ETSI TS 103 666-2 V15.1.0 (2020-02)

Smart Secure Platform (SSP); Part 2: Integrated SSP (iSSP) characteristics (Release 15)

RTS/SCP-00TSSPvf10-2

General Information

• Status: Published
• Publication Date: 06-Feb-2020
• Technical Committee: SET - Secure Element Technologies
• Current Stage: 12 - Completion
• Due Date: 13-Feb-2020
• Completion Date: 07-Feb-2020

Standards Content (Sample)

TECHNICAL SPECIFICATION
Smart Secure Platform (SSP);
Part 2: Integrated SSP (iSSP) characteristics
(Release 15)
Release 15 2 ETSI TS 103 666-2 V15.1.0 (2020-02)

Reference
RTS/SCP-00TSSPVF10-2
Keywords
M2M, MFF
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ETSI
Release 15 3 ETSI TS 103 666-2 V15.1.0 (2020-02)
Contents
Intellectual Property Rights . 8
Foreword . 8
Modal verbs terminology . 8
1 Scope . 10
2 References . 10
2.1 Normative references . 10
2.2 Informative references . 12
3 Definition of terms, symbols and abbreviations . 12
3.1 Terms . 12
3.2 Symbols . 13
3.3 Abbreviations . 13
4 Introduction . 14
4.1 Document Layout . 14
4.2 ASN.1 syntax . 14
4.2.1 Introduction. 14
4.2.2 Start of ASN.1 . 14
5 Overview . 15
5.1 Description . 15
5.2 Security requirements . 15
5.3 References to GlobalPlatform . 15
6 iSSP Architecture . 15
6.1 Overview . 15
6.2 Functional architecture . 16
6.3 Security perimeters . 16
6.4 Unprivileged execution model . 16
6.5 Unprivileged virtual address space . 16
6.6 Run time model . 16
7 Primary Platform . 17
7.1 Hardware Platform . 17
7.1.1 Architecture . 17
7.1.2 Form factor . 17
7.1.3 Security functions . 17
7.1.3.1 Hardware Platform isolation . 17
7.1.3.2 Memory Management Function . 17
7.1.3.3 Key protection function . 17
7.1.3.4 Data protection hardware function . 17
7.1.3.5 Memory transfer function . 18
7.1.3.6 Test functions . 18
7.1.3.7 Remote audit . 18
7.1.3.8 Security sensor function . 18
7.1.4 Memories . 18
7.1.4.1 Non Volatile Memories . 18
7.1.4.2 Volatile memory . 18
7.1.5 Communication functions . 18
7.1.6 Power . 18
7.1.7 Cryptographic functions . 18
7.1.8 Clock . 19
7.1.9 SSP internal interconnect . 19
7.1.10 Secure CPU . 19
7.1.11 Random Number Generator . 19
7.2 Low-level Operating System . 19
7.2.1 Introduction. 19
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Release 15 4 ETSI TS 103 666-2 V15.1.0 (2020-02)
7.2.2 Kernel objects . 19
7.2.3 Global requirements and mandatory Access Control rules . 19
7.2.4 Process states diagram . 19
7.2.5 Definition of the process states . 19
7.2.6 Mandatory access control . 19
7.3 Services . 20
7.3.1 Secondary Platform Bundle Loader . 20
7.3.1.1 Overview . 20
7.3.1.2 Registries . 20
7.3.1.3 Commands . 21
7.3.1.4 Responses . 21
7.3.1.5 Firmware session . 21
7.3.2 Communication service . 22
7.3.3 Management service . 22
7.4 Minimum level of interoperability . 22
7.5 Primary Platform identification . 22
