Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement

IEC 62884-1:2017 specifies the measurement techniques for piezoelectric, dielectric and electrostatic oscillators, including Dielectric Resonator Oscillators (DROs) and oscillators using FBAR (hereinafter referred to as "Oscillator")

Techniques de mesure des oscillateurs piézoélectriques, diélectriques et électrostatiques - Partie 1: Méthodes fondamentales pour le mesurage

L'IEC 62884-1:2017 spécifie les techniques de mesure des oscillateurs piézoélectriques, diélectriques et électrostatiques, y compris les oscillateurs à résonateur diélectrique (DRO – Dielectric Resonator Oscillators) et les oscillateurs utilisant des résonateurs et filtres à ondes de volume sur couches minces (FBAR) (ici appelé "Oscillateur").
NOTE: Les oscillateurs à résonateur diélectrique (DRO) et les oscillateurs utilisant FBAR sont à l'étude.

General Information

Status
Published
Publication Date
07-Jun-2017
Current Stage
PPUB - Publication issued
Start Date
22-Jun-2017
Completion Date
08-Jun-2017
Ref Project

Overview

IEC 62884-1:2017 - Measurement techniques of piezoelectric, dielectric and electrostatic oscillators, Part 1: Basic methods for the measurement (IEC) - defines standardized measurement methods for oscillators including piezoelectric, dielectric (including Dielectric Resonator Oscillators, DROs) and electrostatic devices, and oscillators using FBAR technology. Part 1 provides the basic test circuits, procedures, environmental and electrical measurement conditions, and reporting conventions used to characterize oscillator performance.

Key topics and technical requirements

This standard specifies practical test methods and requirements for a broad set of measurements and inspections:

  • General test conditions: standard temperature, equilibrium and airflow conditions, power-supply requirements, measurement precision and precautions.
  • Visual and mechanical checks: defined visual inspections (tests A–C), dimensional gauging and robustness of terminations.
  • Electrical tests: insulation resistance, dielectric/voltage proof, input power, output frequency, frequency vs temperature, frequency/load/voltage coefficients, start-up and stabilization time, retrace, and frequency adjustment.
  • Signal quality and modulation: amplitude and frequency modulation characteristics, harmonic distortion, spurious responses, spectral purity, incidental frequency modulation.
  • Noise and stability: phase noise (including vibration and acoustic sensitivity), noise pedestal, and RMS fractional frequency fluctuations.
  • Environmental and mechanical tests: solderability/resistance to soldering heat, thermal shock, rapid temperature change, vibration, shock, free-fall, humidity, salt mist and climatic sequence tests.
  • Test infrastructure: standardized test circuits, diagrams and measurement set bandwidths, plus figures and tables to ensure repeatable, comparable results.

Practical applications

IEC 62884-1:2017 is used to:

  • Qualify and characterize oscillator components (DROs, FBAR, crystal-based and electrostatic oscillators).
  • Support R&D measurement protocols for oscillator designers optimizing stability, phase noise and modulation behavior.
  • Define supplier acceptance and incoming inspection procedures for procurement and QA.
  • Provide test baselines for production verification and failure analysis.
  • Ensure consistent reporting and comparability across test labs and manufacturers.

Who should use this standard

  • Oscillator and RF component manufacturers
  • Test and calibration laboratories
  • Design engineers (timing, RF, microwave systems)
  • Quality assurance and procurement teams
  • Certification and compliance engineers concerned with oscillator performance

Related standards and references

Part 1 provides basic measurement methods; organizations typically pair it with complementary IEC and industry standards for EMC, environmental testing and precision frequency measurement to create a complete compliance and qualification program.

Keywords: IEC 62884-1:2017, measurement techniques, piezoelectric oscillators, dielectric resonator oscillators, DRO, FBAR, phase noise, frequency stability, oscillator testing, modulation characteristics.

Standard
IEC 62884-1:2017 - Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement Released:6/8/2017 Isbn:9782832243954
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61 pages
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Standard
IEC 62884-1:2017 - Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
English and French language
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Standards Content (Sample)


IEC 62884-1 ®
Edition 1.0 2017-06
INTERNATIONAL
STANDARD
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Measurement techniques of piezoelectric, dielectric and electrostatic
oscillators –
Part 1: Basic methods for the measurement
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IEC 62884-1 ®
Edition 1.0 2017-06
INTERNATIONAL
STANDARD
colour
inside
Measurement techniques of piezoelectric, dielectric and electrostatic

oscillators –
Part 1: Basic methods for the measurement

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.140 ISBN 978-2-8322-4395-4

– 2 – IEC 62884-1:2017  IEC 2017
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
3.1 General . 9
3.2 Terms and definitions . 10
4 Test and measurement procedures . 10
4.1 General . 10
4.2 Test and measurement conditions . 10
4.2.1 Standard conditions for testing . 10
4.2.2 Equilibrium conditions . 10
4.2.3 Air flow conditions for temperature tests . 10
4.2.4 Power supplies . 11
4.2.5 Precision of measurement . 11
4.2.6 Precautions . 11
4.2.7 Alternative test methods . 11
4.3 Visual inspection . 11
4.3.1 General . 11
4.3.2 Visual test A . 11
4.3.3 Visual test B . 11
4.3.4 Visual test C . 12
4.4 Dimensions and gauging procedures . 12
4.4.1 Dimensions – Test A . 12
4.4.2 Dimensions – Test B . 12
4.5 Electrical test procedures . 12
4.5.1 Insulation resistance . 12
4.5.2 Voltage proof . 12
4.5.3 Input power . 13
4.5.4 Output frequency . 14
4.5.5 Frequency/temperature characteristics . 15
4.5.6 Frequency/load coefficient . 16
4.5.7 Frequency/voltage coefficient . 17
4.5.8 Frequency stability with thermal transient . 17
4.5.9 Oscillation start-up. 18
4.5.10 Stabilization time . 22
4.5.11 Frequency adjustment range. 22
4.5.12 Retrace characteristics . 22
4.5.13 Oscillator output voltage (sinusoidal) . 23
4.5.14 Oscillator output voltage (pulse waveform) . 24
4.5.15 Oscillator output waveform (sinusoidal) . 25
4.5.16 Oscillator output waveform (pulse) . 27
4.5.17 Oscillator output power (sinusoidal) . 27
4.5.18 Oscillator output impedance (sinusoidal) . 27
4.5.19 Re-entrant isolation . 28
4.5.20 Output suppression of gated oscillators . 28
4.5.21 3-state output characteristics . 29
4.5.22 Amplitude modulation characteristics . 30

