EN 60122-1:2002

Quartz crystal units of assessed quality - Part 1: Generic specification

Specifies the methods of test and general requirements for quartz crystal units of assessed quality using either capability approval or qualification approval procedures.

Schwingquarze mit bewerteter Qualität - Teil 1: Fachgrundspezifikation

Résonateurs à quartz sous assurance de la qualité - Partie 1: Spécification générique

Spécifie les méthodes d'essai et les exigences générales pour les résonateurs à quartz dont la qualité est garantie par les procédures d'agrément de savoir-faire ou par les procédures d'homologation.

Quartz crystal units of assessed quality - Part 1: Generic specification (IEC 60122-1:2002)

Ta del standarda IEC 60122 določa preskusne metode in splošne zahteve za kristalne enote določene kakovosti z uporabo postopkov odobritve zmogljivosti ali ustreznosti.

General Information

• Status: Published
• Publication Date: 09-Dec-2002
• Withdrawal Date: 30-Sep-2005
• ICS: 31.140 - Piezoelectric devices
• Technical Committee: CLC/SR 49 - Piezoelectric and dielectric devices for frequency control and selection
• Drafting Committee: IEC/TC 49 - IEC_TC_49
• Parallel Committee: IEC/TC 49 - IEC_TC_49
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 10-Dec-2002
• Completion Date: 10-Dec-2002
• Ref Project: SIST EN 60122-1:2004 - Quartz crystal units of assessed quality -- Part 1: Generic specification

Relations

• Replaces: EN 168000:1993/A2:1998 - Generic Specification: Quartz crystal units
• Effective Date: 28-Jan-2023
• Amended By: EN 60122-1:2002/A1:2018 - Quartz crystal units of assessed quality - Part 1: Generic specification
• Effective Date: 23-Jan-2023

Overview

EN 60122-1:2002 - Quartz crystal units of assessed quality, Part 1: Generic specification defines the general requirements and test methods for quartz crystal units supplied under an assessed-quality system. The standard supports two approval procedures: capability approval and qualification approval, and is intended for manufacturers, test laboratories and purchasers who require verified quality and conformance for frequency-control components.

Key topics and technical requirements

• Quality assessment procedures
  • Two primary approval routes: capability approval and qualification approval.
  • Manufacturer approval, application/granting procedures, documentation (capability manual), screening, release and record-keeping.
• Electrical tests
  • Measurement of resonance frequency and resonance resistance, motional parameters, shunt capacitance, load resonance, and drive level dependency (DLD).
  • Procedures for frequency vs temperature and for unwanted responses.
• Mechanical and environmental tests
  • Robustness of terminations, sealing (leak tests), solderability and resistance to soldering heat, rapid change of temperature, bump, vibration, shock, and free-fall tests.
• Visual, dimensional and marking requirements
  • Defined visual inspections (A, B, C), gauging/dimension checks and marking rules for traceability.
• Preferred ratings and characteristics
  • Guidance on ambient and oven temperature ranges, frequency tolerances, circuit/drive level conditions and climatic categories.
• Test conditions and precision
  • Standard test environments, alternative methods, and measurement precision expectations.

Practical applications - who uses this standard

• Crystal and oscillator manufacturers for product design, production control and to obtain capability or qualification approval.
• Quality engineers and test laboratories implementing consistent test methods for acceptance and certification.
• Procurement and compliance teams who specify assessed-quality components for electronics in telecommunications, automotive, aerospace, medical and industrial systems.
• Design engineers needing assured frequency stability and reliability data (resonance, DLD, environmental robustness) for circuit and system design.

Related standards (normative references)

Common companion standards referenced by EN 60122-1:2002 include:

• IEC/EN 60068 series (environmental testing)
• IEC 60444 series (measurement methods for quartz parameters)
• IEC 60122-3 (standard outlines and lead connections)
• IEC 61178 and IECQ documents (IEC Quality Assessment System for electronic components)
• ISO 1000 (SI units)

EN 60122-1:2002 is the primary generic specification for assessed-quality quartz crystal units and should be used together with the sectional and measurement standards listed above to implement a complete test and approval program.

Keywords: EN 60122-1:2002, quartz crystal units, assessed quality, capability approval, qualification approval, test methods, resonance frequency, drive level dependency, environmental testing, IECQ.

