic
equipment practices
Part 2: Sectional specification -
Interface co-ordination dimensions for
the 25 mm equipment practice --
Section 2: Detail specification -
Dimensions for subracks, chassis,
backplanes, front panels and plug-in
units
IEC 61076-1 1995 Connectors with assessed quality, for EN 61076-1 1995
use in d.c., low frequency analogue and
in digital high-speed data applications
Part 1: Generic specification
IEC 61076-4 1995 Part 4: Sectional specification - Printed EN 61076-4 1996
board connectors
1)
EN 60068-1 includes corrigendum October 1998 + A1:1992 to IEC 60068-1.
Publication Year Title EN/HD Year
IEC 61076-4-001 1996 Part 4: Printed board connectors -- EN 61076-4-001 1996
Section 001: Blank detail specification
ISO 1302 2002 Geometrical Product Specifications EN ISO 1302 2002
(GPS) - Indication of surface texture in
technical product documentation
NORME CEI
INTERNATIONALE IEC
61076-4-115
INTERNATIONAL
Première édition
STANDARD
First edition
2003-02
Connecteurs pour équipements électroniques –
Partie 4-115:
Connecteurs pour cartes imprimées –
Connecteur de fond de panier
pour équipement InfiniBand
Connectors for electronic equipment –
Part 4-115:
Printed board connectors –
Backplane connector
for InfiniBand equipment
IEC 2003 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
XB
Commission Electrotechnique Internationale PRICE CODE
International Electrotechnical Commission
Международная Электротехническая Комиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue
61076-4-115 IEC:2003 – 3 –
CONTENTS
FOREWORD . 9
1 General data .15
1.1 Recommended method of mounting .15
1.2 Ratings and characteristics .17
1.3 Normative references.19
1.4 Marking .21
1.5 IEC type designation .21
1.6 Ordering information .21
2 Technical data .23
2.1 Definitions .23
2.2 Survey of styles and variants.25
2.3 Information on application .27
3 Dimensional information.35
3.1 General .35
3.2 Isometric view and common features.37
3.3 Mating information .43
3.4 Fixed connector .49
3.5 Plug-in card paddle .51
3.6 Mounting information for fixed connector .55
3.7 Mounting information for paddle-guard .57
3.8 Gauges.61
4 Characteristics.71
4.1 Climatic category .71
4.2 Electrical.71
4.3 Mechanical .77
4.4 High-speed characteristics .81
5 Test schedule .87
5.1 General .87
5.2 Test schedule tables .101
Annex A (normative) Test method for gauge supporting force .125
A.1 Object .125
A.2 Preparation of the specimen .125
A.3 Test equipment .125
A.4 Test method.125
A.5 Details to be specified .129
Annex B (normative) Test method for dust and fibre resistance.131
B.1 Object .131
B.2 Preparation of the specimen .131
B.3 Test equipment .131
B.4 Test method.133
61076-4-115 IEC:2003 – 5 –
Figure 1 – Press-in/compression method of mounting .15
Figure 2 – Example of a paddle-guard, to be mounted on the plug-in card paddle.27
Figure 3 – Designation of contacts on backplane for press-in/compression mounting .29
Figure 4 – Designation of contacts on component side.31
Figure 5 – Designation of contacts on solder side .31
Figure 6 – Low-speed section – Apertures in paddle-guard control engaging sequence .33
Figure 7 – Co-ordination dimensions.37
Figure 8 – Height dimensions and mounting pitch .39
Figure 9 – Width dimensions and mounting pitch .41
Figure 10 – Depth dimensions .41
Figure 11 – Contact range in relation to bow and insertion depth.43
Figure 12 – Allowed misalignment in height and width directions .45
Figure 13 – Allowed inclination in height and width directions (mated situation) .47
Figure 14 – Overall dimensions of style A and style C fixed connectors .49
Figure 15 – Detailed dimensions of the lead-in slot .49
Figure 16 – Position of the bifurcated contact beams in the mated condition.51
Figure 17 – Overall dimensions of paddle-guard .51
Figure 18 – Detailed dimensions of paddle-guard style I.53
Figure 19 – Footprint on backplane for press-in/compression mounted fixed connector .55
Figure 20 – Detailed dimensions of contact pads for high-speed and
shielding ground planes.57
Figure 21 – Detailed dimensions of contact pads for low-speed – example
for InfiniBand application .59
