EN IEC 63244-1:2021
(Main)Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
IEC 63244-1:2021 provides general requirements and specifications of the semiconductor devices for the performance and reliability evaluations of wireless power transfer and charging systems. For the performance evaluations, this part covers various characterization parameters and symbols, general system diagrams, and test setups and test conditions. This document also describes classifications of the wireless power transfer technologies.
Halbleiterbauelemente – Halbleiterbauelemente für die drahtlose Leistungsübertragung und Ladung – Teil 1: Allgemeine Anforderungen und Festlegungen
Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour le transfert de puissance et la charge sans fil – Partie 1: Exigences et spécifications générales
L’IEC 63244-1:2021 fournit des exigences et des spécifications générales des dispositifs à semiconducteurs pour les évaluations de fonctionnement et de fiabilité des systèmes de transfert de puissance et de charge sans fil. Dans le cas des évaluations de fonctionnement, la présente partie couvre différents paramètres et symboles de caractérisation, différents schémas de réseaux généraux, ainsi que différents montages et conditions d’essai. Le présent document décrit également des classifications des techniques de transfert de puissance sans fil.
Polprevodniški elementi - Polprevodniški elementi za brezžični prenos moči in napajanje - 1. del: Splošne zahteve in specifikacije (IEC 63244-1:2021)
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-december-2021
Polprevodniški elementi - Polprevodniški elementi za brezžični prenos moči in
napajanje - 1. del: Splošne zahteve in specifikacije (IEC 63244-1:2021)
Semiconductor devices - Semiconductor devices for wireless power transfer and
charging - Part 1 : General requirements and specifications (IEC 63244-1:2021)
Halbleiterbauelemente – Halbleiterbauelemente für die drahtlose Leistungsübertragung
und Ladung – Teil 1: Allgemeine Anforderungen und Festlegungen (IEC 63244-1:2021)
Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour le transfert de
puissance et la charge sans fil – Partie 1: Exigences et spécifications générales (IEC
63244-1:2021)
Ta slovenski standard je istoveten z: EN IEC 63244-1:2021
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 63244-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2021
ICS 31.080.99
English Version
Semiconductor devices - Semiconductor devices for wireless
power transfer and charging - Part 1: General requirements and
specifications
(IEC 63244-1:2021)
Dispositifs à semiconducteurs - Dispositifs à Halbleiterbauelemente - Halbleiterbauelemente für die
semiconducteurs pour le transfert de puissance et la charge drahtlose Leistungsübertragung und Ladung - Teil 1:
sans fil - Partie 1: Exigences et spécifications générales Allgemeine Anforderungen und Festlegungen
(IEC 63244-1:2021) (IEC 63244-1:2021)
This European Standard was approved by CENELEC on 2021-10-19. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 63244-1:2021 E
European foreword
The text of document 47/2706/FDIS, future edition 1 of IEC 63244-1, prepared by IEC/TC 47
“Semiconductor devices” was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 63244-1:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022–07–19
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024–10–19
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 63244-1:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60747-16-1 NOTE Harmonized as EN 60747-16-1
IEC 63028 NOTE Harmonized as EN 63028
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-1 - Environmental testing - Part 2–1: Tests - EN 60068-2-1 -
Test A: Cold
IEC 60068-2-2 - Environmental testing - Part 2–2: Tests - EN 60068-2-2 -
Test B: Dry heat
IEC 60068-2-14 - Environmental testing - Part 2–14: Tests - EN 60068-2-14 -
Test N: Change of temperature
IEC 60068-2-30 - Environmental testing - Part 2–30: Tests - EN 60068-2-30 -
Test Db: Damp heat, cyclic (12 h + 12 h
cycle)
IEC 60529 - Degrees of protection provided by - -
