IEC 62878-1:2019
(Main)Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
Techniques d’assemblage avec appareils intégrés - Partie 1: Spécification générique pour substrats avec appareils intégrés
L'IEC 62878-1:2019 spécifie les exigences et méthodes d’essai génériques relatives aux substrats avec appareils intégrés. Les méthodes fondamentales d'essai pour les matériaux de substrats des cartes imprimées et pour les substrats eux-mêmes sont spécifiées dans l'IEC 61189-3.
La présente partie de l'IEC 62878 est applicable aux substrats avec appareils intégrés fabriqués à partir de matériaux organiques de base, y compris par exemple les appareils actifs ou passifs, les composants discrets formés lors du processus de fabrication des cartes imprimées électroniques, ainsi que les composants de feuilles minces.
La série IEC 62878 ne s'applique ni à la couche de redistribution (RDL – redistribution layer), ni aux modules électroniques définis dans l’IEC 62421.
General Information
Standards Content (sample)
IEC 62878-1
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
Techniques d’assemblage avec appareils intégrés –
Partie 1: Spécification générique pour substrats avec appareils intégrés
IEC 662878-1:2019-10(en-fr)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2019 IEC, Geneva, Switzerland
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.
IEC Central Office Tel.: +41 22 919 02 113, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have beenIEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.
A propos des publications IECLe contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.Recherche de publications IEC - Electropedia - www.electropedia.org
webstore.iec.ch/advsearchform Le premier dictionnaire d'électrotechnologie en ligne au
La recherche avancée permet de trouver des publications IEC monde, avec plus de 22 000 articles terminologiques en
en utilisant différents critères (numéro de référence, texte, anglais et en français, ainsi que les termes équivalents dans
comité d’études,…). Elle donne aussi des informations sur les 16 langues additionnelles. Egalement appelé Vocabulaire
projets et les publications remplacées ou retirées. Electrotechnique International (IEV) en ligne.
IEC Just Published - webstore.iec.ch/justpublished Glossaire IEC - std.iec.ch/glossary
Restez informé sur les nouvelles publications IEC. Just 67 000 entrées terminologiques électrotechniques, en anglais
Published détaille les nouvelles publications parues. et en français, extraites des articles Termes et Définitions des
Disponible en ligne et une fois par mois par email. publications IEC parues depuis 2002. Plus certaines entrées
antérieures extraites des publications des CE 37, 77, 86 etService Clients - webstore.iec.ch/csc CISPR de l'IEC.
Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
sales@iec.ch.
---------------------- Page: 2 ----------------------
IEC 62878-1
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
Techniques d’assemblage avec appareils intégrés –
Partie 1: Spécification générique pour substrats avec appareils intégrés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-7949-6
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical CommissionMarque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 62878-1:2019 © IEC 2019
CONTENTS
FOREWORD ........................................................................................................................... 4
INTRODUCTION ..................................................................................................................... 6
1 Scope .............................................................................................................................. 7
2 Normative references ...................................................................................................... 7
3 Terms and definitions ...................................................................................................... 8
4 Value chain ..................................................................................................................... 8
4.1 System description.................................................................................................. 8
4.1.1 Generic design variants ................................................................................... 8
4.1.2 Generic value chain ......................................................................................... 8
4.2 Elements of the value chain .................................................................................... 9
4.2.1 General ........................................................................................................... 9
4.2.2 System manufacturer ....................................................................................... 9
4.2.3 Components manufacturer ............................................................................... 9
4.2.4 Material manufacturer .................................................................................... 10
4.2.5 Submodule manufacturer ............................................................................... 10
4.2.6 Board manufacturer ....................................................................................... 10
4.2.7 Assembly manufacturer ................................................................................. 10
4.3 Traceability ........................................................................................................... 10
5 Safety aspects of base material and components .......................................................... 10
6 Design and structure of device embedded substrate ...................................................... 11
6.1 Basic rules for layer description ............................................................................ 11
6.2 Design for embedding and testability .................................................................... 11
6.3 Safety aspects of design ....................................................................................... 11
7 Embedding technology .................................................................................................. 11
7.1 Basic technologies for embedding ......................................................................... 11
7.2 Basic requirements to embedding technology ....................................................... 11
7.2.1 Cleanliness of components, submodules and process ................................... 11
7.2.2 ESD ............................................................................................................... 11
7.2.3 Moisture sensitivity ........................................................................................ 11
7.2.4 Defects .......................................................................................................... 12
8 Tests and measuring methods ....................................................................................... 12
8.1 Standard atmospheric conditions .......................................................................... 12