Standards Content (Sample)

SLOVENSKI SIST EN 60122-1:2004

STANDARD
julij 2004
Quartz crystal units of assessed quality - Part 1: Generic specification (IEC 60122-
1:2002)
ICS 31.140 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 60122-1
NORME EUROPÉENNE
EUROPÄISCHE NORM December 2002

ICS 31.140 Supersedes EN 168000:1993 + A2:1998

English version
Quartz crystal units of assessed quality
Part 1: Generic specification
(IEC 60122-1:2002)
Résonateurs à quartz sous assurance  Schwingquarze mit bewerteter Qualität
de la qualité Teil 1: Fachgrundspezifikation
Partie 1: Spécification générique (IEC 60122-1:2002)
(CEI 60122-1:2002)
This European Standard was approved by CENELEC on 2002-10-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60122-1:2002 E
Foreword
The text of document 49/551/FDIS, future edition 3 of IEC 60122-1, prepared by IEC TC 49,
Piezoelectric and dielectric devices for frequency control and selection, was submitted to the
IEC-CENELEC parallel vote and was approved by CENELEC as EN 60122-1 on 2002-10-01.
This European Standard supersedes EN 168000:1993 + A2:1998.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-10-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60122-1:2002 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58:1999 (not modified).
IEC 60068-2-64 NOTE Harmonized as EN 60068-2-64:1994 (not modified).
__________
- 3 - EN 60122-1:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60027 Series Letter symbols to be used in electrical HD 245 Series
technology
IEC 60050-561 1991 International Electrotechnical - -
Vocabulary (IEV)
Chapter 561: Piezoelectric devices for
frequency control and selection

1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance
IEC 60068-2-1 1990 Part 2: Tests - Tests A: Cold EN 60068-2-1 1993

2)
IEC 60068-2-2 1974 Part 2: Tests - Test B: Dry heat EN 60068-2-2 1993

3)
IEC 60068-2-3 1969 Part 2: Tests - Test Ca: Damp heat, HD 323.2.3 S2 1987
steady state
IEC 60068-2-6 1995 Part 2: Tests - Test Fc: Vibration EN 60068-2-6 1995
+ corr. March 1995 (sinusoidal)

4)
IEC 60068-2-7 1983 Part 2: Tests - Test Ga and guidance: EN 60068-2-7 1993
Acceleration, steady state
IEC 60068-2-13 1983 Part 2: Tests - Test M: Low air pressure EN 60068-2-13 1999

5)
IEC 60068-2-14 1984 Part 2: Tests - Test N: Change of EN 60068-2-14 1999
temperature
IEC 60068-2-17 1994 Part 2: Tests - Test Q: Sealing EN 60068-2-17 1994

1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
EN 60068-2-2 includes supplement A:1976 to IEC 60068-2-2.
3)
HD 323.2.3 S2 includes A1:1984 to IEC 60068-2-3.
4)
EN 60068-2-7 includes A1:1986 to IEC 60068-2-7.
5)
EN 60068-2-14 includes A1:1986 to IEC 60068-2-14.

Publication Year Title EN/HD Year
6)
IEC 60068-2-20 1979 Part 2: Tests - Test T: Soldering HD 323.2.20 S3 1988

IEC 60068-2-21 1999 Part 2-21: Tests - Test U: Robustness of EN 60068-2-21 1999
terminations and integral mounting
devices
IEC 60068-2-27 1987 Part 2: Tests - Test Ea and guidance: EN 60068-2-27 1993
Shock
IEC 60068-2-29 1987 Part 2: Tests - Test Eb and guidance: EN 60068-2-29 1993
+ corr. Bump
7)
IEC 60068-2-30 1980 Part 2: Tests - Test Db and guidance: EN 60068-2-30 1999
Damp heat, cyclic (12 + 12 hour cycle)

8)
IEC 60068-2-32 1975 Part 2: Tests - Test Ed: Free fall EN 60068-2-32 1993

IEC 60068-2-45 1980 Part 2: Tests - Test Xa and guidance: EN 60068-2-45 1992
Immersion in cleaning solvents