4.5.23 Frequency modulation characteristics . 36
4.5.24 Spurious response . 40
4.5.25 Phase noise . 40
4.5.26 Phase noise – vibration . 41
4.5.27 Phase noise – acoustic . 41
4.5.28 Noise pedestal . 42
4.5.29 Spectral purity . 43
4.5.30 Incidental frequency modulation . 43
4.5.31 RMS fractional frequency fluctuations . 44
4.5.32 Electromagnetic interference (radiated) . 48
4.6 Mechanical and environmental test procedures . 52
4.6.1 Robustness of terminations (destructive) . 52
4.6.2 Sealing test (non-destructive) . 54
4.6.3 Soldering (solderability and resistance to soldering heat) (destructive) . 54
4.6.4 Rapid change of temperature: severe shock by liquid immersion (non-
destructive). 57
4.6.5 Rapid change of temperature: thermal shock in air (non-destructive) . 57
4.6.6 Bump (destructive) . 57
4.6.7 Vibration (destructive). 58
4.6.8 Shock (destructive) . 58
4.6.9 Free fall (destructive) . 59
4.6.10 Acceleration, steady-state (non-destructive) . 59
4.6.11 Acceleration – 2g tip over . 59
4.6.12 Acceleration noise . 59
4.6.13 Low air pressure (non-destructive) . 59
4.6.14 Dry heat (non-destructive) . 59
4.6.15 Damp heat, cyclic (destructive) . 59
4.6.16 Cold (non-destructive) . 60
4.6.17 Climatic sequence (destructive) . 60
4.6.18 Damp heat, steady-state (destructive) . 60
4.6.19 Salt mist, cyclic (destructive) . 60
4.6.20 Mould growth (non-destructive) . 60
4.6.21 Immersion in cleaning solvent (non-destructive) . 60
4.6.22 Radiation hardness . 60
Bibliography . 61

Figure 1 – Test circuits for insulation resistance measurements . 12
Figure 2 – Test circuit for voltage proof test . 13
Figure 3 – Test circuit for oscillator input power measurement . 13
Figure 4 – Test circuit for oven and oscillator input power measurement . 14
Figure 5 – Test circuit for measurement of output frequency, method1 . 15
Figure 6 – Test circuit for measurement of output frequency, method 2 . 15
Figure 7 – Test circuit for measurement of frequency/temperature characteristics . 16
Figure 8 – Thermal transient behaviour of typical oscillator . 18
Figure 9 – Generalized oscillator circuit . 19
Figure 10 – Test circuit for start-up behaviour and start-up time measurement. 20
Figure 11 – Typical start-up behaviour with slow supply voltage ramp . 20

– 4 – IEC 62884-1:2017  IEC 2017
Figure 12 – Definition of start-up time . 21
Figure 13 – Supply voltage waveform for periodical t measurement . 22
SU
Figure 14 – Typical oscillator stabilization characteristic . 22
Figure 15 – Example of retrace characteristic . 23
Figure 16 – Test circuit for the measurement of output voltage . 24
Figure 17 – Test circuit for the measurement of pulse outputs . 24
Figure 18 – Characteristics of an output waveform . 24
Figure 19 – Test circuit for harmonic distortion measurement . 25
Figure 20 – Quasi-sinusoidal output waveforms . 25
Figure 21 – Frequency spectrum for harmonic distortion . 26
Figure 22 – Test circuit for the determination of isolation between output ports . 28
Figure 23 – Test circuit for measuring suppression of gated oscillators . 29
Figure 24 – Test circuit for 3-state disable mode output current . 29
Figure 25 – Test circuit for output gating time – 3-state . 30
Figure 26 – Test circuit for modulation index measurement . 31
Figure 27 – Modulation waveform for index calculation . 31
Figure 28 – Logarithmic signal amplitude scale . 31
Figure 29 – Test circuit to determine amplitude modulation sensitivity . 33
Figure 30 – Frequency spectrum of amplitude modulation distortion . 33
Figure 31 – Test circuit to determine pulse amplitude modulation . 34
Figure 32 – Pulse modulation characteristic . 35
Figure 33 – Test circuit for the determination of modulation input impedance . 36
Figure 34 – Test circuit for the measurement of f.m. deviation . 36
Figure 35 – Test circuit for the measurement of f.m. sensitivity . 38
Figure 36 – Test circuit for the measurement of frequency modulation distortion . 39
Figure 37 – Test circuit for the measurement of single-sideband phase noise . 40
Figure 38 – Typical noise pedestal spectrum . 42
Figure 39 – Test circuit for the measurement of incidental frequency modulation . 44
Figure 40 – Test circuit for method 1 . 45
Figure 41 – Test circuit for method 2 . 46
Figure 42 – Circuit modifications for methods 1 and 2 . 47
Figure 43 – Time-domain short-term frequency stability of a typical 5 MHz precision
oscillator . 48
Figure 44 – Radiated interference tests . 49
Figure 45 – Characteristics of line impedance of stabilizing network . 50
Figure 46 – Circuit diagram of line impedance of stabilizing network . 51
Figure 47 – Reflow temperature profile for solderability . 55
Figure 48 – Reflow temperature profile for resistance to soldering heat . 56

Table 1 – Measuring sets bandwidth . 52
Table 2 – Tensile force . 52
Table 3 – Thrust force . 53
Table 4 – Bending force . 53

Table 5 – Torque force . 54
Table 6 – Solderability – Test condition, reflow method . 55
Table 7 – Resistance to soldering heat – Test condition and severity, reflow method . 57

– 6 – IEC 62884-1:2017  IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC,
DIELECTRIC AND ELECTROSTATIC OSCILLATORS –

Part 1: Basic methods for the measurement

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62884-1 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency
control, selection and detection.
The text of this International Standard is based on the following documents:
CDV Report on voting
49/1187A/CDV 49/1200/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 62884 series, published under the general title Measurement
techniques of piezoelectric, dielectric and electrostatic oscillators, can be found on the IEC
website.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 8 – IEC 62884-1:2017  IEC 2017
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC,
DIELECTRIC AND ELECTROSTATIC OSCILLATORS –