8.1.1 Standard atmospheric conditions for testing .................................................. 12
8.1.2 Referee conditions ......................................................................................... 12
8.1.3 Reference conditions ..................................................................................... 13
8.2 Electrical performance tests .................................................................................. 13
8.2.1 General ......................................................................................................... 13
8.2.2 Electrical test levels ....................................................................................... 13
8.2.3 Protection of DES and test equipment ........................................................... 13
8.2.4 Accuracy of measurement ............................................................................. 14
8.2.5 Test structures............................................................................................... 15
8.2.6 Mechanical performance tests ....................................................................... 15
8.2.7 Resistance to soldering heat .......................................................................... 15
8.2.8 Solderability................................................................................................... 16
8.2.9 Shock ............................................................................................................ 16
---------------------- Page: 4 ----------------------IEC 62878-1:2019 © IEC 2019 – 3 –
8.2.10 Vibration (sinusoidal) ..................................................................................... 16
8.2.11 Resistance to solvents ................................................................................... 16
8.3 Climatic performance tests .................................................................................... 16
8.3.1 Dry heat ........................................................................................................ 16
8.3.2 Cold............................................................................................................... 17
8.3.3 Damp heat, steady state ................................................................................ 17
8.3.4 Change of temperature .................................................................................. 17
9 Transportation, handling and packing material ............................................................... 18
9.1 Humidity / Temperature / Environmental protection ............................................... 18
9.2 Mechanical protection ........................................................................................... 18
9.3 ESD ...................................................................................................................... 18
10 General requirements .................................................................................................... 18
Bibliography .......................................................................................................................... 19
Figure 1 – Value chain and interfaces ..................................................................................... 9
Table 1 – Referee conditions ................................................................................................ 12
---------------------- Page: 5 ----------------------– 4 – IEC 62878-1:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –
Part 1: Generic specification for device embedded substrates
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62878-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.This bilingual version (2020-03) corresponds to the monolingual English version, published in
2019-10.The text of this International Standard is based on the following documents:
FDIS Report on voting
91/1597/FDIS 91/1616/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.The French version of this standard has not been voted upon.
---------------------- Page: 6 ----------------------
IEC 62878-1:2019 © IEC 2019 – 5 –
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62878 series, published under the general title Device embedded
substrate, can be found on the IEC website.Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 7 ----------------------
– 6 – IEC 62878-1:2019 © IEC 2019
INTRODUCTION
This document is a generic specification for device-embedded substrates fabricated by
embedding discrete active and/or passive electronic devices into one or multiple inner layers
of an organic substrate with electric connections by means of vias, conductor plating,
conductive paste, and printing. Other special technologies for the realization of conductive or
isolating structures and electronic components functions inside of substrates, like electronic
modules or redistribution layers of integrated circuit packages are not covered by this
document.The device-embedded substrate can be used as a substrate to mount SMDs or THDs to form
electronic circuits, as conductor and insulator layers can be formed after embedding
electronic devices.The purpose of this series of documents is to obtain common understanding in structures, test
methods, design and fabrication processes and use of device-embedded substrate in the
industry. These documents do not specify details of the manufacturing processes, design
criteria and requirements, as those normally constitute intellectual property of the
manufacturers and are very specific to the individual embedding technologies andapplications.
Generic specification
The generic specification covers all subjects mainly common to device-embedded substrates
for use in electronic equipment, such as terminology, methods of measurement and tests.
Where the individual subjects require the prescription of conditions or parameters specific to
the particular sub-family or type of embedded substrates, such prescriptions are required to
be given by one of the subordinate specifications.The numeric reference of the generic specification is IEC 62878-1.
Sectional and detail specifications (requirements to technology and components)
Sectional specifications cover all subjects additional to those given in the generic
specification, which are specific to a defined sub-group of device-embedded substrate
technologies. These subjects normally are preferred values for characteristics, additional test
methods and relevant prescriptions for test methods given in the generic specification,
prescriptions for sampling and for the preparation of specimens, recommended test severities
and preferred acceptance criteria. The sectional specification also outlines the structure and
scope of the test schedules that are to be applied in all subordinate detail specifications.
The numeric reference of the sectional and related detail specifications is IEC 62878-3-x.
Guidelines and supporting documentationSupporting documentation and guidelines provide information in addition to the provisions of
generic, sectional and detail specifications.The numeric reference of supporting documentation and guidelines is IEC 62878-2-x.