Figure 22 – Gauges for high-speed contacts in row a.61
Figure 23 – Gauges for high-speed contacts in row b.63
Figure 24 – Holder for test gauges for high-speed section.65
Figure 25 – Sizing gauge for low-speed contacts.67
Figure 26 – Test gauge for low-speed contacts .67
Figure 27 – Holder for test gauges for low-speed section .69
Figure 28 – Derating curve for differential pairs.73
Figure 29 – Derating curve for low-speed contacts.73
Figure 30 – Typical impedance profile, including pads and via-holes (example
for guidance only).81
Figure 31 – Superposition of typical near-end cross-talk curves
(example for guidance only).83
Figure 32 – Layout of plug-in card and backplane for one electromechanical
test specimen.89
Figure 33 – Layout of printed circuit boards for signal integrity validation.91
Figure 34 – Arrangement for measurement of contact resistance .93
Figure 35 – Fixture for dynamic stress tests.93
Figure 36 – Wiring arrangement for voltage proof and polarisation voltage .95
61076-4-115 IEC:2003 – 7 –
Figure 37 – Arrangement for gauge supporting force test on high-speed contacts .97
Figure 38 – Arrangement for sizing on low-speed contacts .99
Figure 39 – Arrangement for gauge supporting force test on low-speed contacts.99
Figure A.1 – Example of a test arrangement for supporting force verification.127
Table 1 – Number of contacts for fixed connector .17
Table 2 – Number of cavities for paddle guard .17
Table 3 – Survey of fixed connectors .25
Table 4 – Survey of paddle-guards .25
Table 5 – Survey of terminations to the backplane .25
Table 6 – Survey of paddle-guard variants .25
Table 7 – Co-ordination dimensions and common features.39
Table 8 – Climatic category .71
Table 9 – Creepage and clearance distances.71
Table 10 – Rated impulse voltages .71
Table 11 – Rated insulation voltages .71
Table 12 – Maximum contact resistances.75
Table 13 – Minimum insulation resistances .75
Table 14 – Maximum engaging and separating forces .77
Table 15 – Vibration .77
Table 16 – Shock .79
Table 17 – Propagation delay skew.85
Table 18 – Number of specimens for inspection and electromechanical test sequence .87
Table 19 – Group P – Preliminary testing sequence .101
Table 20 – Group A – Dynamic/Climatic testing sequence.103
Table 21 – Group B – Mechanical endurance testing sequence .107
Table 22 – Group C – Moisture testing sequence .111
Table 23 – Group D – Electrical load testing sequence.115
Table 24 – Group E – Mechanical resistivity testing sequence.117
Table 25 – Group F – Dust testing sequence .119
Table 26 – Group G – High-speed performance testing sequence .121
61076-4-115 IEC:2003 – 9 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
CONNECTORS FOR ELECTRONIC EQUIPMENT –
Part 4-115: Printed board connectors –
Backplane connector
for InfiniBand equipment
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed that compliance
with this document may involve the use of a patent concerning
a) an electrical connector assembly for establishing electrical contact with contacting devices of external terminals,
e.g. with solder points of a circuit board;
b) an electrical connector assembly for establishing electrical contact with external terminals having contacting devices
with contact faces, e.g. with solder points of a circuit board;
c) an electrical connector assembly with an electrical connector having a connecting position and contacting
devices for establishing electrical contact between a first and a second printed circuit board.
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences under reasonable and
non-discriminatory terms and conditions with applicants throughout the world. In this respect, the statement of the
holder of this patent right is registered with IEC. Information may be obtained from:
Tyco Electronics Corporation
PO Box 3608
Harrisburg, PA 17105-3608
USA
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights
other than those identified above. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61076-4-115 has been prepared by subcommittee 48B: Connectors,
of IEC technical committee 48: Electromechanical components and mechanical structures for
electronic equipment.
