EN IEC 61189-5-502:2021

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-502: Allgemeine Prüfverfahren für Materialien und Baugruppen - Prüfung des Oberflächenisolationswiderstands (OIW) von Baugruppen

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-502: Méthodes d'essai générales pour les matériaux et les ensembles - Essais de résistance d'isolement en surface (RIS) des ensembles

L’IEC 61189-5-502:2021 permet d’évaluer les variations de la résistance d’isolement en surface d’un ensemble de matériaux présélectionné sur une éprouvette représentative et quantifie les effets délétères d’une mauvaise utilisation des matériaux et des processus qui peuvent provoquer une diminution de la résistance électrique.

Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne strukture in sestave - 5-502. del: Splošne preskusne metode za materiale in sestave - Preskušanje površinske izolacijske upornosti sestavov

General Information

• Status: Published
• Publication Date: 11-Mar-2021
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 12-Mar-2021
• Completion Date: 12-Mar-2021
• Ref Project: SIST EN IEC 61189-5-502:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

Standards Content (Sample)

SLOVENSKI STANDARD
01-junij-2021
Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne
strukture in sestave - 5-502. del: Splošne preskusne metode za materiale in
sestave - Preskušanje površinske izolacijske upornosti sestavov
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 5-502: General test methods for materials and assemblies -
Surface insulation resistance (SIR) testing of assemblies
Ta slovenski standard je istoveten z: EN IEC 61189-5-502:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-5-502

NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 31.180
English Version
Test methods for electrical materials, printed board and other
interconnection structures and assemblies - Part 5-502: General
test methods for materials and assemblies - Surface insulation
resistance (SIR) testing of assemblies
(IEC 61189-5-502:2021)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 5-
ensembles - Partie 5-502: Méthodes d'essai générales pour 502: Allgemeine Prüfverfahren für Materialien und
les matériaux et les ensembles - Essais de résistance Baugruppen - Prüfung des
d'isolement en surface (RIS) des ensembles Oberflächenisolationswiderstands (SIR) von Baugruppen
(IEC 61189-5-502:2021) (IEC 61189-5-502:2021)
This European Standard was approved by CENELEC on 2021-03-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-5-502:2021 E

European foreword
The text of document 91/1646/CDV, future edition 1 of IEC 61189-5-502, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-5-502:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61189-5-502:2021 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61189-1 NOTE Harmonized as EN 61189-1
IEC 61189-3 NOTE Harmonized as EN 61189-3
IEC 61189-5 (series) NOTE Harmonized as EN IEC 61189-5 (series)
IEC 61189-6 NOTE Harmonized as EN 61189-6
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2
IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7
IEC 62137-4:2014 NOTE Harmonized as EN 62137-4:2014 (not modified)
ISO 9001 NOTE Harmonized as EN ISO 9001
ISO 9455-1 NOTE Harmonized as EN 29455-1
ISO 9455-2 NOTE Harmonized as EN ISO 9455-2
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-1 - Environmental testing - Part 1: General EN 60068-1 -
and guidance
IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - EN 60068-2-20 -
Test T: Test methods for solderability
and resistance to soldering heat of
devices with leads
IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - EN 60068-2-58 -
Test Td: Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-67 - Environmental testing - Part 2-67: Tests - EN 60068-2-67 -
Test Cy: Damp heat, steady state,
accelerated test primarily intended for
components
IEC 60068-2-78 - Environmental testing - Part 2-78: Tests - EN 60068-2-78 -
Test Cab: Damp heat, steady state
IEC 60194 - Printed board design, manufacture and - -
assembly - Terms and definitions
IEC 61190-1-3 - Attachment materials for electronic EN IEC 61190-1-3 -
assembly - Part 1-3: Requirements for
electronic grade solder alloys and fluxed
and non-fluxed solid solder for electronic
soldering applications
IEC 61189-5-502 ®
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed board and other interconnection

structures and assemblies –
Part 5-502: General test methods for materials and assemblies – Surface

Insulation Resistance (SIR) testing of assemblies

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres

structures d’interconnexion et ensembles –

Partie 5-502: Méthodes d’essai générales pour les matériaux et les ensembles –

Essais de résistance d’isolement en surface (RIS) des ensembles

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-9290-7

– 2 – IEC 61189-5-502:2021 © IEC 2021
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Equipment/Apparatus . 7
4.1 Soldering and other production process equipment . 7
4.2 Measurement instrument . 7
4.3 Resistor verification coupon . 8
4.4 Damp heat chamber . 8
4.5 Magnifiers (10x – 30x) . 9
4.6 Camera . 9
4.7 Cleaning solvent . 9
4.8 Interconnecting cable . 9
4.9 Connector rack . 9
4.10 Solder flux . 9
5 Test coupon. 9
5.1 Test coupon artwork . 9
5.1.1 General . 9
5.1.2 Test coupon . 10
5.1.3 Laminate . 10
5.1.4 Surface finish . 10
5.1.5 Solder mask . 10
5.1.6 Quality . 10
5.2 Components (bill of materials) . 10
5.3 Number of test coupons . 12
5.4 Test conditions . 12
5.5 Coupon identification . 13
6 Procedure . 13
6.1 Test coupon preparation . 13
6.2 Cleaning . 13
6.3 Manufacturing process replication . 13
6.4 Preparation of samples for chamber . 13
6.5 Connector system – High-resistance measurement verification . 13
6.6 Hard wiring . 14
6.7 Coupon orientation in the chamber . 14
6.8 Test coupon measurements . 14
6.9 Evaluation . 15
6.10 Test report . 15
6.11 Additional information . 16
Annex A (informative) Additional information . 17
A.1 Additional information . 17
A.1.1 General . 17
A.1.2 Advisory notes . 17
A.1.3 Use of coupon test pattern on production product . 17
A.2 Use of dummy components . 17
A.3 Frequency of monitoring . 17

IEC 61189-5-502:2021 © IEC 2021 – 3 –
A.4 Condensation . 18
A.5 Flux volatilisation . 18
A.5.1 General . 18
A.5.2 90 % RH or 93 % RH . 18
A.6 Drip shield .
...