EN 60115-8:2012

Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

IEC 60115-8:2009(E) is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions). They have metallized terminations and are primarily intended to be mounted directly on to a circuit board. This second edition constitutes a technical revision and includes test conditions and requirements for lead-free soldering and assessment procedures meeting the requirements of a 'zero defect' approach. The major technical changes with regard to the first edition are the following: - introduction of a product classification based on application requirements; - extension of the list of styles and dimensions; - use of an extended scope of stability class definitions; - extension of the lists of preferred values of ratings; - inclusion of test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD); - inclusion of a new set of severities for a shear test; - inclusion of definitions for a test board; - replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a 'zero defect' approach; - inclusion of an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test; - inclusion of requirements applicable to 0 resistors (jumpers).

Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 8: Rahmenspezifikation - Oberflächenmontierbare (SMD) Festwiderstände

Résistances fixes utilisées dans les équipements électroniques - Partie 8 : Spécification intermédiaire - Résistances fixes pour montage en surface

La CEI 60115-8:2009 s'applique aux résistances fixes pour montage en surface utilisées dans les équipements électroniques. Ces résistances sont généralement décrites selon des types (différentes formes géométriques) et des modèles (différentes dimensions). Elles comportent des extrémités métallisées et sont conçues principalement pour être montées directement sur un circuit imprimé. Les principales modifications techniques par rapport à la première édition sont les suivantes: - introduction d'une classification de produit basée sur les exigences de l'application; - extension de la liste des modèles et des dimensions; - utilisation d'un domaine d'application étendu avec des définitions de classe de stabilité; - extension des listes de valeurs préférentielles des caractéristiques nominales; - inclusion de conditions d'essai et d'exigences pour le brasage sans plomb, pour les surcharges périodiques, pour la résistance aux décharges électrostatiques (DES); - inclusion d'une nouvelle série de sévérités pour un essai de cisaillement; - inclusion de définitions d'une carte d'essai; - remplacement du niveau d'assurance de la qualité E et des autres possibles par l'unique niveau d'assurance de la qualité EZ qui est conforme aux exigences de l'approche "zéro défaut"; - inclusion d'un essai d'endurance étendu, d'un essai d'inflammabilité, d'un essai d'échauffement, d'essais de vibrations, d'un essai étendu de variation rapide de température et d'un essai de surcharge sous forme d'une simple impulsion de tension élevée; - inclusion d'exigences applicable aux résistances de valeurs 0 ohm (cavaliers).

Fiksni upori za elektronsko opremo - 8. del: Področna specifikacija - Fiksni upori za površinsko montažo

Ta del standarda EN 60115 se uporablja za fiksne upore za površinsko montažo, ki se uporabljajo pri elektronski opremi. Ti upori so navadno opisani glede na vrsto (različne geometrijske oblike) in slog (različne dimenzije). Imajo metalizirane priključke in so prvotno namenjeni montaži neposredno na ploščo tiskanega vezja.

General Information

• Status: Published
• Publication Date: 27-Sep-2012
• ICS: 31.040.10 - Fixed resistors
• Technical Committee: CLC/TC 40XB - CLC/TC 40XB
• Drafting Committee: IEC/TC 40 - IEC_TC_40
• Parallel Committee: IEC/TC 40 - IEC_TC_40
• Current Stage: 6060 - Document made available - Publishing
• Due Date: 28-Sep-2012
• Completion Date: 28-Sep-2012
• Ref Project: SIST EN 60115-8:2013 - Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

Relations

• Replaces: EN 140400:2003 - Sectional specification: Fixed low power surface mount (SMD) resistors
• Effective Date: 07-Jun-2022
• Revised: EN 140400:2003 - Sectional specification: Fixed low power surface mount (SMD) resistors
• Effective Date: 06-May-2014

Overview

EN 60115-8:2012 (CLC adoption of IEC 60115-8:2009) is the European sectional specification for fixed surface mount resistors (SMD resistors) used in electronic equipment. It prescribes preferred characteristics, ratings, test methods and quality assessment procedures for metallized-termination resistors designed for direct PCB mounting. This second edition incorporates major technical updates - notably lead‑free soldering requirements, a product classification by application, and assessment procedures aligned with a “zero defect” (EZ) approach.

Key topics and requirements

• Scope and object: Defines how fixed surface mount resistors are described (types, styles, dimensions) and what performance/tests are required for detail specifications.
• Product classification: New classification based on application requirements to guide selection and testing severity.
• Styles and dimensions: Extended lists of preferred styles (rectangular, cylindrical, etc.) and standardized dimensions for SMD packages.
• Electrical ratings and stability: Preferred values for rated resistance, tolerance, temperature coefficient, rated dissipation and limiting element voltage.
• Lead‑free soldering: Test conditions and acceptance criteria for solderability and resistance to soldering heat suited to lead‑free assembly processes.
• Quality assessment & “zero defect”: Replaces previous assessment levels with assessment level EZ, and sets QA/qualification and quality conformance inspection schedules.
• Reliability and environmental tests: Includes extended endurance, flammability, temperature‑rise, vibration, rapid temperature change, periodic overload and single‑pulse high‑voltage overload tests.
• Mechanical and ESD requirements: New severities for shear (adhesion) tests and inclusion of electrostatic discharge (ESD) resistance testing (e.g., human‑body model).
• Special cases: Requirements for 0 Ω resistors (jumpers) and definitions for a standard test board and Kelvin (4‑point) measurement layouts.