This standard cancels and replaces IEC/PAS 61076-4-115 published in 2001. This first edition
constitutes a technical revision.
61076-4-115 IEC:2003 – 11 –
The text of this standard is based on the following documents:
FDIS Report on voting
48B/1288/FDIS 48B/1308/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated when a new edition is prepared.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until 2007.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
61076-4-115 IEC:2003 – 13 –
CONNECTORS FOR ELECTRONIC EQUIPMENT –
Part 4-115: Printed board connectors –
Backplane connector
for InfiniBand equipment
IEC SC 48B – Connectors
Electronic components of assessed quality in accordance Blank detail specification:
with IEC 61076-1:1995
IEC 61076-4-001:1996
Single-part hybrid connector, with
a section for high-speed on a 3 mm
grid and a low-speed section with
power and ground connections on
a 2 mm grid,
for printed boards and backplanes
in accordance with IEC 60917-2-2.
Hybrid connector having one section
containing 2 rows of 12 contact pairs for
differential pair transmission on a 3 mm
pitch
and one section with 1 row of 18
contacts for low-speed and power
connections on a 2 mm pitch.
The fixed connectors are 50 mm high,
pressed-in or surface mount soldered
onto the backplane.
The plug-in card interface is protected
by a paddle-guard.
Performance levels (PL): 1
IEC 684/03
Information on the availability of components qualified to this detail specification is given in the qualified
product list.
61076-4-115 IEC:2003 – 15 –
1 General data
1.1 Recommended method of mounting
Three methods of mounting to the backplane may be adopted.
a) Press-in/compression connections
The fixed connector is pressed-in onto the backplane, using 18 press-in low-speed
connections and four press-in pins.
The high-speed contacts to the backplane use compression connections. See Figure 1.
18 press-in connections
48 compression
connections
4 press-in
retention pins
IEC 685/03
Figure 1 – Press-in/compression method of mounting
b) Press-in connections only
Under consideration.
c) Surface mount soldered connections
Under consideration.
The plug-in card has an extension in the form of a paddle, with contact pads for compression
connections. The paddle shall be protected by a paddle-guard, which may be removable or
permanently mounted.
61076-4-115 IEC:2003 – 17 –
Number of contacts and contact cavities
Table 1 – Number of contacts for fixed connector
Styles Number of I/O channels Differential pairs Low-speed contacts
A 4 x I/O channels 4 + 4 18
C 12 x I/O channels 12 + 12 18
Table 2 – Number of cavities for paddle guard
Styles Cavities for differential pair entries Cavities for low-speed entries
I 12 + 12 18
1.2 Ratings and characteristics
High-speed section
Compression connections bifurcated contacts with independently operating beams
Creepage and clearance 0,3 mm min. between contacts mutually and ground
Rated voltage within same pair 100 V r.m.s.
pair to ground 100 V r.m.s.
Current rating 0,25 A per contact pair at 70 °C (all contacts loaded)
Insulation resistance 1 GΩ min.
Differential impedance 100 Ω ± 10 Ω at 100 ps risetime in the connector
Low-speed section
Compression connections bifurcated contacts with independently operating beams
Creepage and clearance 0,8 mm min. between contacts mutually and ground
Rated voltage contact/contact 500 V r.m.s.
contact to ground 500 V r.m.s.
Current rating 2,5 A per contact at 70 °C (all contacts loaded)
Insulation resistance 5 GΩ min.
Printed board thickness range for use with same fixed connector
= 1,44 mm to 2,64 mm
thickness range for a given paddle-guard
= ± 10 % of nominal thickness
Backplane 1,6 mm min.
