IEC PAS 62178:2000

Temperature cycling

This test is conducted to determine the resistance of a part to extremes of high- and low-temperatures and to the effect of alternate exposures to these extremes.

General Information

• Status: Replaced
• Publication Date: 21-Aug-2000
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 15-Jul-2003

Relations

• Replaced By: IEC 60749-25:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
• Effective Date: 05-Sep-2023

Standards Content (Sample)

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2000-08
Temperature cycling
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IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62178
C O MMI S S I O N
Copyright © 1989, JEDEC; 2000, IEC

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
TEMPERATURE CYCLING
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under given procedures.
IEC-PAS 62178 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor
devices.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47/1451/PAS 47/1484/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC
collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards
transparently to the maximum extent possible in their national and regional standards. Any divergence between the
IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
Page i
Copyright © 1989, JEDEC; 2000, IEC

JESD22-A104-A
Page 1
TEST METHOD A104-A
TEMPERATURE CYCLING
(From JEDEC Council Ballot JCB-88-38A, formulated under the

cognizance of JC-14.1 Committee on Reliability Test Methods for
Packaged Devices.)
1. PURPOSE
This test is conducted to determine the resistance of a part to
extremes of high- and low-temperatures,
and to the effect of
alternate exposures to these extremes.
1.1 Terms and Definitions
1.1.1 Load
The specimens under test and the fixtures holding those specimens
during test. Maximum load shall be determined by using the worst-
case load temperature with specific specimen loading.
Monolithic
loads used to simulate loading may not be appropriate when air
circulation is reduced by load configuration.
The maximum loading
must meet the specified conditions.
1.1.2 Monitoring Sensor
The temperature
sensor that is located and calibrated so as to
indicate the same temperature as at the worst-case
indicator
specimen location.
The worst-case indicator specimen location is
identified during the periodic characterization of the worst-case
load temperature.
1.1.3 Worst-Case Load Temperature
The temperature of specific specimens as indicated by thermocouples

imbedded in their bodies.
These indicator specimens shall be
located at the center and at each corner of the load.
The worst-
case load temperature is determined at periodic intervals.
1.1.4 Working Zone
The volume in the chamber(s) in which th
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