Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave switches. Switches in this standard are based on SPDT (single pole double throw). However, this standard is applicable to the other types of switches.

Halbleiterbauelemente - Teil 16-4: Integrierte Mikrowellenschaltkreise - Schalter

Dispositifs à semiconducteurs - Partie 16-4: Circuits intégrés hyperfréquences - Commutateurs

Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave switches. Switches in this standard are based on SPDT single pole double throw. However, this standard is applicable to the other types of switches.

Polprevodniški elementi – 16-4. del: Mikrovalovna integrirana vezja – Stikala (IEC 60747-16-4:2004)

General Information

Status
Published
Publication Date
29-Sep-2004
Current Stage
6060 - Document made available
Due Date
30-Sep-2004
Completion Date
30-Sep-2004

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SLOVENSKI STANDARD
SIST EN 60747-16-4:2005
01-december-2005

Polprevodniški elementi – 16-4. del: Mikrovalovna integrirana vezja – Stikala (IEC

60747-16-4:2004)
Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches

Halbleiterbauelemente -- Teil 16-4: Integrierte Mikrowellenschaltkreise - Schalter

Dispositifs à semiconducteurs -- Partie 16-4 : Circuits intégrés hyperfréquences -

Commutateurs
Ta slovenski standard je istoveten z: EN 60747-16-4:2004
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN 60747-16-4:2005 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
EUROPEAN STANDARD EN 60747-16-4
NORME EUROPÉENNE
EUROPÄISCHE NORM September 2004
ICS 31.080.99
English version
Semiconductor devices
Part 16-4: Microwave integrated circuits –
Switches
(IEC 60747-16-4:2004)
Dispositifs à semiconducteurs Halbleiterbauelemente
Partie 16-4 : Circuits intégrés Teil 16-4: Integrierte
hyperfréquences – Mikrowellenschaltkreise –
Commutateurs Schalter
(CEI 60747-16-4:2004) (IEC 60747-16-4:2004)

This European Standard was approved by CENELEC on 2004-09-01. CENELEC members are bound to

comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European

Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and

notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech

Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,

Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60747-16-4:2004 E
---------------------- Page: 2 ----------------------
EN 60747-16-4:2004 - 2 -
Foreword

The text of document 47E/256/FDIS, future edition 1 of IEC 60747-16-4, prepared by SC 47E,

Discrete semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the

IEC-CENELEC parallel vote and was approved by CENELEC as EN 60747-16-4 on 2004-09-01.

The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice

The text of the International Standard IEC 60747-16-4:2004 was approved by CENELEC as a

European Standard without any modification.

In the official version, for Bibliography, the following note has to be added for the standard indicated:

IEC 60747-16-1 NOTE Harmonized as EN 60747-16-1:2002 (not modified).
__________
---------------------- Page: 3 ----------------------
- 3 - EN 60747-16-4:2004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60617-12 - Graphical symbols for diagrams EN 60617-12 1998
Part 12: Binary logic elements
1) 2)
IEC 60617-13 - Part 13: Analogue elements EN 60617-13 1993
IEC 60747-1 1983 Semiconductor devices - Discrete devices- -
Part 1: General
A3 1996 - -
IEC 60747-4 - Part 4: Microwave diodes and transistors- -
IEC 60748-2-1 - Semiconductors devices - Integrated - -
circuits
Part 2: Digital integrated circuits - Section
one - Blank detail specification for bipolar
monolithic digital integrated circuit gates
(excluding uncommitted logic arrays)
IEC 60748-3 - Part 3: Analogue integrated circuits - -
IEC 60748-4 - Part 4: Interface integrated circuits - -
Undated reference.
Valid edition at date of issue.
---------------------- Page: 4 ----------------------
INTERNATIONAL IEC
STANDARD 60747-16-4
First edition
2004-07
Semiconductor devices –
Part 16-4:
Microwave integrated circuits –
Switches
” IEC 2004  Copyright - all rights reserved

No part of this publication may be reproduced or utilized in any form or by any means, electronic or

mechanical, including photocopying and microfilm, without permission in writing from the publisher.

International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland

Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch

PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
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For price, see current catalogue
---------------------- Page: 5 ----------------------
– 2 – 60747-16-4 ” IEC:2004(E)
CONTENTS

FOREWORD.........................................................................................................................3

1 Scope ............................................................................................................................5

2 Normative references .....................................................................................................5

3 Terms and definitions .....................................................................................................5

4 Essential ratings and characteristics ...............................................................................7

4.1 Circuit identification and types ...............................................................................7

4.2 Application description...........................................................................................8

4.3 Specification of the function ...................................................................................8

4.4 Limiting values (absolute maximum rating system) ...............................................10

4.5 Operating conditions (within the specified operating temperature range) ...............11

4.6 Electrical characteristics ......................................................................................11

4.7 Mechanical and environmental ratings, characteristics and data ...........................12

4.8 Additional information ..........................................................................................12

5 Measuring methods ......................................................................................................13