Applications and who uses this standard

EN 60115-8:2012 is intended for:

• Resistor manufacturers developing SMD resistor ranges and producing data sheets.
• PCB designers and electronic OEMs specifying component ratings and assembly processes.
• Quality, reliability and test engineers establishing acceptance criteria and qualification programs.
• Procurement and compliance teams ensuring components meet European and industry test requirements. Practical uses include component selection for consumer, industrial and automotive electronics, defining soldering/assembly qualifications, and performing supplier audits under a zero‑defect quality regime.

Related standards

• EN 60115-1 (generic fixed resistor spec)
• EN 60068 series (environmental testing)
• EN 60068-2-58 / EN 60068-2-20 (solderability and soldering heat tests)
• EN 60062 (marking codes)
• EN 61340-3-1 (ESD test waveforms)
• EN 61193-2 (sampling plans)
• EN 61760-1 (surface mounting technology)

Keywords: EN 60115-8:2012, fixed surface mount resistors, SMD resistors, lead‑free soldering, ESD, zero defect, quality assessment, CLC.

Standards Content (Sample)

SLOVENSKI STANDARD
01-januar-2013
)LNVQLXSRUL]DHOHNWURQVNRRSUHPRGHO3RGURþQDVSHFLILNDFLMD)LNVQLXSRUL
]DSRYUãLQVNRPRQWDåR
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed
surface mount resistors
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 8:
Rahmenspezifikation: Oberflächenmontierbare (SMD) Festwiderstände
/
Ta slovenski standard je istoveten z: EN 60115-8:2012
ICS:
31.040.10 Fiksni upor Fixed resistors
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60115-8
NORME EUROPÉENNE
September 2012
EUROPÄISCHE NORM
ICS 31.040.10 Supersedes EN 140400:2003

English version
Fixed resistors for use in electronic equipment -
Part 8: Sectional specification -
Fixed surface mount resistors
(IEC 60115-8:2009, modified)
Résistances fixes utilisées dans les Festwiderstände zur Verwendung in
équipements électroniques - Geräten der Elektronik -
Partie 8 : Spécification intermédiaire - Teil 8: Rahmenspezifikation -
Résistances fixes pour montage en Oberflächenmontierbare (SMD)
surface Festwiderstände
(CEI 60115-8:2009, modifiée) (IEC 60115-8:2009, modifiziert)

This European Standard was approved by CENELEC on 2012-08-13. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60115-8:2012 E
CONTENTS
Foreword . 5
1 General . 6
1.1 Sc op e . 6
1.2 Object . 6
1.3 Normative references . 6
1.4 Information to be specified in a detail specification . 6
1.4.1 Outline drawing . 7
1.4.2 Style and dimensions . 7
1.4.3 Climatic category . 7
1.4.4 Limits of resistance change after testing . 7
1.4.5 Resistance range . 7
1.4.6 Tolerance on rated resistance . 7
1.4.7 Temperature coefficient of resistance . 7
1.4.8 Rated dissipation . 7
1.4.9 Limiting element voltage . 7
1.4.10 Insulation voltage . 8
1.4.11 Insulation resistance . 8
1.4.12 Marking . 8
1.4.13 Ordering information . 8
1.4.14 Mounting . 8
1.4.15 Storage . 8
1.4.16 Additional information . 8
1.5 Product classification . 8
2 Preferred characteristics, ratings and test severities . 9
2.1 Preferred characteristics . 9
2.1.1 Style and dimensions . 9
2.1.2 Preferred climatic categories . 11
2.1.3 Variation of resistance with temperature . 11
2.1.4 Limits for change in resistance . 12
2.2 Preferred values of ratings . 14
2.2.1 Rated resistance . 14
2.2.2 Tolerance on rated resistance . 14
2.2.3 Rated dissipation P . 14
2.2.4 Limiting element voltage U . 15
max
2.2.5 Insulation resistance . 15
2.2.6 Insulation voltage . 15
2.3 Preferred test severities . 15
2.3.1 Short time overload . 15
2.3.2 Solderability . 16
2.3.3 Resistance to soldering heat . 17
2.3.4 Shock test . 18
2.3.5 Vibration test . 18
2.3.6 Single-pulse high-voltage overload test . 18
2.3.7 Component solvent resistance . 19
2.3.8 Solvent resistance of marking . 19
2.3.9 Shear (adhesion) test . 19
2.3.10 S ubs tr at e b e n d i n g t e s t . 19

