IEC 63563-10:2025

Qi Specification version 2.0 - Part 10: MPP System Specification

IEC 63563-10:2025 defines MPP (Magnetic Power Profile), an extension to Qi v1.3 BPP (Baseline Power Profile). Manufacturers can use this specification to implement PTx and/or PRx that are interoperable.

Spécification Qi version 2.0 - Partie 10 : Spécification du système MPP

IEC 63563-10:2025 définit le MPP (Magnetic Power Profile), une extension du BPP (Baseline Power Profile) de Qi v1.3. Les fabricants peuvent utiliser cette spécification pour mettre en œuvre des PTx et/ou PRx interopérables.

General Information

• Status: Published
• Publication Date: 09-Feb-2025
• ICS: 29.240.99 - Other equipment related to power transmission and distribution networks
• ICS: 35.240.99 - IT applications in other fields
• Technical Committee: TA 15 - Wireless Power Transfer
• Drafting Committee: WG 1 - TC 100/TA 15/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 10-Feb-2025
• Completion Date: 07-Mar-2025

Overview - IEC 63563-10:2025 (Qi Specification version 2.0, Part 10: MPP System Specification)

IEC 63563-10:2025 defines the Magnetic Power Profile (MPP) - an extension to the Qi v1.3 Baseline Power Profile (BPP) - to enable interoperable wireless power devices. The standard provides system-level requirements and models that manufacturers can use to implement compliant PTx (power transmitter) and PRx (power receiver) products that interoperate within the Qi ecosystem.

Key topics and technical requirements

The standard covers functional, mechanical and electrical aspects necessary for MPP implementations. Major technical topics include:

• System architecture and models
  • PTx and PRx functional block diagrams and system models for interoperability.
• Authentication protocol
  • Framework for secure device identification and handshaking between transmitter and receiver.
• Coil design (mechanical & electrical)
  • Detailed guidelines for PTx and PRx coil construction and electrical properties, plus measurement of mated coil systems.
• Power delivery and profiles
  • Definitions and requirements for MPP power profiles that extend Qi BPP, including system recommendations and specification notes.
• Operating and signaling methods
  • Object detection, operating frequency considerations, and the requirement for digital pings (128 kHz / 360 kHz) as part of device discovery and negotiation.
• Measurement & estimation
  • K estimation (coupling coefficient) methods and specifications for assessing coil coupling and alignment.
• Power control and safety-related behavior
  • Output impedance, load transients, and procedures for setting maximum receiver power (Set Pr_max).
• Compliance and testing implications
  • Specifications that drive interoperability testing and certification processes.

Practical applications and who uses this standard

IEC 63563-10:2025 is intended for:

• Wireless power product manufacturers designing PTx and PRx hardware and firmware to meet Qi MPP interoperability.
• Hardware engineers focused on coil design, EMI/EMC considerations and system integration.
• Firmware and protocol developers implementing authentication, digital pinging and power control algorithms.
• Test labs and certification bodies creating test plans for MPP interoperability and conformance.
• OEMs and product managers evaluating wireless charging options for consumer devices (smartphones, wearables, IoT devices) and accessory ecosystems.

Practical uses include designing interoperable wireless charging pads, vehicle-integrated wireless chargers, and accessory chargers that must work reliably with Qi-certified devices under MPP.

Related standards and references

• Qi Specification version 2.0 (overall framework)
• IEC 63563 series (other parts covering different Qi system aspects)
• Qi v1.3 Baseline Power Profile (BPP) for baseline interoperability context

Keywords: IEC 63563-10:2025, Qi Specification 2.0, Magnetic Power Profile, MPP, wireless power, Qi BPP, PTx, PRx, coil design, digital pings, K estimation, interoperability.

Standards Content (Sample)

IEC 63563-10 ®
Edition 1.0 2025-02
INTERNATIONAL
STANDARD
Qi Specification version 2.0 –
Part 10: MPP System Specification

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IEC 63563-10 ®
Edition 1.0 2025-02
INTERNATIONAL
STANDARD
Qi Specification version 2.0 –

Part 10: MPP System Specification

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.240.99; 35.240.99 ISBN 978-2-8327-0183-6

