Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20 : Résistance des CMS à boîtier plastique à l’effet combiné de l’humidité et de la chaleur de brasage

IEC 60749-20:2020 est disponible sous forme de IEC 60749-20:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L’IEC 60749-20:2020 fournit des moyens d’évaluer la résistance à la chaleur de brasage des semiconducteurs sous emballage comme les composants à boîtier plastique pour montage en surface (CMS). Cet essai est destructif. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente: - incorporation d’un corrigendum de l’IEC 60749-20:2008 (deuxième édition), - inclusion d’un nouvel Article 3, - inclusion de notes explicatives.

Polprevodniške naprave - Metode za mehansko in klimatsko preskušanje - 20. del: Odpornost elementov SMD v plastičnih ohišjih proti kombiniranemu učinkovanju vlage in spajkalne vročine

General Information

Status
Published
Publication Date
08-Oct-2020
Current Stage
6060 - Document made available - Publishing
Start Date
09-Oct-2020
Completion Date
09-Oct-2020

Relations

Buy Standard

Standard
EN IEC 60749-20:2020
English language
30 pages
sale 10% off
Preview
sale 10% off
Preview
e-Library read for
1 day

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 60749-20:2020
01-december-2020
Nadomešča:
SIST EN 60749-20:2010
Polprevodniške naprave - Metode za mehansko in klimatsko preskušanje - 20. del:
Odpornost elementov SMD v plastičnih ohišjih proti kombiniranemu učinkovanju
vlage in spajkalne vročine
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of
plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20:
Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD)
gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
20: Résistance des CMS à boîtiers plastique à l'effet combiné de l'humidité et de la
chaleur de brasage
Ta slovenski standard je istoveten z: EN IEC 60749-20:2020
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 60749-20:2020 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 60749-20:2020

---------------------- Page: 2 ----------------------
SIST EN IEC 60749-20:2020


EUROPEAN STANDARD EN IEC 60749-20

NORME EUROPÉENNE

EUROPÄISCHE NORM
October 2020
ICS 31.080.01 Supersedes EN 60749-20:2009 and all of its
amendments and corrigenda (if any)
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 20: Resistance of plastic encapsulated SMDs to the
combined effect of moisture and soldering heat
(IEC 60749-20:2020)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 20 : Résistance des Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter
CMS à boîtier plastique à l'effet combiné de l'humidité et de oberflächenmontierbarer Bauelemente (SMD) gegenüber
la chaleur de brasage der kombinierten Beanspruchung von Feuchte und
(IEC 60749-20:2020) Lötwärme
(IEC 60749-20:2020)
This European Standard was approved by CENELEC on 2020-10-05. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.



European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 60749-20:2020 E

---------------------- Page: 3 ----------------------
SIST EN IEC 60749-20:2020
EN IEC 60749-20:2020 (E)
European foreword
The text of document 47/2634(F)/FDIS, future edition 3 of IEC 60749-20, prepared by IEC/TC 47
“Semiconductor devices” was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-20:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-07-05
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-10-05
document have to be withdrawn
This document supersedes EN 60749-20:2009 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-20:2020 was approved by CENELEC as a European
Standard without any modification.
2

---------------------- Page: 4 ----------------------
SIST EN IEC 60749-20:2020
EN IEC 60749-20:2020 (E)
Annex ZA
(normative)

Normative refe
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.