IEC 60122-3 2001 Quartz crystal units of assessed quality EN 60122-3 2001
Part 3: Standard outlines and lead
connections
IEC 60444-1 1986 Measurement of quartz crystal unit EN 60444-1 1997
parameters by zero phase technique in
a pi-network
Part 1: Basic method for the
measurement of resonance frequency
and resonance resistance of quartz
crystal units by zero phase technique in
a pi-network
IEC 60444-2 1980 Part 2: Phase offset method for EN 60444-2 1997
measurement of motional capacitance
of quartz crystal units
IEC 60444-4 1988 Part 4: Method for the measurement of EN 60444-4 1997
the load resonance frequency fL, load
resonance resistance RL and the
calculation of other derived values of
quartz crystal units, up to 30 MHz

IEC 60444-5 1995 Part 5: Methods for the determination of EN 60444-5 1997
equivalent electrical parameters using
automatic network analyzer techniques
and error correction
IEC 60444-6 1995 Part 6: Measurement of drive level EN 60444-6 1997
dependence (DLD)
6)
HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20.
7)
EN 60068-2-30 includes A1:1985 to IEC 60068-2-30.
8)
EN 60068-2-32 includes A2:1990 to IEC 60068-2-32.

- 5 - EN 60122-1:2002
Publication Year Title EN/HD Year
IEC 60617 Series Graphical symbols for diagrams EN 60617 Series

IEC 61178-2 1993 Quartz crystal units - A specification in - -
the IEC Quality Assessment System for
electronic Components (IECQ)
Part 2: Sectional specification -
Capability approval
IEC 61178-3 1993 Part 3: Sectional specification - - -
Qualification approval
IEC QC 001001 2000 IEC Quality Assessment System for - -
Electronic Components (IECQ)- Basic
rules
IEC QC 001002-2 1998 IEC Quality Assessment System for - -
Electronic Components (IECQ) - Rules
of Procedure
Part 2: Documentation
IEC QC 001002-3 1998 Part 3: Approval procedures - -

IEC QC 001005 2000 Register of firms, products and services - -
approved under the IECQ system,
including ISO 9000
ISO 1000 1992 SI units and recommendations for the - -
use of their multiples and of certain
other units
NORME CEI
INTERNATIONALE IEC
60122-1
INTERNATIONAL
QC 680000
STANDARD
Troisième édition
Third edition
2002-08
Résonateurs à quartz sous assurance
de la qualité –
Partie 1:
Spécification générique
Quartz crystal units of assessed quality –
Part 1:
Generic specification
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
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électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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Pour prix, voir catalogue en vigueur
For price, see current catalogue

60122-1 © IEC:2002 – 3 –
CONTENTS
FOREWORD . 9
1 General .13
1.1 Scope .13
1.2 Normative references .13
1.3 Order of precedence.17
2 Terminology and general requirements .17
2.1 General .17
2.2 Terms, definitions and classification of phenomena .17
2.3 Preferred ratings and characteristics .47
o
2.3.1 Temperature ranges in degrees Celsius ( C) suitable for
ambient operation .47
o
2.3.2 Elevated temperature ranges in degrees Celsius ( C) suitable
for oven control.47
–6
2.3.3 Frequency tolerance (1×10 ) .47
2.3.4 Circuit conditions .47
2.3.5 Levels of drive .47
2.3.6 Drive level dependency.49
2.3.7 Climatic category .49
2.3.8 Bump severity.49
2.3.9 Vibration severity .51
2.3.10 Shock severity .51
2.3.11 Leak rate .51
2.4 Marking .51
3 Quality assessment procedures .53
3.1 Primary stage of manufacture .53
3.2 Structurally similar components .53
3.3 Subcontracting .53
3.4 Manufacturer’s approval .53
3.5 Approval procedures.53
3.5.1 General.53
3.5.2 Capability approval .53
3.5.3 Qualification approval .55
3.6 Procedures for capability approval.55
3.6.1 General.55
3.6.2 Eligibility for capability approval.55
3.6.3 Application for capability approval.55
3.6.4 Granting of capability approval.55
3.6.5 Capability manual .55
3.7 Procedures for qualification approval.55
3.7.1 General.55
3.7.2 Eligibility for qualification approval.55
3.7.3 Application for qualification approval.57
3.7.4 Granting of qualification approval.57
3.7.5 Quality conformance inspection .57
3.8 Test procedures.57
3.9 Screening requirements.57

