EN 61837-3:2015

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures

IEC 61837-3:2015 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices. This edition includes the following significant technical changes with respect to the previous edition: - The outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below; the view from the right was drawn optionally in the previous edition. - The height of package (G1) is eliminated, instead total height is expressed by the symbol letter G or with a subscript number. - The dimensions of terminal lead spacing are shown by the centre position of the terminal leads and its basic value e is 2.54 x n mm (n is an integer) and 1,27 x n mm for package dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not a multiple of the basic value, a subscript number such as e1, e2 is attached, e.g. e1, e2, etc. If there are plural spacing values, the subscript number is followed by a hyphen and numbers such as e1-1, e1-2 , etc. - In terminal land areas, the lengths of each terminal pad are now expressed with maximum values for consumer's convenience. They were expressed as minimum values in the previous edition of IEC 61837-3. - If there are plural identical enclosures with different height, each enclosure was expressed by a dash (/) and a two-digit number after the basic type name. The identity references are given in the table of the sheet. - The configurations of the enclosures were revised as shown in Table 1.

Oberflächenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -selektion - Norm-Gehäusemaße und Anschlüsse - Teil 3: Metallgehäuse

Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 3: Enveloppes métalliques

L'IEC 61837-3:2015 est applicable aux enveloppes métalliques normalisées et connexions des sorties des dispositifs à montage en surface pour la commande et le choix de la fréquence; elle est fondée sur l'IEC 61240, qui a normalisé les règles de tracé des dessins d'encombrement des dispositifs à montage en surface. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - Le dessin d'encombrement est défini comme un ensemble de dessins composé de quatre vues, à savoir la vue de dessus, la vue de face, la vue de droite et la vue de dessous, la vue de droite ayant été dessinée en option dans l'édition précédente. - La hauteur du boîtier (G1) a été supprimée, la hauteur totale étant exprimée par la lettre-symbole G ou par un numéro en indice. - Les dimensions de l'espacement entre les sorties sont présentées par la position centrale des sorties et sa valeur de base e est de 2,54 x n mm (n étant un entier) et 1,27 x n mm pour des dimensions de boîtier inférieures à 6 mm (voir l'IEC 61240:2012, 5.5). Si l'espacement entre les sorties n'est pas un multiple de la valeur de base, un numéro d'indice tel que e1, e2 est associé, par exemple e1, e2, etc. En présence de plusieurs valeurs d'espacement, le numéro en indice est suivi d'un trait d'union et de numéros tels que e1-1, e1-2 , etc. - Dans les surfaces de contact des sorties, les longueurs de chaque plaquette de sortie sont désormais exprimées avec des valeurs maximales pour les besoins du client. Elles étaient exprimées en valeurs minimales dans l'édition précédente de l'IEC 61837-3. - En présence de plusieurs enveloppes identiques de hauteur différente, chacune d'elles était exprimée par une barre oblique (/) et un numéro à deux chiffres placé après le nom de type de base. Les références d'identité sont données dans le tableau de la feuille. - Les configurations des enveloppes ont été révisées comme indiqué au Tableau 1.

Površinsko nameščeni piezoelektrični elementi za regulacijo frekvence in filtriranje - Standardni okrovi in žični priključki - 3. del: Kovinski okrov

Ta del standarda IEC 61837 obravnava standardne mere in priključne izvode, ki se uporabljajo pri površinsko nameščenih piezoelektričnih elementih (SMD) za regulacijo in izbiranje frekvence na kovinskih okrovih, in temelji na standardu IEC 61240, ki je standardiziral pravila za prikaz tehničnih risb površinsko montiranih naprav.

General Information

• Status: Published
• Publication Date: 03-Dec-2015
• Withdrawal Date: 19-May-2018
• ICS: 31.140 - Piezoelectric devices
• Technical Committee: CLC/SR 49 - Piezoelectric and dielectric devices for frequency control and selection
• Drafting Committee: IEC/TC 49 - IEC_TC_49
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 04-Dec-2015
• Completion Date: 04-Dec-2015
• Ref Project: SIST EN 61837-3:2016 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosure

Relations

• Replaces: EN 61837-3:2000 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures
• Effective Date: 28-Jan-2023

Overview

EN 61837-3:2015 (identical to IEC 61837-3:2015) specifies standard outlines and terminal lead connections for surface mounted piezoelectric devices (SMDs) used for frequency control and selection housed in metal enclosures. The standard defines dimensional drawings, type designation rules and terminal/land layout conventions and is intended to be read in conjunction with IEC 61240:2012 (outline drawing rules for SMD frequency-control devices).