plated-through press-in hole for low-speed connections
= ∅ 0,6 mm ± 0,05 mm
press-in hole diameter for fixed connector retention pins
= ∅ 1 mm +0,09/–0,06 mm
61076-4-115 IEC:2003 – 19 –
1.3 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60352-5:2001, Solderless connections – Part 5: Press-in connections – General require-
ments, test methods and practical guidance
IEC 60512 (all parts), Connectors for electronic equipment – Tests and measurements
IEC 60512-1-100:2001, Connectors for electronic equipment – Tests and measurements –
Part 1-100: General – Applicable publications
IEC 60917-2-2:1994: Modular order for the development of mechanical structures for electronic
equipment practices – Part 2: Sectional specification – Interface co-ordination dimensions for
the 25 mm equipment practice – Section 2: Detail specification – Dimensions for subracks,
chassis, backplanes, front panels and plug-in units
IEC 61076-1:1995, Connectors with assessed quality, for use in d.c. low frequency analogue
and digital high-speed data applications – Part 1: Generic specification
IEC 61076-4:1995, Connectors with assessed quality, for use in d.c., low-frequency analogue
and in digital high-speed data applications – Part 4: Sectional specification – Printed board
connectors
IEC 61076-4-001:1996, Connectors with assessed quality, for use in d.c., low-frequency
analogue and in digital high-speed data applications – Part 4: Printed board connectors –
Section 001: Blank detail specification
ISO 1302:2002, Geometrical Product Specifications (GPS) – Indication of surface texture in
technical product documentation
61076-4-115 IEC:2003 – 21 –
1.4 Marking
The marking of the connector and the package shall be in accordance with 2.6 of IEC 61076-4.
1.5 IEC type designation
See 2.1 for definitions and 2.2 for designation of styles and variants. The designation shall be
derived in accordance with 2.5 of IEC 61076-4.
IEC 61076-4-115 - L N N N N - L L - N N
|| | | | | ↓
|| | | | |
1 Performance level
| | | | | |
Contact finish
Styles ↓ | | | | ↓
4 × I/O channels A | | | | 1 Gold or gold alloy
12 × I/O channels C | | | | 2 Palladium/nickel
Paddle-guard InfiniBand | | | | + gold flash
I
| | | |
| | | |
Number of high-speed Style of termination
contacts ↓ | | ↓ low-speed
4 + 4 differential pairs 16 | | P Press-in connection
12 + 12 differential pairs | | Surface mount soldered
48 S
| |
Number of low-speed | | Style of termination
↓ ↓
contacts high-speed
18 contacts 18 C Compression mount
Press-in connection
P
Surface mount soldered
S
NOTE “L” stands for letter; “N” stands for number.
Example for fixed connector
A style C fixed connector, press-in/compression mounted, with 2 × 12 differential pairs and 18
low-speed contacts, gold plated, meeting performance level 1, is designated as follows:
IEC 61076-4-115 – C4818 – CP – 11
Example for paddle-guard
A style I paddle-guard, with apertures for 2 × 12 differential pairs and 18 low-speed contacts,
meeting performance level 1, is designated as follows:
IEC 61076-4-115 – I4818 – CP – 11
1.6 Ordering information
For ordering connectors according to this detail specification, the IEC type designation
described in 1.5 shall be used.
61076-4-115 IEC:2003 – 23 –
2 Technical data
2.1 Definitions
For the purpose of this part of IEC 61076, the following definitions apply.
2.1.1 Mechanical features
paddle-guard – Protective plastic glove that covers the milled edges of the board paddle at the
plug-in unit. It is a robust and accurate interface to the fixed connector; it aligns the contact
beams to the pads and activates the mating movement of the high-speed section during
insertion and withdrawal of the plug-in unit.
2.1.2 Contacts and terminations
contact range – The range from minimum to maximum distance between the reference planes
of the fixed and free boards, within which the specified contact resistance is met.
contact beam – Part of the contact that makes the contact to the pad on the board, this part is
usually plated and shaped like the back of a spoon.
compression connection – Solderless connection between a contact beam and a contact pad
on the board, accomplished through a specific pressure in the contact area, generated by a
continuous compression force and a spherical shape of the beam.
dual compression connection – Connection between a bifurcated contact beams and one
contact pad on the board.
2.1.3 Engagement sequence
contact level – set of contacts which engage/separate simultaneously, taking the accuracy
required by the engaging sequence into account.
engaging sequence – given order of engagement/separation of contacts belonging to different
contact levels, which assures that all contacts of a given level do close/open after the previous
level and before the next level.