60122-1 © IEC:2002 – 5 –
3.10 Rework and repair work .57
3.10.1 Rework .57
3.10.2 Repair work .57
3.11 Certified records of released lots .57
3.12 Validity of release .57
3.13 Release for delivery.59
3.14 Unchecked parameters .59
4 Test and measurement procedures .59
4.1 General .59
4.2 Alternative test methods .59
4.3 Precision of measurement .59
4.4 Standard conditions for testing .59
4.5 Visual inspection .61
4.5.1 Visual test A .61
4.5.2 Visual test B .61
4.5.3 Visual test C .61
4.6 Dimensioning and gauging procedures .61
4.6.1 Dimensions, test A.61
4.6.2 Dimensions, test B.61
4.7 Electrical test procedures .61
4.7.1 Frequency and resonance resistance.61
4.7.2 Drive level dependency.61
4.7.3 Frequency and resonance resistance as a function of temperature .63
4.7.4 Unwanted responses .63
4.7.5 Shunt capacitance .63
4.7.6 Load resonance frequency and resistance .65
4.7.7 Frequency pulling range (f , f ).65
L1 L2
4.7.8 Motional parameters .65
4.7.9 Insulation resistance .65
4.8 Mechanical and environmental test procedures.65
4.8.1 Robustness of terminations (destructive) .65
4.8.2 Sealing tests (non-destructive).67
4.8.3 Soldering (solderability and resistance to soldering heat) (destructive) .71
4.8.4 Rapid change of temperature, two-fluid bath method (non-destructive) .71
4.8.5 Rapid change of temperature with prescribed time of transition
(non-destructive).71
4.8.6 Bump (destructive).71
4.8.7 Vibration (destructive).73
4.8.8 Shock (destructive) .73
4.8.9 Free fall (destructive).73
4.8.10 Acceleration, steady state (non-destructive).73
4.8.11 Dry heat (non-destructive) .73
4.8.12 Damp heat, cyclic (destructive) .73
4.8.13 Cold (non-destructive).73
4.8.14 Climatic sequence (destructive) .75
4.8.15 Damp heat, steady state (destructive).75
4.8.16 Immersion in cleaning solvents (non-destructive) .75

60122-1 © IEC:2002 – 7 –
4.9 Endurance test procedure.75
4.9.1 Ageing (non-destructive).75
4.9.2 Extended ageing (non-destructive).77
Bibliography.79
Figure 1 – Symbol and equivalent electrical circuit of a piezoelectric resonator .21
Figure 2 – Impedance |Z|, resistance R , reactance X , series arm reactance X of
e e 1
a piezoelectric resonator as a function of frequency .27
Figure 3 – Impedance and admittance diagram of a piezoelectric resonator .29
Figure 4 – Resonance, anti-resonance and load resonance frequencies.31
Figure 5 – Equivalent circuit of a piezoelectric resonator with a series (load)
capacitance C .45
L
Figure 6 – Terminal bend test tool.69
Table 1 – List of symbols used for the equivalent electric circuit of
a piezoelectric resonator .37
Table 2 – Solutions for the various characteristic frequencies .41
Table 3 – Minimum values for the ratio Q r to be expected for various types
of piezoelectric resonators .41
Table 4 – Approximate relations between the characteristic frequencies and the series
resonance frequency f of a piezoelectric resonator .43
s
60122-1 © IEC:2002 – 9 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY –
Part 1: Generic specification
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60122-1 has been prepared by IEC technical committee 49:
Piezoelectric and dielectric devices for frequency control and selection.
This third edition of IEC 60122-1 cancels and replaces IEC 61178-1 published in 1993 and
IEC 60302 published in 1969 and constitutes their technical revision.
International Standard IEC 60122-1 is the first part of a new edition of the IEC standard series
for quartz crystal units of assessed quality.
The text of this standard is based on the following documents:
FDIS Report on voting
49/551/FDIS 49/558/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.