Part 1: Basic methods for the measurement

1 Scope
This part of IEC 62884 specifies the measurement techniques for piezoelectric, dielectric and
electrostatic oscillators, including Dielectric Resonator Oscillators (DROs) and oscillators
using FBAR (hereinafter referred to as "Oscillator").
NOTE Dielectric Resonator Oscillators (DROs) and oscillators using FBAR are under consideration.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050-561, International electrotechnical vocabulary – Part 561: Piezoelectric, dielectric
and electrostatic devices and associated materials for frequency control, selection and
detection. Available at http://www.electropedia.org
IEC 60068-1:2013, Environmental testing – Part 1: General and guidance
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-7, Basic environmental testing procedures – Part 2-7: Tests – Test Ga and
guidance: Acceleration, steady state
IEC 60068-2-10:2005, Environmental testing – Part 2-10: Tests – Test J and guidance: Mould
growth
IEC 60068-2-13, Basic environmental testing procedures – Part 2-13: Tests – Test M: Low air
pressure
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-17:1994, Basic environmental testing procedures – Part 2-17: Tests – Test Q:
Sealing
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-21, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices

IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-31, Environmental testing – Part 2-31: Tests – Test Ec: Rough handling shocks,
primarily for equipment-type specimens
IEC 60068-2-45, Basic environmental testing procedures – Part 2-45: Tests – Test XA and
guidance: Immersion in cleaning solvents
IEC 60068-2-52, Environmental testing – Part 2-52: Tests – Test Kb: Salt mist, cyclic (sodium,
chloride solution)
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-64, Environmental testing – Part 2-64: Tests – Test Fh: Vibration, broadband
random and guidance
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60469, Transitions, pulses and related waveforms – Terms, definitions and algorithms
IEC 60617, Graphical symbols for diagrams. Available at http://std.iec.ch/iec60617
IEC 60679-1:2017, Piezoelectric, dielectric and electrostatic oscillators of assessed quality –
Part 1: Generic specification
ISO 80000-1, Quantities and units – Part 1: General
Where any discrepancies occur for any reason, documents shall rank in the following order of
precedence:
– detail specification;
– sectional specification;
– generic specification;
– any other international documents (for example of the IEC) to which reference is made.
The same order of precedence shall apply to equivalent national documents.
3 Terms and definitions
3.1 General
Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken
from the following standards:
• IEC 60027;
• IEC 60050-561;
• IEC 60469;
• IEC 60617;
• ISO 80000-1.
– 10 – IEC 62884-1:2017  IEC 2017
3.2 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60679-1 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Test and measurement procedures
4.1 General
The test and measurement procedures shall be carried out in accordance with the relevant
detail specification.
4.2 Test and measurement conditions
4.2.1 Standard conditions for testing
Unless otherwise specified, all tests shall be carried out under the standard atmospheric
conditions for testing as specified in 4.3 of IEC 60068-1:2013.
– Temperature: 15 °C to 35 °C;
– Relative humidity: 25 % to 75 %;
– Air pressure: 86 kPa to 106 kPa (860 mbar to 1 060 mbar).
In case of dispute, the referee conditions are the following:
– Temperature: 25 °C ± 2 °C;
– Relative humidity: 48 % to 52 %;
– Air pressure: 86 kPa to 106 kPa (860 mbar to 1 060 mbar).
Before measurements are made, Oscillator shall be stored at the measuring temperature for a
time sufficient to allow Oscillator to reach thermal equilibrium. Controlled recovery conditions
and standard conditions for assisted drying are given in 4.4 and 4.5 of IEC 60068-1:2013.
The ambient temperature during the measurements shall be recorded and stated in the test
report.
4.2.2 Equilibrium conditions
All electrical tests shall be conducted under equilibrium conditions, unless otherwise specified.
When test conditions cause a significant change with time of the characteristic being
measured, means of compensation for such effects shall be specified, for example the period
of time that Oscillator shall be maintained at specified test conditions before making a
measurement.
4.2.3 Air flow conditions for temperature tests
When devices are to be measured at temperatures other than 25 °C ± 2 °C, they shall be
subjected to adequate forced air circulation to ensure close temperature control.
lf heat loss due to forced air circulation affects the performance of Oscillator, still air
conditions shall be simulated by enclosing Oscillator in a draught shield consisting of a
thermally conducting box, having internal dimensions so that a sufficient clearance is

maintained from all surfaces of Oscillator. The temperature at which measurements should be
taken under these conditions is the reference point temperature on the surface of the draught
shield.
If a draught shield is necessary, it shall be used for both high and low temperature tests.
4.2.4 Power supplies
DC power sources used in the testing of crystal controlled oscillators shall not have a ripple
content large enough to effect the desired accuracy of measurement; AC power sources shall
be transient free. When the ripple and/or the transient content of the power sources are
critical to the measurement being performed, their effects shall be fully defined in the detail
specification.
4.2.5 Precision of measurement
The limits given in the detail specification are true values. Measurement inaccuracies shall be
taken into account when evaluating the results. Precautions should be taken to reduce
measurement errors to a minimum.
4.2.6 Precautions
4.2.6.1 Measurements
The measurement circuits shown for specified electrical tests are the preferred circuits. Due
allowance shall be made for any loading effects in cases where the measuring apparatus
modifies the characteristics being examined.
4.2.6.2 Electrostatic sensitive devices
Where the component is identified as electrostatic sensitive, precautions shall be taken to
prevent damage from electrostatic charge before, during, and after test (see IEC 61000-4-2).
4.2.7 Alternative test methods
Measurements shall preferably be carried out using the methods specified. Any other method
giving equivalent results may be used, except in case of dispute.
NOTE “Equivalent” means that the value of the characteristic established by such other methods falls within the
specified limits when measured by the specified method.
4.3 Visual inspection
4.3.1 General
Unless otherwise specified, external visual examination shall be performed under normal
factory lighting and visual conditions.
4.3.2 Visual test A
Oscillator shall be visually examined to ensure that the condition, workmanship and finish are
satisfactory. The marking shall be legible.
4.3.3 Visual test B
Oscillator shall be visually examined under ×10 magnification. There shall be no cracks in the
glass or damage to the terminations. Minute flaking around the further edge of a meniscus
shall not be considered a crack.

