EN IEC 62769-7:2023

Field Device Integration (FDI®) - Part 7: Communication Devices

IEC 62769-7:2023 is available as IEC 62769-7:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-7:2023 specifies the elements implementing communication capabilities called Communication Devices. The overall FDI®[1] architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this illustration. The document scope with respect to FDI® Packages is limited to Communication Devices. The Communication Server shown in Figure 1 is an example of a specific Communication Device. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

Feldgeräteintegration (FDI®) - Teil 7: FDI-Kommunikationsgeräte

Intégration des appareils de terrain (FDI®) - Partie 7: Appareils de Communication

IEC 62769-7:2023 est disponible sous forme de IEC 62769-7:2023 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L'IEC 62769-7:2023 spécifie les éléments de mise en œuvre des fonctions de communication, appelés Appareils de Communication. L'architecture FDI®[1] complète est représentée à la Figure 1. Les composants architecturaux qui relèvent du domaine d'application du présent document ont été mis en évidence dans cette représentation. Le domaine d'application du document relatif aux Paquetages FDI® est limité aux Appareils de Communication. Le Serveur de Communication représenté à la Figure 1 est un exemple d'Appareil de Communication spécifique. [1] FDI® est une marque déposée de l’organisation à but non lucratif Fieldbus Foundation, Inc. Cette information est donnée à l'intention des utilisateurs du présent document et ne signifie nullement que l'IEC approuve le détenteur de la marque ou l'emploi de ses produits. La conformité n'exige pas l'utilisation de la marque. L'utilisation de la marque exige l'autorisation du détenteur de la marque.

Integracija procesne naprave (FDI®) - 7. del: Komunikacijske naprave (IEC 62769-7:2023)

General Information

• Status: Published
• Publication Date: 18-May-2023
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.100.05 - Multilayer applications
• Technical Committee: CLC/TC 65X - Industrial-process measurement, control and automation
• Drafting Committee: IEC/SC 65E - IEC_SC_65E
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 19-May-2023
• Due Date: 28-Oct-2022
• Completion Date: 19-May-2023
• Ref Project: SIST EN IEC 62769-7:2023 - Field Device Integration (FDI®) - Part 7: Communication Devices (IEC 62769-7:2023)

Relations

• Replaces: EN IEC 62769-7:2021 - Field Device Integration (FDI) - Part 7: Communication devices
• Effective Date: 09-Nov-2021

Standards Content (Sample)

SLOVENSKI STANDARD
oSIST prEN IEC 62769-7:2022
01-maj-2022
Integracija procesne naprave (FDI) - 7. del: Komunikacijske naprave
Field Device Integration (FDI) - Part 7: Communication Devices
Intégration des appareils de terrain (FDI) - Partie 7: Appareils de communication
Ta slovenski standard je istoveten z: prEN IEC 62769-7:2022
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
oSIST prEN IEC 62769-7:2022 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN IEC 62769-7:2022

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oSIST prEN IEC 62769-7:2022

65E/859/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62769-7 ED3
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2022-03-04 2022-05-27
SUPERSEDES DOCUMENTS:
65E/826/RR

IEC SC 65E : DEVICES AND INTEGRATION IN ENTERPRISE SYSTEMS
SECRETARIAT: SECRETARY:
United States of America Mr Donald (Bob) Lattimer
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:

SC 65B,SC 65C
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.

TITLE:
Field Device Integration (FDI) - Part 7: Communication Devices

PROPOSED STABILITY DATE: 2025

Copyright © 2022 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.

