EN IEC 61189-2-808:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-808: Thermischer Widerstand der dielektrischen Schicht durch thermische transiente Methode

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures et assemblages d'interconnexion - Partie 2-808 : Résistance thermique d'un assemblage par la méthode du transitoire thermique

L’IEC 61189-2-808:2024 décrit la méthode du transitoire thermique pour caractériser la résistance thermique d'un assemblage constitué d'une source de chaleur (par exemple, un dispositif de puissance), d'un matériau de fixation (par exemple, une brasure) et d'une couche diélectrique avec électrode. Cette méthode permet de déterminer la résistance thermique des matériaux et des méthodes d'assemblage ainsi que d'optimiser le flux thermique vers un dissipateur thermique. NOTE: Cette méthode n’est toutefois pas destinée à mesurer et à spécifier la valeur de la résistance thermique d'un matériau diélectrique. Il existe d’autres normes à cet effet. Des exemples sont donnés à l'Annexe A.

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-808. del: Meritev toplotne upornosti sestava z metodo toplotnega prehajanja

General Information

• Status: Published
• Publication Date: 30-May-2024
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 31-May-2024
• Completion Date: 31-May-2024
• Ref Project: kSIST fprEN IEC 61189-2-808:2024 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

Standards Content (Sample)

SLOVENSKI STANDARD
oSIST prEN IEC 61189-2-808:2023
01-april-2023
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-808. del: Meritev toplotne upornosti sestava z metodo
toplotnega prehajanja
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient
method
Ta slovenski standard je istoveten z: prEN IEC 61189-2-808:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
oSIST prEN IEC 61189-2-808:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN IEC 61189-2-808:2023

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oSIST prEN IEC 61189-2-808:2023


91/1833/CDV

COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61189-2-808 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2023-02-10 2023-05-05
SUPERSEDES DOCUMENTS:
91/1767/CD, 91/1830/CC

IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:


Other TC/SCs are requested to indicate their interest, if
any, in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft
for Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of
• any relevant patent rights of which they are aware and to provide supporting documentation,
• any relevant “in some countries” clauses to be included should this proposal proceed. Recipients are
reminded that the enquiry stage is the final stage for submitting "in some countries" clauses. See
AC/22/2007.

TITLE:
Test methods for electrical materials, printed board and other interconnection structures and
assemblies – Part 2-808: Thermal resistance of an assembly by thermal transient method

PROPOSED STABILITY DATE: 2028

NOTE FROM TC/SC OFFICERS:


Copyright © 2022 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to
download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National
Committee positions. You may not copy or "mirror" the file or printed version of the document, or any part of it,
for any other purpose without permission in writing from IEC.

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oSIST prEN IEC 61189-2-808:2023
IEC CDV 61189-2-808 © IEC 2022 -2- 91/1833/CDV

1 CONTENTS
2
3 1 FOREWORD . 3
4 1 Scope . 5
5 2 Normative references . 5
6 3 Terms and Definitions . 5
7 4 Objective . 5
8 5 Test specimen . 5
9 6 Test equipment and procedures . 6
10 7 Test result . 8
11 8 Report . 9
12 9 Bibliographies. 9
13 Annex A . 10
14 Annex B . 12
15 B.1 Test specimen . 12
16 B.2 Die attach materials .
...