60122-1 © IEC:2002 – 11 –
IEC 60122 consists of the following parts under the general title: Quartz crystal units of
assessed quality:
– Part 1: Generic specification (IEC 60122-1);
– Part 2: Guide to the use of quartz crystal units for frequency control and selection
(IEC 60122-2 at present);
– Part 3: Standard outlines and lead connections (IEC 60122-3);
– Part 4: Sectional specification – Capability Approval (IEC 61178-2 at present);
– Part 4-1: Blank detail specification – Capability Approval (IEC 61178-2-1 at present);
– Part 5: Sectional specification – Qualification Approval (IEC 61178-3 at present);
– Part 5-1: Blank detail specification – Qualification Approval (IEC 61178-3-1 at present).
The QC number which appears on the front cover of this publication is the specification
number in the IEC Quality Assessment System for Electronic Components (IECQ).
The committee has decided that the contents of this publication will remain unchanged until
2007. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
60122-1 © IEC:2002 – 13 –
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY –
Part 1: Generic specification
1 General
1.1 Scope
This part of IEC 60122 specifies the methods of test and general requirements for quartz
crystal units of assessed quality using either capability approval or qualification approval
procedures.
1.2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60027(all parts), Letter symbols to be used in electrical technology
IEC 60050(561):1991, International Electrotechnical Vocabulary (IEV) – Chapter 561:
Piezoelectric devices for frequency control and selection
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-1:1990, Environmental testing – Part 2: Tests – Tests A: Cold
IEC 60068-2-2:1974, Environmental testing – Part 2: Tests – Tests B: Dry heat
IEC 60068-2-3:1969, Environmental testing – Part 2: Tests – Test Ca: Damp heat, steady state
IEC 60068-2-6:1995, Environmental testing – Part 2: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-7:1983, Environmental testing – Part 2: Tests – Test Ga: Acceleration,
steady state
IEC 60068-2-13:1983, Environmental testing – Part 2: Tests – Test M: Low air pressure
IEC 60068-2-14:1984, Environmental testing – Part 2: Tests – Test N: Change of temperature
IEC 60068-2-17:1994, Basic environmental testing procedures– Part 2: Tests – Test Q: Sealing
IEC 60068-2-20:1979, Environmental testing – Part 2: Tests – Test T: Soldering
IEC 60068-2-21:1999, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices

60122-1 © IEC:2002 – 15 –
IEC 60068-2-27:1987, Environmental testing – Part 2: Tests – Test Ea and guidance: Shock
IEC 60068-2-29:1987, Environmental testing – Part 2: Tests – Test Eb and guidance: Bump
IEC 60068-2-30:1980, Environmental testing – Part 2: Tests – Test Db and guidance: Damp
heat, cyclic (12 + 12-hour cycle)
IEC 60068-2-32:1975, Environmental testing – Part 2: Tests – Test Ed: Free fall (Procedure 1)
IEC 60068-2-45:1980, Environmental testing – Part 2: Tests – Test XA and guidance:
Immersion in cleaning solvents
IEC 60122-3:2001, Quartz crystal units of assessed quality – Part 3: Standard outlines and
lead connections
IEC 60444-1:1986, Measurement of quartz crystal unit parameters by zero phase technique in
a π-network – Part 1: Basic method for the measurement of resonance frequency and
resonance resistance of quartz crystal units by zero phase techniques in a π-network
IEC 60444-2:1980, Measurement of quartz crystal unit parameters by zero phase technique in
a π-network – Part 2: Phase offset method for the measurement of motional capacitance of
quartz crystal units
IEC 60444-4:1988, Measurement of quartz crystal unit parameters by zero phase technique in
a π-network – Part 4: Method for the measurement of the load resonance frequency f , load
L
resonance resistance R and the calculation of other derived values of quartz crystal units, up
L
to 30 MHz
IEC 60444-5:1995, Measurement of quartz crystal unit parameters – Part 5: Methods for the
determination of equivalent electrical parameters using automatic network analyzer
techniques and error corrections
IEC 60444-6:1995, Measurement of quartz crystal unit parameters – Part 6: Measurement of
drive level dependence (DLD)
IEC 60617 (all parts), Graphical symbols for diagrams
IEC 61178-2:1993, Quartz crystal units – A specification in the IEC Quality Assessment
System for Electronic Components (IECQ) – Part 2: Sectional specification – Capability
approval
IEC 61178-3:1993, Quartz crystal units – A specification in the IEC Quality Assessment
System for Electronic Components (IECQ) – Part 3: Sectional specification – Qualification
approval
IEC QC 001001:2000, IEC Quality Assessment System for Electronic Components (IECQ) –
Basic Rules
IEC QC 001002-2:1998, ICQ Quality Assessment System for Electronic Components (IECQ) –
Rules of Procedure – Part 2: Documentation
IEC QC 001002-3:1998, IEC Quality Assessment System for Electronic Components (IECQ) –
Rules of Procedure – Part 3: Approval Procedures