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NOTE FROM TC/SC OFFICERS:

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1 CONTENTS
2
3 FOREWORD . 7
4 1 Scope . 9
5 2 Normative references . 10
6 3 Terms, definitions, abbreviated terms, acronyms and conventions . 10
7 3.1 Terms and definitions . 10
8 3.2 Abbreviated terms and acronyms . 10
9 3.3 Conventions for graphical notation . 11
10 4 General . 11
11 5 FDI Communication Package . 13
12 5.1 General . 13
13 5.2 EDD . 13
14 5.2.1 General rules . 13
15 5.2.2 Device component . 14
16 5.2.3 CommunicationDevice component . 16
17 5.2.4 Communication service provider component . 17
18 5.2.5 Connection Point component. 18
19 5.2.6 Connection Point collection . 19
20 5.2.7 Network component . 20
21 5.2.8 ValidateNetwork . 21
22 5.2.9 ValidateModules . 22
23 5.2.10 UIP specifics . 22
24 5.2.11 Deployment . 23
25 6 Communication relations . 23
26 7 FDI Communication Server definition . 24
27 7.1 General . 24
28 7.2 General characteristics . 24
29 7.3 Information Model . 24
30 7.3.1 General . 24
31 7.3.2 CommunicationServerType . 27
32 7.3.3 ServerCommunicationDeviceType . 31
33 7.3.4 ServerCommunicationServiceType . 36
34 7.4 OPC UA Server Profile for FDI Communication Server . 40
35 7.5 Mapping the FDI Server IM to the FDI Communication Server IM . 41
36 7.5.1 General . 41
37 7.5.2 Information Model differences . 41
38 7.6 Installer . 42
39 7.7 FDI Communication Package . 42
40 7.7.1 General . 42
41 7.7.2 EDD for Lightweight Communication Server . 42
42 7.7.3 EDD for Multi-Channel Communication Server . 43

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43 7.7.4 COMMANDs in EDDs for FDI Communication Servers . 43
44 7.7.5 Documentation . 44
45 7.8 Handling and behavior. 44
46 7.8.1 General . 44
47 7.8.2 Deployment . 45
48 7.8.3 Server configuration . 45
49 7.8.4 Start up . 46
50 7.8.5 Shutdown . 46
51 7.8.6 Watchdog . 46
52 7.8.7 Establish the OPC UA connection . 46
53 7.8.8 Instantiate the Communication Server . 47
54 7.8.9 Configure the communication hardware . 47
55 7.8.10 Configure the Network . 47
56 7.8.11 Parameterize . 47
57 7.8.12 Initialize . 47
58 7.8.13 Create the communication service object . 47
59 7.8.14 Communication relation. 48
60 7.8.15 Connect . 48
61 7.8.16 Disconnect . 49
62 7.8.17 Abort indication . 49
63 7.8.18 Scan . 49
64 7.8.19 SetAddress . 49
65 8 FDI Communication Gateway definition . 49
66 8.1 General . 49
67 8.2 Information Model . 49
68 8.2.1 General . 49
69 8.2.2 CommunicationGatewayType . 50
70 8.2.3 GatewayCommunicationDeviceType . 51
71 8.2.4 GatewayCommunicationServiceType . 54
72 8.3 FDI Communication Package . 58
73 8.3.1 General . 58
74 8.3.2 EDD . 59
75 8.4 Handling and behavior. 61
76 8.4.1 General . 61
77 8.4.2 Deployment . 61
78 8.4.3 Start up . 62
79 8.4.4 Configure the communication hardware . 62
80 8.4.5 Configure the Network . 62
81 8.4.6 Parameterize . 62
82 8.4.7 Communication relation. 62
83 8.4.8 Connect . 62
84 8.4.9 Disconnect . 62
85 8.4.10 Abort indication . 62
86 8.4.11 Scan . 62

