EN IEC 60747-16-7:2023

Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators

This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit attenuators.

Halbleiterbauelemente - Teil 16-7: Integrierte Mikrowellenschaltkreise - Dämpfungsglieder

Dispositifs à semiconducteurs - Partie 16-7: Circuits intégrés hyperfréquences - Atténuateurs

L’IEC 60747-16-7:2022 spécifie la terminologie, les valeurs assignées et caractéristiques essentielles, et les méthodes de mesure des atténuateurs des circuits intégrés hyperfréquences.

Polprevodniški elementi - 16-7. del: Mikrovalovna integrirana vezja - Blažilniki (IEC 60747-16-7:2022)

Ta del standarda IEC 60747 določa terminologijo, bistvene vrednosti in lastnosti ter merilne metode za blažilnike mikrovalovnih integriranih vezij.

General Information

• Status: Published
• Publication Date: 12-Jan-2023
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/SC 47E - IEC_SC_47E
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 13-Jan-2023
• Completion Date: 13-Jan-2023
• Ref Project: SIST EN IEC 60747-16-7:2023 - Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 60747-16-7:2022)

Standards Content (Sample)

SLOVENSKI STANDARD
01-marec-2023
Polprevodniški elementi - 16-7. del: Mikrovalovna integrirana vezja - Blažilniki (IEC
60747-16-7:2022)
Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC
60747-16-7:2022)
Halbleiterbauelemente - Teil 16-7: Integrierte Mikrowellenverstärker - Schaltungsdämpfer
(IEC 60747-16-7:2022)
Dispositifs à semiconducteurs - Partie 16-7: Circuits intégrés hyperfréquences -
Atténuateurs (IEC 60747-16-7:2022)
Ta slovenski standard je istoveten z: EN IEC 60747-16-7:2023
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60747-16-7

NORME EUROPÉENNE
EUROPÄISCHE NORM January 2023
ICS 31.080.99
English Version
Semiconductor devices - Part 16-7: Microwave integrated
circuits - Attenuators
(IEC 60747-16-7:2022)
Dispositifs à semiconducteurs - Partie 16-7: Circuits Halbleiterbauelemente - Teil 16-7: Integrierte
intégrés hyperfréquences - Atténuateurs Mikrowellenverstärker - Schaltungsdämpfer
(IEC 60747-16-7:2022) (IEC 60747-16-7:2022)
This European Standard was approved by CENELEC on 2023-01-03. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60747-16-7:2023 E

European foreword
The text of document 47E/794/FDIS, future edition 1 of IEC 60747-16-7, prepared by SC 47E
"Discrete semiconductor devices" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-
CENELEC parallel vote and approved by CENELEC as EN IEC 60747-16-7:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2023-10-03
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-01-03
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60747-16-7:2022 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 60747-16-1:2001 NOTE Harmonized as EN 60747-16-1:2002 (not modified)
IEC 60747-16-1:2001/AMD1:2007 NOTE Harmonized as EN 60747-16-1:2002/A1:2007 (not modified)
IEC 60747-16-1:2001/AMD2:2017 NOTE Harmonized as EN 60747-16-1:2002/A2:2017 (not modified)
IEC 60747-16-4:2004 NOTE Harmonized as EN 60747-16-4:2004 (not modified)
IEC 60747-16-4:2004/AMD1:2009 NOTE Harmonized as EN 60747-16-4:2004/A1:2011 (not modified)
IEC 60747-16-4:2004/AMD2:2017 NOTE Harmonized as EN 60747-16-4:2004/A2:2017 (not modified)
IEC 60747-16-6:2019 NOTE Harmonized as EN IEC 60747-16-6:2019 (not modified)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60747-1 2006 Semiconductor devices - Part 1: General - -
+ A1 2010  - -
IEC 60747-4 - Semiconductor devices - Discrete devices - - -
Part 4: Microwave diodes and transistors
IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
IEC/TR 61340-5-2 - Electrostatics - Part 5-2: Protection of - -
electronic devices from electrostatic
phenomena - User guide
IEC 60747-16-7 ®
Edition 1.0 2022-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-7: Microwave integrated circuits – Attenuators

Dispositifs à semiconducteurs –

Partie 16-7: Circuits intégrés hyperfréquences – Atténuateurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-6116-3

– 2 – IEC 60747-16-7:2022  IEC 2022
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Essential ratings and characteristics . 10
4.1 General requirements . 10
4.1.1 Circuit identification and types . 10
4.1.2 General function description . 11
4.1.3 Manufacturing technology . 11
4.1.4 Package identification . 11
4.2 Application description . 11
4.2.1 Conformance to system and/or interface information . 11
4.2.2 Overall block diagram . 11
4.2.3 Reference data . 11
4.2.4 Electrical compatibility . 11
4.2.5 Associated devices . 12
4.3 Specification of the function . 12
4.3.1 Detailed block diagram – Functional blocks . 12
4.3.2 Identification and function of terminals . 12
4.3.3 Function description . 13
4.4 Limiting values (absolute maximum rating system) . 13
4.4.1 Requirements . 13
4.4.2 Electrical limiting values . 13
4.4.3 Temperatures . 14
4.5 Operating conditions (within the specified operating temperature range) . 15
4.6 Electrical characteristics . 15
4.7 Mechanical and environmental ratings, characteristics and data . 15
4.8 Additional information . 16
5 Measuring methods . 16
5.1 General . 16
5.1.1 General precautions . 16
5.1.2 Characteristic impedance . 16
5.1.3 Handling precautions . 16
5.1.4 Types . 16
5.2 Transmission loss (L ) and insertion loss (L ) . 17
trans ins
5.2.1 Purpose . 17
5.2.2 Measuring methods . 17
5.3 Attenuation value (A ). 20
att
5.3.1 Purpose . 20
5.3.2 Measuring methods . 20
5.4 Attenuation range (A ) . 22
ran
5.4.1 Purpose . 22
5.4.2 Measuring methods . 22
5.5 Attenuation accuracy (A ), Attenuation accuracy (RMS) (A ) . 24
aur aur(RMS)
5.5.1 Purpose . 24
5.5.2 Measuring methods . 24

IEC 60747-16-7:2022  IEC 2022 – 3 –
5.6 Input return loss (L ) . 26
ret(in)
5.6.1 Purpose . 26
5.6.2 Measuring methods . 26
5.7 Output return loss (L ) . 29
ret(out)
5.7.1 Purpose . 29
5.7.2 Measuring methods . 29
5.8 Input power at n dB compression (P ). 31
i(ndB)
5.8.1 Purpose . 31
5.8.2 Circuit diagram . 31
5.8.3 Principle of measurement . 31
5.8.4 Circuit description and requirements . 31
5.8.5 Precautions to be observed . 31
5.8.6 Measurement procedure . 31
5.8.7 Specified conditions . 31
5.9 Intermodulation distortion (two-tone)(P /P ) . 32
n 1
5.9.1 Purpose . 32
5.9.2 Circuit diagram .
...