Smart Cards; Smart Secure Platform (SSP); Requirements Specification

RTS/SCP-RSSPvf10

General Information

Status
Published
Publication Date
08-Aug-2019
Technical Committee
Current Stage
12 - Completion
Due Date
22-Aug-2019
Completion Date
09-Aug-2019
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ETSI TS 103 465 V15.1.0 (2019-08) - Smart Cards; Smart Secure Platform (SSP); Requirements Specification
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ETSI TS 103 465 V15.1.0 (2019-08)






TECHNICAL SPECIFICATION
Smart Cards;
Smart Secure Platform (SSP);
Requirements Specification

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2 ETSI TS 103 465 V15.1.0 (2019-08)



Reference
RTS/SCP-RSSPvf10
Keywords
interface, secure element, security, UICC
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3 ETSI TS 103 465 V15.1.0 (2019-08)
Contents
Intellectual Property Rights . 7
Foreword . 7
Modal verbs terminology . 7
Introduction . 8
1 Scope . 9
2 References . 9
2.1 Normative references . 9
2.2 Informative references . 11
3 Definition of terms, symbols and abbreviations . 11
3.1 Terms . 11
3.2 Symbols . 13
3.3 Abbreviations . 13
4 Abstract (informative) . 14
5 SSP concept description . 15
5.1 Introduction . 15
5.2 Core features . 16
5.3 Security . 16
5.4 Electrical characteristics and physical interfaces . 16
5.4.1 Unlinking electrical characteristics of the SSP from its physical interfaces . 16
5.4.2 Operational stages . 16
6 Background (informative) . 17
6.1 Overview of the use cases . 17
6.2 Use Case 1 - Embedded secure element . 17
6.2.1 Overview . 17
6.2.2 Sub use cases . 17
6.2.2.1 Use case 1.1 - Embedded eecure element, electrical interface . 17
6.2.2.2 Use case 1.2 - Embedded secure element, physical interface . 18
6.2.2.3 Use case 1.3 - Embedded secure element, independence from hardware form factor . 18
6.2.2.4 Use case 1.4 - Embedded secure element, protocol interface . 18
6.2.3 Interaction with existing features . 18
6.3 Use case 2 - Securing IoT devices . 18
6.3.1 Overview . 18
6.3.2 Sub use cases . 19
6.3.2.1 Use case 2.1 - Management of IoT devices . 19
6.3.2.2 Use case 2.2 - Constrained terminals for M2M . 19
6.3.2.3 Use case 2.3 - General power efficiency . 19
6.3.3 Interaction with existing features . 19
6.4 Use case 3 - Storage of large data . 19
6.4.1 Overview . 19
6.4.2 Sub use cases . 19
6.4.2.1 Use case 3.1 - Storage of large configuration data . 19
6.4.2.2 Use case 3.2 - Storage of identification data . 19
6.4.2.3 Use case 3.3 - Storage of user data . 19
6.4.2.4 Use case 3.4 - Storage of emails . 19
6.4.3 Interaction with existing features (informative) . 19
6.5 Use case 4 - Security token/HSM . 20
6.5.1 Overview . 20
6.5.2 Sub use cases . 20
6.5.2.1 Use case 4.1 - Security for VPN . 20
6.5.2.2 Use case 4.2 - Security token for email . 20
6.5.2.3 Use case 4.3 - Security token for network elements . 20
6.5.2.4 Use case 4.4 - Secure boot . 20
ETSI

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4 ETSI TS 103 465 V15.1.0 (2019-08)
6.5.3 Interaction with existing features . 20
6.6 Use case 5 - Multiple applications . 20
6.6.1 Overview . 20
6.6.2 Sub use cases . 21
6.6.2.1 Use case 5.1 - Multiple applications active at the same time . 21
6.6.2.2 Use case 5.2 - Multiple applications from independent stakeholders . 21
6.6.3 Interaction with existing features . 21
6.7 Use case 6 - Optimization for LPWA IoT . 21
6.7.1 Overview . 21
6.8 Use case 7 - Tamper resistant secure hardware component for 3GPP next generation system . 22
6.8.1 Overview . 22
6.8.2 Sub use cases . 22
6.8.2.1 Use case 7.1 - Storage and processing of network access credentials . 22
6.8.2.2 Use case 7.2 - Interworking with non-3GPP systems . 22
6.8.3 Interaction with existing features . 22
6.9 Use case 8 - IMEI protection . 22
6.10 Use case 9 - Integrated secure element . 23
6.11 Use case 10 - Evolution of UICC functionality to support 3GPP requirements . 23
6.11.1 Introduction. 23
6.11.2 Existing features . 23
6.11.2.1 Introduction . 23
6.11.2.2 File Storage . 23
6.11.2.2.1 Introduction . 23
6.11.2.2.2 Examples from 3GPP specifications . 24
6.11.2.3 Internet of Things . 25
6.11.2.3.1 Power efficiency . 25
6.11.2.3.2 Hardware flexibility . 26
6.11.2.3.3 Electrical Interface and protocols . 26
6.11.2.4 Toolkit . 26
6.11.2.4.1 User-related applications . 26
6.11.2.4.2 System applications . 27
6.11.2.5 Concurrent operation of applications . 27
6.11.3 Possible new features . 28
6.11.3.0 General . 28
6.11.3.1 Storage of data . 28
6.11.3.1.1 The ability to provide the ME with storage space . 28
6.11.3.1.2 The ability to provide the new secure platform with storage space in the ME . 28
6.11.3.2 Extensibility of functionality . 28
6.11.3.3 Multiple application environment . 28
7 SSP Classes overview . 28
7.1 Introduction . 28
7.2 iSSP: integrated SSP . 29
7.3 eSSP: embedded SSP . 29
7.3.0 General . 29
7.3.1 eSSP: Type 1. 29
7.3.2 eSSP: Type 2. 29
7.4 rSSP: removable SSP . 29
8 Requirements applicable for all SSP classes . 29
8.1 General . 29
8.1.0 Introduction. 29
8.1.1 General - mandatory requirements . 30
8.1.2 General - optional requirements. 30
8.1.3 General - use case specific requirements . 30
8.2 Application and file structure . 30
8.2.1 SSP applications . 30
8.2.1.1 SSP applications - mandatory requirements . 30
8.2.1.2 SSP applications - optional requirements . 31
8.2.1.3 SSP applications - use case specific requirements . 31
8.2.2 File system . 31
8.2.2.1 File system - mandatory requirements . 31
ETSI