5.1 General ...............................................................................................................13

5.2 Insertion loss (L ) ..............................................................................................14

ins

5.3 Isolation (L ) .....................................................................................................16

iso

5.4 Return loss (L ) .................................................................................................18

ret
5.5 Input power at 1 dB compression (P ) and output power at 1 dB
i(1dB)

compression (P ) ..........................................................................................20

o(1dB)

5.6 Turn-on time (t ), turn-off time (t ), rise time (t ), and fall time (t )...........21

on off r(out) f(out)

5.7 Adjacent channel power ratio (P /P ) .........................................................23

o(mod) adj

5.8 n-th order harmonic distortion ratio (P /P ).........................................................26

nth 1

Bibliography .......................................................................................................................28

Figure 1 – Circuit diagram for the measurement of the insertion loss L .............................14

ins

Figure 2 – Circuit diagram for the measurement of the isolation L .....................................16

iso

Figure 3 – Circuit for the measurements of the return loss ...................................................18

Figure 4 – Circuit for the measurements of switching time....................................................21

Figure 5 – Input and output waveforms................................................................................21

Figure 6 – Circuit for the measurement of the adjacent channel power ratio .........................23

Figure 7 – Circuit diagram for the n-th order harmonic distortion ratio ..................................26

---------------------- Page: 6 ----------------------
60747-16-4 ” IEC:2004(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any

equipment declared to be in conformity with an IEC Publication.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60747-16-4 has been prepared by subcommittee 47E: Discrete

semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/256/FDIS 47E/261/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 7 ----------------------
– 4 – 60747-16-4 ” IEC:2004(E)

The committee has decided that the contents of this publication will remain unchanged until

the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in

the data related to the specific publication. At this date, the publication will be

• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
---------------------- Page: 8 ----------------------
60747-16-4 ” IEC:2004(E) – 5 –
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
1 Scope

This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as

well as essential ratings and characteristics for integrated circuit microwave switches.

There are many combinations for RF ports in switches, such as SPST (single pole single

throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole

double throw), etc. Switches in this standard are based on SPDT. However, this standard is

applicable to the other types of switches.
2 Normative references

The following referenced documents are indispensable for the application of this document.

For dated references, only the edition cited applies. For undated references, the latest edition

of the referenced document (including any amendments) applies.
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements

IEC 60747-1(1983), Semiconductor devices – Discrete devices and integrated circuits –

Part 1: General
Amendment 3 (1996)

IEC 60747-4, Semiconductor devices – Discrete devices – Part 4: Microwave devices

IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits

IEC 60748-3, Semiconductor devices – Integrated circuits – Part 3: Analogue integrated

circuits

IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated

circuits
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
Terms related to electrical characteristics
3.1
insertion loss
ins

ratio of the output power at the switched on port to the input power in the linear region of the

power transfer curve P (dBm) = f(P )
o i
NOTE 1 In this region, 'P (dBm) = 'P (dBm).
o i
NOTE 2 Usually the insertion loss is expressed in decibels.
---------------------- Page: 9 ----------------------
– 6 – 60747-16-4 ” IEC:2004(E)
3.2
isolation
iso

ratio of the output power at the switched off port to the input power in the linear region of the

power transfer curve P (dBm) = f(P )
o i
NOTE 1 In this region, 'P (dBm) = 'P (dBm).
o i
NOTE 2 Usually the isolation is expressed in decibels.
3.3
return loss
ret

ratio of the incident power P at the specified port to the reflected power P at the same

inc ref
port in the linear region of the power transfer curve P (dBm) = f(P )
ref inc
NOTE 1 In this region, 'P (dBm) = 'P (dBm).
ref inc
NOTE 2 Usually the return loss is expressed in decibels.
3.4
input power at 1 dB compression
i(1 dB)

input power where the insertion loss increases by 1 dB compared with insertion loss in linear

region
3.5
output power at 1 dB compression
o(1dB)

output power where the insertion loss increases by 1 dB compared with insertion loss in linear

region
3.6
turn on time

interval between the lower reference point on the leading edge of the control voltage and the

upper reference point on the leading edge of the envelope of the output voltage in the linear

region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
3.7
turn off time
off

interval between the upper reference point on the trailing edge of the control voltage and the

lower reference point on the trailing edge of the envelope of the output voltage in the linear

region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
3.8
rise time
r(out)

interval between the lower reference point on the leading edge of the output voltage and the

upper reference point on the leading edge of the envelope of the output voltage in the linear

region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
---------------------- Page: 10 ----------------------
60747-16-4 ” IEC:2004(E) – 7 –
3.9
fall time
f(out)

interval between the upper reference point on the trailing edge of the output voltage and the

lower reference point on the trailing edge of the envelope of the output voltage in the linear

region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, 'P (dBm) = 'P (dBm).
o i
3.10
adjacent channel power ratio
P /P
o(mod) adj

ratio of the total power in the specified carrier signal frequency band to total output power in

the specified frequency band away from the specified carrier signal frequency, at the specified

output power when the modulation signal is supplied
3.11
n-th order harmonic distortion ratio
P /P
nth 1
See 3.14 of IEC 60747-16-1(2001).
4 Essential ratings and characteristics

