Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

The unbiased autoclave test is performed to evaluate the moisture resistance integrity of non-hermetically packaged solid-state devices using moisture condensing or moisture saturated steam environments. It is a highly accelerated test which employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material or along the interface between the external protective material and the metallic conductors passing through it.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 33: Beschleunigte Verfahren für Feuchtebeständigkeit - Autoclave ohne elektrische Beanspruchung

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 33: Résistance à l'humidité accélérée - Autoclave sans polarisation

The unbiased autoclave test is performed to evaluate the moisture resistance integrity of non-hermetically packaged solid-state devices using moisture condensing or moisture saturated steam environments. It is a highly accelerated test which employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material or along the interface between the external protective material and the metallic conductors passing through it.

Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance, unbiased autoclave (IEC 60749-33:2004)

General Information

Status
Published
Publication Date
15-Apr-2004
Withdrawal Date
31-Mar-2007
Drafting Committee
IEC/TC 47 - IEC_TC_47
Parallel Committee
IEC/TC 47 - IEC_TC_47
Current Stage
6060 - Document made available - Publishing
Start Date
16-Apr-2004
Completion Date
16-Apr-2004

Overview

EN 60749-33:2004 is a European standard developed by CLC that specifies the mechanical and climatic test methods for semiconductor devices, particularly focusing on accelerated moisture resistance using an unbiased autoclave test. This test method is designed to evaluate the moisture integrity of non-hermetically sealed solid-state devices by exposing them to a highly accelerated moisture environment. It simulates conditions of pressure, humidity, and temperature under saturated steam or condensing moisture to expedite penetration through protective materials or along the interface between protective layers and metallic conductors.

This standard is essential for manufacturers and quality assurance professionals in the semiconductor industry to verify device reliability when exposed to moisture, preventing failures in moisture-sensitive applications.

Key Topics

  • Scope and Purpose
    The test focuses on non-hermetic semiconductor packages and their resistance to moisture ingress under accelerated conditions without electrical bias applied. It serves as a predictive measure for long-term moisture exposure effects.

  • Test Environment
    Utilizes a saturated steam atmosphere inside an autoclave that imposes elevated pressure, humidity, and temperature on the test samples, creating harsh conditions to accelerate moisture penetration.

  • Test Procedure
    Establishes specific conditions of temperature, pressure, and humidity to simulate condensing moisture impact over a shortened timeframe compared to real-life exposure, enabling quicker reliability assessments.

  • Unbiased Testing
    The absence of electrical bias ensures that failure mechanisms associated with moisture penetration are isolated from electrical stress factors, providing insights focused on material and packaging integrity.

  • Acceptance Criteria
    The standard defines methods to evaluate whether devices maintain moisture resistance without degradation or failure, using established parameters adapted for conformance checks.

Applications

  • Semiconductor Device Qualification
    Essential for qualifying new semiconductor packages, materials, and coatings against moisture-induced failure modes before market release.

  • Quality Assurance
    Used in ongoing production testing to monitor moisture resistance consistency and detect potential manufacturing process issues.

  • Reliability Engineering
    Supports reliability predictions by simulating harsh moisture environments, informing design improvements and accelerated lifetime testing.

  • Component Selection
    Enables engineers to validate the suitability of non-hermetic devices for applications in humid or moisture-prone environments such as automotive, industrial, and consumer electronics.

  • Failure Analysis Support
    Assists failure analysts in replicating moisture ingress scenarios for root-cause investigations and corrective actions.

Related Standards

  • IEC 60749-24 – Mechanical and climatic test methods for accelerated moisture resistance using an unbiased Highly Accelerated Stress Test (HAST), complementing EN 60749-33 by covering different moisture acceleration techniques.

  • IEC 60068 – General environmental testing standards covering climatic, mechanical, and other stress tests relevant to electronic components.

  • JEDEC JESD22-A101 – Moisture sensitivity testing for semiconductor devices, offering alternative test procedures aligned with packaging moisture resistance evaluation.

Practical Value

Implementing EN 60749-33:2004 ensures that manufacturers and engineers gain critical assurance on the moisture resistance performance of silicon devices packaged without hermetic seals. Its accelerated unbiased autoclave test method supports effective risk mitigation against in-field failures caused by moisture ingress. The standard’s widespread acceptance within European and international markets facilitates regulatory compliance and promotes reliability-centric design and manufacturing processes.

Key benefits of using EN 60749-33 include:

  • Early detection of moisture-related packaging weaknesses
  • Standardized method improving comparability of device moisture performance
  • Accelerated testing reducing product development cycle time
  • Enhanced confidence in device durability under humid conditions

Keywords: EN 60749-33, semiconductor devices, moisture resistance, unbiased autoclave, mechanical test methods, climatic test methods, accelerated moisture testing, non-hermetic packaging, reliability testing, semiconductor standards, CLC standard.

Frequently Asked Questions

EN 60749-33:2004 is a standard published by CLC. Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave". This standard covers: The unbiased autoclave test is performed to evaluate the moisture resistance integrity of non-hermetically packaged solid-state devices using moisture condensing or moisture saturated steam environments. It is a highly accelerated test which employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material or along the interface between the external protective material and the metallic conductors passing through it.

The unbiased autoclave test is performed to evaluate the moisture resistance integrity of non-hermetically packaged solid-state devices using moisture condensing or moisture saturated steam environments. It is a highly accelerated test which employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material or along the interface between the external protective material and the metallic conductors passing through it.

EN 60749-33:2004 is classified under the following ICS (International Classification for Standards) categories: 31.080 - Semiconductor devices. The ICS classification helps identify the subject area and facilitates finding related standards.

You can purchase EN 60749-33:2004 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of CLC standards.

Standards Content (Sample)


SLOVENSKI SIST EN 60749-33:2004

STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 33:
Accelerated moisture resistance, unbiased autoclave (IEC 60749-33:2004)
ICS 31.080.01 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 60749-33
NORME EUROPÉENNE
EUROPÄISCHE NORM April 2004
ICS 31.080
English version
Semiconductor devices –
Mechanical and climatic test methods
Part 33: Accelerated moisture resistance –
Unbiased autoclave
(IEC 60749-33:2004)
Dispositifs à semiconducteurs –  Halbleiterbauelemente –
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 33: Résistance à l'humidité Teil 33: Beschleunigte Verfahren für
accélérée – Feuchtebeständigkeit –
Autoclave sans polarisation Autoclave ohne elektrische
(CEI 60749-33:2004) Beanspruchung
(IEC 60749-33:2004)
This European Standard was approved by CENELEC on 2004-04-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-33:2004 E
Foreword
The text of document 47/1737/FDIS, future edition 1 of IEC 60749-33, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-33 on 2004-04-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-04-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-33:2004 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60749-33:2004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60749-24 - Semiconductor devices - Mechanical and EN 60749-24 2004
climatic test methods
Part 24: Accelerated moisture resistance -
Unbiased HAST
1)
Undated reference.
2)
Valid edition at date of issue.



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