CLC/TS 50466:2006
(Main)Long duration storage of electronic components - Specification for implementation
Long duration storage of electronic components - Specification for implementation
This document, which is in line with IEC/PAS 62435 relating to the management of obsolescence of electronic components, is first of all a practical guide to methods of long duration storage (more than 5 years) which summarizes the existing practices in the industry.
Langzeitlagerung von elektronischen Bauelementen - Spezifikation für die Ausführung
Stockage longue durée des composants électroniques - Guide de mise en oeuvre
Dolgotrajno hranjenje elektronskih komponent - Specifikacija uporabe
General Information
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TECHNICAL SPECIFICATION
CLC/TS 50466
SPÉCIFICATION TECHNIQUE
May 2006
TECHNISCHE SPEZIFIKATION
ICS 31.020
English version
Long duration storage of electronic components –
Specification for implementation
Stockage longue durée des composants Langzeitlagerung von elektronischen
électroniques – Bauelementen –
Guide de mise en oeuvre Spezifikation für die Ausführung
This Technical Specification was approved by CENELEC on 2005-12-03.
CENELEC members are required to announce the existence of this TS in the same way as for an EN and to
make the TS available promptly at national level in an appropriate form. It is permissible to keep conflicting
national standards in force.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. CLC/TS 50466:2006 E
Foreword
This Technical Specification was prepared by the Technical Committee CENELEC TC 107X,
Process management for avionics.
The text of the draft was submitted to the formal vote and was approved by CENELEC as
CLC/TS 50466 on 2005-12-03.
The following date was fixed:
– latest date by which the existence of the CLC/TS
has to be announced at national level (doa) 2006-06-03
This document, which is in line with IEC/PAS 62435 relating to the management of
obsolescence of electronic components, is first of all a practical guide to methods of long
duration storage (more than 5 years) which summarizes the existing practices in the industry.
The application of the approach proposed in this guide in no way guarantees that the stored
components are in perfect operating condition at the end of this storage. It only comprises a
means of minimizing potential and probable degradation factors.
Unless otherwise specified, the approach, as well as the methods presented apply to all families
of electronic components:
− passive components, including quartz crystals, connectors and relays. However, components
with "manufacturer's" specifications showing an expiry date, or specific storage conditions,
are excluded from this guide (e.g. primary cells, storage cells, etc.),
− encapsulated or non-encapsulated active components of a silicon [Si] or gallium arsenide
[GaAs] technology,
− micro-electronic assemblies.
- 3 - CLC/TS 50466:2006
Contents
1 General .5
2 Normative references.5
3 Storage decision criteria .6
3.1 Advantages of storage .6
3.1.1 Technical simplicity – Rapidity.6
3.1.2 Solution durability .6
3.1.3 Preventive storage.6
3.2 Hazards – Drawbacks.6
3.2.1 Generic aging hazard.6
3.2.2 Poor stock dimensioning.7
3.2.3 Incorrect control of reliability during storage .7
3.2.4 Freezing equipment functionalities.7
3.3 Storage cost (Annex C) .7
3.4 Decision criteria.7
4 Purchasing procurement.8
4.1 List of components .8
4.2 Quantity of components to be stored.8
4.2.1 Production stock.8
4.2.2 Field service stock .8
4.3 When is it worth keeping in stock?.9
4.4 Procurement recommendations.9
5 Technical validation of the components .9
5.1 Purpose .9
5.2 Relevant field.9
5.3 Test selection criteria .10
5.4 Measurements and tests .10
5.4.1 Sampling .10
5.4.2 Visual examination, sealing, solderability.11
5.4.3 Compliance with the electrical specifications .11
5.4.3.1 Measurement of electrical parameters .11
5.4.3.2 Temperature impact .12
5.4.4 Assessment of the supplied batch reliability .12
5.4.5 Manufacturing control check (technological analysis) .14
5.5 Sanction.14
6 Conditioning and storage.14
6.1 Type of environment .14
6.2 Elementary storage unit .15
6.3 Stock management.15
6.4 Redundancy .15
6.5 Identification - Traceability .15
6.6 Initial packaging .15
6.7 Solderability.16
6.8 Stabilization bake .16
6.9 Storage conditions.16
6.9.1 Storage area .16
6.9.2 Temperature .16
6.9.3 Temperature variations.16
6.9.4 Relative humidity - Chemical attacks - Contamination .16
6.9.5 Pressure.17
6.9.6 Electrostatic discharges.17
6.9.7 Vibrations – Mechanical impacts.17
6.9.8 Electromagnetic field - Radiation .17
6.9.9 Light.17
6.10 Maintaining storage conditions .17
7 Periodic check of the components .18
7.1 Objectives .18
7.2 Periodicity.18
7.3 Tests during periodic check .18
8 De-stocking.18
8.1 Precautions .18
8.1.1 Electrostatic discharges.19
8.1.2 Mechanical impacts .19
8.2 Inspection.19
9 Feedfback .19
Annex A – Example related to components .20
A.1 Example of a component list .20
A.2 Data description.21
Annex B – Examples of periodic and/or destocking tests.22
Annex C – Parameters influencing the final price of the component storage.24
Annex D – Parameters influencing the quantity of the components to be stored .25
Annex E – Failure mechanisms - Hermetically encapsulated and
non-encapsulated active components.26
Annex F – Failure mechanisms: GaAs components.28
Bibliography . 30
Table E.1 – Failure mechanisms - Hermetically encapsulated
and non-encapsulated active components .26
Table F.1 – Failure modes compared with initial table on the silicon devices.28
Table F.2 – Failure modes specific to GaAs components .29
- 5 - CLC/TS 50466:2006
1 General
Although it has always existed to some extent, obsolescence of electronic components, and
particularly integrated circuits, has become increasingly intense over the last few years.
Indeed, with the existing technological boom, the commercial life of a component has become
very short compared with the life of industrial equipment such as those encountered in the
aeronautical field, the railway industry or the energy sector.
The many solutions enabling obsolescence to be resolved are now identified. However,
selecting one of these solutions must be preceded by a case by case technical and economic
feasibility study, depending on whether storage is envisaged for field service or production.
Remedial storage as soon as components are no longer marketed.
Preventive storage anticipating declaration of obsolescence.
Taking into account the expected life of some installations, sometimes covering several
decades, the qualification times, and the unavailability costs, which can also be very high, the
solution to be adopted to resolve obsolescence must often be rapidly implemented. This is why
the solution retained in most cases consists in systematically storing components which are in
the process of becoming obsolescent.
The technical risks of this solution are, a priori, fairly low. However, it requires the perfect
mastery of the implemented process, and especially of the storage environment, although this
mastery becomes critical when it comes to long term storage.
All handling, protection, storage and test operations should be performed in accordance with the
technology requirements of the component.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of the
referenced document (including any amendments) applies.
EN 190000:1995, Generic specification: Integrated monolithic circuits
EN 60068-2-17:1994, Environmental testing - Part 2: Tests - Test Q: Sealing
(IEC 60
...
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