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
QI SPECIFICATION VERSION 2.0 –
Part 10: MPP System Specification
FOREWORD
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IEC 635-10 has been prepared by technical area 15: Wireless Power Transfer, of IEC
technical committee 100: Audio, video and multimedia systems and equipment. It is an
International Standard.
It is based on Qi Specification version 2.0, MPP System Specification and was submitted as a
Fast-Track document.
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Table of Contents
Table of Contents . 2
List of Figures . 6
List of Tables . 9
1 General Description. 10
1.1 Introduction . 10
1.1.1 Scope . 10
1.1.2 Document organization . 10
1.1.3 Design goals . 10
1.1.4 BPP and MPP interoperability . 12
1.1.5 Related documents . 12
1.2 Architectural overview . 13
1.2.1 System Description . 13
1.2.2 System block diagrams . 14
11.3 Glossary . 16
1.3.1 Definitions. 16
1.3.2 Acronyms . 17
1.3.3 Symbols . 17
1.4 System Model vs Spec . 18
2 Authentication Protocol . 19
2.1 Authentication . 19
3 Coil Design . 20
3.1 Introduction and Background . 20
3.2 PTx Coil System Model . 20
3.2.1 Mechanical Construction . 20
3.2.2 Electrical Properties . 31
3.3 PRx Coil System Model . 33
3.3.1 Mechanical Construction . 33
3.3.2 Electrical Properties . 42

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33.4 Properties of Mated Coil System Models . 43
3.4.1 Electrical measurement under mated conditions . 43
3.5 Coil Specifications. 44
3.5.1 PRx Coil Specifications . 44
3.5.2 PTx Coil Specifications. 50
4 Power Delivery . 57
4.1 Power Profiles (BPP + MPP) . 57
4.1.1 Specifications . 57
4.1.2 Recommendations . 57
4.1.3 Specification Notes . 57
4.2 Power Receiver Functional Block Diagram . 58
4.2.1 System Model . 58
4.3 Power Transmitter Functional Block Diagram . 65
4.3.1 System Model . 65
4.4 Operating Frequency . 68
4.4.1 System Model . 68
4.4.2 Specifications . 68
4.5 Object Detection . 68
4.5.1 System Model . 68
4.5.2 Specifications . 69
4.6 Digital Pings 128kHz/360kHz . 69
4.6.1 Need For Digital Pings 128kHz / 360kHz . 69
4.6.2 Specifications . 76
4.7 K Estimation . 78
4.7.1 System Model . 78
4.7.2 Specifications . 82
4.8 Output Impedance and Load Transients . 83
4.8.1 System Model . 83
4.9 Set Pr_max . 86
4.9.1 Background . 86
4.9.2 System Model . 86
4.9.3 PTx Specifications . 92
4.9.4 PTx Specification Notes . 92
4.10 Power Transfer Control . 92
4.10.1 Intro and Background (Informative) . 92

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4.10.2 System Model . 92
4.10.3 End-to-End Control Specifications . 98
44.11 Mitigation of Side Effects of Cd at MPP Frequency . 101
4.11.1 System Model . 101
4.11.2 Specifications . 104
4.12 Cloak . 104
4.13 Common-mode Noise . 104
5 Communications Physical Layer . 105
5.1 Introduction . 105
5.2 Frequency Shift Keying (PTx to PRx) . 105
5.2.1 System Model . 106
5.2.2 Frequency Shift Keying Specifications . 108
5.3 Amplitude Shift Keying (PRx to PTx) . 109
5.3.1 Modulation Scheme . 109
5.3.2 System Model . 110
5.3.3 ASK Specifications . 115
6 Foreign Object Detection . 117
6.1 Background . 117
6.2 Open-air Q-Test (pre-power transfer FOD method). 117
6.2.1 Introduction . 117
6.2.2 Movement Timer. 120
6.2.3 Settling Timer . 120
6.2.4 Glossary . 120
6.2.5 Open-air Q-Test Specifications . 120
6.2.6 Theory of Operation . 121
6.2.7 PRx movement and digital ping . 125
6.3 MPP Power Loss Accounting (in-power transfer FOD method) . 126
6.3.1 Introduction . 126
6.3.2 MPLA Specifications . 127
6.3.3 MPLA Equations. 130
6.3.4 Eco-System Scaling . 131
6.3.5 Process of Extracting LQK-Dependent Coefficients . 133
6.3.6 FO power estimation error outside 2x2 cylinder . 134
6.3.7 FO Detection Thresholds . 135
6.3.8 In-Power FOD Action . 138

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6.3.9 Accessory Power Loss Requirements . 140
6.3.10 Error Budget . 140
6.3.11 Measuring coil current . 147
7 Annex . 149
7.1 PTx Working with Legacy PRx . 149
7.1.1 Background . 149
7.2 Mitigation of Saturation for BPP . 149
7.2.1 System Model . 149
7.2.2 SHO Specifications . 153
77.3 Loss-Split Modeling: A framework for calculating localized eddy-current losses . 153
7.3.1 Introduction . 153
7.3.2 Comparison between the standard T-Model and Loss-Split Model . 155
7.3.3 Determining the Loss-Split Model Parameters . 156
7.3.4 Calculating Power Loss using Loss-Split Model . 157
7.3.5 Loss-Split Model Validation . 158
7.4 Resistive Coupling Factor . 158
7.4.1 Introduction . 158
7.4.2 Definition of Mutual Resistance and Kr . 158
7.4.3 Cause of Mutual Resistance . 159
7.4.4 Why is Kr non-negligible . 161

