EN IEC 60191-1:2018

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

IEC 60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. This edition includes the following significant technical changes with respect to the previous edition: a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8; b) a definition of the term "stand-off" has been added; c) the methods for locating the datum have been extended to be suitable for SMD-packages; d) the visual identification of terminal position one for automatic handling has been clarified; e) the rules for the drawing of terminals have been clarified; f) Table A.1 has been completed with symbols specifically for SMD-packages; g) Annex B "Standardization philosophy" has been deleted; h) a normative Annex with special rules for SMD-packages has been added; i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.

Mechanische Normung von Halbleiterbauelementen - Teil 1: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von Einzelhalbleiterbauelementen

Normalisation mécanique des dispositifs à semi-conducteurs - Partie 1: Règles générales pour la préparation des dessins d'encombrement des dispositifs discrets

L’IEC 60191-1:2018 donne des lignes directrices pour la préparation des dessins d’encombrement des dispositifs discrets, comprenant les dispositifs discrets à semiconducteurs pour montage en surface dont le nombre de connexions est inférieur à 8. Il convient également de se référer à l’IEC 60191-6 pour la préparation des dessins d’encombrement des dispositifs discrets pour montage en surface dont le nombre de connexions est supérieur ou égal à 8. L’objectif principal de ces dessins consiste à indiquer l’espace à octroyer aux dispositifs dans un équipement, ainsi que d’autres caractéristiques dimensionnelles exigées pour assurer une interchangeabilité mécanique. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
le domaine d’application a été étendu pour couvrir les dispositifs à semiconducteurs pour montage en surface dont le nombre de connexions est inférieur à 8;
une définition du terme "élévation" a été ajoutée;
les méthodes de positionnement de la référence spécifiée ont été étendues pour englober les boîtiers des composants pour montage en surface (CMS);
l’identification visuelle de la position de broche no 1, dans le cadre des procédures de manipulation automatique, a été clarifiée;
les règles de représentation des broches ont été clarifiées;
le Tableau A.1 a été complété avec des symboles spécifiquement destinés aux boîtiers CMS;
l’Annexe B "Concept de normalisation" a été supprimée;
une annexe normative avec des règles spécifiques aux boîtiers CMS a été ajoutée;
les exemples de dessins de dispositifs à semiconducteurs ont été alignés sur l’état de l’art des boîtiers, en englobant les boîtiers CMS.

Standardizacija mehanskih lastnosti polprevodniških elementov - 1. del: Splošna pravila za pripravo tehničnih risb diskretnih elementov (IEC 60191-1:2018)

Ta del standarda IEC 60191 podaja smernice za pripravo tehničnih risb diskretnih elementov, vključno z diskretnimi površinsko nameščenimi polprevodniškimi elementi z manj kot 8 vodili.
Za pripravo tehničnih risb površinsko nameščenih diskretnih elementov z 8 ali več vodili se uporablja tudi standard IEC 60191-6.
Glavni cilj tehničnih risb je prikaz prostora, ki je namenjen elementom v opremi, ter drugih dimenzijskih lastnosti, ki so potrebne za zagotavljanje mehanske medsebojne zamenljivosti.
Za zagotavljanje popolne medsebojne zamenljivosti je treba upoštevati tudi druge dejavnike, kot so električne in toplotne lastnosti zadevnih polprevodniških elementov.
Mednarodna standardizacija, ki jo prikazujejo te risbe, spodbuja proizvajalce elementov k upoštevanju prikazanih toleranc na risbah, da lahko razširijo bazo svojih strank na mednarodni ravni. Prav tako pomeni zagotovilo razvijalcem opreme o mehanski medsebojni zamenljivosti elementov dobaviteljev iz različnih držav, če v svoji opremi namenijo prostor, kot je označeno na risbah, in upoštevajo podrobnejše informacije o podnožjih, stojnih vijakih itd.
OPOMBA: Dodatne podrobnosti glede referenčnih črkovnih oznak, ki se uporabljajo v tem dokumentu, so podane v dodatku A.

General Information

• Status: Published
• Publication Date: 29-Mar-2018
• Withdrawal Date: 26-Feb-2021
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 30-Mar-2018
• Completion Date: 30-Mar-2018
• Ref Project: SIST EN IEC 60191-1:2018 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018)

Relations

• Replaces: EN 60191-1:2007 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
• Effective Date: 01-Nov-2016

Standards Content (Sample)

SLOVENSKI STANDARD
01-junij-2018
1DGRPHãþD
SIST EN 60191-1:2008
6WDQGDUGL]DFLMDPHKDQVNLKODVWQRVWLSROSUHYRGQLãNLKHOHPHQWRYGHO6SORãQD
SUDYLOD]DSULSUDYRWHKQLþQLKULVEGLVNUHWQLKHOHPHQWRY,(&
Mechanical standardization of semiconductor devices - Part 1: General rules for the
preparation of outline drawings of discrete devices (IEC 60191-1:2018)
Mechanische Normung von Halbleiterbauelementen - Teil 1: Allgemeine Regeln für die
Erstellung von Gehäusezeichnungen von Einzelhalbleiterbauelementen (IEC 60191-
1:2018)
Normalisation mécanique des dispositifs à semi-conducteurs - Partie 1: Règles
générales pour la préparation des dessins d'encombrement des dispositifs discrets (IEC
60191-1:2018)
Ta slovenski standard je istoveten z: EN IEC 60191-1:2018
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60191-1

NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2018
ICS 31.080.01 Supersedes EN 60191-1:2007
English Version
Mechanical standardization of semiconductor devices - Part 1:
General rules for the preparation of outline drawings of discrete
devices
(IEC 60191-1:2018)
Normalisation mécanique des dispositifs à semi- Mechanische Normung von Halbleiterbauelementen - Teil
conducteurs - Partie 1: Règles générales pour la 1: Allgemeine Regeln für die Erstellung von
préparation des dessins d'encombrement des dispositifs Gehäusezeichnungen von Einzelhalbleiterbauelementen
discrets (IEC 60191-1:2018)
(IEC 60191-1:2018)
This European Standard was approved by CENELEC on 2018-02-27. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60191-1:2018 E

European foreword
The text of document 47D/886/CDV, future edition 3 of IEC 60191-1, prepared by IEC/SC 47D
"Semiconductor devices packaging, of IEC technical committee 47: Semiconductor devices" was
submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 60191-1:2018.

The following dates are fixed:
(dop) 2018-11-27
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2021-02-27
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60191-1:2007.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60191-1:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60191-6 (series) NOTE Harmonized as EN 60191-6 (series).
ISO 5459:2011 NOTE Harmonized as EN ISO 5459:2011 (not modified).
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60191-2 -  Mechanical standardization of - -
semiconductor devices - Part 2:
Dimensions
IEC 60191-4 -  Mechanical standardization of EN 60191-4 -
semiconductor devices - Part 4: Coding
system and classification into forms of
package outlines for semiconductor device
packages
IEC 60191-6-1 -  Mechanical standardization of EN 60191-6-1 -
semiconductor devices - Part 6-1: General
rules for the preparation of outline
drawings of surface mounted
semiconductor device packages - Design
guide for gull-wing lead terminals
IEC 60191-6-3 -  Mechanical standardization of EN 60191-6-3 -
semiconductor devices - Part 6-3: General
rules for the preparation of outline
drawings of surface mounted
semiconductor device packages -
Measuring methods for package
dimensions of quad flat packs (QFP)
IEC 60191-6-20 -  Mechanical standardization of EN 60191-6-20 -
semiconductor devices - Part 6-20:
General rules for the preparation of outline
drawings of surface mounted
semiconductor device packages -
Measuring methods for package
dimensions of small outline J-lead
packages (SOJ)
IEC 60191-6-21 -  Mechanical standardization of EN 60191-6-21 -
semiconductor devices - Part 6-21:
General rules for the preparation of outline
drawings of surface mounted
semiconductor device packages -
Measuring methods for package
dimensions of small outline packages
(SOP)
IEC 60191-1 ®
Edition 3.0 2018-01
INTERNATIONAL
STANDARD
Mechanical standardization of semiconductor devices –

Part 1: General rules for the preparation of outline drawings of discrete devices

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-5266-6

– 2 – IEC 60191-1:2018  IEC 2018
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 General rules for all drawings . 8
4.1 Drawing layout . 8
4.2 Dimensions and tolerances . 9
4.3 Methods for locating the datum . 10
4.4 Numbering of terminals . 11
4.4.1 General . 11
4.4.2 Single-ended devices with terminals in a linear array . 11
4.4.3 Single-ended devices with terminals in a circular array . 11
4.4.4 Double-ended devices . 11
4.4.5 Devices with terminals disposed in a square or rectangular periphery . 11
4.4.6 Particular case of lozenge – shaped bases . 11
4.4.7 Other devices . 12
5 Additional rules . 12
5.1 Rules for device and case outline drawings . 12
5.2 Rules to specify the dimensions and positions of terminals . 13
5.2.1 General rules . 13
5.2.2 Rules to specify the dimensions and the positions of the terminals on a
base drawing . 13
5.3 Rules for gauge drawings . 13
6 Inter-conversion of inch and millimetre dimensions and rules for rounding off . 14
7 Rules for coding . 14
Annex A (informative) Reference letter symbols . 15
Annex B (informative) Rules to specify the dimensions and positions of terminals on a
base drawing . 18
B.1 Example of dimensioning for a circular base outline with no tab and having
four terminals located symmetrically on a pitch circle . 18
B.1.1 Interpretation of the principle of dimensioning . 18
B.1.2 Checking . 19
B.2 Example of dimensioning for a circular base outline with a tab and having
four terminals located symmetrically on a pitch circle . 19
B.2.1 Interpretation of the principle of dimensioning . 19
B.2.2 Checking . 20
Annex C (normative) General philosophy of flat base devices . 24
Annex D (normative) Special rules for SMD-packages . 26
D.1 General reference . 26
D.2 Lead terminals . 26
D.3 Measuring methods . 26
Annex E (informative) Examples of semiconductor device drawings . 27
Annex F (informative) Former rules for rounding off . 33
F.1 Toleranced dimensions . 33
F.1.1 Maximum and minimum values of toleranced dimensions . 33
F.1.2 Nominal value of toleranced dimensions . 33

IEC 60191-1:2018 © IEC 2018 – 3 –
F.2 Untoleranced dimensions (maximum only or minimum only) . 33
F.3 Untoleranced nominal dimensions given for general information . 33
F.4 Untoleranced nominal dimensions given to specify true geometrical positions . 34
Annex G (informative) Former rules for coding . 35
G.1 General . 35
G.2 Device outlines . 35
G.3 Bases . 35
G.4 Case outlines . 35
G.5 Type variants and provisional drawings . 35
Bibliography . 36

Figure 1 – Numbering of terminals for the particular case of lozenge – shaped bases . 12
Figure 2 – System to indicate the dimensions of the terminals . 13
Figure B.1 – Circular base outline with no tab .
...