61076-4-115 IEC:2003 – 25 –
2.2 Survey of styles and variants
2.2.1 Styles of connectors
Table 3 – Survey of fixed connectors
Style Colour I/O Channels Length
A Black 4 50 mm
C Blue 12 50 mm
Table 4 – Survey of paddle-guards
Style Engagement sequence low-speed
I InfiniBand configuration (see 3.7.2)
2.2.2 Styles of termination
Termination to the backplane
Table 5 – Survey of terminations to the backplane
Method of mounting Section Style of termination Dimensions
High-speed Dual compression connection –
Press-in/compression
Press-in connection,
∅ 0,6 mm ± 0,05 mm
Low-speed
according to IEC 60352-5
High-speed Under consideration Under consideration
Press-in only
Press-in connection,
Low-speed
∅ 0,6 mm ± 0,05 mm
according to IEC 60352-5
High-speed Under consideration –
Surface mount soldered
Low-speed Under consideration –
Termination to the plug-in card
All bifurcated contacts shall make a dual compression connection to the contact pads at the
plug-in card.
2.2.3 Variants of the paddle-guard
Thickness of the plug-in card
Table 6 – Survey of paddle-guard variants
Variant Thickness of plug-in card Tolerance range on thickness
1 1,6 mm 1,44 mm – 1,76 mm
2 2 mm 1,8 mm – 2,2 mm
3 2,4 mm 2,16 mm – 2,64 mm
61076-4-115 IEC:2003 – 27 –
2.3 Information on application
2.3.1 Description of the connector
The connector is basically a one-part fixed connector, mounted on the backplane.
On the plug-in card however, a paddle-guard shall be applied.
Only the outer features and characteristics of the paddle-guard that determine the interface to
the fixed connector are a normative part of this specification.
The footprint and the plating of the contact pads on the plug-in card are equally important for
the functionality of the interface and are also a normative part of this specification.
Details about the shape of the plug-in card paddle and the features needed for paddle-guard
assembly are however shown for guidance and as an example for information only.
IEC 686/03
Figure 2 – Example of a paddle-guard, to be mounted on the plug-in card paddle
The two sections in the connector
The high-speed and the low-speed sections have different characteristics and test programs.
Their mechanical features and connection technologies are basically different.
High-speed section
The high-speed contact pairs are mounted in an electrically conductive shell. The insertion of
the plug-in unit pushes the shell towards the paddle-guard. With this movement, the bifurcated
contact beams enter the apertures in the paddle-guard and make a dual wiping compression
contact to the pads on the component side of the plug-in card.
Withdrawal of the plug-in unit pulls the shell back from the paddle-guard and makes all contact
pairs lift off and leave the apertures of the paddle-guard.
Cams on the paddle-guard and on the shell drive the movement of the shell.
61076-4-115 IEC:2003 – 29 –
Low-speed section
The low speed contacts operate similarly to card-edge connections. However, instead of
opening the contact beams with the edge of the plug-in card, the smooth edge of the paddle-
guards lifts the bifurcated contact beams over the edge to let them sink into the apertures and
make a dual wiping compression connection to the pads on the solder side of the plug-in card.
The staged length of the apertures controls the engaging sequence of the low-speed
connections (see 2.3.3).
Plug-in card thickness
The fixed connector is capable of mating with a range of plug-in card thicknesses.
The reference plane of the plug-in unit – the component side – shall always remain in the same
position, the difference in thickness must be made up by the flexibility of the low-speed
contacts.
The outer dimensions of the paddle-guard remain the same for the whole range of card
thicknesses, only the depth of the apertures for the low-speed connections varies according to
the chosen card thickness.
2.3.2 Contact designation
2.3.2.1 Contact designation on the backplane
a) Press-in/compression mounted fixed connector
Datum plane
Component side
of plug-in card
Press-in
mounting hole
Enveloppe of
connector housing
IEC 687/03
Figure 3 – Designation of contacts on backplane
for press-in/compression mounting
61076-4-115 IEC:2003 – 31 –
b) Press-in mounted fixed connector
Under consideration.
c) Surface mount soldered fixed connector
Under consideration.