– 12 – IEC 62884-1:2017  IEC 2017
4.3.4 Visual test C
Oscillator shall be visually examined. There shall be no corrosion or other deterioration likely
to impair satisfactory operation. The marking shall be legible.
4.4 Dimensions and gauging procedures
4.4.1 Dimensions – Test A
The dimensions, spacing, and alignment of the terminations shall be checked and shall
comply with the specified values.
4.4.2 Dimensions – Test B
The dimensions shall be measured and shall comply with the specified values.
4.5 Electrical test procedures
4.5.1 Insulation resistance
A maximum voltage of 20 V, unless otherwise stated in the detail specification, shall be
applied to the specified test points using the test circuit shown in Figure 1a. The resulting
current shall be measured. It shall be less than the specified maximum value.
Alternatively, the resistance shall be directly measured with an ohmmeter (see Figure 1b). It
shall be greater than the minimum specified.
Precautions shall be taken to ensure that measurements are made across the specified points
with an applied voltage of the correct polarity and not exceeding the specified value. Failure
to observe any of these conditions can result in damage to the device under test.
After the test, measurements shall be made to ensure that Oscillator is still functional.
A
Oscillator
Power supply V
V : Voltmeter
A : Ammeter
IEC
a) – Voltage-current method
Oscillator
Ohmmeter
IEC
b) – Ohmmeter method
Figure 1 – Test circuits for insulation resistance measurements
4.5.2 Voltage proof
The specified voltage shall be applied only across the designated terminals, using the test
circuit shown in Figure 2, after any specified preconditioning procedures have been applied.
The source resistance and maximum permissible current flow shall be stated in the detail
specification.
There shall be no arcing or other evidence of electrical breakdown.
After the test, measurements shall be made to ensure that Oscillator is still functional.
Source resistance
A
V
Oscillator
Voltage
IEC
source
Figure 2 – Test circuit for voltage proof test
4.5.3 Input power
4.5.3.1 Oscillator input power
Oscillator shall be connected to the power supply and specified load as shown in Figure 3.
The specified voltage shall be applied and allowed to stabilize for the specified time.
Measurements of the voltage and current shall be made at the reference temperature, unless
otherwise stated in the detail specification. The input power shall be calculated using these
measurements.
A
Power supply Oscillator
Load
V
IEC
Figure 3 – Test circuit for oscillator input power measurement
4.5.3.2 Oven and oscillator input power
Oscillator shall be connected to the test circuit (see note to Figure 4) and placed in the
environmental chamber as shown in Figure 4. The load and supply voltage(s) shall be as
specified in the detail specification. Where the input power to Oscillator will be affected by
forced air circulation, still air conditions shall be simulated by enclosing Oscillator in a draught
shield, as described in 4.2.3. Readings of voltage and current shall be taken at the specified
temperatures as stated in the detail specification (usually at the minimum and maximum of the
operating temperature range, as well as at the reference temperature).
The temperature will normally be taken as the reference point temperature on the surface of
the draught shield, when used. If peak power is specified, the transient values of voltage and
current shall be measured when the environmental chamber is adjusted to each of the
specified temperatures. In this case, it can be necessary to attach a recording meter to the
ammeter and/or voltmeter, so as to measure adequately the transient values.
Oscillator and oven shall be allowed to reach thermal equilibrium at the operating temperature,
while unenergized, prior to any measurement of peak power. Should peak power be required,
the environmental chamber shall have a thermal time constant significantly less than that of
the oven-oscillator combination being measured.
The input power is calculated using the measured values of voltage and current.

– 14 – IEC 62884-1:2017  IEC 2017
Environmental chamber
A
RF power supply
V
Load
RF circuit
A
Oven circuits
Oven power supply V
IEC
NOTE The power to Oscillator can be supplied from the same power supply.
Figure 4 – Test circuit for oven and oscillator input power measurement
4.5.3.3 Oven input power
To measure the oven input power only, the test procedure described in 4.5.3.2 shall be used,
except that the power supply to Oscillator shall be disconnected.
4.5.4 Output frequency
4.5.4.1 General
Output frequency measurements shall be made using either method 1 or method 2 described
below, according to the accuracy specified for Oscillator.
The following precautions shall be observed:
– the accuracy and resolution of the system shall always be an order better than that of the
frequency to be determined;
– Oscillator shall be correctly loaded;
– the stability and accuracy of the system shall be verified by periodic checks of the
frequency standard against an internationally recognized standard;
– for accurate measurements, it is essential that great care be taken to ensure that
environmental conditions do not influence the results.
–8
4.5.4.2 Method 1 – Measurement for accuracies less than or equal to 1 × 10
Oscillator shall be connected, as shown in Figure 5, to the specified supply voltage and load.
It shall be allowed to stabilize for the specified time under normal operating conditions.
The frequency shall then be measured on the frequency counter. The frequency may be
determined either by direct frequency measurement or by period averaging. The time period
of measurement will normally lie in the range of 0,1 s to 10 s. Period averaging will generally
be used for the measurement of frequencies less than 5 MHz.

Power supply
Oscillator
Load
Frequency
Frequency
counter
standard
IEC
Figure 5 – Test circuit for measurement of output frequency, method1
–8
4.5.4.3 Method 2 – Measurement for accuracies greater than 1 × 10
Oscillator shall be connected, as shown in Figure 6, to the specified supply voltage and load.
It shall be allowed to stabilize for the specified time under normal operating conditions.
The frequency shall be measured on the frequency counter after multiplication to a frequency
commensurate with the required accuracy. The time period will normally be in the range of
0,1 s to 10 s. For example a 2,5 MHz signal would need to be multiplied to 25 MHz to enable
–8
a measurement of frequency to be obtained to an accuracy better than 1 × 10 within 10 s.
Alternative methods include the use of a high speed counter in place of the frequency
multiplier. It is also possible to use a system of phase comparison against a frequency
–10
synthesizer which is driven from a frequency standard, for accuracies of 1 × 10 or better.
Power
Oscillator
Load
supply
Frequency
Frequency
counter
multiplier
Frequency
standard
IEC
Figure 6 – Test circuit for measurement of output frequency, method 2
4.5.5 Frequency/temperature characteristics
4.5.5.1 Frequency at specified temperature
The unenergized oscillator shall be placed in the environmental chamber and connected to
the specified load using the test circuit shown in Figure 7. The specified supply voltage shall
then be applied to Oscillator.
Where the input power to Oscillator will be affected by forced air circulation, still air conditions
shall be simulated by enclosing Oscillator in a draught shield as described in 4.2.3.