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List of Figures
Figure 2.1.3 : 1 Multipole magnet design that tightly couples strong permanent magnetic fields within the region of the
magnet array . . 11
Figure 2.1.3 : 2 Accurate magnetic alignment within a 2mm radius (without case and with silicone case) . . 11
Figure 2.2.2 : 3 System block diagram . . 15
Figure 2.2.2 : 4 MPP PTx functional diagram . . 15
Figure 2.2.2 : 5 MPP accessory functional diagram (e.g., PRx case, wallet, automative dash-mount) . . 15
Figure 2.2.2 : 6 MPP PRx functional diagram . . 16
Figure 4.2.1.1 : 7 Exploded view of PTx coil system model . . 20
Figure 4.2.1.3 : 8 Exploded view of the Coil Module for the PTx Coil System Model . . 21
Figure 4.2.1.3 : 9 Side view of PTx Coil Module . . 22
Figure 4.2.1.3 : 10 Top view of PTx ferrite . . 22
Figure 4.2.1.4 : 11 Magnet Array top view . . 24
Figure 4.2.1.5 : 12 Magnet assembly (Cross-section) . . 26
Figure 4.2.1.6 : 13 Side view of Bottom Enclosure . . 27
Figure 4.2.1.8 : 14 Side view of PTx coil system model assembly . 29
Figure 4.2.1.9.1 : 15 Transmitter orientation magnets (Top View) . . 30
Figure 4.2.1.9.1 : 16 Transmitter Orientation Magnet Dimensions and Polarity . . 31
Figure 4.3.1.1 : 17 Exploded view of PRx coil system model . . 34
Figure 4.3.1.4 : 18 Exploded view of the coil module for the PRx coil system model . . 35
Figure 4.3.1.4 : 19 Cross-section of the coil module for the PRx coil system model . . 36
Figure 4.3.1.4 : 20 Cross-sectional view of coil for the PRx coil system model . . 36
Figure 4.3.1.4 : 21 Top view of PRx coil system model . . 37
Figure 4.3.1.5 : 22 Magnet of the PRx coil system model (top view) . . 40
Figure 4.3.1.5 : 23 Magnet of the PRx coil system model (side view) . . 40
Figure 4.3.1.5 : 24 Magnetic field of the PRx coil system model . . 41
Figure 4.3.1.5 : 25 Orientation magnet of the PRx coil system model (side view) . . 41
Figure 4.3.1.7 : 26 Cross-sectional view showing assembly of PRx coil system model . . 41
Figure 5.1.3.1 : 27 MPP minimum power delivery requirement shaOOEH3O•:IRUmm ” ]”PPPP ” U”PP . 57
Figure 5.1.3$Q03337[VKDOOEHDEOHWRGHOLYHU3O•:WRDQ%33V\VWHPPRGHO35[IRUPP ”]”PPPP ” r
” 8mm . . 58
Figure 5.1.3.1 : 29 Cross section view of the system model indicating the "z" gap . . 58
Figure 5.2.1.1 : 30 System model PRx circuit topology (with BPP and MPP compatibility) . . 59
Figure 5.2.1.3.1 : 31 Cantilever Equivalent Circuit . . 60
Figure 5.2.1.3.2.1 : 32 Efficiency vs Crx: sweep of Crx at the maximum coupling position in the system model shows that
efficiency is low when Crx < 300nF (system is capacitive) . . 62
Figure 5.2.1.3.2.1 : 33 Bode plot of Zin(s) at maximum coupling location with two different Crx values. With Crx=60nF, the
system impedance is capacitive, which is undesirable. . . 63