This clause gives ratings and characteristics required for specifying integrated circuit micro-

wave switches.
4.1 Circuit identification and types
4.1.1 Designation and types

Identification of type (device name), category of circuit and technology applied should be

given. Microwave switches comprise one category.
4.1.2 General function description

A general description of the function performed by the integrated circuit microwave switches

and the features for the application should be made.
4.1.3 Manufacturing technology

The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film

integrated circuit, micro-assembly, etc. should be stated. This statement should include

details of the semiconductor technologies such as Schottky-barrier diode, PIN diode, MESFET,

Si bipolar transistor, etc.

IEC 60747-4 should be referred to for terminology and letter symbols, essential ratings and

characteristics and measuring methods of such microwave devices.
4.1.4 Package identification
The following statements should be made:
a) chip or packaged form;

b) IEC and/or national reference number of the outline drawing, of drawing of non-standard

package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic.
---------------------- Page: 11 ----------------------
– 8 – 60747-16-4 ” IEC:2004(E)
4.1.5 Main application

The main application should be stated. If the device has restrictive applications, these should

be stated here.
4.2 Application description

Information on application of the integrated circuit and its relation to the associated devices

should be given.
4.2.1 Conformance to system and/or interface information

It should be stated whether the integrated circuit conforms to an application system and/or an

interface standard or a recommendation.

Detailed information concerning application systems, equipment and circuits such as VSAT

systems, DBS receivers, microwave landing systems, etc. should also be given.
4.2.2 Overall block diagram
A block diagram of the applied systems should be given if necessary.
4.2.3 Reference data

The most important properties that permit comparison between derivative types should be

given.
4.2.4 Electrical compatibility

It should be stated whether the integrated circuit is electrically compatible with other particular

integrated circuits, or families of integrated circuits, or whether special interfaces are required.

Details should be given concerning the type of input and output circuits, e.g. input/output

impedances, d.c. block, open-drain, etc. Interchangeability with other devices, if any, should

also be given.
4.2.5 Associated devices
If applicable, the following should be stated:

– devices necessary for correct operation (list with type number, name and function);

– peripheral devices with direct interfacing (list with type number, name and function).

4.3 Specification of the function
4.3.1 Detailed block diagram – Functional blocks

A detail block diagram or equivalent circuit information of the integrated circuit microwave

switches should be given. The block diagram should be composed of the following:
a) functional blocks;
b) mutual interconnections among the functional blocks;
c) individual functional units within the functional blocks;
d) mutual interconnections among the individual functional blocks;
e) function of each external connection;
f) inter-dependence between the separate functional blocks.
---------------------- Page: 12 ----------------------
60747-16-4 ” IEC:2004(E) – 9 –

The block diagram should identify the function of each external connection and, where no

ambiguity can arise, also show the terminal symbols and/or numbers. If the encapsulation has

metallic parts, any connection to them from external terminals should be indicated. The

connections with any associated external electrical elements should be stated, where

necessary.

As additional information, the complete electrical circuit diagram can be reproduced, but not

necessarily with indications of the values of the circuit components. The graphical symbol for

the function shall be given. Rules governing such diagrams may be obtained from IEC 60617-12

or IEC 60617-13.
4.3.2 Identification and function of terminals

All terminals should be identified on the block diagram (supply terminals, input or output

terminals, input/output terminals).
The terminal functions 1) to 4) should be indicated in a table as follows:
Function of terminal
Terminal Terminal 1) Terminal
2) Function
3) Input/output 4) Type of input/
number symbol designation
identification output circuits
1) Terminal designation

A terminal designation to indicate the function of the terminal should be given. Supply

terminals, ground terminals, blank terminals (with abbreviation NC), non-usable terminals

(with abbreviation NU) should be distinguished.
2) Function
A brief indication of the terminal function should be given:

– each function of multi-role terminals, i.e. terminals having multiple functions;

– each function of integrated circuit selected by mutual pin connections, programming

and/or application of function selection data to the function selection pin, such as

mode selection pin.
3) Input/output identification

Input, output, input/output and multiplex input/output terminals should be distinguished.