- 3 - EN 60115-8:2012
2.3.11 Resistance to electrostatic discharge (ESD) . 20
2.3.12 Periodic pulse overload test . 20
2.4 Preparation of specimen . 20
2.4.1 Drying . 20
2.4.2 Mounting of components . 21
3 Quality assessment procedures . 22
3.1 General . 22
3.2 Definitions . 23
3.2.1 Primary stage of manufacture . 23
3.2.2 Structurally similar components . 23
3.2.3 Assessment level EZ . 23
3.3 Formation of inspection lots . 23
3.4 Qualification approval (QA) procedures . 24
3.4.1 Granting the approval for products classified to level P . 24
3.4.2 Granting the approval for products classified to level R . 24
3.5 Qu al i t y c o nf orm anc e i nsp ect i on . 24
3.6 Capability approval (CA) procedures . 25
3.7 Technology approval (TA) procedures . 25
3.8 Delayed delivery . 25
3.9 Certified test records . 25
3.10 Failure rate level . 25
3.11 Certificate of conformity (CoC) . 25
Annex A (normative) 0 Ω resistors (Jumper) . 36
A.1Information to be specified in a detail specification . 36
A.2Preferred characteristics. 36
A.3Preferred ratings . 36
A.4Preferred severities . 36
A.5Test schedule for qualification approval . 37
A.6Test schedule for quality conformance inspection . 37
Annex B (informative) Letter symbols and abbreviations . 38
B.1Letter symbols . 38
B.2Abbreviations . 39
Annex ZX (informative) Cross reference to EN 140400 . 40
Bibliography . 42

Figure 1 – Shape and dimensions of rectangular (RR) resistors . 9
Figure 2 – Shape and dimensions of cylindrical (RC) resistors . 10
Figure 3a – Derating curve . 14
Figure 3b – Derating curve for power resistors . 15
Figure 4 – Basic layout for mechanical, environmental and electrical tests, Kelvin (4 point)
connections . 21
Figure 5 – Attachment of the sense line for Kelvin (4 point) connections for specimen with
rated resistance lower than 100 mΩ . 21
Figure 6 – Basic layout for mechanical, environmental and electrical tests . 22

Table 1a – Preferred styles for rectangular (RR) resistors . 10

Table 1b – Preferred styles for cylindrical (RC) resistors . 11
Table 2 – Permitted change of resistance . 12
Table 3a – Limits for change of resistance . 13
Table 3b – Limits for change of resistance . 13
Table 4 – Shear test force . 19
Table 5 – Soldering pad dimensions . 22
Table 6 – Test schedule for qualification approval . 26
Table 7a – Test schedule for quality conformance inspection: Lot-by-lot tests . 31
Table 7b – Test schedule for quality conformance inspection: Periodic tests . 32
Table ZX.1 – Cross reference to EN 140400 . 40

- 5 - EN 60115-8:2012
Foreword
This document EN 60115-8:2012 consists of the text of IEC 60115-8:2009, prepared by IEC/TC 40
"Capacitors and resistors for electronic equipment", together with the common modifications prepared by the
Technical Committee CLC/TC 40XB "Resistors".
The following dates are fixed:
(dop) 2013-08-13
• latest date by which this document has to be
implemented
at national level by publication of an identical
national standard or by endorsement
(dow) 2015-08-13
• latest date by which the national standards conflicting
with this document have to be withdrawn
This document supersedes EN 140400:2003.
Preceding documents on the subject covered by this specification have been:
– EN 140400:1996-11
– CECC 40 400:1989-00,
— introduction of a product classification based on application requirements;
— extension of the list of styles and dimensions;
— introduction of the code letters for temperature coefficient as given in EN 60062;
— introduction of description and test methods for lead-free soldering;
— introduction of a new system of test severities for the shear test;
— introduction of new test severities for the single-pulse high-voltage overload test;
— introduction of a test on the resistance to electrostatic discharge;
— amendment of the prescriptions for mounting of components;
— adoption of the IECQ rules of procedure, QC 001002-3:2005;
— separation of the test schedule into separate tables for qualification approval and for quality conformance
inspection;
— consolidation of the prescription for 0 Ω resistors in a new annex;
— editorial revision.
In this document, the common modifications to IEC 60115-8:2009 are indicated by a vertical line in the left
margin of the text.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
1 General
1.1 Scope
This part of EN 60115 is applicable to fixed surface mount resistors for use in electronic equipment.
These resistors are typically described according to types (different geometric shapes) and styles
(different dimensions). They have metallized terminations and are primarily intended to be mounted
directly on to a circuit board.
1.2 Object
The object of this standard is to prescribe preferred ratings and characteristics and to select from
EN 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to
give general performance requirements for this type of resistor.
Test severities and requirements prescribed in detail specifications referring to this sectional
specification shall be of equal or higher performance level, because lower performance levels are not
permitted.
1.3 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
EN 60062:2005 + corrigendum 2007, Marking codes for resistors and capacitors (IEC 60062:2004)
EN 60068-1:1994, Environmental testing – Part 1: General and guidance (IEC 60068-1:1988 +
A1:1992 + corrigendum Oct. 1988)
EN 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008)
EN 60068-2-58:2004 + corrigendum 2004, Environmental testing – Part 2-58: Tests – Test Td: Test
methods for solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD) (IEC 60068-2-58:2004)
EN 60115-1:2011, Fixed resistors for use in electronic equipment – Part 1: Generic specification (IEC
60115-1:2008, modified)
EN 61193-2:2007, Quality assessment systems – Part 2: Selection and use of sampling plans for
inspection of electronic components and packages (IEC 61193-2:2007)
EN 61340-3-1, Electrostatics – Part 3-1: Methods for simulation of electrostatic effects – Human
body model (HBM) electrostatic discharge test waveforms (IEC 61340-3-1)
EN 61760-1:2006, Surface mounting technology – Part 1: Standard method for the specification of
surface mounting components (SMDs) (IEC 61760-1:2006)
1.4 Information to be specified in a detail specification
Detail specifications shall be derived from the relevant blank detail specification.

