IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

Techniques d’assemblage avec appareils intégrés - Partie 1: Spécification générique pour substrats avec appareils intégrés

L'IEC 62878-1:2019 spécifie les exigences et méthodes d’essai génériques relatives aux substrats avec appareils intégrés. Les méthodes fondamentales d'essai pour les matériaux de substrats des cartes imprimées et pour les substrats eux-mêmes sont spécifiées dans l'IEC 61189-3.
La présente partie de l'IEC 62878 est applicable aux substrats avec appareils intégrés fabriqués à partir de matériaux organiques de base, y compris par exemple les appareils actifs ou passifs, les composants discrets formés lors du processus de fabrication des cartes imprimées électroniques, ainsi que les composants de feuilles minces.
La série IEC 62878 ne s'applique ni à la couche de redistribution (RDL – redistribution layer), ni aux modules électroniques définis dans l’IEC 62421.

General Information

• Status: Published
• Publication Date: 13-Oct-2019
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• ICS: 33.180.01 - Fibre optic systems in general
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 6 - TC 91/WG 6
• Current Stage: PPUB - Publication issued
• Start Date: 01-Nov-2019
• Completion Date: 14-Oct-2019

Standards Content (Sample)

IEC 62878-1 ®
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

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IEC 62878-1 ®
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
Device embedding assembly technology –

Part 1: Generic specification for device embedded substrates

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-7460-6

– 2 – IEC 62878-1:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Value chain . 8
4.1 System description. 8
4.1.1 Generic design variants . 8
4.1.2 Generic value chain . 8
4.2 Elements of the value chain . 9
4.2.1 General . 9
4.2.2 System manufacturer . 9
4.2.3 Components manufacturer . 9
4.2.4 Material manufacturer . 10
4.2.5 Submodule manufacturer . 10
4.2.6 Board manufacturer . 10
4.2.7 Assembly manufacturer . 10
4.3 Traceability . 10
5 Safety aspects of base material and components . 10
6 Design and structure of device embedded substrate . 11
6.1 Basic rules for layer description . 11
6.2 Design for embedding and testability . 11
6.3 Safety aspects of design . 11
7 Embedding technology . 11
7.1 Basic technologies for embedding . 11
7.2 Basic requirements to embedding technology . 11
7.2.1 Cleanliness of components, submodules and process . 11
7.2.2 ESD . 11
7.2.3 Moisture sensitivity . 11
7.2.4 Defects . 12
8 Tests and measuring methods . 12
8.1 Standard atmospheric conditions . 12
8.1.1 Standard atmospheric conditions for testing . 12
8.1.2 Referee conditions . 12
8.1.3 Reference conditions . 13
8.2 Electrical performance tests . 13
8.2.1 General . 13
8.2.2 Electrical test levels . 13
8.2.3 Protection of DES and test equipment . 13
8.2.4 Accuracy of measurement . 14
8.2.5 Test structures. 15
8.2.6 Mechanical performance tests . 15
8.2.7 Resistance to soldering heat . 15
8.2.8 Solderability. 16
8.2.9 Shock . 16
8.2.10 Vibration (sinusoidal) . 16

8.2.11 Resistance to solvents . 16
8.3 Climatic performance tests . 16
8.3.1 Dry heat . 16
8.3.2 Cold. 17
8.3.3 Damp heat, steady state . 17
8.3.4 Change of temperature . 17
9 Transportation, handling and packing material . 18
9.1 Humidity / Temperature / Environmental protection . 18
9.2 Mechanical protection . 18
9.3 ESD . 18
10 General requirements . 18
Bibliography . 19

Figure 1 – Value chain and interfaces . 9

Table 1 – Referee conditions . 12

– 4 – IEC 62878-1:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –

Part 1: Generic specification for device embedded substrates

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
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International Standard IEC 62878-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this International Standard is based on the following documents:
FDIS Report on voting
91/1597/FDIS 91/1616/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62878 series, published under the general title Device embedded
substrate, can be found on the IEC website.

Future standards in this series will carry the new general title as cited above. Titles of existin
...

IEC 62878-1 ®
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates

Techniques d’assemblage avec appareils intégrés –
Partie 1: Spécification générique pour substrats avec appareils intégrés

IEC 662878-1:2019-10(en-fr)
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.

need further assistance, please contact the Customer Service

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publication ou si vous avez des questions contactez-nous:
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IEC 62878-1 ®
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Device embedding assembly technology –

Part 1: Generic specification for device embedded substrates

Techniques d’assemblage avec appareils intégrés –

Partie 1: Spécification générique pour substrats avec appareils intégrés

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-7949-6

– 2 – IEC 62878-1:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Value chain . 8
4.1 System description. 8
4.1.1 Generic design variants . 8
4.1.2 Generic value chain . 8
4.2 Elements of the value chain . 9
4.2.1 General . 9
4.2.2 System manufacturer . 9
4.2.3 Components manufacturer . 9
4.2.4 Material manufacturer . 10
4.2.5 Submodule manufacturer . 10
4.2.6 Board manufacturer . 10
4.2.7 Assembly manufacturer . 10
4.3 Traceability . 10
5 Safety aspects of base material and components . 10
6 Design and structure of device embedded substrate . 11
6.1 Basic rules for layer description . 11
6.2 Design for embedding and testability . 11
6.3 Safety aspects of design . 11
7 Embedding technology . 11
7.1 Basic technologies for embedding . 11
7.2 Basic requirements to embedding technology . 11
7.2.1 Cleanliness of components, submodules and process . 11
7.2.2 ESD . 11
7.2.3 Moisture sensitivity . 11
7.2.4 Defects . 12
8 Tests and measuring methods . 12
8.1 Standard atmospheric conditions . 12
8.1.1 Standard atmospheric conditions for testing . 12
8.1.2 Referee conditions . 12
8.1.3 Reference conditions . 13
8.2 Electrical performance tests . 13
8.2.1 General . 13
8.2.2 Electrical test levels . 13
8.2.3 Protection of DES and test equipment . 13
8.2.4 Accuracy of measurement . 14
8.2.5 Test structures. 15
8.2.6 Mechanical performance tests . 15
8.2.7 Resistance to soldering heat . 15
8.2.8 Solderability. 16
8.2.9 Shock . 16

8.2.10 Vibration (sinusoidal) . 16
8.2.11 Resistance to solvents . 16
8.3 Climatic performance tests . 16
8.3.1 Dry heat . 16
8.3.2 Cold. 17
8.3.3 Damp heat, steady state . 17
8.3.4 Change of temperature . 17
9 Transportation, handling and packing material . 18
9.1 Humidity / Temperature / Environmental protection . 18
9.2 Mechanical protection . 18
9.3 ESD . 18
10 General requirements . 18
Bibliography . 19

Figure 1 – Value chain and interfaces . 9

Table 1 – Referee conditions . 12

– 4 – IEC 62878-1:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –

Part 1: Generic specification for device embedded substrates

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
c
...