---------------------- Page: 8 ----------------------IEC 62878-1:2019 © IEC 2019 – 7 –
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –
Part 1: Generic specification for device embedded substrates
1 Scope
This part of IEC 62878 specifies the generic requirements and test methods for device-
embedded substrates. The basic test methods for printed board substrate materials and
substrates themselves are specified in IEC 61189-3.This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of
organic base material, which includes, for example, active or passive devices, discrete
components formed in the fabrication process of electronic printed boards, and sheet-formed
components.The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic
modules defined in IEC 62421.2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-21, Environmental testing – Part 2-21: Tests – Test U: Robustness ofterminations and integral mounting devices
IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-69, Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing
of electronic components and printed boards by the wetting balance (force measurement)
methodIEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
stateIEC 60194-2, Printed board design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technologiesIEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements---------------------- Page: 9 ----------------------
– 8 – IEC 62878-1:2019 © IEC 2019
IEC 61340-5-3, Electrostatics – Part 5-3: Protection of electronic devices from electrostatic
phenomena – Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devicesIEC 61760-4, Surface mounting technology – Part 4: Classification, packaging, labelling and
handling of moisture sensitive devicesIEC 62137-1-4, Surface mounting technology – Environmental and endurance test methods
for surface mount solder joint – Part 1-4: Cyclic bending testIEC 62878-1-1, Device embedded substrate – Part 1-1: Generic specification – Test methods
IEC TS 62878-2-1, Device embedded substrate – Part 2-1: Guidelines – General description
of technologyIEC TR 62878-2-2, Device embedded substrate – Part 2-2: Guidelines – Electrical testing
IEC TS 62878-2-3, Device Embedded Substrate – Part 2-3: Guidelines – Design Guide
IEC TS 62878-2-4, Device Embedded Substrate – Part 2-4: Guidelines – Test element groups
(TEG)J-STD 033, Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process
Sensitive Components3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194-2 and the
following apply.ISO and IEC maintain terminological databases for use in standardization at the following
addresses:• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
device-embedded substrate
DES
substrate in which one or more active devices (semiconductor device) and/or passive devices
(e.g. resistor or capacitor) are formed using thick-film technology or by embedding them
within the substrate4 Value chain
4.1 System description
4.1.1 Generic design variants
Generic design variants are described in IEC TS 62878-2-1.
4.1.2 Generic value chain
The business model shown in Figure 1 shows the supply routes and communication along the
value chain.---------------------- Page: 10 ----------------------
IEC 62878-1:2019 © IEC 2019 – 9 –
Figure 1 – Value chain and interfaces
4.2 Elements of the value chain
4.2.1 General
All materials have to be aligned with the embedding technology and the components to be
embedded. Composition and processability of the materials and components for embedding
shall be compatible.The detail specification for the base material shall be defined by the board or submodule
manufacturer. Generic specifications such as "FR4" are not specific enough.4.2.2 System manufacturer
The requirements to the electronic system normally are determined by the system (equipment)
manufacturer and can contain requirements such as functionality, use conditions(environmental and electrical), field performance, reliability, useful lifetime, restriction of
substances and further customer-specific requirements. These requirements shall be
deployed through the total value chain, e.g. by requirement sheets, so that assembly design
and processing, device-embedded substrate design and processing, as well as thecomponents and materials fit together, and can contribute to the fulfilment of those
requirements. The strategy for electrical tests shall be planned and confirmed by the involved
partners in accordance with IEC 62878-1-1 and IEC TR 62878-2-2, taking into consideration
component test specifications and tests at board and system level.This deployment process can be supported in form of a failure mode and effect analysis
(FMEA) or by similar tools. A concept for the qualification of processes, components and
materials shall be agreed at a very early stage of development (see also IEC TS 62878-2-4).
4.2.3 Components manufacturerThe generic requirements of components are related to the embedding technology used, and
shall be specified in the supply specification, including specific requirements on dimensions
and tolerances.---------------------- Page: 11 ----------------------
– 10 – IEC 62878-1:2019 © IEC 2019
Standard components can be used for embedding technologies using solder or conductive
adhesive to realize electrical contacts. Specific embedding technologies, such as contacting
the components by microvia, require components specially designed for that use.The manufacturers of components for DES should provide information on the limiting
conditions, e.g. sensitivity to pressure and mechanical forces, temperature, incompatibility
with chemicals and ionic contaminations, as well as other stresses induced by embedding
processes. Also, the thermal characteristic of the component under electrical load should be
specified. The component supplier should also supply a material content data sheet in a
format required by the submodule/board manufacturer.4.2.4 Material manufacturer
Manufacturers of materials should be mindful of the limiting conditions and the characteristics
of the components. In order to indicate that the material can’t be specified for use with the
components, either a purchase specification that reflects the limiting conditions and
characteristics of the components in the frame of the upper and lower specification limits
should be signed, or an early warning should be given.4.2.5 Submodule manufacturer
The submodule manufacturer is responsible for selecting processes, materials and
components that meet the specifications of the system manufacturer, but also ensure that no
incompatibilities or reliability risks arise between the material, components and processes.
The careful selection of materials, processes and components should be documented by
purchase specifications signed by all suppliers that participate in the DES. Risks related to
shipping, transportation, handling and assembly into the substrate shall be considered.
4.2.6 Board manufacturerThe board manufacturer shall provide design guidelines and a description of process
capability. All processes needed for the selected embedding technology shall be qualified
accordingly (see also Clause 7).4.2.7 Assembly manufacturer
When processing the device embedded substrate (printed circuit board with devices
embedded), the assembly manufacturer shall consider the allowable mechanical and thermal
stresse...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.