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87 8.4.12 Communication Error Handling . 63
88 Annex A (informative) Layered protocols . 64
89 A.1 General . 64
90 A.2 Convention for protocol specific annex creation . 64
91 A.2.1 Connection Point . 64
92 A.3 FDI Communication Package definition . 66
93 A.3.1 Communication services . 66
94 A.3.2 Connection Point . 66
95 A.3.3 Network . 67
96 A.4 Representation in the IM . 67
97 Annex B (normative) Namespace and Mappings . 68
98
99 Figure 1 – FDI architecture diagram . 9
100 Figure 2 – FDI communication infrastructure architecture . 12
101 Figure 3 – Communication relation . 23
102 Figure 4 – Communication relation state chart . 24
103 Figure 5 – FDI Communication Server AddressSpace . 26
104 Figure 6 – CommunicationServerType . 27
105 Figure 7 – ServerCommunicationDeviceType . 31
106 Figure 8 – ServerCommunicationServiceType . 37
107 Figure 9 – Information Model differences (example) . 41
108 Figure 10 – FDI Communication Server state machine . 45
109 Figure 11 – Communication relation state chart . 48
110 Figure 12 – Gateway information model . 50
111 Figure 13 – CommunicationGatewayType . 51
112 Figure 14 – GatewayCommunicationDeviceType . 51
113 Figure 15 – GatewayCommunicationServiceType . 55
114 Figure 16 – Nested Communication . 61
115
116 Table 1 – ValidateNetwork Action arguments . 22
117 Table 2 – ValidateModules Action arguments . 22
118 Table 3 – CommunicationServerType definition . 27
119 Table 4 – MethodSet of CommunicationServerType . 27
120 Table 5 – Reset Method arguments . 28
121 Table 6 – Reset Method AddressSpace definition . 28
122 Table 7 – Initialize Method arguments . 29
123 Table 8 – Initialize Method AddressSpace definition . 29
124 Table 9 – AddComponent Method arguments . 30
125 Table 10 – AddComponent Method AddressSpace definition . 30
126 Table 11 – RemoveComponent Method arguments. 31

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127 Table 12 – RemoveComponent Method AddressSpace definition . 31
128 Table 13 – ServerCommunicationDeviceType definition . 32
129 Table 14– MethodSet of ServerCommunicationDeviceType . 32
130 Table 15 – Scan Method arguments . 33
131 Table 16 – Scan Method AddressSpace definition . 33
132 Table 17 – Scan Method arguments . 34
133 Table 18 – Scan Method AddressSpace definition . 34
134 Table 19 – ResetScan Method arguments . 35
135 Table 20 – ResetScan Method AddressSpace definition . 35
136 Table 21 – SetAddress Method arguments . 36
137 Table 22 – ServerCommunicationServiceType definition . 37
138 Table 23 – MethodSet of ServerCommunicationServiceType . 37
139 Table 24 – Connect Method arguments . 38
140 Table 25 – Disconnect Method arguments . 38
141 Table 26 – Transfer Method arguments . 39
142 Table 27 – GetPublishedData Method arguments . 40
143 Table 28 – FDICommunicationServer_Facet definition . 40
144 Table 29 – CommunicationGatewayType definition . 51
145 Table 30 – GatewayCommunicationDeviceType definition . 52
146 Table 31– MethodSet of GatewayCommunicationDeviceType . 52
147 Table 32 – Scan Method arguments . 53
148 Table 33 – Scan Method AddressSpace definition . 53
149 Table 34 – ScanNext Method arguments . 53
150 Table 35 – ScanNext Method AddressSpace definition . 54
151 Table 36 – GatewayCommunicationServiceType definition . 55
152 Table 37 – MethodSet of GatewayCommunicationServiceType . 55
153 Table 38 – Connect Method arguments . 57
154 Table 39 – Transfer Method arguments . 58
155
156

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157 INTERNATIONAL ELECTROTECHNICAL COMMISSION
158 ____________
159
160 FIELD DEVICE INTEGRATION (FDI) –
161
162 Part 7: Communication Devices
163
164 FOREWORD
165 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national
166 electrotechnical committees (IEC National Committees). The object of IEC is to promote international co -operation on all
167 questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities , IEC
168 publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and
169 Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC Natio nal
170 Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non -
171 governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the
172 International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two
173 organizations.
174 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus
175 of opinion on the relevant subjects since each technical committee has representation from all interested IEC National
176 Committees.
177 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in
178 that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC
179 cannot be held responsible for the way in which they are used or for any misinterpretation by any end user.
180 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to
181 the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the
182 corresponding national or regional publication shall be clearly indicated in the latter.
183 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment
184 services and, in some areas, access to IEC marks of conformity. IEC is not responsib le for any services carried out by
185 independent certification bodies.
186 6) All users should ensure that they have the latest edition of this publication.
187 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its
188 technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature
189 whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the p ublication, use of,
190 or reliance upon, this IEC Publication or any other IEC Publications.
191 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable
192 for the correct application of this publication.
193 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC
194 shall not be held responsible for identifying any or all such patent rights.
195 IEC 62769-7 has been prepared by subcommittee 65E: Devices and integration in enterprise systems, of
196 IEC technical committee 65: Industrial-process measurement, control and automation. It is an International
197 Standard.
198 This third edition cancels and replaces the second edition published in 2021. This edition constitutes a
199 technical revision.
200 This edition includes the following significant technical changes with respect to the previous edition:
201 a) added ScanExtended method