2.3.2.2 Contact designation on plug-in card
a) Component side of the plug-in card
ax01
bx01
ay01
sa01
by01
sb02
sb11
sa11
bx12
ax12
by12
ay12
IEC 688/03
Figure 4 – Designation of contacts on component side
b) Solder side of the plug-in card
z01
z18
IEC 689/03
Figure 5 – Designation of contacts on solder side
61076-4-115 IEC:2003 – 33 –
2.3.3 Arrangement of contact levels
In the high-speed section, all connections operate simultaneously. Connections are made no
earlier than 2,3 mm before full insertion; reliable connection is achieved no later than 1,7 mm
before full insertion.
In the low-speed sections, the connections may operate in four different levels, staged by
a minimum of 1,5 mm.
IEC 690/03
Figure 6 – Low-speed section – Apertures in paddle-guard control engaging sequence
Potential inclination of the incoming plug-in unit shall be taken into account when assigning
contact positions to the different contact levels, in order to avoid mismatch in the engaging
sequence.
2.3.4 Polarisation and keying
The shape of the card slot in the fixed connector will prevent all wrong engagement. No keying
features are provided.
2.3.5 Mounting on backplane
Three alternative methods of mounting to the backplane may be adopted.
a) Press-in/compression connections
The high-speed connections to the backplane are made by bifurcated compression
contacts. During the lifetime of the interconnection, the press-in attachment to the
backplane shall support a reliable pressure on these contacts.
On one side the fixed connector housing is attached to the backplane by 4 metal pins,
pressed into plated-through holes, and by the 18 low-speed press-in terminations on the
other side.
After provisional placement on the backplane, multiple fixed connectors may be pressed-in
simultaneously using a flat rock press-in tool.
b) Press-in connections only
Under consideration.
c) Surface mount soldered connections
Under consideration.
61076-4-115 IEC:2003 – 35 –
2.3.6 Mounting on the plug-in card
The paddle-guard shall be rigidly fixed to the plug-in card paddle, in such a way that the gap
between the surface of the board and the slot in the paddle-guard does not exceed 0,1 mm on
the component side (datum C).
3 Dimensional information
3.1 General
Original dimensions are in millimetres and all dimensions on the drawings and tables are in
millimetres.
All drawings are shown in first angle projection.
The shape of the parts may deviate from the one given in the drawings, as long as the
specified dimensions are not affected and the intended functionality is provided.
Dimensions not specified may be chosen according to required characteristics and intended use.
61076-4-115 IEC:2003 – 37 –
3.2 Isometric view and common features
IEC 691/03
Key
See Table 7.
NOTE For guidance the reference planes are shown in accordance with IEC 60917-2-2.
Figure 7 – Co-ordination dimensions
61076-4-115 IEC:2003 – 39 –
3.2.1 Common features
Table 7 – Co-ordination dimensions and common features
Dimension Feature description
H 50 mm Maximum overall height of the fixed connector
D 30 mm Maximum overall depth of the fixed connector
D 0 Depth co-ordination dimension: tip of paddle-guard stops at backplane
ref.
D 0 to 1,5 mm Contact range
range
W 20 mm Overall width of fixed connector
3.2.2 Height dimensions
Envelope of plug-in unit
(when no connector in this position)
IEC 692/03
NOTE For guidance, the reference planes are shown in accordance with IEC 60917-2-2.
Figure 8 – Height dimensions and mounting pitch
50 max.
61076-4-115 IEC:2003 – 41 –
3.2.3 Width dimensions
11,6 max.
8,6 max.
IEC 693/03
NOTE For guidance, the reference planes are shown in accordance with IEC 60917-2-2.
Figure 9 – Width dimensions and mounting pitch
3.2.4 Depth dimensions
IEC 694/03
NOTE For guidance, the reference planes are shown in accordance with IEC 60917-2-2.
Figure 10 – Depth dimensions
61076-4-115 IEC:2003 – 43 –
3.3 Mating information
3.3.1 Engaging direction
Contact range
In the equipment practice the reference plane depth is the front face of the backplane.
On the plug-in unit, it is the tip of the paddle-guard.
On full insertion, the tip of the paddle-gua
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