– 16 – IEC 62884-1:2017  IEC 2017
The chamber shall be allowed to stabilize at the specified temperature and, when Oscillator
has reached equilibrium (see 4.2.2), measurements of the frequency shall be made using the
appropriate measurement method given in 4.5.4.2 or 4.5.4.3.
Power supply Oscillator Load
Frequency
measuring
Environmental
system with
chamber
recording function
Temperature
Thermometer
sensor
IEC
Figure 7 – Test circuit for measurement of frequency/temperature characteristics
4.5.5.2 Total frequency excursion
The unenergized oscillator shall be placed in the environmental chamber and connected to
the specified load using the test circuit shown in Figure 7. The specified supply voltage shall
then be applied to Oscillator.
Where the input power to Oscillator will be affected by forced air circulation, still air conditions
shall be simulated by enclosing Oscillator in a draught shield as described in 4.2.3.
The chamber shall be allowed to stabilize at a temperature extreme and, when Oscillator has
reached equilibrium (see 4.2.2), the frequency and temperature shall be recorded using the
appropriate frequency measurement method given in 4.5.4.2 or 4.5.4.3.
The test chamber temperature shall be changed in incremental steps of 1,5 °C, ensuring that
equilibrium is reached after each temperature step, or changed at a rate of 0,5 °C/min to the
other extreme of temperature, unless otherwise specified in the detail specification.
Recordings of the frequency and temperature shall be made during the test.
If it is required by the detail specification to determine the reproducibility of the frequency/
temperature characteristics, the frequencies shall be recorded with temperature changes in
both directions.
NOTE In some applications, it can be required to determine the reproducibility of the frequency/temperature
characteristics as the temperature is first increased from minimum to maximum, then decreased from maximum to
minimum. Differences in the characteristics obtained during increasing and decreasing temperatures are called
retrace errors, or hysteresis, and are of particular importance when testing TCXO devices.
4.5.6 Frequency/load coefficient
Using a frequency measuring system as described in 4.5.4, measurements of Oscillator
output frequency shall be made for the specified nominal load, minimum load and maximum
load, all other operating parameters being maintained constant at their specified values. The
load values shall then be calculated taking into account the effect of the measuring equipment
connected to the output of Oscillator, which shall be included in the total load value.

4.5.7 Frequency/voltage coefficient
Using a frequency measuring system as described in 4.5.4, and maintaining al
...


IEC 62884-1 ®
Edition 1.0 2017-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Measurement techniques of piezoelectric, dielectric and electrostatic
oscillators –
Part 1: Basic methods for the measurement

Techniques de mesure des oscillateurs piézoélectriques, diélectriques et
électrostatiques –
Partie 1: Méthodes fondamentales pour le mesurage

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IEC 62884-1 ®
Edition 1.0 2017-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Measurement techniques of piezoelectric, dielectric and electrostatic

oscillators –
Part 1: Basic methods for the measurement

Techniques de mesure des oscillateurs piézoélectriques, diélectriques et

électrostatiques –
Partie 1: Méthodes fondamentales pour le mesurage

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.140 ISBN 978-2-8322-7263-3

– 2 – IEC 62884-1:2017  IEC 2017
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
3.1 General . 9
3.2 Terms and definitions . 10
4 Test and measurement procedures . 10
4.1 General . 10
4.2 Test and measurement conditions . 10
4.2.1 Standard conditions for testing . 10
4.2.2 Equilibrium conditions . 10
4.2.3 Air flow conditions for temperature tests . 10
4.2.4 Power supplies . 11
4.2.5 Precision of measurement . 11
4.2.6 Precautions . 11
4.2.7 Alternative test methods . 11
4.3 Visual inspection . 11
4.3.1 General . 11
4.3.2 Visual test A . 11
4.3.3 Visual test B . 11
4.3.4 Visual test C . 11
4.4 Dimensions and gauging procedures . 12
4.4.1 Dimensions – Test A . 12
4.4.2 Dimensions – Test B . 12
4.5 Electrical test procedures . 12
4.5.1 Insulation resistance . 12
4.5.2 Voltage proof . 12
4.5.3 Input power . 13
4.5.4 Output frequency . 14
4.5.5 Frequency/temperature characteristics . 15
4.5.6 Frequency/load coefficient . 16
4.5.7 Frequency/voltage coefficient . 17
4.5.8 Frequency stability with thermal transient . 17
4.5.9 Oscillation start-up. 18
4.5.10 Stabilization time . 22
4.5.11 Frequency adjustment range. 22
4.5.12 Retrace characteristics . 23
4.5.13 Oscillator output voltage (sinusoidal) . 23
4.5.14 Oscillator output voltage (pulse waveform) . 24
4.5.15 Oscillator output waveform (sinusoidal) . 25
4.5.16 Oscillator output waveform (pulse) . 27
4.5.17 Oscillator output power (sinusoidal) . 27
4.5.18 Oscillator output impedance (sinusoidal) . 27
4.5.19 Re-entrant isolation . 28
4.5.20 Output suppression of gated oscillators . 28
4.5.21 3-state output characteristics . 29
4.5.22 Amplitude modulation characteristics . 30

4.5.23 Frequency modulation characteristics . 36
4.5.24 Spurious response . 40
4.5.25 Phase noise . 40
4.5.26 Phase noise – vibration . 41
4.5.27 Phase noise – acoustic . 41
4.5.28 Noise pedestal . 41
4.5.29 Spectral purity . 43
4.5.30 Incidental frequency modulation . 43
4.5.31 RMS fractional frequency fluctuations . 44
4.5.32 Electromagnetic interference (radiated) . 48
4.6 Mechanical and environmental test procedures . 52
4.6.1 Robustness of terminations (destructive) . 52
4.6.2 Sealing test (non-destructive) . 54
4.6.3 Soldering (solderability and resistance to soldering heat) (destructive) . 54
4.6.4 Rapid change of temperature: severe shock by liquid immersion (non-
destructive). 57
4.6.5 Rapid change of temperature: thermal shock in air (non-destructive) . 57
4.6.6 Bump (destructive) . 57
4.6.7 Vibration (destructive). 58
4.6.8 Shock (destructive) . 59
4.6.9 Free fall (destructive) . 59
4.6.10 Acceleration, steady-state (non-destructive) . 59
4.6.11 Acceleration – 2g tip over . 59
4.6.12 Acceleration noise . 59
4.6.13 Low air pressure (non-destructive) . 59
4.6.14 Dry heat (non-destructive) . 59
4.6.15 Damp heat, cyclic (destructive) . 60
4.6.16 Cold (non-destructive) . 60
4.6.17 Climatic sequence (destructive) . 60
4.6.18 Damp heat, steady-state (destructive) . 60
4.6.19 Salt mist, cyclic (destructive) . 60
4.6.20 Mould growth (non-destructive) . 60
4.6.21 Immersion in cleaning solvent (non-destructive) . 60
4.6.22 Radiation hardness . 60
Bibliography . 61

