Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes

IEC TS 62647-3:2014(E) defines for circuit card assemblies a default method for those companies that require a pre-defined approach, and a protocol for those companies that wish to develop their own test methods. The intent of this document is to aid avionics/defence suppliers in satisfying the reliability and/or performance requirements of IEC/TS 62647-1 as well as support the expectations in IEC/TS 62647-21. The default method is intended for use by electronic equipment manufacturers, repair facilities, or programs that may be unable to develop methods specific to their own products and applications. It should be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing lead-free (Pb-free) solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of avionics electronic equipment.

General Information

Status
Published
Publication Date
24-Feb-2014
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
15-Jun-2014
Completion Date
25-Feb-2014
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IEC TS 62647-3:2014 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
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IEC TS 62647-3
®

Edition 1.0 2014-02
TECHNICAL
SPECIFICATION

colour
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Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 3: Performance testing for systems containing lead-free solder and finishes

IEC TS 62647-3:2014-02(en)

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IEC TS 62647-3

®


Edition 1.0 2014-02




TECHNICAL



SPECIFICATION








colour

inside










Process management for avionics – Aerospace and defence electronic systems

containing lead-free solder –

Part 3: Performance testing for systems containing lead-free solder and finishes


























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ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-1456-5



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– 2 – IEC TS 62647-3:2014 © IEC 2014
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 9
3 Terms, definitions and abbreviations . 9
3.1 Terms and definitions. 9
3.2 Abbreviations . 10
4 Assumption . 1
...

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