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5 ETSI TS 103 465 V15.1.0 (2019-08)
8.2.2.2 File system - optional requirements . 31
8.2.2.3 File system - class dependent requirements . 31
8.2.2.4 File system - use case specific requirements . 31
8.2.3 SSP application and file system access conditions . 32
8.2.3.1 SSP application and file system access conditions - mandatory requirements . 32
8.2.3.2 SSP application and file system access conditions - optional requirements. 32
8.2.4 Terminal support for SSP applications . 32
8.2.4.1 Terminal support for SSP applications - mandatory requirements . 32
8.2.4.2 Terminal support for SSP applications - optional requirements . 32
8.3 Protocols . 32
8.3.1 Protocols - mandatory requirements . 32
8.3.2 Protocols - optional requirements . 32
8.3.2.1 SCL network layer requirements . 32
8.3.2.2 SCL Transport layer requirements . 33
8.3.2.3 SCL session layer requirements . 33
8.3.2.4 Presentation layer requirements . 33
8.3.2.5 Common underlying protocol stack requirements . 33
8.3.3 Protocols - class dependent requirements . 34
8.3.3.1 Protocols - requirements for SPI . 34
8.4 Electrical and physical Interface . 34
8.4.1 Electrical and physical Interface - mandatory requirements . 34
8.4.2 Electrical and physical Interface - class dependent requirements . 34
8.4.2.1 Electrical and physical Interface requirements. 34
8.4.2.2 Electrical and physical Interface: SPI requirements . 35
8.4.2.3 Electrical and physical Interface: I2C requirements . 35
8.5 Form factor . 35
8.5.1 Form factor - mandatory requirements . 35
8.6 Security . 35
8.6.1 Security - mandatory requirements . 35
8.6.2 Security - optional requirements . 36
8.7 SSP management . 36
8.7.1 SSP management - mandatory requirements . 36
8.7.2 SSP management - optional requirements . 36
8.8 Backwards compatibility . 36
8.8.1 Backwards compatibility - mandatory requirements . 36
8.8.2 Backwards compatibility - optional requirements . 36
8.9 Primary/secondary platform architecture . 37
8.9.1 Primary/secondary platform architecture - class dependent requirements . 37
8.9.1.1 General . 37
8.9.1.2 Primary/secondary platform external interfaces and SPB provisioning and management . 39
8.9.1.2.1 General description . 39
8.9.1.2.2 Primary/secondary platform external interfaces requirements . 40
8.9.1.2.3 SPB metadata requirements . 41
8.9.1.2.4 SPB provisioning information requirements . 42
8.9.1.2.5 Primary/secondary platform PKI requirements . 42
8.9.1.3 APIs. 43
8.9.1.4 Platform applications . 43
8.9.1.5 Primary/secondary platform security requirements . 43
8.9.1.6 Primary/secondary platform core security requirements . 43
8.9.1.7 Access rights requirements . 44
8.9.1.8 Certification requirements . 44
9 Requirements for iSSP class. 44
9.1 Introduction . 44
9.2 Additional requirements for iSSP . 44
9.2.0 General Requirements . 44
9.2.1 Void (Clause is now 8.9.1.3) . 45
9.2.2 Filesystem . 45
9.2.3 Void (Clause is now 8.9.1.4) . 45
9.2.4 Transport protocol . 45
9.2.5 Link layer protocol. 45
9.2.6 Physical and electrical interface . 45
ETSI

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6 ETSI TS 103 465 V15.1.0 (2019-08)
9.2.7 Form factor . 45
9.2.8 Power modes and related timings . 45
9.2.9 Security .
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