7.6 Provisioning of Primary Platform software . 23
7.7 Part Number Identifier . 23
8 Primary Platform Interface . 23
8.1 Kernel functions ABI/API . 23
8.2 Communication service interface . 23
8.3 Secondary Platform Bundle management service interface . 24
9 Secondary Platform Bundle . 24
9.1 Introduction . 24
9.2 States . 24
9.3 Secondary Platform Bundle container format . 25
9.4 Secondary Platform . 25
9.4.1 High-level OS . 25
9.4.2 Execution framework . 25
9.4.3 UICC platform as a Secondary Platform . 25
9.4.4 Capability exchange . 25
9.4.5 Identifiers of Secondary Platform Bundle . 26
9.5 SSP Application . 26
9.5.1 Overview . 26
9.5.2 Lifecycle management . 26
9.6 Lifecycle management of Secondary Platform Bundles. 26
9.7 Secondary Platform Bundle family identifier . 27
10 Communication interface . 27
10.1 Low level protocol layers . 27
10.1.1 Physical layer . 27
10.1.2 Link layer . 27
10.2 SSP Common Layer . 27
10.3 Communication layers above SCL . 27
11 Certification . 27
11.1 Introduction . 27
11.2 Primary Platform certification . 27
11.2.1 Overview . 27
11.2.2 Security Capabilities . 28
11.3 Secondary Platform Bundle certification . 29
12 iSSP ecosystem and interfaces . 29
12.1 General architecture . 29
12.1.1 Introduction. 29
12.1.2 Architecture overview . 30
12.1.3 Entities . 30
12.1.4 Interfaces. 30
12.2 Security overview . 31
12.2.1 Public key infrastructures . 31
12.2.1.1 Public key infrastructure for Si4 interface . 31
12.2.1.1.1 Certificate chains . 31
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Release 15 5 ETSI TS 103 666-2 V15.1.0 (2020-02)
12.2.1.1.2 Certificate description . 32
12.2.1.1.3 Algorithm identifiers and parameters . 34
12.2.1.1.4 Certification path verification . 35
12.2.1.1.5 Certificate revocation status verification . 36
12.2.2 Cryptographic algorithms . 36
12.2.2.1 Elliptic curve domain parameter sets . 36
12.2.2.2 Digital signature algorithm . 37
12.2.2.3 Key agreement algorithm . 37
12.2.2.4 Block cipher algorithm . 37
12.3 Secondary Platform Bundle provisioning procedure . 37
12.3.1 Overview . 37
12.3.2 Preparation procedure . 39
12.3.2.1 Overview . 39
12.3.2.2 Secondary Platform Bundle selection process . 39
12.3.2.3 Service provider reference creation process . 39
12.3.2.4 Cancellation of the preparation procedure . 40
12.3.3 Download procedure . 40
12.3.3.1 Capability negotiation . 40
12.3.3.2 Bound SPB image download. 43
12.3.4 Installation procedure . 46
12.4 Secondary Platform Bundle management procedure. 47
12.4.1 Enable a Secondary Platform Bundle . 47
12.4.2 Disable a Secondary Platform Bundle . 48
12.4.3 Delete a Secondary Platform Bundle . 48
12.4.4 SPB metadata retrieving procedure . 49
12.5 Notification procedure . 50
12.5.1 Overview . 50
12.5.2 Notification of the service provider . 50
12.5.3 Notification from the LBA . 50
