IEC TS 62647-3:2014

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes

IEC TS 62647-3:2014(E) defines for circuit card assemblies a default method for those companies that require a pre-defined approach, and a protocol for those companies that wish to develop their own test methods. The intent of this document is to aid avionics/defence suppliers in satisfying the reliability and/or performance requirements of IEC/TS 62647-1 as well as support the expectations in IEC/TS 62647-21. The default method is intended for use by electronic equipment manufacturers, repair facilities, or programs that may be unable to develop methods specific to their own products and applications. It should be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing lead-free (Pb-free) solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of avionics electronic equipment.

General Information

• Status: Published
• Publication Date: 24-Feb-2014
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 47.020.60 - Electrical equipment of ships and of marine structures
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Drafting Committee: WG 1 - TC 107/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 15-Jun-2014
• Completion Date: 25-Feb-2014

Relations

• Replaces: IEC PAS 62647-3:2011 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC TS 62647-3 ®
Edition 1.0 2014-02
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 3: Performance testing for systems containing lead-free solder and finishes

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IEC TS 62647-3 ®
Edition 1.0 2014-02
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Aerospace and defence electronic systems

containing lead-free solder –
Part 3: Performance testing for systems containing lead-free solder and finishes

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-1456-5

– 2 – IEC TS 62647-3:2014 © IEC 2014
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 9
3 Terms, definitions and abbreviations . 9
3.1 Terms and definitions. 9
3.2 Abbreviations . 10
4 Assumption . 11
5 Default test methods . 11
5.1 General . 11
5.2 Test vehicles . 11
5.2.1 Test vehicle type . 11
5.2.2 Sample size . 12
5.3 Pre-conditioning by thermal aging method . 12
5.3.1 General . 12
5.3.2 Thermal aging acceleration model . 12
5.3.3 Default test parameters . 13
5.4 Default temperature cycle test method . 13
5.4.1 Test parameters . 13
5.4.2 Test duration . 13
5.4.3 Failure determination and analysis . 13
5.4.4 Acceleration model . 14
5.5 Vibration test . 15
5.6 Mechanical shock . 16
5.7 Combined environments . 16
6 Protocol to design and conduct performance tests . 16
6.1 General . 16
6.2 Test vehicles . 17
6.3 Temperature cycle test protocol . 17
6.3.1 General . 17
6.3.2 Measure the recovery time . 17
6.3.3 Determine the high-temperature dwell times and temperatures . 18
6.3.4 Select other test parameters as appropriate for the application . 19
6.3.5 Conduct tests . 19
6.3.6 Determine the temperature versus cycles-to-failure relationship . 19
6.3.7 Estimate the cycles-to-failure . 20
6.4 Vibration test . 20
6.4.1 General . 20
6.5 Mechanical shock . 21
6.6 Combined environments test protocol . 21
6.6.1 General . 21
6.6.2 Combined environment relation . 23
6.6.3 Additional insight: NASA-DoD lead-free project . 23
6.6.4 Additional insight: concept of life cycle in accordance with MIL-STD-
810G . 24
6.7 Failure determination and analysis . 24

7 Final remarks . 24
Annex A (informative) Test sample size . 25
Annex B (informative) Material properties of lead-free solder materials . 27
Annex C (informative) NASA-DoD lead-free electronics project test information . 31
C.1 General . 31
C.2 Vibration test . 31
C.2.1 General . 31
C.2.2 Vibration test description . 31
C.2.3 Vibration test rationale . 33
C.2.4 Vibration of major or unique equipment . 34
C.2.5 Vibration data recording and calculations . 35
C.3 Mechanical shock . 35
C.3.1 Mechanical shock description . 35
C.3.2 Mechanical shock rationale . 36
C.3.3 Mechanical shock of major or unique equipment . 37
C.3.4 Data recording and calculations . 38
C.4 Combined environment test . 38
C.4.1 General . 38
C.4.2 Combined environment test description . 39
C.4.3 Combined environment test rationale . 39
C.4.4 Data recording and calculations . 40
Bibliography . 41

Figure 1 – Notional method for determining the recovery time for a given solder alloy,
or combination of alloys . 18
Figure 2 – Notional method for determining the relationship between high temperature

dwell time, t , and recovery time, t . 19
hd r
Figure 3 – Cycles-to-failure – Notional method for determining the relationship
between cycles-to-failure . 20
Figure C.1 – Vibration spectrum . 32
Figure C.2 – Vibration test fixture . 34
Figure C.3 – Vibration table showing Y-axis . 35
Figure C.4 – Mechanical shock response spectrum . 36
Figure C.5 – Mechanical shock test set-up . 38

Table B.1 – Test and acceleration model parameters . 28
Table C.1 – Vibration profile . 32
Table C.2 – Vibration test methodology . 34
Table C.3 – Mechanical shock test methodology – Test procedure . 37
Table C.4 – Combined environments test methodology . 39

– 4 – IEC TS 62647-3:2014 © IEC 2014
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –

Part 3: Performance testing for systems containing
lead-free solder and finishes
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dea
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