Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).

Umweltprüfungen - Teil 2: Prüfungen - Prüfgruppe T: Löten

Essais fondamentaux climatiques et de robustesse mécanique - Partie 2: Essais - Essai T: Soudure

Décrit les modes opératoires des essais de "soudabilité" applicables aux sorties par fils ou par cosses (Ta), ou aux cartes de circuits imprimés (Tc) : décrit les essais de résistance à la chaleur de soudage, applicables aux composants (Tb).

Basic environmental testing procedures - Part 2: Tests - Test T: Soldering

General Information

Status
Withdrawn
Publication Date
01-Dec-1988
Drafting Committee
Parallel Committee
Current Stage
6060 - Document made available
Due Date
02-Dec-1988
Completion Date
02-Dec-1988

RELATIONS

Buy Standard

Standardization document
HD 323.2.20 S3:2003
English language
31 pages
sale - 10%
Preview
sale - 10%
Preview

Standards Content (sample)

SLOVENSKI SIST HD 323.2.20 S3:2003
STANDARD
julij 2003
Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
ICS 19.040 Referenčna številka
SIST HD 323.2.20 S3:2003(en)
© S
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.