Key topics and technical requirements

• Outline drawings: One set of drawings comprises four views - top, front, right and bottom - for each metal enclosure outline (the right view is now mandatory).
• Type designation: A four-part designation (e.g., SMS‑L4/01) using the prefix SMS (Surface‑Mounted, Special), lead structure (L, J or leadless), number of terminals and a two‑digit serial number.
• Package height/notation: The previous G1 symbol was removed; total height is now expressed by the symbol G or with a numeric subscript (G1, G2, ...).
• Terminal lead spacing (e): Spacing is shown by the centre position of terminals. The basic value e is 2.54 × n mm (n integer) or 1.27 × n mm for package dimensions < 6 mm. Non‑standard spacings use subscripts (e1, e2) and hyphenated sequences for multiple values (e1‑1, e1‑2).
• Terminal land areas: Terminal pad lengths are now given as maximum values (changed from minimum values in the earlier edition) to help PCB designers and end users.
• Multiple variants: Identical enclosures with differing heights or lengths are indicated by a dash and two‑digit suffix after the basic type name; configuration tables list these variants (e.g., SMS‑L4/01…03).
• Lead connections: Because SMS metal enclosures are special SMD types, lead connections are not standardized within this part - they must be specified in a detail specification agreed with the customer.

Applications and practical use

EN 61837-3 is directly applicable to:

• Component manufacturers designing metal‑enclosed piezoelectric SMDs (crystals, resonators) who need standardized outline and terminal definitions.
• PCB designers and layout engineers creating land patterns that match standardized terminal spacing and pad maxima.
• Procurement and quality engineers specifying mechanical package data and enforcing supplier compliance.
• Test labs and compliance teams verifying physical conformity to SMD outline standards.

Using EN 61837-3 helps ensure mechanical interchangeability, reliable soldering/assembly on PCBs, and clearer supplier-customer mechanical agreements for frequency-control components.

Related standards

• IEC 61240:2012 - General rules for SMD outline drawings (normative reference).
• The EN version is published by CENELEC/CLC and aligns with IEC 61837‑3:2015; related IEC documents listed in the standard’s bibliography may be relevant for electrical and mechanical testing or packaging rules.

Keywords: EN 61837-3:2015, IEC 61837-3:2015, surface mounted piezoelectric devices, SMD metal enclosure, terminal lead connections, IEC 61240, terminal spacing e, SMS package designation.

Standards Content (Sample)

SLOVENSKI STANDARD
01-marec-2016
1DGRPHãþD
SIST EN 61837-3:2001
3RYUãLQVNRQDPHãþHQLSLH]RHOHNWULþQLHOHPHQWL]DUHJXODFLMRIUHNYHQFHLQILOWULUDQMH
6WDQGDUGQLRNURYLLQåLþQLSULNOMXþNLGHO.RYLQVNLRNURY
Surface mounted piezoelectric devices for frequency control and selection - Standard
outlines and terminal lead connections - Part 3: Metal enclosure
Ta slovenski standard je istoveten z: EN 61837-3:2015
ICS:
31.140 3LH]RHOHNWULþQHLQ Piezoelectric and dielectric
GLHOHNWULþQHQDSUDYH devices
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61837-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
December 2015
ICS 31.140 Supersedes EN 61837-3:2000
English Version
Surface mounted piezoelectric devices for frequency control and
selection - Standard outlines and terminal lead connections -
Part 3: Metal enclosures
(IEC 61837-3:2015)
Dispositifs piézoélectriques à montage en surface pour la Oberflächenmontierbare piezoelektrische Bauteile zur
commande et le choix de la fréquence - Encombrements Frequenzstabilisierung und -selektion - Norm-
normalisés et connexions des sorties - Partie 3: Enveloppes Gehäusemaße und Anschlüsse - Teil 3: Metallgehäuse
métalliques (IEC 61837-3:2015)
(IEC 61837-3:2015)
This European Standard was approved by CENELEC on 2015-05-20. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61837-3:2015 E
European foreword
The text of document 49/1118/FDIS, future edition 2 of IEC 61837-3, prepared by IEC/TC 49
"Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61837-3:2015.
The following dates are fixed:
• latest date by which the document has (dop) 2016-06-04
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2018-05-20
• latest date by which the national
standards conflicting with the
document have to be withdrawn
This document supersedes EN 61837-3:2000.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 61837-3:2015 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60122-3:2010 NOTE  Harmonized as EN 60122-3:2010 (not modified).
IEC 60191-6:2009 NOTE  Harmonized as EN 60191-6:2009 (not modified).
IEC 60368-1:2000 NOTE  Harmonized as EN 60368-1:2000 (not modified).
A1:2004 A1:2004
IEC 60368-2-2:1996 NOTE  Harmonized as EN 60368-2-2:1999 (not modified).
IEC 60368-3:2010 NOTE  Harmonized as EN 60368-3:2010 (not modified).
IEC 60679-1:2007 NOTE  Harmonized as EN 60679-1:2007 (not modified).
IEC 60679-3:2012 NOTE  Harmonized as EN 60679-3:2013 (not modified).
IEC 60862-1:2003 NOTE  Harmonized as EN 60862-1:2003 (not modified).
IEC 60862-2:2012 NOTE  Harmonized as EN 60862-2:2012 (not modified).
IEC 60862-3:2003 NOTE  Harmonized as EN 60862-3:2003 (not modified).
ISO 1101:2012 NOTE  Harmonized as EN ISO 1101:2013 (not modified).
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61240 2012 Piezoelectric devices - Preparation of EN 61240 2012
outline drawings of surface-mounted
devices (SMD) for frequency control and
selection - General rules
IEC 61837-3 ®
Edition 2.0 2015-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –

Standard outlines and terminal lead connections –

Part 3: Metal enclosures
Dispositifs piézoélectriques à montage en surface pour la commande et le choix

de la fréquence – Encombrements normalisés et connexions des sorties –

Partie 3: Enveloppes métalliques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.140 ISBN 978-2-8322-2598-1

– 2 – IEC 61837-3:2015  IEC 2015
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Configuration of enclosures . 5
4 Designation of types . 5
5 Metal enclosure dimensions. 6
6 Lead connections . 6
7 Designation of metal enclosures . 6
Bibliography . 20

Table 1 – Revised configurations . 6
Table 2 – Designation of metal enclosures . 7

IEC 61837-3:2015  IEC 2015 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTED PIEZOELECTRIC
DEVICES FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 3: Metal enclosures
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
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arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61837-3 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection.
This second edition cancels and replaces the first edition published in 2000. It constitutes a
technical revision.
This International Standard is to be read in conjunction with IEC 61240:2012.
This edition includes the following significant technical changes with respect to the previous
edition:
• The outline drawing is defined as one set of drawings consisting of four views, which are the
view from above, the front view, the view from the right, and the view from below; the view
from the right was drawn optionally in the previous edition.

– 4 – IEC 61837-3:2015  IEC 2015
• The height of package (G ) is eliminated, instead total height is expressed by the symbol
letter G or with a subscript number.
• The dimensions of terminal lead spacing are shown by the centre position of the terminal
leads and its basic value e is 2.54 × n mm (n is an integer) and 1,27 × n mm for package
dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not
a multiple of the basic value, a subscript number such as e , e is attached, e.g. e , e , etc.

1 2 1 2
If there are plural spacing values, the subscript number is followed by a hyphen and numbers
such as e , e , etc.
1-1 1-2
• In terminal land areas, the lengths of each terminal pad are now expressed with maximum
values for consumer’s convenience. They were expressed as minimum values in the
previous edition of IEC 61837-3.
• If there are plural identical enclosures with different height, each enclosure was expressed
by a dash (/) and a two-digit number after the basic type name. The identity references are
given in the table of the sheet.
• The configurations of the enclosures were revised as shown in Table 1.
The text of this standard is based on the following documents:
FDIS Report on voting
49/1118/FDIS 49/1140/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61837 series, published under the general title Surface mounted
piezoelectric devices for frequency control and selection – Standard outlines and terminal lead
connections, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IEC 61837-3:2015  IEC 2015 – 5 –
SURFACE MOUNTED PIEZOELECTRIC
DEVICES FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 3: Metal enclosures
1 Scope
This part of IEC 61837 deals with standard outlines and terminal lead connections as they
apply to SMDs for frequency control and selection in metal enclosures and is based on
IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
IEC 61240:2012, Piezoelectric devices – Preparation of outline drawings of surface mounted
devices (SMD) for frequency control and selection – General rules
3 Configuration of enclosures
The enclosures of the surface-mounted devices are made of metal with the formed lead
terminals based on the descriptive designation system for semiconductors – devices package.
All SMD enclosures described in this part of IEC 61837 are special surface mount types.
Therefore, the following designator is used.
– SMS (Surface-Mounted, Special)
4 Designation of types
The type designator consists of four parts as follows:
B C
A D
A: Configuration symbol of enclosures:
– SMS (Surface-Mounted, Special).
B: Structure of terminal leads
– L: folded leads type;
– J: folded leads type.
If there is a leadless type, it will have no mark.
See Clause 3 of IEC 61240:2012, Classification of SMD.
C:
...