60122-1 © IEC:2002 – 17 –
IEC QC 001005:2000, Register of firms, products and services approved under the IECQ
System, including ISO 9000
ISO 1000:1992, Sl units and recommendations for the use of their multiples and of certain
other units
1.3 Order of precedence
Where any discrepancies occur for any reason, documents shall rank in the following order of
precedence:
– the detail specification;
– the sectional specification;
– the generic specification;
– any other international documents (for example of the IEC) to which reference is made.
The same order of precedence shall apply to equivalent national documents.
2 Terminology and general requirements
2.1 General
Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken
from the following standards: IEC 60027, IEC 60050(561), IEC 60617 and ISO 1000.
2.2 Terms, definitions and classification of phenomena
The following paragraphs contain additional terminology applicable to quartz crystal units and
describe certain phenomena in this context.
2.2.1
crystal element (crystal blank)
piezoelectric material cut to a given geometrical shape, size and orientation with respect to
the crystallographic axes of the crystal
2.2.2
electrode
an electrically conductive plate or film in contact with, or in proximity to, a face of a crystal
element by means of which an electric field is applied to the element
2.2.3
crystal resonator
a mounted crystal element that vibrates when an alternating electric field exists between the
electrodes
2.2.4
mounting
the means by which the crystal resonator is supported (within its enclosure)
2.2.5
enclosure
the enclosure protecting the crystal resonator(s) and mounting

60122-1 © IEC:2002 – 19 –
2.2.6
enclosure type
a crystal enclosure of specific outline dimensions and material with a defined method of
sealing
2.2.7
crystal unit
a crystal resonator mounted in an enclosure
2.2.8
socket
a component into which the crystal unit is inserted to hold the crystal unit and to provide
electrical connection
2.2.9
mode of vibration
the pattern of motion in a vibrating body of the individual particles resulting from stresses
applied to the body, the frequency of oscillation and the boundary conditions existing. The
common modes of vibration are:
–flexural;
– extensional;
– face shear;
– thickness shear.
2.2.10
fundamental crystal unit
a crystal resonator designed to operate at the lowest order of a given mode
2.2.11
overtone crystal unit
a crystal resonator designed to operate at a higher order than the lowest of the given mode
2.2.12
overtone order
the numbers allotted to the successive overtones of a given mode of vibration from the
ascending series of integral numbers commencing with the fundamental as unity. For shear
and extensional modes, this overtone is the integral multiple of the fundamental frequency to
which the overtone frequency approximates
2.2.13
crystal unit equivalent circuit
the electric circuit which has the same impedance as the crystal unit in the region of the
desired resonance and anti-resonance frequencies. It is represented by an inductance,
capacitance and resistance in series, this series arm being shunted by the capacitance
between the terminals of the unit. The parameters of the series branch of inductance,
capacitance and resistance are given by L , C and R respectively: these are termed
1 1 1
“motional parameters” of the crystal unit. The shunt (parallel) capacitance is denoted by C
(see figure 1).
60122-1 © IEC:2002 – 21 –
The parameters are independent of frequency for isolated modes of motion. Generally, the
mode in question is sufficiently isolated from other modes to permit this assumption. When
this is not true, the equations and measuring methods outlined herein do not apply. For
identification of symbols used in this standard, see table 1.
NOTE 1 The equivalent circuit does not represent all the characteristics of a crystal unit.
NOTE 2 The values of R , X , G and B vary rapidly around the resonance frequency,
e e p p
where
R is the equivalent circuit series resistance of the resonator;
e
Xe is the equivalent circuit series reactance of the resonator;
G is the equivalent circuit parallel conductance of the resonator;
p
B is the equivalent circuit parallel susceptance of the resonator.
p
IEC  1931/02
Figure 1 – Symbol and equivalent electrical circuit of
a piezoelectric resonator
2.2.14
motional resistance (R )
the resistance in the motional (series) arm of the equivalent circuit
2.2.15
motional inductance (L )
the inductance in the motional (series) arm of the equivalent circuit
2.2.16
motional capacitance (C )
the capacitance in the motional (series) arm of the equivalent circuit
2.2.17
shunt capacitance (C )
the capacitance in parallel with the motional arm of the equivalent circuit