12.6 Interfaces and functions . 51
12.6.1 Overview . 51
12.6.2 Common features . 52
12.6.2.1 Common data types . 52
12.6.2.2 SSP information . 52
12.6.2.2.1 Introduction . 52
12.6.2.2.2 Public SSP information . 52
12.6.2.2.3 Protected SSP information. 54
12.6.2.3 SPBM credential . 55
12.6.2.4 SSP credential . 55
12.6.2.5 Bound SPB image . 56
12.6.2.6 SPB metadata . 58
12.6.2.7 Terminal information . 59
12.6.2.8 Notification token . 59
12.6.3 Si1 interface . 60
12.6.3.1 Overview . 60
12.6.3.2 Si1 common headers . 60
12.6.3.2.1 Si1 command header . 60
12.6.3.2.2 Si1 response header . 61
12.6.3.3 Si1 error codes . 61
12.6.3.4 Si1.SelectSpb . 62
12.6.3.4.1 Command . 62
12.6.3.4.2 Procedure . 63
12.6.3.4.3 Response . 63
12.6.3.5 Si1.CreateSPReference . 64
12.6.3.5.1 Command . 64
12.6.3.5.2 Procedure . 65
12.6.3.5.3 Response . 65
12.6.3.6 Si1.FinalizePreparation . 66
12.6.3.6.1 Command . 66
12.6.3.6.2 Procedure . 67
12.6.3.6.3 Response . 67
12.6.3.7 Si1.CancelPreparation . 67
ETSI
Release 15 6 ETSI TS 103 666-2 V15.1.0 (2020-02)
12.6.3.7.1 Command . 67
12.6.3.7.2 Procedure . 68
12.6.3.7.3 Response . 69
12.6.3.8 Si1.HandleNotification . 69
12.6.3.8.1 Command . 69
12.6.3.8.2 Procedure . 70
12.6.4 Si2 interface . 71
12.6.4.1 Overview . 71
12.6.4.2 Si2.GetSpbmCertificate . 71
12.6.4.2.1 Command . 71
12.6.4.2.2 Procedure . 72
12.6.4.2.3 Response . 73
12.6.4.3 Si2.GetBoundSpbImage . 74
12.6.4.3.1 Command . 74
12.6.4.3.2 Procedure . 75
12.6.4.3.3 Response . 77
12.6.5 Si3 interface . 79
12.6.5.1 Overview . 79
12.6.5.2 Registries . 79
12.6.5.3 Commands . 79
12.6.5.4 Responses . 79
12.6.5.5 Functions . 79
12.6.5.5.1 Si3.GetSspInfo . 79
12.6.5.5.2 Si3.SetSpbmCredential . 81
12.6.5.5.3 Si3.LoadBoundSpbInfo . 82
12.6.5.5.4 Si3.LoadBoundSpbSds . 83
12.6.5.5.5 Si3.LoadBoundSpbSeg . 83
12.6.5.5.6 Si3.GetSspCredential . 84
12.6.5.5.7 Si3.EnableSpb . 84
12.6.5.5.8 Si3.DisableSpb . 84
12.6.5.5.9 Si3.DeleteSpb . 85
12.6.5.5.10 Si3.GetSpbMetadata . 85
Annex A (normative): Additions for Telecom Secondary Platform Bundles . 86
A.1 Telecom family identifier . 86
A.2 Data types for telecom family identifier . 86
A.2.1 Introduction . 86
A.2.2 SSP information . 86
A.2.3 Terminal information . 86
A.3 SPB metadata for the telecom family identifier . 86
A.4 Terminal behaviour . 87
Annex B (normative): ASN.1 definitions . 88
B.1 End of ASN.1 . 88
B.2 Complete ASN.1 file . 88
Annex C (normative): Bundle eligibility check . 89
C.1 Introduction . 89
C.2 Basic eligibility check . 89
C.2.1 Summary . 89
C.2.2 Version compatibility check . 89
C.2.3 Bundle compatibility check . 89
C.2.4 Primary platform identifier check . 89
C.3 Family identifier-specific eligibility check . 90
Annex D (informative): UML code of figures . 91
ETSI
Release 15 7 ETSI TS 103 666-2 V15.1.0 (2020-02)
Annex E (informative): Change history . 92
History . 94