Figure 1 – Test circuits for insulation resistance measurements . 12
Figure 2 – Test circuit for voltage proof test . 13
Figure 3 – Test circuit for oscillator input power measurement . 13
Figure 4 – Test circuit for oven and oscillator input power measurement . 14
Figure 5 – Test circuit for measurement of output frequency, method1 . 15
Figure 6 – Test circuit for measurement of output frequency, method 2 . 15
Figure 7 – Test circuit for measurement of frequency/temperature characteristics . 16
Figure 8 – Thermal transient behaviour of typical oscillator . 18
Figure 9 – Generalized oscillator circuit . 19
Figure 10 – Test circuit for start-up behaviour and start-up time measurement. 20
Figure 11 – Typical start-up behaviour with slow supply voltage ramp . 20

– 4 – IEC 62884-1:2017  IEC 2017
Figure 12 – Definition of start-up time . 21
Figure 13 – Supply voltage waveform for periodical t measurement . 22
SU
Figure 14 – Typical oscillator stabilization characteristic . 22
Figure 15 – Example of retrace characteristic . 23
Figure 16 – Test circuit for the measurement of output voltage . 24
Figure 17 – Test circuit for the measurement of pulse outputs . 24
Figure 18 – Characteristics of an output waveform . 24
Figure 19 – Test circuit for harmonic distortion measurement . 25
Figure 20 – Quasi-sinusoidal output waveforms . 25
Figure 21 – Frequency spectrum for harmonic distortion . 26
Figure 22 – Test circuit for the determination of isolation between output ports . 28
Figure 23 – Test circuit for measuring suppression of gated oscillators . 29
Figure 24 – Test circuit for 3-state disable mode output current . 29
Figure 25 – Test circuit for output gating time – 3-state . 30
Figure 26 – Test circuit for modulation index measurement . 31
Figure 27 – Modulation waveform for index calculation . 31
Figure 28 – Logarithmic signal amplitude scale . 31
Figure 29 – Test circuit to determine amplitude modulation sensitivity . 33
Figure 30 – Frequency spectrum of amplitude modulation distortion . 33
Figure 31 – Test circuit to determine pulse amplitude modulation . 34
Figure 32 – Pulse modulation characteristic . 35
Figure 33 – Test circuit for the determination of modulation input impedance . 36
Figure 34 – Test circuit for the measurement of f.m. deviation . 36
Figure 35 – Test circuit for the measurement of f.m. sensitivity . 38
Figure 36 – Test circuit for the measurement of frequency modulation distortion . 39
Figure 37 – Test circuit for the measurement of single-sideband phase noise . 40
Figure 38 – Typical noise pedestal spectrum . 42
Figure 39 – Test circuit for the measurement of incidental frequency modulation . 44
Figure 40 – Test circuit for method 1 . 45
Figure 41 – Test circuit for method 2 . 46
Figure 42 – Circuit modifications for methods 1 and 2 . 47
Figure 43 – Time-domain short-term frequency stability of a typical 5 MHz precision
oscillator . 48
Figure 44 – Radiated interference tests . 49
Figure 45 – Characteristics of line impedance of stabilizing network . 50
Figure 46 – Circuit diagram of line impedance of stabilizing network . 51
Figure 47 – Reflow temperature profile for solderability . 55
Figure 48 – Reflow temperature profile for resistance to soldering heat . 56

Table 1 – Measuring sets bandwidth . 52
Table 2 – Tensile force . 52
Table 3 – Thrust force . 53
Table 4 – Bending force . 53

Table 5 – Torque force . 54
Table 6 – Solderability – Test condition, reflow method . 55
Table 7 – Resistance to soldering heat – Test condition and severity, reflow method . 57

– 6 – IEC 62884-1:2017  IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC,
DIELECTRIC AND ELECTROSTATIC OSCILLATORS –

Part 1: Basic methods for the measurement

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62884-1 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency
control, selection and detection.
This bilingual version (2019-08) corresponds to the monolingual English version, published in
2017-06.
The text of this International Standard is based on the following documents:
CDV Report on voting
49/1187A/CDV 49/1200/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.

The French version of this standard has not been voted upon.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62884 series, published under the general title Measurement
techniques of piezoelectric, dielectric and electrostatic oscillators, can be found on the IEC
website.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 8 – IEC 62884-1:2017  IEC 2017
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC,
DIELECTRIC AND ELECTROSTATIC OSCILLATORS –

Part 1: Basic methods for the measurement

1 Scope
This part of IEC 62884 specifies the measurement techniques for piezoelectric, dielectric and
electrostatic oscillators, including Dielectric Resonator Oscillators (DROs) and oscillators
using FBAR (hereinafter referred to as "Oscillator").
NOTE Dielectric Resonator Oscillators (DROs) and oscillators using FBAR are under consideration.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050-561, International electrotechnical vocabulary – Part 561: Piezoelectric, dielectric
and electrostatic devices and associated materials for frequency control, selection and
detection. Available at http://www.electropedia.org
IEC 60068-1:2013, Environmental testing – Part 1: General and guidance
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-7, Basic environmental testing procedures – Part 2-7: Tests – Test Ga and
guidance: Acceleration, steady state
IEC 60068-2-10:2005, Environmental testing – Part 2-10: Tests – Test J and guidance: Mould
growth
IEC 60068-2-13, Basic environmental testing procedures – Part 2-13: Tests – Test M: Low air
pressure
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-17:1994, Basic environmental testing procedures – Part 2-17: Tests – Test Q:
Sealing
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-21, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices

IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-31, Environmental testing – Part 2-31: Tests – Test Ec: Rough handling shocks,
primarily for equipment-type specimens
IEC 60068-2-45, Basic environmental testing procedures – Part 2-45: Tests – Test XA and
guidance: Immersion in cleaning solvents
IEC 60068-2-52, Environmental testing – Part 2-52: Tests – Test Kb: Salt mist, cyclic (sodium,
chloride solution)
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-64, Environmental testing – Part 2-64: Tests – Test Fh: Vibration, broadband
random and guidance
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60469, Transitions, pulses and related waveforms – Terms, definitions and algorithms
IEC 60617, Graphical symbols for diagrams. Available at http://std.iec.ch/iec60617
IEC 60679-1:2017, Piezoelectric, dielectric and electrostatic oscillators of assessed quality –
Part 1: Generic specification
ISO 80000-1, Quantities and units – Part 1: General
Where any discrepancies occur for any reason, documents shall rank in the following order of
precedence:
– detail specification;
– sectional specification;
– generic specification;
– any other international documents (for example of the IEC) to which reference is made.
The same order of precedence shall apply to equivalent national documents.
3 Terms and definitions
3.1 General
Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken
from the following standards:
• IEC 60027;
• IEC 60050-561;
• IEC 60469;
• IEC 60617;
• ISO 80000-1.
– 10 – IEC 62884-1:2017  IEC 2017
3.2 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60679-1 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Test and measurement procedures
4.1 General
The test and measurement procedures shall be carried out in accordance with the relevant
detail specification.
4.2 Test and measurement conditions
4.2.1 Standard conditions for testing
Unless otherwise specified, all tests shall be carried out under the standard atmospheric
conditions for testing as specified in 4.3 of IEC 60068-1:2013.
– Temperature: 15 °C to 35 °C;
– Relative humidity: 25 % to 75 %;
– Air pressure: 86 kPa to 106 kPa (860 mbar to 1 060 mbar).
In case of dispute, the referee conditions are the following:
– Temperature: 25 °C ± 2 °C;
– Relative humidity: 48 % to 52 %;
– Air pressure: 86 kPa to 106 kPa (860 mbar to 1 060 mbar).
Before measurements are made, Oscillator shall be stored at the measuring temperature for a
time sufficient to allow Oscillator to reach thermal equilibrium. Controlled recovery conditions
and standard conditions for assisted drying are given in 4.4 and 4.5 of IEC 60068-1:2013.
The ambient temperature during the measurements shall be recorded and stated in the test
report.
4.2.2 Equilibrium conditions
All electrical tests shall be conducted under equilibrium conditions, unless otherwise specified.
When test conditions cause a significant change with time of the characteristic being
measured, means of compensation for such effects shall be specified, for example the period
of time that Oscillator shall be maintained at specified test conditions before making a
measurement.
4.2.3 Air flow conditions for temperature tests
When devices are to be measured at temperatures other than 25 °C ± 2 °C, they shall be
subjected to adequate forced air circulation to ensure close temperature control.
lf heat loss due to forced air circulation affects the performance of Oscillator, still air
conditions shall be simulated by enclosing Oscillator in a draught shield consisting of a
thermally conducting box, having internal dimensions so that a sufficient clearance is
maintained from all surfaces of Oscillator. The temperature at which measurements should be
taken under these conditions is the reference point temperature on the surface of the draught
shield.
If a draught shield is necessary, it shall be used for both high and low temperature tests.
4.2.4 Power supplies
DC power sources used in the testing of crystal controlled oscillators shall not have a ripple
content large enough to effect the desired accuracy of measurement; AC power sources shall
be transient free. When the ripple and/or the transient content of the power sources are
critical to the measurement being performed, their effects shall be fully defined in the detail
specification.
4.2.5 Precision of measurement
The limits given in the detail specification are true values. Measurement inaccuracies shall be
taken into account when evaluating the results. Precautions should be taken to reduce
measurement errors to a minimum.
4.2.6 Precautions
4.2.6.1 Measurements
The measurement circuits shown for specified electrical tests are the preferred circuits. Due
allowance shall be made for any loading effects in cases where the measuring apparatus
modifies the characteristics being examined.
4.2.6.2 Electrostatic sensitive devices
Where the component is identified as electrostatic sensitive, precautions shall be taken to
prevent damage from electrostatic charge before, during, and after test (see IEC 61000-4-2).
4.2.7 Alternative test methods
Measurements shall preferably be carried out using the methods specified. Any other method
giving equivalent results may be used, except in case of dispute.
NOTE “Equivalent” means that the value of the characteristic established by such other methods falls within the
specified limits when measured by the specified method.
4.3 Visual inspection
4.3.1 General
Unless otherwise specified, external visual examination shall be performed under normal
factory lighting and visual conditions.
4.3.2 Visual test A
Oscillator shall be visually examined to ensure that the condition, workmanship and finish are
satisfactory. The marking shall be legible.
4.3.3 Visual test B
Oscillator shall be visually examined under ×10 magnification. There shall be no cracks in the
glass or damage to the terminations. Minute flaking around the further edge of a meniscus
shall not be considered a crack.
4.3.4 Visual test C
Oscillator shall be visually examined. There shall be no corrosion or other deterioration likely
to impair satisfactory operation. The marking shall be legible.

– 12 – IEC 62884-1:2017  IEC 2017
4.4 Dimensions and gauging procedures
4.4.1 Dimensions – Test A
The dimensions, spacing, and alignment of the terminations shall be checked and shall
comply with the specified values.
4.4.2 Dimensions – Test B
The dimensions shall be measured and shall comply with the specified values.
4.5 Electrical test procedures
4.5.1 Insulation resistance
A maximum voltage of 20 V, unless otherwise stated in the detail specification, shall be
applied to the specified test points using the test circuit shown in Figure 1a. The resulting
current shall be measured. It shall be less than the specified maximum value.
Alternatively, the resistance shall be directly measured with an ohmmeter (see Figure 1b). It
shall be greater than the minimum specified.
Precautions shall be taken to ensure that measurements are made across the specified points
with an applied voltage of the correct polarity and not exceeding the specified value. Failure
to observe any of these conditions can result in damage to the device under test.
After the test, measurements shall be made to ensure that Oscillator is still functional.
A
Oscillator
Power supply V
V : Voltmeter
A : Ammeter
IEC
a) – Voltage-current method
Oscillator
Ohmmeter
IEC
b) – Ohmmeter method
Figure 1 – Test circuits for insulation resistance measurements
4.5.2 Voltage proof
The specified voltage shall be applied only across the designated terminals, using the test
circuit shown in Figure 2, after any specified preconditioning procedures have been applied.
The source resistance and maximum permissible current flow shall be stated in the detail
specification.
There shall be no arcing or other evidence of electrical breakdown.
After the test, measurements shall be made to ensure that Oscillator is still functional.