- 7 - EN 60115-8:2012
Detail specifications shall not specify requirements inferior to those of the generic specification,
sectional specification or blank detail specification. When more severe requirements are included,
they shall be listed in a subclause of the detail specification and indicated in the test schedules, for
example by a note.
The following information shall be given in each detail specification and the values quoted shall
preferably be selected from those given in the appropriate clause of this sectional specification.
1.4.1 Outline drawing
There shall be an illustration of the resistor as an aid to easy recognition and for comparison of the
resistor with others.
1.4.2 Style and dimensions
See 2.1.1.
Dimensions and their associated tolerances, which affect interchangeability and mounting, shall be
given in the detail specification.
1.4.3 Climatic category
See 2.1.2.
1.4.4 Limits of resistance change after testing
See 2.1.4.
1.4.5 Resistance range
See 2.2.1.
NOTE When products approved according to the detail specification have different ranges, the following statement should
be added: “The range of values available in each style, together with the associated tolerance and temperature coefficient,
is given in the register of approvals, available for example on the website www.iecq.org”.
1.4.6 Tolerance on rated resistance
See 2.2.2.
1.4.7 Temperature coefficient of resistance
See 2.1.3.
1.4.8 Rated dissipation
See 2.2.3.
The detail specification shall state the maximum allowable dissipation P at an ambient temperature
of 70 °C (i.e. the rated temperature).
The detail specification shall state the maximum dissipation at temperatures other than 70 °C, for
example the derating, either in a diagram or in the form of a statement. All break points shall be
verified by test.
The mounting conditions are as described in 2.4.2.
1.4.9 Limiting element voltage
See 2.2.4.
1.4.10 Insulation voltage
This information is required only for insulated resistors.
See 2.2.6 and the definition for insulation voltage given in EN 60115-1:2011, 2.2.
For small size resistors where the dimensions of the test jig given in EN 60115-1:2011, 4.6 are not
adequate, they shall be specified in the detail specification.
1.4.11 Insulation resistance
This information is required only for insulated resistors.
See 2.2.5.
For small size resistors where the dimensions of the test jig given in EN 60115-1:2011, 4.6 are not
adequate, they shall be specified in the detail specification.
1.4.12 Marking
Surface mount resistors are generally not marked on the body. However, if some marking is applied
to the body, the resistor shall be marked with the resistance using one of the coding systems
provided by EN 60062:2005, and as many of the remaining items listed in EN 60115-1:2011, 2.4 as
possible. All the required information shall be marked on the packaging.
1.4.13 Ordering information
The detail specification shall specify the following minimum information as required for the ordering
resistors:
The number of the detail specification and style reference.
Resistance, tolerance on resistance and, if required, temperature coefficient of resistance according
to EN 60062.
Failure rate level for products classified to Level R, according to EN 60115-1:2011, Annex ZR.
NOTE A nominal failure rate level E0 may be used for products classified to Level P, for which no failure rate level is
assessed.
1.4.14 Mounting
The detail specification shall give guidance on methods of mounting for normal use, preferably based
on the specification of assembly process conditions of EN 61760-1:2006, Clause 5. Mounting for test
and measurement purposes (when required) shall be in accordance with 2.4.2 of this specification
and EN 60115-1:2011, 4.31.
1.4.15 Storage
See EN 60115-1:2011, 2.7.
The detail specification shall specify the permissible duration of storage and, if required, periodicity,
method and requirements of a re-examination to be applied.
1.4.16 Additional information
The detail specification may include additional information (which is not normally required to be
verified by the inspection procedure), such as circuit diagrams, curves, drawings and notes needed
for the clarification of the detail specification.
1.5 Product classification
The introduction of a product classification permits the user to select performance requirements
according to the conditions of the intended end-use application.

- 9 - EN 60115-8:2012
Three general end product levels have been established to reflect characteristic differences in
functional, performance and reliability requirements and to permit the use of suitable inspection and
test schedules. It should be recognized that there may be overlaps of applications between the
levels.
Level G – General electronic equipment, typically operated under benign or moderate environmental
conditions, where the major requirement is function. Examples for level G include consumer products
and telecommunication user terminals.
Level P – High-performance electronic equipment, where one or more of the following criteria
applies:
– uninterrupted performance is desired or mandatory;
– operation in harsh environmental conditions;
– extended lifetime.
Examples for level P include professional equipment, telecommunication transmission systems,
industrial control and measurement systems and most automotive applications operated outside the
passenger compartment.
NOTE 1 This product classification to Level P adopts the former Version A.
Level R — High-performance and high-reliability electronic equipment, where the requirement for
established reliability and for an approved failure rate level applies in addition to the criteria of Level
P.
Examples for Level R include military & defence equipment, avionics and aerospace applications.
NOTE 2 This product classification to Level R adopts the former Version E.
Each level shall be used in individual detail specifications, except for Level P and Level R, which
may be used in combined detail specifications.
2 Preferred characteristics, ratings and test severities
2.1 Preferred characteristics
The values given in detail specifications shall preferably be selected from the following.
2.1.1 Style and dimensions
The shape and dimensions of rectangular resistors, commonly referred to as chip resistors, is shown
in Figure 1, with preferred styles and their respective dimensions given in Table 1a. Style
designators of rectangular resistors are prefixed RR.

