EN 62047-13:2012
(Main)Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMS-Strukturen
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 13: Méthodes d'essais de types courbure et cisaillement de mesure de la résistance d'adhérence pour les structures MEMS
La CEI 62047-13:2012 spécifie la méthode d'essai d'adhérence entre des éléments microminiaturisés et un substrat au moyen d'éprouvettes de forme en colonnes. La présente norme internationale peut être appliquée à la mesure de la résistance d'adhérence des microstructures, préparées sur un substrat, dont la largeur et l'épaisseur sont de 1 μm à 1 mm, respectivement. La présente norme spécifie la méthode d'essai d'adhérence pour les éléments microminiaturisés, en vue d'une sélection optimale des matériaux et des conditions de traitement pour les dispositifs MEMS. La présente norme ne présente pas de restrictions particulières relatives au matériau des éprouvettes d'essai, à la taille de ces dernières, ni à la performance du dispositif de mesure, étant donné que les matériaux et la taille des composants des dispositifs MEMS comportent une large gamme et que les machines d'essais pour les matériaux microminiaturisés n'ont pas été généralisées.
Polprevodniški elementi - Mikroelektromehanski elementi - 13. del: Preskusne metode "upogibaj in reži" za merjenje adhezivne trdnosti struktur MEMS
Ta del standarda IEC 62047 določa adhezivno preskusno metodo med mikroelementi in podlago z uporabo stolpičaste oblike vzorcev. Ta mednarodni standard je mogoče uporabiti za merjenje adhezivne trdnosti mikrostruktur, pripravljenih na podlagi ter širokih 1 μm in debelih 1 mm. Mikroelementi naprav MEMS so sestavljeni iz laminiranih filmov s finim vzorcem na podlagi, ki so izdelani z nalaganjem, površinsko obdelavo in/ali premazovanjem s fotolitografijo. Naprave MEMS vključujejo veliko število vmesnikov med različnimi materiali, pri katerih med izdelavo ali med delovanjem občasno pride do razslojitve. Kombinacija materialov pri spoju določa adhezivno trdnost; poleg tega imajo okvare in preostala obremenitev v bližini vmesnika, ki se spreminjajo s pogoji obdelave, velik vpliv na adhezivno trdnost. Ta standard določa adhezivno preskusno metodo za mikroelemente, da se materiali in pogoji obdelave za naprave MEMS izberejo optimalno. Ta standard ne omejuje izrecno materiala preskusnih vzorcev, velikosti preskusnih vzorcev in delovanja merilne naprave, ker se materiali in velikost sestavnih delov naprave MEMS zelo razlikujejo, pri čemer preskusna naprava za mikromateriale še ni posplošena.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-junij-2012
Polprevodniški elementi - Mikroelektromehanski elementi - 13. del: Preskusne
metode "upogibaj in reži" za merjenje adhezivne trdnosti struktur MEMS
Semiconductor devices - Microelectromechanical devices - Part 13: Bend- and shear-
type test methods of measuring adhesive strength for MEMS structures
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und
Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMS-Strukturen
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 13:
Méthodes d'essais de types courbure et cisaillement de mesure de la résistance
d'adhérence pour les structures MEMS
Ta slovenski standard je istoveten z: EN 62047-13:2012
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD
EN 62047-13
NORME EUROPÉENNE
April 2012
EUROPÄISCHE NORM
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices -
Part 13: Bend- and shear- type test methods of measuring adhesive
strength for MEMS structures
(IEC 62047-13:2012)
Dispositifs à semiconducteurs - Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 13: Méthodes d'essais de types Teil 13: Biege- und Scherprüfverfahren
courbure et cisaillement de mesure de la zur Messung der Haftfestigkeit bei MEMS-
résistance d'adhérence pour les structures Strukturen
MEMS (IEC 62047-13:2012)
(CEI 62047-13:2012)
This European Standard was approved by CENELEC on 2012-04-03. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.
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Spain, Sweden, Switzerland, Turkey and the United Kingdom.
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European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-13:2012 E
Foreword
The text of document 47F/109/FDIS, future edition 1 of IEC 62047-13, prepared by SC 47F, "Micro-
electromechanical systems", of IEC TC 47, "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN 62047-13:2012.
The following dates are fixed:
(dop) 2013-01-03
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2015-04-03
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.
Endorsement notice
The text of the International Standard IEC 62047-13:2012 was approved by CENELEC as a European
Standard without any modification.
- 3 - EN 62047-13:2012
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
IEC 62047-2 2006 Semiconductor devices - Micro- EN 62047-2 2006
electromechanical devices -
Part 2: Tensile testing methods of thin film
materials
IEC 62047-13 ®
Edition 1.0 2012-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 13: Bend - and shear - type test methods of measuring adhesive strength
for MEMS structures
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 13: Méthodes d'essais de types courbure et cisaillement de mesure de la
résistance d'adhérence pour les structures MEMS
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX P
ICS 31.080.99 ISBN 978-2-88912-937-9
– 2 – 62047-13 IEC:2012
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test method . 6
4.1 General . 6
4.2 Data analysis . 7
5 Test equipment . 8
5.1 General . 8
5.2 Actuator . 8
5.3 Force measurement sensor . 8
5.4 Alignment system . 8
5.5 Recorder . 8
6 Test pieces . 9
6.1 Design of test pieces . 9
6.2 Preparation of test pieces . 9
7 Test conditions . 9
7.1 Method for gripping . 9
7.2 Speed of testing . 9
7.3 Alignment of test piece . 9
7.4 Test environment. 10
8 Test report. 10
Annex A (informative) Technical background . 11
Bibliography . 14
Figure 1 – Columnar test pieces . 6
Figure 2 – Adhesive strength test method . 7
Figure 3 – Alignment between columnar test piece and loading tool . 10
Figure A.1 – Example of the RRT results (see [1]) . 11
Figure A.2 – Effects of aspect ratio of columnar test piece on the stress condition in
bend type test (see [2]) . 12
Figure A.3 – Effects of knife edge angle of loading tool and aspect ratio of columnar
test piece on the stress condition in bend test . 13
62047-13 IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 13: Bend - and shear - type test methods
of measuring adhesive strength for MEMS structures
FOREWORD
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-13 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/109/FDIS 47F/119/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
– 4 – 62047-13 IEC:2012
A list of all parts of IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be f
...
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