4) Type of input/output circuits

The type of input and output circuit, e.g. input/output impedances, with or without d.c.

block, etc., should be distinguished.
5) Type of ground
If the baseplate of the package is used as ground, this should be stated.
Example:
Bias supply voltage(s) Control supply voltage(s)
Input(s) Integrated NC
circuit
microwave
NU Output(s)
switch
Ground
---------------------- Page: 13 ----------------------
– 10 – 60747-16-4 ” IEC:2004(E)
4.3.3 Function description

The function performed by the circuit should be specified, including the following information:

– basic function;
– relation to external terminals;
– operation mode (e.g., set-up method, preference, etc.);
– interrupt handling.
4.3.4 Family related characteristics

In this part, all the family specific functional descriptions shall be stated (referred to

IEC 60748-2, IEC 60748-3 and IEC 60748-4).

If ratings and characteristics, as well as function characteristics exist for the family, the

relevant part of IEC 60748 should be used (e.g. for microprocessors, see IEC 60748-2,

Chapter III, Section Three).

NOTE For each new device family, specific items should be added the relevant part of IEC 60748.

4.4 Limiting values (absolute maximum rating system)
The table for these values should contain the following:
– Any interdependence of limiting conditions shall be specified.

– If externally connected and/or attached elements, for example heatsinks, have an

influence on the values of the ratings, the ratings shall be prescribed for the integrated

circuit with the elements connected and/or attached.

– If limiting values are exceeded for transient overload, the permissible excess and their

durations shall be specified.

– Where minimum and maximum values differ during programming of the device, this should

be stated.

– All voltages are referenced to a specified reference terminal (V , ground, etc.).

– In satisfying the following clauses, if maximum and/or minimum values are quoted, the

manufacturer shall indicate whether he refers to the absolute magnitude or to the

algebraic value of the quantity.

– The ratings given shall cover the operation of the multi-function integrated circuit over the

specified range of operating temperatures. Where such ratings are temperature-dependent,

these dependence should be indicated.
4.4.1 Electrical limiting values
Limiting values should be specified as follows:
Subclause Parameters Min. Max.
4.4.1.1 Bias supply voltage(s) (where appropriate) +
4.4.1.2 Bias supply current(s) (where appropriate) +
4.4.1.3 Control supply voltage(s) (where appropriate) +
4.4.1.4 Control supply current(s) (where appropriate) +
4.4.1.5 Terminal voltage(s) (where appropriate) + +
4.4.1.6 Terminal current(s) (where appropriate) +
4.4.1.7 Input power +
4.4.1.8 Power dissipation +

NOTE It is necessary to select either 4.4.1.1 or 4.4.1.2, either 4.4.1.3 or 4.4.1.4, and either

4.4.1.5 or 4.4.1.6.
---------------------- Page: 14 ----------------------
60747-16-4 ” IEC:2004(E) – 11 –

The detail specification may indicate those values within the table including notes 1 and 2.

Parameters (Note 1, Note 2) Symbols Min. Max. Unit
NOTE 1 Where appropriate, in accordance with the type of circuit considered.
NOTE 2 For power supply voltage range:

– limiting value(s) of the continuous voltage(s) at the supply terminal(s) with respect to a special electrical

reference point;
– where appropriate, limiting value between specified supply terminals;

– when more than one voltage supply is required, a statement should be made as to whether the sequence in

which these supplies are applied is significant: if so, the sequence should be stated;

– when more than one supply is needed, it may be necessary to state the combinations of ratings for these supply

voltages and currents.
4.4.2 Temperatures
a) Operating temperature
b) Ambient or case temperature
c) Storage temperature
d) Channel temperature
e) Lead temperature (for soldering).

The detail specification may indicate those values within the table including the note.

Parameters (Note) Symbols Min. Max. Unit
NOTE Where appropriate, in accordance with the type of circuit considered.
4.5 Operating conditions (within the specified operating temperature range)
They are not to be inspected, but may be used for quality assessment purposes.
4.5.1 Power supplies – Positive and/or negative values
4.5.2 Initialization sequences (where appropriate)

If special initialization sequences are necessary, power supply sequencing and initialization

procedure should be specified.
4.5.3 Input voltage(s) (where appropriate)
4.5.4 Output current(s) (where appropriate)
4.5.5 Voltage and/or current of other terminal(s)
4.5.6 External elements (where appropriate)
4.5.7 Operating temperature range
4.6 Electrical characteristics

The characteristics shall apply over the full operating temperature range, unless otherwise

specified. Each characteristic of 4.6.1 and 4.6.2 should be stated either
a) over the specified range of operating temperatures, or
b) at a temperature of 25 °C, and at maximum and minimum operating temperatures.
---------------------- Page: 15 ----------------------
– 12 – 60747-16-4 ” IEC:2004(E)
The parameters should be specified corresponding to the type as follows:
Subclause Parameters Min. Typical Max.
4.6.1 Bias supply operating current + +
4.6.2 Control supply operating current + +
4.6.3 Insertion loss + +
4.6.4 Isolation (where appropriate
...

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