60122-1 © IEC:2002 – 23 –
2.2.18
parameters of piezoelectric resonators
the fundamental parameters C , L , R and C define the equivalent electric circuit shown
1 1 1 0
in figure 1, and all other parameters may be derived from them. At a given frequency,
the parameters of the equivalent electric circuit generally approach constant values as the
amplitude of vibration approaches zero. The amplitude which can be tolerated before
the parameters are appreciably affected varies widely between resonators of various types
and can only be determined by experiment.
The equation for the impedance Z or admittance Y:
1 j ȍ − jδ
Z = = × (1)
Y ωC 1−ȍ + jδ
of the equivalent electric circuit of the piezoelectric resonator is the basic equation describing
the relationships between the various parameters.
In equation (1):
2 2
f − f
s
ȍ = and δ = 2πfC R
0 1
2 2
f − f
p s
are the normalized frequency factor and the normalized damping factor, respectively. See
table 1, for definitions of f , f , and the other symbols used in equation (1) and for other
p s
essential parameters. The characteristic frequencies of equation (1) are defined in table 2.
The magnitude of the impedance of the equivalent electric network (|Z|), its resistive
component (R ), its reactive component (X ), and the reactance X of the L , C , R branch
e e 1 1 1 1
are plotted as functions of frequency in figure 2, for the purpose of defining the different
characteristic frequencies. |Z | and |Z | denote minimum and maximum impedance
m n
respectively, and R , R the impedances at zero phase angle. These curves, however, have
r a
only qualitative character and do not represent a particular piezoelectric resonator.
For further clarification, the impedance and admittance circles of a piezoelectric resonator are
reproduced in figure 3. However, the circle representation of the impedance or admittance of
a piezoelectric resonator is valid only if the circle diameter of the admittance diagram is large
compared with the change of 2 πfC in the resonance range or if r << Q , which is fulfilled in
most resonators. If the latter conditions are not fulfilled, the admittance curve shows a
cissoidal character. Throughout the remainder of this standard, it is assumed that the
impedance (or admittance) of the resonator can be represented by a circle diagram. Table 3
gives data for Q, r, and Q r for various types of resonators, indicating that this assumption
is valid for all practical cases.
It is necessary to make approximations in deriving practical equations for general use. It is
the error of these approximations, in addition to the errors of instrumentation that govern the
overall accuracy of the experimentally derived parameters.

60122-1 © IEC:2002 – 25 –
As a first approximation sufficient for many practical purposes, the following assumptions
can be made:
f = f = f and f = f = f
m r s a n p
More exact relations between the characteristic frequencies f , f , f , f , f , and the series
m r a p n
resonance frequency f of a resonator, valid for the figure of merit M > 10 and the capacitance
s
ratio r > 10, are shown in table 4. These relationships have been derived by various authors
under the assumption that M >> 1.
The separation between parallel and series resonance frequencies is given by:
2 2
f − f
C
p s 1
= = (2)
C r
f 0
s
The approximation:
f − f
p s
−1
= 1+r − 1
f
s
1 § 1 · 1
= 1− + . ≈
¨ ¸
2r 4r 2r
© ¹
(3)
1 C
=
2 C
can be used for larger values of r (for example, when r is greater than 25, the error is less
than 1 %).
2.2.19
resonance frequency (f )
r
the lower of the two frequencies of the crystal unit alone, under specified conditions, at which
the electrical impedance of the crystal unit is resistive
2.2.20
resonance resistance (R )
r
the resistance of the crystal unit alone at the resonance frequency f
r
2.2.21
anti-resonance frequency (f )
a
the higher of the two frequencies of the crystal unit alone, under specified conditions, at which
the electrical impedance of the crystal unit is resistive
2.2.22
load capacitance (C )
L
the effective external capacitance associated with the crystal unit which determines the load
resonance frequency f
L
2.2.23
load resonance frequency (f )
L
one of the two frequencies of a crystal unit in association with a series or with a parallel load
capacitance, under specified conditions at which the electrical impedance of the combination
is resistive. The load resonance frequency is the lower of the two frequencies when the load
capacitance is in series and the higher when it is in parallel (see figure 4).