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Figure 5.2.1.3.2.1 : 34 Bode plot of G(s) at maximum coupling location with two different Crx values. Crx=710nF has
~1.4dB higher gain than Crx=60nF. . . 63
Figure 5.2.1.5 : 35 System model PRx Vrect/Irect profile . . 65
Figure 5.3.1 : 36 PTx power stage block diagram . . 66
)LJXUH'HILQLWLRQRILQYHUWHUSKDVHș . 66
Figure 5.6.1 : 38 MPP Power Negotiation Flow . . 70
Figure 5.6.1 : 39 Top-level diagram . . 72
Figure 5.6.1 : 40 Digital Ping Flowchart . . 73
Figure 5.6.1 : 41 Identification 128kHz Flowchart . . 74
Figure 5.6.1 : 42 Identification 360kHz Flowchart . . 75
Figure 5.6.1 : 43 Configuration Flowchart . . 76
Figure 5.7.1.2.1 : 44 E0 and E1 Fit Example . . 80
Figure 5.7.1.2.1 : 45 Kest E0 and E1 Extraction Flow . . 80
Figure 5.7.1.4 : 46 Example PTx/PRx Kest Error Stack-up . . 82
Figure 5.8.1.1 : 47 Typical Output Impedance Plot (Vrect vs Irect) . . 84
Figure 5.8.1.2.1 : 48 Vrect timing diagram during load step procedure in the system model . . 85
Figure 5.8.1.2.2 : 49 Vrect timing diagram during load dump procedure in the system model . . 85
Figure 5.9.2.3.1 : 50 Set Pr_max Overall Flow . . 88
Figure 5.9.2.3.1 : 51 Example Time Sequence . . 89
Figure 5.9.2.3.2 : 52 Gain Measurement Flow . . 90
Figure 5.9.2.3.3 : 53 Set initial Vrect_target and Pr_max based on G1*G2 . . 91
Figure 5.9.2.3.3 : 54 Pr_max vs G1*G2 . . 91
Figure 5.10.2.2.1 : 55 Tx Voltage Control Flow Chart . . 95
Figure 5.10.2.3.3 : 56 Ilim control diagram . . 97
Figure 5.11.1.0.1 : 57 Vrect vs inverter phase at light load . . 101
Figure 5.11.1.0.1 : 58 Output impedance with 50 and 120 degrees inverter phase . 102
Figure 5.11.1.0.2 : 59 Gain (Vrect/Vin) with and without Cd . . 102
Figure 5.11.1.0.2 : 60 Load release from 7W to 0W, with and without Cd, and with mitigations implemented in the system
model . . 103
Figure 5.11.1.0.3 : 61 ZVS state with and without Cd, and with mitigations implemented in the system model . . 103
Figure 6.1 : 62 MPP Comms Physical System Model . . 105
Figure 6.2.1.1 : 63 System Model for FSK Transmitter . . 106
Figure 6.2.1.2 : 64 System Model for FSK Receiver . . 107
Figure 6.2.1.2 : 65 Sample Waveform: Digital Ping 360 kHz AC2 node voltage . . 108
Figure 6.3.1 : 66 (a) Primary Resonant Capacitor Amplitude and (b) Primary Resonant Capacitor Phase Shift . . 110
Figure 6.3.2.1 : 67 System Model for ASK Modulator at 128 kHz . . 111
Figure 6.3.2.1 : 68 System Model for ASK Modulator at 360 kHz . . 112
Figure 6.3.2.1 : 69 Representative Waveforms for ASK Modulator at 360 kHz . . 112
Figure 6.3.2.2 : 70 System Model for ASK Receiver . . 113
Figure 6.3.2.3 : 71 ASK Modulation Trends for (a) DC Load Current and (b) Capacitor Modulation . . 114

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Figure 7.2.1 : 72 Detection Capability V.S. Thermal Requirements . . 118
Figure 7.2.1 : 73 Simplified flow diagram for open-air Q test . 119
Figure 7.2.6.1 : 74 Implementation of how to measure ring response . . 121
Figure 7.2.6.1.0.1 : 75 bias ping configuration . . 122
Figure 7.2.6.4.2 : 76 PRx replaced before the movement timer expires to prevent false fo flag . . 124
Figure 7.2.7 : 77 Example of q-deflection profile when Prx is approaching ptx . . 126
Figure 7.3.4.2 : 78 Eco-System Scaling Diagram . . 133
Figure 7.3.5 : 79 Linear fit error for coil and friendly metal losses. The resistances Rtx and Rrx represent the free-air coil
resistances at the switching frequency. . . 134
Figure 7.3.6 : 80 MPLA estimation error for P_FO grows monotonically away from origin. . . 135
Figure 7.3.7.2 : 81 15W PFO error distribution with and without FO at 85º critical heating radius (scenario 2: Q-test does
detect no FO) . . 137
Figure 7.3.7.2 : 82 10W PFO error distribution with and without FO at 70º critical heating radius (scenario 1: Q-test detects
FO) . . 137
Figure 7.3.8.1 : 83 Recommended flowchart for PTx FOD action. . . 139
Figure 7.3.10.3 : 84 PRx Compliance Test pFO Distribution . . 145
Figure 7.3.10.5 : 85 Compliance Test Ppr shift explanation for Scenario 2 (15W) . . 147
Figure 8.2.1.1 : 86 Comparison of PTx current with and without SHO . . 150
Figure 8.2.1.2 : 87 System Model SHO detection flowchart . . 151
Figure 8.2.1.3 : 88 System Model SHO mitigation flowchart . . 152
Figure 8.3.1 : 89 Simulation based power accounting flow . . 154
Figure 8.3.1 : 90 Loss-Split Power Accounting Flow . . 154
Figure 8.3.2 : 91 Standard T-Model . .
...