Figure 1 – Shape and dimensions of rectangular (RR) resistors

Table 1a – Preferred styles for rectangular (RR) resistors
Style Dimensions
a Length L Width W Height T
Metric Imperial
mm mm mm
RR0603M RR0201
0,6 ± 0,05 0,3 ± 0,05 0,23 ± 0,05
RR1005M RR0402 1,0 ± 0,05 0,5 ± 0,05 0,35 ± 0,05
RR1608M RR0603 1,6 ± 0,1 0,8 ± 0,1 0,45 ± 0,1
++++0,15
0,5
RR2012M RR0805 2,0 ± 0,1 1,25 ± 0,15
−−−−0,10
RR3216M RR1206
3,2 ± 0,2 1,6 ± 0,15 0,55 ± 0,1
RR3225M RR1210 3,2 ± 0,2 2,5 ± 0,2 0,55 ± 0,1
RR3245M RR1218 3,2 ± 0,2 4,6 ± 0,2 0,55 ± 0,1
RR4532M RR1812
4,6 ± 0,2 3,2 ± 0,2 0,55 ± 0,1
RR5025M RR2010 5,0 ± 0,2 2,5 ± 0,2 0,55 ± 0,2
RR6332M RR2512 6,3 ± 0,2 3,2 ± 0,2 0,55 ± 0,2
a
Historical style codes, for information only.

The shape and dimensions of cylindrical resistors, commonly referred to as MELF resistors, is shown
in Figure 2, with preferred styles and their respective dimensions given in Table 1b. Style
designators of cylindrical resistors are prefixed RC.

Figure 2 – Shape and dimensions of cylindrical (RC) resistors

- 11 - EN 60115-8:2012
Table 1b – Preferred styles for cylindrical (RC) resistors
Style Dimensions
Length L Diameter D
Metric
mm mm
++ 0,15
++++ 0,10 ++
1,6 1,0
RC1610M
−−−−0,05 −−−−0,05
++++ 0,2
RC2012M 2,0 ± 0,1 1,25
−−0,1
−−
0 0
RC2211M 2,2 1,1
−−0,2 −−0,10
−− −−
0 0
a
3 ,7 1,5
RC3715M −−−−0,3 −−−−0,2
0 0
b
6 ,1 2 ,3
RC6123M
−−−−0,6 −−−−0,3
a
Comparable to the IEC style RC3514M
(L = (3,5 ± 0,2) mm; D = (1,4 ± 0,2) mm).
b
Comparable to the IEC style RC5922M
(L = (5,9 ± 0,2) mm; D = (2,2 ± 0,2) mm).

When the component style is other than described above, for example for surface mount wirewound
resistors (Style designators are prefixed RW), the detail specification shall state such dimensional
information as will adequately describe the resistor.
2.1.2 Preferred climatic categories
The surface mount resistors covered by this specification are classified into climatic categories
according to the general rules given in EN 60068-1:1994, Annex A.
The lower and upper category temperature and the duration of the damp heat, steady state test shall
be chosen from the following:
Lower category temperature (LCT) -55 °C; -40 °C; -25 °C and -10 °C.
Upper category temperature (UCT) 85 °C; 100 °C; 125 °C; 155 °C;
175 °C and 200 °C.
Duration of damp heat, steady state test: 10, 21 and 56 days.
The severities for the cold and dry heat tests are the lower and upper category temperatures
respectively.
NOTE The climatic performance of assembled resistors is greatly influenced by the circuit board, the assembly method
and a final coating.
2.1.3 Variation of resistance with temperature
The preferred limits of change in resistance for the variation of resistance with temperature test are
given in Table 2.
Table 2 – Permitted change of resistance
Limit of resistance change, ∆∆∆∆R/R
Tempe-
%
rature
a
Lower category temperature / Reference temperature /
coefficient
a
Reference temperature Upper category temperature
±1 000 W ±7,50 ±6,00 ±4,50 ±3,00 ±6,50 ±10,5 ±13,5 ±15,5 ±18,0
±500 V ±3,75 ±3,00 ±2,25 ±1,50 ±3,25 ±5,25 ±6,75 ±7,75 ±9,00
±250 U ±1,88 ±1,50 ±1,13 ±0,75 ±1,63 ±2,63 ±3,38 ±3,88 ±4,50
±100 S ±0,75 ±0,60 ±0,45 ±0,30 ±0,65 ±1,05 ±1,35 ±1,55 ±1,80
±50 R ±0,375 ±0,300 ±0,225 ±0,150 ±0,325 ±0,525 ±0,675 ±0,775 ±0,900
±25 Q ±0,188 ±0,150 ±0,113 ±0,075 ±0,163 ±0,263 ±0,338 ±0,388 ±0,450
±15 P ±0,113 ±0,090 ±0,068 ±0,045 ±0,098 ±0,158 ±0,203 ±0,233 ±0,270
±10 N ±0,075 ±0,060 ±0,045 ±0,030 ±0,065 ±0,105 ±0,135 ±0,155 ±0,180
±5 M ±0,038 ±0,030 ±0,023 ±0,015 ±0,033 ±0,053 ±0,068 ±0,078 ±0,090
±2 L ±0,015 ±0,012 ±0,009 ±0,006 ±0,013 ±0,021 ±0,027 ±0,031 ±0,036
±1 K ±0,008 ±0,006 ±0,005 ±0,003 ±0,007 ±0,011 ±0,014 ±0,016 ±0,018
a
If additional temperature coefficients or category temperatures are required, these shall be specified in the
detail specification.
b
Code letters according to EN 60062:2005, 5.5.