Source resistance
A
V Oscillator
Voltage
IEC
source
Figure 2 – Test circuit for voltage proof test
4.5.3 Input power
4.5.3.1 Oscillator input power
Oscillator shall be connected to the power supply and specified load as shown in Figure 3.
The specified voltage shall be applied and allowed to stabilize for the specified time.
Measurements of the voltage and current shall be made at the reference temperature, unless
otherwise stated in the detail specification. The input power shall be calculated using these
measurements.
A
Power supply Oscillator
Load
V
IEC
Figure 3 – Test circuit for oscillator input power measurement
4.5.3.2 Oven and oscillator input power
Oscillator shall be connected to the test circuit (see note to Figure 4) and placed in the
environmental chamber as shown in Figure 4. The load and supply voltage(s) shall be as
specified in the detail specification. Where the input power to Oscillator will be affected by
forced air circulation, still air conditions shall be simulated by enclosing Oscillator in a draught
shield, as described in 4.2.3. Readings of voltage and current shall be taken at the specified
temperatures as stated in the detail specification (usually at the minimum and maximum of the
operating temperature range, as well as at the reference temperature).
The temperature will normally be taken as the reference point temperature on the surface of
the draught shield, when used. If peak power is specified, the transient values of voltage and
current shall be measured when the environmental chamber is adjusted to each of the
specified temperatures. In this case, it can be necessary to attach a recording meter to the
ammeter and/or voltmeter, so as to measure adequately the transient values.
Oscillator and oven shall be allowed to reach thermal equilibrium at the operating temperature,
while unenergized, prior to any measurement of peak power. Should peak power be required,
the environmental chamber shall have a thermal time constant significantly less than that of
the oven-oscillator combination being measured.
The input power is calculated using the measured values of voltage and current.

– 14 – IEC 62884-1:2017  IEC 2017
Environmental chamber
A
RF power supply
V
Load
RF circuit
A
Oven circuits
Oven power supply
V
IEC
NOTE The power to Oscillator can be supplied from the same power supply.
Figure 4 – Test circuit for oven and oscillator input power measurement
4.5.3.3 Oven input power
To measure the oven input power only, the test procedure described in 4.5.3.2 shall be used,
except that the power supply to Oscillator shall be disconnected.
4.5.4 Output frequency
4.5.4.1 General
Output frequency measurements shall be made using either method 1 or method 2 described
below, according to the accuracy specified for Oscillator.
The following precautions shall be observed:
– the accuracy and resolution of the system shall always be an order better than that of the
frequency to be determined;
– Oscillator shall be correctly loaded;
– the stability and accuracy of the system shall be verified by periodic checks of the
frequency standard against an internationally recognized standard;
– for accurate measurements, it is essential that great care be taken to ensure that
environmental conditions do not influence the results.
–8
4.5.4.2 Method 1 – Measurement for accuracies less than or equal to 1 × 10
Oscillator shall be connected, as shown in Figure 5, to the specified supply voltage and load.
It shall be allowed to stabilize for the specified time under normal operating conditions.
The frequency shall then be measured on the frequency counter. The frequency may be
determined either by direct frequency measurement or by period averaging. The time period
of measurement will normally lie in the range of 0,1 s to 10 s. Period averaging will generally
be used for the measurement of frequencies less than 5 MHz.

Power supply Oscillator
Load
Frequency
Frequency
counter
standard
IEC
Figure 5 – Test circuit for measurement of output frequency, method1
–8
4.5.4.3 Method 2 – Measurement for accuracies greater than 1 × 10
Oscillator shall be connected, as shown in Figure 6, to the specified supply voltage and load.
It shall be allowed to stabilize for the specified time under normal operating conditions.
The frequency shall be measured on the frequency counter after multiplication to a frequency
commensurate with the required accuracy. The time period will normally be in the range of
0,1 s to 10 s. For example a 2,5 MHz signal would need to be multiplied to 25 MHz to enable
–8
a measurement of frequency to be obtained to an accuracy better than 1 × 10 within 10 s.
Alternative methods include the use of a high speed counter in place of the frequency
multiplier. It is also possible to use a system of phase comparison against a frequency
–10
synthesizer which is driven from a frequency standard, for accuracies of 1 × 10 or better.
Power
Oscillator
Load
supply
Frequency
Frequency
counter
multiplier
Frequency
standard
IEC
Figure 6 – Test circuit for measurement of output frequency, method 2
4.5.5 Frequency/temperature characteristics
4.5.5.1 Frequency at specified temperature
The unenergized oscillator shall be placed in the environmental chamber and connected to
the specified load using the test circuit shown in Figure 7. The specified supply voltage shall
then be applied to Oscillator.
Where the input power to Oscillator will be affected by forced air circulation, still air conditions
shall be simulated by enclosing Oscillator in a draught shield as described in 4.2.3.

– 16 – IEC 62884-1:2017  IEC 2017
The chamber shall be allowed to stabilize at the specified temperature and, when Oscillator
has reached equilibrium (see 4.2.2), measurements of
...

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Frequently Asked Questions

IEC 62884-1:2017 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement". This standard covers: IEC 62884-1:2017 specifies the measurement techniques for piezoelectric, dielectric and electrostatic oscillators, including Dielectric Resonator Oscillators (DROs) and oscillators using FBAR (hereinafter referred to as "Oscillator")

IEC 62884-1:2017 specifies the measurement techniques for piezoelectric, dielectric and electrostatic oscillators, including Dielectric Resonator Oscillators (DROs) and oscillators using FBAR (hereinafter referred to as "Oscillator")

IEC 62884-1:2017 is classified under the following ICS (International Classification for Standards) categories: 11.040.50 - Radiographic equipment; 31.140 - Piezoelectric devices. The ICS classification helps identify the subject area and facilitates finding related standards.

You can purchase IEC 62884-1:2017 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of IEC standards.

IEC 62884-1:2017 is a standard that provides measurement techniques for piezoelectric, dielectric, and electrostatic oscillators. This includes oscillators such as Dielectric Resonator Oscillators (DROs) and those using FBAR.

記事のタイトル:IEC 62884-1:2017 - ピエゾ電気、誘電体、静電躍動子の測定技術 - 第1部:測定のための基本的な方法 記事内容:IEC 62884-1:2017は、ピエゾ電気、誘電体、静電躍動子などの測定技術に関する規格です。これには誘電体共振子振動子(DRO)やFBARを使用する振動子も含まれます。

기사 제목: IEC 62884-1:2017 - 압전, 유전 및 정전 울림계의 측정 기법 - 파트 1: 측정을 위한 기본 방법 기사 내용: IEC 62884-1:2017은 압전, 유전 및 정전 울림계에 대한 측정 기법을 규정합니다. 이에는 유전 레조네이터 울림계(DROs)와 FBAR을 사용하는 울림계가 포함됩니다.