EN 60749-19:2003/A1:2010

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Amandma A1:2010 je dodatek k standardu SIST EN 60749-19:2004
This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term “semiconductor die” should be taken to include passive elements). This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. NOTE This determination is based on a measure of the force applied to the die or to the element, and, if a failure occurs, the type of failure resulting from the application of force and the visual appearance of the residual die attach medium and the header/substrate metallization.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 19: Résistance de la pastille au cisaillement

Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 19. del: Strižna trdnost čipov - Dopolnilo A1 (IEC 60749-19:2003/A1:2010)

Amandma A1:2010 je dodatek k standardu SIST EN 60749-19:2004.
Ta del IEC 60749 ugotavlja (glej opombo) celovitost materialov in postopkov, uporabljenih za priklop polprevodniških čipov na glave paketov ali druge substrate (za namen te preskusne metode, izraz »polprevodniški čipi« vključuje tudi pasivne elemente). Preskusna metoda na splošno velja samo za votle pakete ali kot nadzornik procesov. Ne velja za območja za čipe večja od 10 mm2. Prav tako ne velja za tehnologije Flip Chip ali za fleksibilne substrate. OPOMBA Ta ugotovitev je osnovana na izmeri moči, uporabljene na elementu, in če se zgodi napaka, na vrsti napake, ki se zgodi zaradi uporabe moči ter vizualnem zgledu preostalega medija za priklop čipa in metalizaciji glave/substrata.

General Information

• Status: Published
• Publication Date: 02-Sep-2010
• Withdrawal Date: 31-Aug-2013
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 03-Sep-2010
• Completion Date: 03-Sep-2010
• Ref Project: SIST EN 60749-19:2004/A1:2010 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003/A1:2010)

Relations

• Amends: EN 60749-19:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60749-19:2004/A1:2010
01-november-2010
3ROSUHYRGQLãNLHOHPHQWL0HWRGH]DPHKDQVNRLQNOLPDWVNRSUHVNXãDQMHGHO
6WULåQDWUGQRVWþLSRY'RSROQLOR$,(&$
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear
strength (IEC 60749-19:2003/A1:2010)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung
der Chip-Bondfestigkeit (IEC 60749-19:2003/A1:2010)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
19: Résistance de la pastille au cisaillement (CEI 60749-19:2003/A1:2010)
Ta slovenski standard je istoveten z: EN 60749-19:2003/A1:2010
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-19:2004/A1:2010 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-19:2004/A1:2010

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SIST EN 60749-19:2004/A1:2010

EUROPEAN STANDARD
EN 60749-19/A1

NORME EUROPÉENNE
September 2010
EUROPÄISCHE NORM

ICS 31.080.01


English version


Semiconductor devices -
Mechanical and climatic test methods -
Part 19: Die shear strength
(IEC 60749-19:2003/A1:2010)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques - Prüfverfahren -
Partie 19: Résistance de la pastille Teil 19: Prüfung der Chip-Bondfestigkeit
au cisaillement (IEC 60749-19:2003/A1:2010)
(CEI 60749-19:2003/A1:2010)




This amendment A1 modifies the European Standard EN 60749-19:2003; it was approved by CENELEC on
2010-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this amendment the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This amendment exists in three official versions (English, French, German). A version in any other language
made by translation under the responsibility of a CENELEC member into its own language and notified to the
Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

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© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-19:2003/A1:2010 E

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SIST EN 60749-19:2004/A1:2010
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