IEC 62137-1-5:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Technologie du montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface - Partie 1-5: Essai de fatigue par cisaillement mécanique

La CEI 62137-1-5:2009 s'applique aux boîtiers de type matriciel tels que les BGA. Cette méthode d'essai est destinée à évaluer l'endurance des joints de soudure situés entre les sorties du composant et les pastilles d'un substrat comme illustré à la Figure 1. On utilise généralement une approche par cycles de températures pour évaluer la fiabilité des joints de soudure. Une autre méthode consiste à faire subir aux joints de soudure des cycles mécaniques pour réduire le temps d'essai plutôt que de produire des contraintes générées par des variations de température. La méthodologie consiste à imposer une déformation par cisaillement aux joints de soudure par déplacement mécanique au lieu d'un déplacement relatif produit par une différence de coefficient de dilatation thermique (CTE) comme cela est représenté sur la Figure 2. A la place des essais de cycles de températures, cet essai de fatigue par cisaillement mécanique sert à prévoir la fiabilité des joints de soudure dans des conditions de variations de température répétées en faisant subir des cycles mécaniques aux joints de soudure. Dans la présente méthode d'essai, pour procéder à l'évaluation, le composant pour montage en surface nécessite d'abord d'être monté sur le substrat par brasage par fusion, puis les joints de soudure sont soumis à des déformations cycliques par cisaillement mécanique jusqu'à ce que les joints de soudure rompent. Les propriétés des joints de soudure (par exemple alliage de soudure, substrat, dispositif assemblé ou conception, etc.) sont évaluées pour aider à améliorer la résistance des joints de soudure.

General Information

• Status: Published
• Publication Date: 10-Feb-2009
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 3 - TC 91/WG 3
• Current Stage: PPUB - Publication issued
• Start Date: 28-Feb-2009
• Completion Date: 11-Feb-2009

Standards Content (Sample)

IEC 62137-1-5 ®
Edition 1.0 2009-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology – Environmental and endurance test methods for
surface mount solder joints –
Part 1-5: Mechanical shear fatigue test

Technologie du montage en surface – Méthodes d'essais d'environnement et
d'endurance des joints brasés montés en surface –
Partie 1-5: Essai de fatigue par cisaillement mécanique

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IEC 62137-1-5 ®
Edition 1.0 2009-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology – Environmental and endurance test methods for
surface mount solder joints –
Part 1-5: Mechanical shear fatigue test

Technologie du montage en surface – Méthodes d'essais d'environnement et
d'endurance des joints brases montes en surface –
Partie 1-5: Essai de fatigue par cisaillement mécanique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.190 ISBN 978-2-88910-628-8
– 2 – 62137-1-5 © IEC:2009
CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references .7
3 Terms and definitions .8
4 Test equipment and materials.8
4.1 Test equipment for mechanical shear fatigue testing .8
4.2 Test substrate .8
4.3 Solder alloy .9
4.4 Solder paste.9
4.5 Reflow soldering equipment .9
5 Mounting .9
6 Test conditions .10
6.1 Pre-treatment .10
6.2 Test procedures .10
6.3 Judging criteria.10
7 Items to be included in the test report.11
8 Items to be given in the product specification .11
Annex A (normative) Mechanical shear fatigue test equipment.12
Annex B (normative) Mechanical shear fatigue test procedure .15
Annex C (informative) Evaluation of mechanical properties of a single solder joint by
mechanical shear fatigue test .17
Bibliography.21

Figure 1 – Image drawing on evaluation area of joint strength.6
Figure 2 – Schematic illustrations of thermomechanical and mechanical fatigue for
solder joints .7
Figure 3 – A typical temperature profile taken by reflow soldering equipment.10
Figure A.1 – Sample structures of shear fatigue jig .13
Figure B.1 – Example of set-up for electrical resistance measuring.16
Figure C.1 – Schematic illustration of the single solder joint for mechanical fatigue
testing .18
Figure C.2 – Schematic illustration of fixing jig for soldering of the single solder joint .18
Figure C.3 – Schematic illustration of the shear fatigue jig.19
Figure C.4 – Relationship between reaction forces and the number of cycles during a
fatigue test.20
Figure C.5 – Relationship between the displacement range and fatigue life .20

62137-1-5 © IEC:2009 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS
FOR SURFACE MOUNT SOLDER JOINTS –

Part 1-5: Mechanical shear fatigue test

FOREWORD
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International Standard IEC 62137-1-5 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/826/FDIS 91/841/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 62137-1-5 © IEC:2009
A list of all parts of the IEC 62137 series, under the general title Surface mounting
technology – Environmental and endurance test methods for surface mount solder joints, can
be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
62137-1-5 © IEC:2009 – 5 –
INTRODUCTION
The mechanical properties of lead-free solder joints between leads and lands on a printed
wiring board are not the same with tin-lead-containing solder joints, due to their solder
compositions. Thus, it becomes important to test the mechanical properties of solder joints of
...