Each line in the table gives the preferred temperature coefficient and limits of change in resistance
for the measurement of the variation of resistance with temperature (see EN 60115-1:2011, 4.8) on
the basis of category temperature ranges of 2.1.2 of this specification.
2.1.4 Limits for change in resistance
Tables 3a and 3b list preferred limits for resistance change for all tests listed in the heading. To
classify the performance of resistors, they will be assigned to stability classes as listed in Table 3a
and Table 3b below.
–6
10 /K
b
Code
-55 °C / 20 °C
-40 °C / 20 °C
-25 °C / 20 °C
-10 °C / 20 °C
20 °C / 85 °C
20 °C / 125 °C
20 °C / 155 °C
20 °C / 175 °C
20 °C / 200 °C
- 13 - EN 60115-8:2012
Table 3a – Limits for change of resistance
Stability
Limit of resistance change, ∆∆∆∆R
class
Ω
Long term tests Short term tests
EN 60115-1:2011, EN 60115-1:2011, EN 60115-1:2011,
4.23 Climatic 4.25.1 Endurance at 70 °C, 4.13 Short time
sequence overload
4.24 Damp heat, 4.18 Resistance to

steady state soldering heat
4.25.3 Endurance at 4.19 Rapid change of
upper category temperature,
temperature 5 cycles
b
4.21 Shock
c
4.22 Vibration
a 4.33 Substrate
1 000 h Extended, 8 000 h
bending test
±(5 % R + 0,1 Ω) ±(5 % R + 0,1 Ω) ±(10 % R + 0,1 Ω) ±(1 % R + 0,05 Ω)
±(2 % R + 0,1 Ω) ±(2 % R + 0,1 Ω) ±(5 % R + 0,1 Ω) ±(0,5 % R + 0,05 Ω)
1 ±(1 % R + 0,05 Ω) ±(1 % R + 0,05 Ω) ±(2 % R + 0,05 Ω) ±(0,25 % R + 0,05 Ω)
0,5 ± (0,5 % R + 0,05 Ω) ±(0,5 % R + 0,05 Ω) ±(1 % R + 0,05 Ω) ±(0,1 % R + 0,01 Ω)
0,25
±(0,25 % R + 0,05 Ω) ±(0,25 % R + 0,05 Ω) ±(0,5 % R + 0,05 Ω) ±(0,05 % R + 0,01 Ω)
0,1
±(0,1 % R + 0,02 Ω) ±(0,1 % R + 0,02 Ω) ±(0,25 % R + 0,02 Ω) ±(0,05 % R + 0,01 Ω)
0,05
±(0,05 % R + 0,01 Ω) ±(0,05 % R + 0,01 Ω) ±(0,1 % R + 0,01 Ω) ±(0,025 % R + 0,01 Ω)
0,025
±(0,025 % R + 0,01 Ω) ±(0,025 % R + 0,01 Ω) ±(0,05 % R + 0,01 Ω) ±(0,01 % R + 0,01 Ω)
a
This test shall be applied to resistors categorized as level P or level R.
b
This test shall be applied to resistors of other styles than RR or RC, e.g. of style RW.
c
This test shall be applied to resistors of styles RR or RC.

Table 3b – Limits for change of resistance
Stability
Limit of resistance change, ∆∆R
∆∆
class
Ω
EN 60115-1:2011, EN 60115-1:2011, EN 60115-1:2011, EN 60115-1:2011,
4.19 Rapid change 4.27 Single pulse 4.38 Electrostatic 4.39 Periodic electric
b a
of temperature, high-voltage discharge overload
a a
≥≥≥≥ 100 cycles overload test
± (1 % R + 0,05 Ω) ±(1 % R + 0,05 Ω) ±(1% R + 0,05 Ω) ±(2 % R + 0,05 Ω)
± (0,5 % R + 0,05 Ω)
0,5
0,25
±(0,5 % R + 0,05 Ω) ±(0,5 % R + 0,05 Ω) ±(1 % R + 0,05 Ω)
0,1
±(0,25 % R + 0,05 Ω)
0,05
0,025
a
This test shall be applied to resistors categorized as level P or level R.
b
Human body model (HBM) according to EN 61340-3-1, using 3 positive and 3 negative discharges for resistors
categorized as level P or level R, or 1 positive and 1 negative discharge for resistors categorized as level G.

