IEC 62899-202-7:2021
(Main)Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.
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Standards Content (Sample)
IEC 62899-202-7 ®
Edition 1.0 2021-03
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 202-7: Materials – Printed film – Measurement of peel strength for printed
layer on flexible substrate by the 90° peel method
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IEC 62899-202-7 ®
Edition 1.0 2021-03
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 202-7: Materials – Printed film – Measurement of peel strength for printed
layer on flexible substrate by the 90° peel method
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.035.01; 31.180 ISBN 978-2-8322-9466-6
– 2 – IEC 62899-202-7:2021 IEC 2021
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Standard atmospheric conditions . 7
5 Test sample . 7
5.1 General . 7
5.2 Size of test sample . 7
5.3 Applicability of the method . 7
6 Testing method and test apparatus . 8
6.1 General . 8
6.2 Test apparatus . 8
6.3 Test procedure. 9
7 Data analysis . 10
7.1 Peel strength calculation . 10
7.2 Report of the results . 10
Bibliography . 12
Figure 1 – Schematic of peel test of the printed layer on a flexible substrate . 8
Figure 2 – Apparatus for peel test of the printed layer on a flexible substrate . 9
Figure 3 – Typical peeling curve measured during the peel test . 10
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 202-7: Materials – Printed film – Measurement of peel strength for
printed layer on flexible substrate by the 90° peel method
FOREWORD
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IEC 62899-202-7 has been prepared by IEC technical committee 119: Printed Electronics. It is
an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
119/342/FDIS 119/345/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
– 4 – IEC 62899-202-7:2021 IEC 2021
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement,
available at www.iec.ch/members_experts/refdocs. The main document types developed by
IEC are described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62899 series, published under the general title Printed electronics,
can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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INTRODUCTION
A printed layer on a flexible substrate is widely employed as an electrode or interconnection
for flexible devices. An integral component of this conductive body of the devices is
conductive composite material and is commercialized as conductive ink.
A simple tape test method has been widely used for qualitative adhesion measurement, but it
cannot be used to measure strong adhesion between the printed layer and the flexible
substrate.
A conventional peel test method is widely used in the printed circuits industry to evaluate the
adhesion between a thin printed layer with dense microstructure and the flexible substrate.
Peel strength value can be measured after an additional metal electroplating process on a
thin printed layer to increase the printed layer thickness to provide a stable grip in an
adhesion testing machine. However, it is not suitable for testing a printed layer which has a
porous structure susceptible to contamination of the interface between the printed layer and
flexible substrate during the electroplating process.
Therefore, a quantitative and reliable adhesion test method is used to measure and
understand interfacial adhesion of the printed layer to the flexible substrate and its long-term
reliability.
In this document, a new standard test method to measure the peel strength of a printed layer
on a flexible substrate is proposed. This method calls for peeling the flexible substrate instead
of an additional metal electroplating on the printed layer. It is useful to monitor and compare
the thickness dependence of the peel strength of a layer on the same flexible substrate.
– 6 – IEC 62899-202-7:2021 IEC 2021
PRINTED ELECTRONICS –
Part 202-7: Materials – Printed film – Measurement of peel strength for
printed layer on flexible substrate by the 90° peel method
1 Scope
This part of IEC 62899 provides a test method to measure the peel strength of a printed layer
on a flexible substrate. This method calls for peeling the flexible substrate instead of an
additional metal electroplating on the printed layer. The method described in this document
can be used to compare the peel strengths of the printed layers on the same flexible substrate
and thickness conditions. It can be used when the adhesion between the printed layer and
flexible substrate is weaker than any other interface between the printed layer and the
adhesive, the adhesive and the panel.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 62899-202:2016, Printed electronics – Part 202: Materials – Conductive ink
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
conductive material
ingredient of a printing or coating material, which itself is electrically conductive or becomes
electrically conductive by post treatment such as heating
[SOURCE: IEC 62899-202:2016, 3.1]
3.2
conductive ink
printable fluid intended for printing in which one or more molecules, polymers, or parti
...
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