Semiconductor devices - Classification of defects in gallium nitride epitaxial film on silicon carbide substrate

IEC 63229:2021(E) gives guidelines for the definition and classification of defects in GaN epitaxial film grown on SiC substrate. They are identified and described on the basis of examples, mainly by schematic illustrations, optical microscope images, and transmission electron microscope images for these defects. This document covers only defects in as-grown GaN epitaxial film on SiC substrate and does not include defects caused by subsequent processes.

General Information

Status
Published
Publication Date
06-Apr-2021
Technical Committee
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
07-May-2021
Completion Date
07-Apr-2021
Ref Project

Buy Standard

Standard
IEC 63229:2021 - Semiconductor devices - Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
English language
21 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (Sample)


IEC 63229 ®
Edition 1.0 2021-04
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Classification of defects in gallium nitride epitaxial film
on silicon carbide substrate
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC online collection - oc.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always
committee, …). It also gives information on projects, replaced have access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 000 terminological entries in English
details all new publications released. Available online and
and French, with equivalent terms in 18 additional languages.
once a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc

If you wish to give us your feedback on this publication or
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
IEC 63229 ®
Edition 1.0 2021-04
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Classification of defects in gallium nitride epitaxial

film on silicon carbide substrate

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-9669-1

– 2 – IEC 63229:2021 © IEC 2021
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Classification of defects . 9
4.1 General . 9
4.2 Description of the defect classes. 9
4.2.1 General . 9
4.2.2 Vacancy . 9
4.2.3 Interstitial . 10
4.2.4 Substitutional defect . 11
4.2.5 Point defect complex . 12
4.2.6 Threading dislocation . 13
4.2.7 Crack . 14
4.2.8 Inclusion . 15
4.2.9 Hillock . 16
4.2.10 Pit. 18
4.2.11 Scratch . 20
4.2.12 Others . 21

Figure 1 – Vacancy . 10
Figure 2 – Interstitial . 11
Figure 3 – Substitutional defect. 12
Figure 4 – Point defect complex . 13
Figure 5 – Threading dislocation . 14
Figure 6 – Crack . 15
Figure 7 – Inclusion . 16
Figure 8 – Hillock . 18
Figure 9 – Pit . 20
Figure 10 – Scratch . 21

Table 1 – Classification of defects in GaN epitaxial film on SiC substrate . 9

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
CLASSIFICATION OF DEFECTS IN GALLIUM NITRIDE
EPITAXIAL FILM ON SILICON CARBIDE SUBSTRATE

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 63229 has been prepared by IEC technical committee 47:
Semiconductor devices. It is an International Standard.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2687/FDIS 47/2693/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 63229:2021 © IEC 2021
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement,
available at www.iec.ch/members_experts/refdocs. The main document types developed by
IEC are described in greater detail at www.iec.ch/standardsdev/publications.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

INTRODUCTION
Gallium nitride (GaN) as a representative of the wide band gap semiconductors has
outstanding properties, such as wide band gap, high critical electric field, high electron
saturation drift velocity, and good resistance to corrosion and radiation. Owing to these
properties, GaN can bring significant improvements to electronic devices, such as high-
voltage, high-frequency, and high-power, which will be widely used in wireless communication
base stations, radars, automotive electronics, aerospace, the nuclear industry, and military
electronics.
To date, the development of GaN epitaxial film and related devices is hindered by high cost,
low yield, and poor reliability. Among them, the defects in GaN epitaxial film, which closely
related to device reliability, are especially serious.
There are various defects found in GaN epitaxial film on silicon carbide (SiC) substrate. In
addition, global researchers have not established a uniform definition and classification
criterion for defects in GaN epitaxial film yet. Thus, it is essential to establish a set of
international standards for GaN epitaxial film on SiC substrate, which will benefit the
development of GaN epitaxial film and related devices.
To define and classify defects in GaN epitaxial film on SiC substrate, a new international
standard is proposed. The main contents of this document are listing and illustrating the
definition and classification of defects in GaN epitaxial film on SiC substrate, providing
reference for future GaN-related research and device manufacture.

– 6 – IEC 63229:2021 © IEC 2021
SEMICONDUCTOR DEVICES –
CLASSIFICATION OF DEFECTS IN GALLIUM NITRIDE
EPITAXIAL FILM ON SILICON CARBIDE SUBSTRATE

1 Scope
This International Standard gives guidelines for the definition and classification of defects in
GaN epitaxial film grown on SiC substrate. They are identified and described on the basis of
examples, mainly by schematic illustrations, optical microscope images, and transmission
electron microscope images for these defects. This document covers only defects in as-grown
GaN epitaxial film on SiC substrate and does not include defects caused by subsequent
processes.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IE
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.