2.2 Preferred values of ratings
2.2.1 Rated resistance
See EN 60115-1:2011, 2.3.2.
2.2.2 Tolerance on rated resistance
The preferred values of relative tolerance on rated resistance are:
±10 %; ±5 %; ±2 %; ±1 %; ±0,5 %; ±0,25 %; ±0,1 %; ±0,05 %; ±0,02 %; ±0,01 %; 0/-30 %; 0/-20 %
and
0/-10 %.
NOTE Asymmetric relative tolerance values (e.g. 0/-20 %) are intended to be used for laser trimmable resistors.
2.2.3 Rated dissipation P
The preferred values of rated dissipation P for mounted resistors at 70 °C ambient temperature
are:
0,016 W; 0,032 W; 0,05 W; 0,063 W; 0,1 W; 0,125 W; 0,25 W; 0,33 W; 0,4 W; 0,5 W; 0,75 W; 1 W;
2 W and 3 W.
The detail specification shall specify the conditions under which the rated dissipation applies.
Figure 3a shows the typical shape of a derating curve that may be used to provide derating
information for all cases where the maximum element temperature (MET) is equal to the upper
category temperature (UCT).
Figure 3a – Derating curve
For cases where the maximum element temperature (MET) exceeds the upper category temperature
(UCT), as it is common e.g. for wirewound power resistors, a shape as shown in Figure 3b is better
suited to provide the derating information, and also to illustrate the limited temperature range applied
for testing.
- 15 - EN 60115-8:2012
Figure 3b – Derating curve for power resistors
The end points and break points of each curve shall be verified by tests.
2.2.4 Limiting element voltage U
max
The preferred values of limiting element voltage U d.c. or a.c. (r.m.s.) are:
max
12,5 V; 15 V; 25 V; 50 V; 75 V; 100 V; 150 V; 200 V; 300 V and 500 V.
2.2.5 Insulation resistance
For insulated resistors, the insulation resistance R shall be not less than 1 GΩ, when measured
ins
according to EN 60115-1:2011, 4.6.
The insulation resistance R shall not be less than 1 GΩ after the tests
ins
• 4.25.1, Endurance at 70 °C
• 4.25.3, Endurance at Upper Category Temperature.
The insulation resistance R shall not be less than 100 MΩ after the tests
ins
• 4.23, Climatic sequence
• 4.24, Damp heat, steady state.
2.2.6 Insulation voltage
For insulated resistors, the preferred values of insulation voltage U d.c. or a.c. (peak) are:
ins
75 V; 100 V; 200 V; 300 V and 500 V.
2.3 Preferred test severities
2.3.1 Short time overload
See EN 60115-1:2011, 4.13, with the following details:
Applied voltage: The detail specification shall state the applied voltage. Preferred values are