60122-1 © IEC:2002 – 27 –
For a given value of load capacitance C , these frequencies are identical for all practical
L
purposes and are given by the expression
1 LC (C +C )
1 1 0 L
= 2π (4)
f C +C +C
L 1 0 L
NOTE 1 The frequencies defined in 2.2.19, 2.2.21 and 2.2.23 are listed as being the terms more commonly used.
The frequencies associated with a quartz crystal are numerous and for a full explanation tables 2 and 4 should be
consulted.
NOTE 2 When higher accuracies are required or secondary data (for example, values of crystal unit motional
parameters) are to be derived from the frequency measurements, table 1, IEC 60444-1 and IEC 60444-5 should be
consulted.
⏐Z ⏐
n
R
a
⏐Z⏐
⏐Z⏐
R
e
X
R
r
⏐Z ⏐
m
R
e
X
e
f f f f f f
m s r a p n
Frequency
IEC  1932/02
Figure 2 – Impedance |Z|, resistance R , reactance X , series arm reactance X
e e 1
of a piezoelectric resonator as a function of frequency
Impedance
60122-1 © IEC:2002 – 29 –
f
R
r
Resistance
f
R a
a
f
r
f
Z
m s
Y
m
f
m
X
Z
n
Y
n
f
p
f
n
X
R
R
f
f
m
Y
m
Z
m
f
s
f
n
X
Conductance
f
p
R
r
Y
n
Z 1 f f
a
n r
R
a
IEC  1933/02
Figure 3 – Impedance and admittance diagram of a piezoelectric resonator
The symbols conform with those in table 1 and figure 2.
– Reactance +
– Susceptance +
60122-1 © IEC:2002 – 31 –
+
Reactance, Ω
∞
f
r
f
a
a)
–
+
C
L
Reactance, Ω
∞
f f
L a
b)
–
+
Reactance, Ω
∞
C
L
f f
r L
c)
–
IEC  1934/02
NOTE 1 The values of load capacitances shown in b) and c) are equal.
NOTE 2 See 2.2.19, 2.2.21 and 2.2.23.
Figure 4 – Resonance, anti-resonance and load resonance frequencies
2.2.24
load resonance resistance (R )
L
the resistance of the crystal unit in series with a stated external capacitance at the load
resonance frequency f .
L
NOTE To a close approximation the value of R is related to the value of R by the expression:
L r
§ ·
C
¨ ¸
R ≅ R 1+ (5)
L r
¨ ¸
C
© L ¹
2.2.25
nominal frequency (f )
nom
the frequency assigned to the crystal unit by the manufacturer

60122-1 © IEC:2002 – 33 –
2.2.26
working frequency (f )
w
the operational frequency of the crystal unit together with associated circuits
2.2.27
load resonance frequency offset (ǻf )
L
ǻf = f – f (6)
L L r
It can be calculated approximately from
f C
r 1
ǻf ≅ (7)
L
2(C +C )
0 L
In usage, the load resonance frequency offset ǻf for a given value of load capacitance can
L
be written as, for instance, ǻf or ǻf to indicate the actual value of load capacitance in
30 20
picofarads involved.
2.2.28
fractional load resonance frequency offset (D )
L
f − f
L r
D = (8)
L
f
r
It can be calculated approximately from
C
D ≅ (9)
L
2(C +C )
0 L
This can also be written as, for instance, D to indicate the fractional load resonance
frequency offset D with a load capacitance of 30 pF.
L
2.2.29
frequency pulling range (ǻf )
L1,L2
ǻf = | f – f | (10)
L1,L2 L1 L2
It can be calculated approximately from:
f C (C −C )
r 1 L2 L1
ǻf = (11)
L1,L2
2(C +C )(C +C )
0 L1 0 L2
This can also be written as, for instance ǻf to indicate the frequency pulling range
20,30
between load capacitances of 20 pF and 30 pF
2.2.30
fractional pulling range (D )
L1,L2
f − f
L1 L2
D = = D −D (12)
L1, L2 L1 L2
f
r
60122-1 © IEC:2002 – 35 –
It can be calculated approximately from:
C (C −C )
1 L2 L1
D = (13)
L1,L2
2(C +C )(C +C )
0 L1 0 L2
This can be written as, for instance, D , to indicate the fractional pulling range between
20,30
load capacitanc
...