ETSI
Release 15 8 ETSI TS 103 666-2 V15.1.0 (2020-02)
Intellectual Property Rights
Essential patents
IPRs essential or potentially essential to normative deliverables may have been declared to ETSI. The information
pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-members, and can be found
in ETSI SR 000 314: "Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in
respect of ETSI standards", which is available from the ETSI Secretariat. Latest updates are available on the ETSI Web
server (https://ipr.etsi.org/).
Pursuant to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee
can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the updates on the ETSI Web
server) which are, or may be, or may become, essential to the present document.
Trademarks
The present document may include trademarks and/or tradenames which are asserted and/or registered by their owners.
ETSI claims no ownership of these except for any which are indicated as being the property of ETSI, and conveys no
right to use or reproduce any trademark and/or tradename. Mention of those trademarks in the present document does
not constitute an endorsement by ETSI of products, services or organizations associated with those trademarks.
Foreword
This Technical Specification (TS) has been produced by ETSI Technical Committee Smart Card Platform (SCP).
The contents of the present document are subject to continuing work within TC SCP and may change following formal
TC SCP approval. If TC SCP modifies the contents of the present document, it will then be republished by ETSI with
an identifying change of release date and an increase in version number as follows:
Version x.y.z
where:
x the first digit:
0 early working draft;
1 presented to TC SCP for information;
2 presented to TC SCP for approval;
3 or greater indicates TC SCP approved document under change control.
y the second digit is incremented for all changes of substance, i.e. technical enhancements, corrections,
updates, etc.
z the third digit is incremented when editorial only changes have been incorporated in the document.
The present document is part 2 of a multi-part deliverable covering Smart Secure Platform (SSP), as identified below:
Part 1: "General characteristics";
Part 2: "Integrated SSP (iSSP) characteristics".
ETSI
Release 15 9 ETSI TS 103 666-2 V15.1.0 (2020-02)
Modal verbs terminology
In the present document "shall", "shall not", "should", "should not", "may", "need not", "will", "will not", "can" and
"cannot" are to be interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of
provisions).
"must" and "must not" are NOT allowed in ETSI deliverables except when used in direct citation.
ETSI
Release 15 10 ETSI TS 103 666-2 V15.1.0 (2020-02)
1 Scope
The present document details the technical specifications for the Smart Secure Platform (SSP) integrated into an SoC,
also known as iSSP. The present document defines specific attributes on top of the generic SSP specified in ETSI
TS 103 666-1 [3].
2 References
2.1 Normative references
References are either specific (identified by date of publication and/or edition number or version number) or
non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the
referenced document (including any amendments) applies.
• In the case of a reference to a TC SCP document, a non-specific reference implicitly refers to the latest version
of that document in the same Release as the present document.
Referenced documents which are not found to be publicly available in the expected location might be found at
http://docbox.etsi.org/Reference.
NOTE: While any hyperlinks included in this clause were valid at the time of publication ETSI cannot guarantee
their long term validity.
The following referenced documents are necessary for the application of the present document.
[1] ETSI TS 102 221: "Smart Cards; UICC-Terminal interface; Physical and logical characteristics".
[2] ETSI TS 102 223: "Smart Cards; Card Application Toolkit (CAT)".
[3] ETSI TS 103 666-1: "Smart Secure Platform (SSP); Part 1: General characteristics".
[4] BSI-CC-PP-0084-2014: "Security IC Platform Protection Profile with Augmentation Packages".
NOTE: Available at https://www.commoncriteriaportal.org/files/ppfiles/pp0084b_pdf.pdf.
[5] BSI-CC-PP-0089-2015: "Embedded UICC Protection Profile, Version 1.1 25.08.2015".
NOTE: Available at https://www.commoncriteriaportal.org/files/ppfiles/pp0089a_pdf.pdf.
[6] GlobalPlatform Card Technology: "Open Firmware Loader for Tamper Resistant Element",
Version 1.3.
NOTE: Available at https://globalplatform.org/specs-library/open-firmware-loader-for-tamper-resistant-element-
v1-3/.
[7] GlobalPlatform Technology: "VPP - Concepts and Interfaces", Version 1.0.1.
NOTE: Available at https://globalplatform.org/specs-library/globalplatform-technology-virtual-primary-platform-
v1-0-1/.
[8] GlobalPlatform Technology: "Virtual Primary Platform - Firmware Format", Version 1.0.1.
NOTE: Available at https://globalplatform.org/specs-library/globalplatform-technology-virtual-primary-platform-
v1-0-1/.
[9] GlobalPlatform Technology: "VPP - OFL VNP Extension", Version 1.0.1.
NOTE: Available at https://globalplatform.org/specs-li
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