U == 2,5 ⋅⋅U (1)
== ⋅⋅
r
or
U ==== 2 ⋅⋅⋅⋅U (2)
max
whichever is the less severe,
where
U is the rated voltage, U ==== P ⋅⋅⋅⋅ R
r 70
r
r
U is the limiting element voltage.
max
Duration: The detail specification shall state the load duration.
Preferred values are 0,5 s; 1 s; 2 s; 5 s and 10 s.
This time shall be fixed in such a way, that the maximum element
temperature is at least 30 K above the upper category temperature.
Mounting: See 2.4.2. The distance between individual surface mount resistors shall not
be less than the largest surface mount resistor dimension.
The test board shall be mounted horizontally and shall be in free air at the
standard atmospheric conditions for testing as given in
EN 60115-1:2011, 4.2.1 (e.g. ambient temperature 15 °C to 35 °C).
2.3.2 Solderability
See EN 60115-1:2011, 4.17, with the following details:
The solderability test shall be preceded by accelerated ageing. Unless otherwise specified in the
relevant detail specification, Ageing 3a as prescribed in EN 60068-2-20:2008, 4.1.1 (i.e. 4 h at
155 °C dry heat) shall be used. After the accelerated ageing, the specimen shall be subjected to
standard atmospheric conditions for testing for not less than 2 h and not more than 24 h.
The solderable termination surface of the resistors shall be compatible with both, traditional SnPb
solder and lead-free solder, unless otherwise explicitly stated in the relevant detail specification.
Therefore solderability testing is required for both soldering processes.
Solderability with traditional SnPb solder shall be tested according to EN 60068-2-58:2004, 8.2.1
solder bath method with the following severity
Solder alloy: Sn60Pb40 or Sn63Pb37
Bath temperature: (235 ± 5) °C
Immersion time: (2 ± 0,2) s
Lead-free solder alloys are grouped in EN 60068-2-58:2004, Clause 4 according to their typical
process temperature. The most popular solder alloys SnAg, SnAgCu and SnAgBi are contained in
group 3, medium-high temperature. Solderability with lead-free solder shall be tested according to
EN 60068-2-58:2004, 8.1.1, solder bath method with the following representative severity for group
3:
Solder alloy: Sn96,5Ag3,0Cu0,5
Bath temperature: (245 ± 5) °C
Immersion time: (3 ± 0,3) s
- 17 - EN 60115-8:2012
2.3.3 Resistance to soldering heat
See EN 60115-1:2011, 4.18, with the following details:
Resistors shall be capable of withstanding the full variety of soldering processes described in
EN 61760-1, unless explicitly stated otherwise in the relevant detail specification:
• SnPb vapour phase reflow soldering;
• Lead-free vapour phase reflow soldering;
• SnPb infrared or forced gas convection reflow soldering;
• Lead-free infrared or forced gas convection reflow soldering;
• SnPb double wave soldering;
• Lead-free double wave soldering.
Resistance to soldering heat for the combination of all soldering methods shall be tested with the
worst case condition from EN 60068-2-58:2004, 8.2.1 and EN 60068-2-58:2004, 8.1.1 :
Test method: Solder bath method
Solder alloy: any alloy SnPb or SnCu or SnAgCu or SnAg
Bath temperature: (260 ± 5) °C
Immersion time: (10 ± 1) s
Test cycles: 1
For resistors, where the relevant detail specification explicitly excludes wave soldering, resistance to
soldering heat may be tested with the worst case reflow condition from EN 60068-2-58:2004, 8.2.4
and EN 61760-1:2006, Clause 6.
Test method: Vapour phase soldering
Vapour temperature: (230 ± 5) °C
Immersion time: (40 ± 1) s
Test cycles: 3, the recovery period between two successive cycles shall be at least the
time it takes until the specimen drops below 50 °C.
For resistors, where the relevant detail specification explicitly excludes wave soldering and vapour
phase reflow soldering, resistance to soldering heat may be tested with the worst case non-vapour
phase reflow condition from EN 60068-2-58:2004, 8.2.4 and EN 60068-2-58:2004, 8.1.2.2.
Test method: Infrared and forced gas convection soldering
Preheating: 150 °C to 180 °C
for (120 ± 5) s
Peak temperature: (255 ± 5) °C
Dwell time: (40 ± 1) s above 245 °C
(60 to 90) s above 220 °C
Test cycles: 3, the recovery period between two successive cycles shall be at least the
time it takes until the specimen drops below 50 °C.
2.3.4 Shock test
See EN 60115-1:2011, 4.21, with the following details:
Pulse shape: Half sine
Peak acceleration: 500 m/s²
Pulse duration: 11 ms
Number of shocks: 3 successive shocks in each direction of three mutually perpendicular axes of
the specimen.
This test shall be applied to specimen of other styles than rectangular resistor (RR) or cylindrical
resistors (RC).
2.3.5 Vibration test
See EN 60115-1:2011, 4.22, with the following details:
Procedure: Endurance by sweeping
Frequency range: 10 Hz to 2 000 Hz
Amplitude: 1,5 mm or 200 m/s², whichever is the less severe
Sweep cycles: 10 cycles in each of three mutually perpendicular axes of the specimen
Duration: 2,5 h per axis.
The specimen shall be mounted in such a way that they are not exposed to resonances.
This test shall be applied to all styles of rectangular resistors (RR) and cylindrical resistors (RC).
2.3.6 Single-pulse high-voltage overload test
See EN 60115-1:2011, 4.27, with the following details:
Mounting of specimen: See 2.4.2, or unmounted
Pulse shape: 10 µs/700 µs
ˆ ˆ
Peak voltage: U == 10 ⋅⋅U or U == 2 ⋅⋅U , whichever is the less severe
== ⋅⋅ == ⋅⋅
r max
(Severity No. 4), or
ˆ ˆ
U ==== x ⋅⋅⋅⋅U or U ==== y ⋅⋅⋅⋅U , whichever is the less severe
r max
(Severity No. B), where
x is the multiplier of the rated voltage, x ≥ 10
y is the multiplier of the limiting element voltage, y ≥ 2.
The relevant specification shall prescribe the factors x and y.

- 19 - EN 60115-8:2012
2.3.7 Component solvent resistance
See EN 60115-1:2011, 4.29, with the following detail:
Solvent temperature: ( 50 ) °C.
−−−−5
2.3.8 Solvent resistance of marking
See EN 60115-1:2011, 4.30, with the following detail:
Solvent temperature: ( 50 ) °C.
−−−−5
Rubbing device: Tooth brush.
The toothbrush prescribed as the rubbing device shall be a regular commercial hard grade quality
with tightly clustered bristles of consistent length, made of regular synthetic fibres. It shall be used
with a single solvent only and applied with normal hand pressure (approx. 0,5 N to 1 N normal to the
specimen surface) for the required ten strokes. The toothbrush shall be discarded when there is any
evidence of softening, bending, wear, or loss of bristles.
2.3.9 Shear (adhesion) test
See EN 60115-1:2011, 4.32.2 b), with the following details:
Unless otherwise specified in the relevant detail specification, a force as given in Table 4 shall be
applied to the surface mount resistor body.
Table 4 – Shear test force
Style
Force
N
Rectangular Cylindrical
++++ 0,2
RR0603M — 2
++++ 0,3
RR1005M — 3
++++ 0,5
RR1608M RC1610M
RC2012M
++++ 0,9
RR2012M 9
RC2211M
RR3216M
++++2,5
RC3715M
RR3225M
RR3245M
RR4532M
++++ 4,5
— 45
RR5025M
RR6332M
— ++++ 9,0
RC6123M 90
NOTE The forces for the shear test given in Table 4 are specified so as to exceed the result of an acceleration of 981 m/s
(100 g), for example a shock or a bump, based on the typical mass of resistors of the respective style.
2.3.10 Substrate bending test
See EN 60115-1:2011, 4.33, with the following details:
Substrate thickness (1,6 ± 0,2) mm

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