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202 The text of this International Standard is based on the following documents:
Draft Report on voting
XX/XX/FDIS XX/XX/RVD
203
204 Full information on the voting for its approval can be found in the report on voting indicated in the above
205 table.
206 The language used for the development of this International Standard is English.
207 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in accordance
208 with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available at
209 www.iec.ch/members_experts/refdocs. The main document types developed by IEC are described in
210 greater detail at www.iec.ch/standardsdev/publications.
211 The committee has decided that the contents of this document will remain unchanged until the stability
212 date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific
213 document. At this date, the document will be
214 • reconfirmed,
215 • withdrawn,
216 • replaced by a revised edition, or
217 • amended.
218

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219
220 FIELD DEVICE INTEGRATION (FDI) –
221
222 Part 7: Communication Devices
223
224
225
226 1 Scope
227 This part of IEC 62769 specifies the elements implementing communication capabilities c alled
228 Communication Devices.
229 The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the
230 scope of this document have been highlighted in this illustration. The document scope with respect to FDI
231 Packages is limited to Communication Devices. The Communication Server shown in Figure 1 is an
232 example of a specific Communication Device.
User Interface
FDI Package
Description
FDI Package
User
Device Business User
Interface
Definition Interface
User Logic User
FDI Client Device Business Plug-in
Interface Interface
Definition Logic
Description Plug-in
UID
Interpreter
UID
FDI Server
UIP
Information Model Management
Services
Information Model Business Logic
User Interface Processor
OPC UA
Plug-in
Device Object
Business
Device Object
Logic
Device Object
User Interface Services
Platform UI Services
(Drawing, Input Devices)
System Services
OPC UA
Services
OPC UA
OPC UA Client

Services
System
Communication
Communication
Hardware
Server
Data
Specified by this part of this International Standard
Store
Specified by other parts of this International Standard
Not specified by this International Standard
233
234 Figure 1 – FDI architecture diagram
OPC UA
Hosting Services
Device Access
Services
OPC UA Services
Business Logic
Interface

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235 2 Normative references
236 The following documents, in whole or in part, are normatively referenced in this document and are
237 indispensable for its application. For dated references, only the edition cited applies. For undated
238 references, the latest edition of the referenced document (including any amendments) applies.
239 IEC 62769-3, Function blocks (FB) for process control and Electronic Device Description Language
240 (EDDL) – Part 3: EDDL syntax and semantics
241 IEC 62769-4, Function blocks (FB) for process control and Electronic Device Description Language
242 (EDDL) – Part 4: EDD interpretation
243 IEC TR 62541-1, OPC Unified Architecture – Part 1: Overview and Concepts
244 IEC 62541-4, OPC Unified Architecture – Part 4: Services
245 IEC 62541-6, OPC Unified Architecture – Part 6: Mappings
246 IEC 62541-7, OPC Unified Architecture – Part 7: Profiles
247 IEC 62541-100, OPC Unified Architecture – Part 100: OPC UA for Devices
248 IEC 62769-1, Field Device Integration (FDI) – Part 1: Overview
249 IEC 62769-2, Field Device Integration (FDI) – Part 2: FDI Client
250 IEC 62769-3, Field Device Integration (FDI) – Part 3: FDI Server
251 IEC 62769-4, Field Device Integration (FDI) – Part 4: FDI Packages
252 IEC 62769-5, Field Device Integration (FDI) – Part 5: FDI Information Model
253 3 Terms, definitions, abbreviated terms, acronyms and conventions
254 3.1 Terms and definitions
255 For the purposes of this document, the terms and definitions given in IEC 6
...