enclosures (IP Code)
IEC 60749-10 - Semiconductor devices - Mechanical and EN 60749-10 -
climatic test methods - Part 10: Mechanical
shock
IEC 61967-2 - Integrated circuits - Measurement of EN 61967-2 -
electromagnetic emissions, 150 kHz to
1 GHz - Part 2: Measurement of radiated
emissions - TEM cell and wideband TEM
cell method
IEC 61967-4 - Integrated circuits - Measurement of EN IEC 61967-4 -
electromagnetic emissions - Part 4:
Measurement of conducted emissions –
1 Ω /150 Ω direct coupling method
IEC 61967-8 - Integrated circuits - Measurement of EN 61967-8 -
electromagnetic emissions - Part 8:
Measurement of radiated emissions - IC
stripline method
IEC 62132-2 - Integrated circuits - Measurement of EN 62132-2 -
electromagnetic immunity - Part 2:
Measurement of radiated immunity - TEM
cell and wideband TEM cell method
IEC 62132-4 - Integrated circuits - Measurement of EN 62132-4 -
electromagnetic immunity 150 kHz to 1 GHz
- Part 4: Direct RF power injection method
IEC 62132-8 - Integrated circuits - Measurement of EN 62132-8 -
electromagnetic immunity - Part 8:
Measurement of radiated immunity - IC
stripline method
IEC 62262 - Degrees of protection provided by EN 62262 -
enclosures for electrical equipment against
external mechanical impacts (IK code)
IEC 62969-2 2018 Semiconductor devices - Semiconductor EN IEC 62969-2 2018
interface for automotive vehicles - Part 2:
Efficiency evaluation methods of wireless
power transmission using resonance for
automotive vehicles sensors
IEC CISPR 11 - Industrial, scientific and medical equipment EN 55011 -
- Radio-frequency disturbance
characteristics - Limits and methods of
measurement
IEC 63244-1 ®
Edition 1.0 2021-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor devices for wireless power transfer
and charging –
Part 1: General requirements and specifications
Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour le transfert
de puissance et la charge sans fil –
Partie 1: Exigences et spécifications générales
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-1023-2
– 2 – IEC 63244-1:2021 © IEC 2021
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and symbols. 8
3.1 Terms and definitions . 8
3.1.1 General terminology . 8
3.1.2 Terminology for near-field based wireless power transfer . 9
3.1.3 Terminology for far-field based wireless power transfer . 10
3.2 Symbols and abbreviated terms . 11
4 Classification . 12
5 Test items for reliability . 14
5.1 General . 14
5.2 IP rating . 14
5.3 Temperature test . 15
5.4 Humidity test . 15
5.5 Mechanical impact and vibration test . 15
5.6 EMC test . 15
5.6.1 General . 15
5.6.2 Electromagnetic immunity . 15
5.6.3 Electromagnetic emission . 15
6 Performance evaluation items . 16
6.1 Efficiency . 16
6.1.1 General . 16
6.1.2 Block diagram for efficiency analysis . 16
6.1.3 Component-level efficiency . 17
6.1.4 Module-level efficiency . 20
6.1.5 System-level power transfer efficiency . 22
6.2 Evaluation components in PTx and PRx . 23
6.2.1 General . 23
6.2.2 Rectifier and ripple smoothing circuit . 23
6.2.3 DC to DC converter . 26
6.2.4 Inverter . 27
6.2.5 Variable gain amplifier (VGA) . 29
Annex A (informative) Field regions for electromagnetically short antenna . 32
Bibliography . 33
Figure 1 – Classification of WET technologies . 13
Figure 2 – Example of reliability test conditions and items . 14
Figure 3 – Block diagram for efficiency analysis of MF WPT system . 16
Figure 4 – Block diagram for efficiency analysis of EMW WPT system . 16
Figure 5 – Measurement setup for AC to DC converting efficiency or rectifying
efficiency . 18
Figure 6 – Measurement setup for DC to DC converting efficiency . 19
Figure 7 – Measurement setup for DC to AC converting efficiency . 20
IEC 63244-1:2021 © IEC 2021 – 3 –
Figure 8 – Measurement setup for coupling efficiency between transmitting and
receiving coils . 21
Figure 9 – Measurement setup for power transfer efficiency between power
transmitting and receiving antennas . 22
Figure 10 – Semiconductor components in PTx and PRx .
...
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